CN102205597A - Process and die for fabricating surface-mounted lamp display screen module by SMT (surface mount technology) - Google Patents
Process and die for fabricating surface-mounted lamp display screen module by SMT (surface mount technology) Download PDFInfo
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- CN102205597A CN102205597A CN2011100384421A CN201110038442A CN102205597A CN 102205597 A CN102205597 A CN 102205597A CN 2011100384421 A CN2011100384421 A CN 2011100384421A CN 201110038442 A CN201110038442 A CN 201110038442A CN 102205597 A CN102205597 A CN 102205597A
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- injection moulding
- display screen
- screen module
- lamp plate
- pcb
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- 238000000034 method Methods 0.000 title abstract description 11
- 238000005516 engineering process Methods 0.000 title abstract description 4
- 239000000463 material Substances 0.000 claims abstract description 28
- 238000001746 injection moulding Methods 0.000 claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 claims abstract description 8
- 238000002347 injection Methods 0.000 claims abstract description 7
- 239000007924 injection Substances 0.000 claims abstract description 7
- 239000004033 plastic Substances 0.000 claims description 11
- 229920003023 plastic Polymers 0.000 claims description 11
- 239000012943 hotmelt Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000010412 perfusion Effects 0.000 claims 1
- 239000002245 particle Substances 0.000 abstract 2
- 238000012856 packing Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229920000297 Rayon Polymers 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
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Abstract
The invention discloses a process and a die for fabricating a surface-mounted lamp display screen module by an SMT (surface mount technology). The process comprises the following steps of: fixing a finished product PCB (printed circuit board) lamp panel on a lower die, injecting a material into an injection moulding machine, maintaining the temperature of the injection moulding machine to be 140-200 DEG C, controlling the temperature of the material injected at a pouring gate to be 100-150 DEG C, pushing out the injection moulding material by virtue of an injection pressure, controlling the temperature of the injection moulding material at the pouring gate to be 100-150 DEG C, then pouring the injection moulding materiel into gaps between lamp particles on the front of the PCB lamp panel. After the gap between the lamp particles on the front of the PCB panel is filled with the injection moulding material, the upper die presses the front of the PCB lamp panel filled with the injection moulding material, and a mask shrinkage material is replenished under a packing pressure when the injection moulding ends, thus the process for making a mask is completed. The mask made by adopting the method provided by the invention has a smooth and beautiful surface, and the production efficiency is greatly improved.
Description
Technical field
The present invention relates to the mounting technology of a SMT, relate in particular to a kind of manufacture craft and mould thereof of SMT surface mounted light display screen module.
Background technology
Tradition SMT surface mounted light display screen is made up of PCB lamp plate and the face shield that covers on the PCB lamp plate, packaging technology is also very traditional, be generally the through hole of on the PCB lamp plate, opening non-quantitative, also open on the face shield and the corresponding through hole of PCB lamp plate, screw in described through hole with screw then, PCB lamp plate and face shield are fixed, form complete SMT surface mounted light display screen module, this method assembling SMT surface mounted light needs PCB lamp plate and face shield are holed, fix at the screw-in screw, such suit flow journey needs 10-15 minute, under the efficient.Also there is a drawback in such method, when the lamp granule density on the PCB lamp plate little to a certain degree the time, just can't on lamp plate, bore and be used for fixing the through hole that connects face shield, there is the producer to adopt the method that forms face shield on artificial viscose glue and the PCB lamp plate at present, such method, not only efficient extremely under, and extremely out-of-flatness of lampshade surface, water proofing property seriously lacks, and influences the quality of product.
Summary of the invention
The object of the present invention is to provide a kind of preparation method and mould thereof of SMT surface mounted light display screen module, not only surfacing, and efficiency of assembling improves greatly.
The present invention is achieved in that
SMT surface mounted light display screen module manufacture craft may further comprise the steps:
A, location: finished product PCB lamp plate is fixed on the counterdie.
B, get the raw materials ready: injected plastics material can be PVC or PE, and specification is 60 degree, 75 degree or 105 degree, and hardness is P70-P100.
C, temperature: injected plastics material is in injection machine, and the injection machine temperature remains on: the 140-200Shi degree, the temperature of injected plastics material arrival cast gate is controlled at 100-150 degree centigrade and penetrates pressure-controlled at 60bar-120bar.
D, injection moulding: when PVC or PE arrival cast gate, this moment, temperature was controlled at 100-150 degree centigrade, and injected plastics material is poured into PCB lamp plate front lamp grain gap location then.PVC or the PE material release cast gate with hot melt for 60bar-120bar pressed in penetrating of this moment.
E, compacting: after lamp intergranular crack, PCB lamp plate front is injection molding material and is full of, patrix is suppressed the PCB lamp plate front that is perfused with injected plastics material simultaneously, and injection moulding ending time, individual dwell pressure is arranged, replenish the material that face shield shrinks, described dwell pressure is 20bar-55bar, thereby finishes the process that face shield is made.
SMT surface mounted light display screen module mould, counterdie is the position according to the component at the PCB lamp plate back side, take the custom-designed mould of scheme of dodging, play the effect of support fixation PCB lamp plate, and in pressing process, can not damage the component at the PCB lamp plate back side, promptly have the room groove in the corresponding PCB lamp plate of counterdie electric elements position, described locating slot is than the corresponding big 0.2-0.5mm of electric elements, the dark 0.5mm of the electric elements of depth ratio correspondence.
The present invention is applicable to PCB lamp plate lamp intergranular apart from too small, and cause can't perforate on the PCB lamp plate, makes face shield and PCB lamp plate to assemble, and attractive in appearance by the face shield surfacing of preparation method making of the present invention, and enhances productivity greatly.
Description of drawings
Fig. 1 is an embodiment of the invention patrix schematic diagram.
Fig. 2 is an embodiment of the invention counterdie schematic diagram.
Fig. 3 is a finished product structural representation of the present invention.
Fig. 4 is embodiment of the invention compacting flow chart.
Among the figure: 1, patrix 2, counterdie; 3, locating slot; 4, LED lamp grain; 5, injection mo(u)lding face shield; 6, PCB lamp plate
The specific embodiment
1, location: bed die 2 surfaces must be smooth, and must hollow out the district at electric elements place, the corresponding PCB lamp plate back side and form locating slot 3, this locating slot 3 is than the big 0.2-0.5mm of described electric elements, so just the PCB lamp plate can be fixed on the bed die 2, described electric elements contact with locating slot 3, the dark slightly 0.5mm of the height of the depth ratio electric elements of locating slot 3.
2, prepare injected plastics material: selecting specification for use is 105 degree, and hardness is the PVC material of P80.
3, prepare injection temperature: temperature is set in 170 degrees centigrade, and the PVC material melts in injection machine.
4, injection moulding: by a pressure of penetrating for 90bar, the PVC material that melts is released cast gate, behind the arrival cast gate, temperature is controlled at 130 degrees centigrade, begins then PCB lamp plate front is poured into, and is full of lamp intergranular crack, PCB lamp plate front up to the PVC material.
5, compacting: patrix 1 begins the PVC material that is full of lamp intergranular crack, PCB lamp plate front is suppressed, make that the PVC material is smooth, and do not have the gap that the individual pressurize of 55bar that is also will be arranged this moment with the lamp intergranular, continue to replenish the PVC material, replenish the PVC material that lacks after the face shield cooling is shunk.
Claims (5)
1.SMT surface mounted light display screen module manufacture craft is characterized in that:
A, location: the PCB lamp plate is fixed on the counterdie;
B, injection moulding: injection machine has one to penetrate pressure, and the injected plastics material behind the hot melt is full of between the lamp intergranular crack, PCB lamp plate front;
C, compacting: after PCB lamp plate front lamp grain had been full of the injected plastics material of hot melt, patrix was suppressed the PCB lamp plate front that is perfused with injected plastics material simultaneously, also had this moment a pressurize to continue the perfusion injected plastics material.
2. SMT surface mounted light display screen module manufacture craft according to claim 1, it is characterized in that: described injected plastics material is PVC, and specification is 105 degree, and hardness is P80.
3. SMT surface mounted light display screen module manufacture craft according to claim 1, it is characterized in that: described melt temperature is 170 degrees centigrade, the cast gate temperature is 130 degrees centigrade.
4. SMT surface mounted light display screen module manufacture craft according to claim 1 is characterized in that: the described pressure of penetrating is 90bar, and dwell pressure is 54bar.
5.SMT surface mounted light display screen module mould is characterized in that: described counterdie and PCB lamp plate back side electric elements opposite position have some locating slots, and described locating slot is than the corresponding big 0.2-0.5mm of electric elements, the dark 0.5mm of the electric elements of depth ratio correspondence.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2011100384421A CN102205597A (en) | 2011-02-15 | 2011-02-15 | Process and die for fabricating surface-mounted lamp display screen module by SMT (surface mount technology) |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN2011100384421A CN102205597A (en) | 2011-02-15 | 2011-02-15 | Process and die for fabricating surface-mounted lamp display screen module by SMT (surface mount technology) |
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CN102205597A true CN102205597A (en) | 2011-10-05 |
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CN2011100384421A Pending CN102205597A (en) | 2011-02-15 | 2011-02-15 | Process and die for fabricating surface-mounted lamp display screen module by SMT (surface mount technology) |
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Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1244832A (en) * | 1996-12-10 | 2000-02-16 | 全美冈布尔公司 | Injection molding encapsulation for an electronic device directly onto a substrate |
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2011
- 2011-02-15 CN CN2011100384421A patent/CN102205597A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1244832A (en) * | 1996-12-10 | 2000-02-16 | 全美冈布尔公司 | Injection molding encapsulation for an electronic device directly onto a substrate |
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Application publication date: 20111005 |