CN102163788A - Microstructural composite phase-transition cooling integrated system for high-power slab laser - Google Patents
Microstructural composite phase-transition cooling integrated system for high-power slab laser Download PDFInfo
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- CN102163788A CN102163788A CN2010101130485A CN201010113048A CN102163788A CN 102163788 A CN102163788 A CN 102163788A CN 2010101130485 A CN2010101130485 A CN 2010101130485A CN 201010113048 A CN201010113048 A CN 201010113048A CN 102163788 A CN102163788 A CN 102163788A
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- 238000001816 cooling Methods 0.000 title claims description 45
- 239000002131 composite material Substances 0.000 title claims description 29
- 239000013078 crystal Substances 0.000 claims description 38
- 238000009833 condensation Methods 0.000 claims description 13
- 230000005494 condensation Effects 0.000 claims description 13
- 238000007493 shaping process Methods 0.000 claims description 9
- 238000001704 evaporation Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 4
- 238000005057 refrigeration Methods 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000007787 solid Substances 0.000 description 9
- 239000007788 liquid Substances 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000005086 pumping Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000002250 absorbent Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000960 laser cooling Methods 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a novel microstructural composite phase-transition cooling integrated system for a high-power slab laser, which is characterized in that slab laser working media form a photo-thermal crystal composite member; the composite phase-transition cooling system is composed of a micro-slot group evaporator, a microgroove condenser, a thermoelectric module (TEC), a film temperature sensor, a thermal control subsystem, an external radiating air-cooled (AC) subsystem and other parts; the photo-thermal crystal composite member reduces high heat-flow density heat production of a slab effectively; the composite phase-transition cooling system absorbs heat generated by a high heat-flow density surface uniformly by working medium vapor-liquid phase transition and absorption and release of latent heat of phase transition; the thermoelectric module (TEC) enables the working temperature of the slab to be lower than atmospheric environment temperature; and a tubular pump and other devices required by a water-cooling system are not used in the composite phase-transition cooling system. The radiating power density of the composite phase-transition cooling integrated system for a high-power slab laser provided by the invention is more than one order of magnitude higher than that of the water-cooling system, the radiating surface temperature of the integrated system is even, the structure of the integrated system is compact, and the integrated system is free of maintenance. The integrated system improves overall effect of effective radiation obviously.
Description
Technical field
The present invention relates to a kind of novel high-power slab laser cooling system, particularly a kind of micro-structural composite phase-change cooling integrated system that is used for high-power slab laser.
Technical background
The diode pumping great-power solid laser has important application in industry and military affairs.Laser cutting and laser welding are its most important commercial Application directions, and directed energy weapon then is that it is in one of application of military field.These applications not only require high power, and require high light beam quality.Along with the increase of solid state laser power output, the caloric value of Solid State Laser working media is also increasing.The heat accumulation of Solid State Laser working media---laser crystal can cause the distortion of crystal heat, thereby causes laser beam quality to descend.Therefore, how when improving laser output power, the Solid State Laser working media is implemented " efficiently radiates heat ", with high light beam quality and the stable output that guarantees solid state laser, be the technical bottleneck that needs to be resolved hurrily during solid state laser manufactures and designs always.Cooling means commonly used at present is a water-cooling method, comprises conventional water-cooled and microchannel hot and cold water sink method, the about 10w/cm of heat of cooling current density of conventional water-cooling method
2, be difficult to adapt to the Technical Development Requirement that the Solid State Laser power output constantly increases.Microchannel hot and cold water sink method claims its maximum heat current density can reach 1000w/cm
2, in actual the use, because water can cause the microchannel to stop up to the action of rust of copper base passage, coolant must use deionized water, increases system operation cost, and system bears high pressure, is not desirable the selection.And water-cooling system all must be equipped with pump, pipeline, water tank and refrigerating units, and is bulky, is difficult to satisfy many-sided application demand, demands the breakthrough of the novelty of solid state laser cooling heat dissipation technology urgently.
Content of the present invention:
The object of the present invention is to provide a kind of micro-structural composite phase-change cooling integrated system applicable to high-power slab laser.Its technical scheme is as follows:
A kind of composite phase-change cooling integrated system of novel high-power slab laser is characterized in that: described high-power slab laser composite phase-change cooling integrated system, and its slab laser working media is the photo-thermal crystal sub-assembly that special process is processed into; Its composite phase-change cooling system is by micro capillary groove evaporator, little groove condenser, the TEC electrothermal module, and film temperature sensor, the thermal control subsystem, parts such as connecting tube and outer heat radiation air cooling subsystem are formed.The composite phase-change cooling system carries out " efficiently radiates heat " cooling to photo-thermal crystal sub-assembly.
Described photo-thermal crystal sub-assembly is combined by slab laser crystal and high thermal conductance crystal.Pump light source is entered by the slab laser crystal on side face after the shaping of optical shaping cylindrical microlenses, two big faces of lath fit tightly than the high thermal conductance wafer greater than 2 with area, and two end faces of lath are provided with laserresonator Effect of Back-Cavity Mirror and laserresonator outgoing mirror respectively.Photo-thermal crystal sub-assembly surface is integrated with film temperature sensor.
The micro capillary groove evaporator of described composite phase-change cooling system, its evaporating surface is the microflute group of various cross sectional shapes, but cross sectional shape comprises triangle, rectangle, trapezoidal other cross sectional shapes that reach machine-shaping, and the characteristic dimension of interface shape is between 0.2～1.0mm.
Described little groove condenser working surface is made up of the little groove in trapezoid cross section, and the steam that enters condenses at little groove end face, and condensate liquid flows to the condenser bottom because surface tension gathers little groove the lowest point through little groove.The outer surface of little groove condenser condensation front is provided with film temperature sensor.
Described TEC electrothermal module is close to the outer surface of little groove condenser condensation front with heat-conducting glue, the thermal control subsystem is implemented power control according to the temperature value that photo-thermal sub-assembly and little groove condenser condensation front outer surface film temperature sensor measure to TEC module refrigeration, guarantees that photo-thermal crystal sub-assembly working temperature is constant.
Described outer heat radiation air cooling subsystem is made up of fin radiator and fan.The fin radiator plane is close to by the radiating surface of heat-conducting glue and TEC electrothermal module, and the heat of condensation spills into the ambient atmosphere environment by fin radiator and fan in the condenser.
The object of the present invention is achieved like this:
Pump light source forms optical cross-section after the shaping of optical shaping cylindrical microlenses be the one dimension directional light of flat rectangle, enters by in the middle of the photo-thermal crystal sub-assembly side.The heat that laser crystal produced in the photo-thermal crystal sub-assembly is after the thermal diffusion of high thermal conductance crystal, be transmitted to the micro capillary groove evaporator of being close to the photo-thermal sub-assembly, liquid working media in the micro capillary groove evaporator microflute is vaporized into steam after absorbing latent heat of phase change, steam enters little groove condenser through connecting pipeline, after discharging latent heat of phase change, condensation surface changes liquid state into, flow to the condenser bottom along groove, flow back to micro-structural evaporator reservoir and microflute group, finish a phase transformation circulation through connecting tube.The heat that little groove condenser condensation surface discharges is absorbed by the TEC electrothermal module chill surface of being close to its back of the body surface, spills into surrounding environment from TEC module heat delivery surface by the fin fan system again.The thermal control subsystem is implemented power control according to the temperature value that photo-thermal sub-assembly surface and little groove condenser condensation front outer surface film temperature sensor measure to TEC module refrigeration, guarantees that photo-thermal crystal sub-assembly working temperature is constant.
Advantage of the present invention and technique effect are:
1, photo-thermal crystal sub-assembly has good heat conduction and heat diffusion capabilities, and it is nearly 30% that thermal conductivity ratio copper pedestal improves, and significantly reduce density of heat flow rate;
2, photo-thermal crystal sub-assembly has significantly improved the thermal mismatching between laser crystal and the heat conduction heat sink material, has reduced the laser crystal thermal stress;
3, the heat radiation power of micro-structural composite phase-change cooling system cools off a high order of magnitude than conventional water-cooled, and its actual use density of heat flow rate can reach 100w/cm
2More than;
4, micro-structural composite phase-change cooling system evaporative cooling surface temperature is even, and controllability is strong, closely cooperates with photo-thermal crystal sub-assembly, can implement " efficiently radiates heat " cooling to the high heat flux surface;
5, little groove condenser condenses face and TEC electrothermal module chill surface in the micro-structural composite phase-change cooling integrated system fit tightly, the TEC electrothermal module is controlled little groove condenser cooling power according to photo-thermal plane of crystal temperature, thereby keeps photo-thermal crystal working temperature constant;
6, the micro capillary groove evaporator of micro-structural composite phase-change cooling system and little groove condenser can split, and are convenient to system's flexible arrangement;
7, micro-structural composite phase-change cooling system adopts the outer cooling system of air cooling to replace the outer cooling system of water-cooled, has simplified system configuration.
8, micro-structural composite phase-change cooling integrated system provided by the invention not only can be used for high-power lath (slab) laser, and can be conveniently used in high-power thin slice (disk) laser and high power semiconductor lasers.
Description of drawings:
Accompanying drawing 1 is the high-power slab laser micro-structural of the present invention composite phase-change cooling integrated system structural representation.
1, photo-thermal crystal sub-assembly; 2, laser diode pumping source; 3, the shaping cylindrical microlenses; 4, micro capillary groove evaporator; 5, the condensate liquid reflux line; 6, little groove condenser; 7, fan; 8, fin radiator; 9, the TEC electrothermal module; 10, the steam (vapor) outlet pipeline; 11, laser diode pumping source; 12, the thermal control subsystem
Accompanying drawing 2 is micro capillary groove evaporator microflute evaporating surface structural representation in the high-power slab laser micro-structural of the present invention composite phase-change cooling integrated system.
13, evaporating surface micro-channel structure; 14, the micro capillary groove evaporator heat-absorbent surface; 15, reservoir
Accompanying drawing 3 is little groove condenser groove condensing surface structural representation in the micro-structural composite phase-change cooling integrated system of the high-power slab laser of the present invention.
16, little groove condenser groove fin; 17, little groove condenser heat delivery surface
Embodiment:
Consult Fig. 1, Fig. 2, shown in Figure 3.The pump light that pump light source 2,11 is sent is after 3 shapings of shaping cylindrical microlenses, and the laser crystal from photo-thermal crystal sub-assembly 1 enters two sides up and down.The heat that laser crystal produced in the photo-thermal crystal sub-assembly 1 is after the thermal diffusion of high thermal conductance crystal and reducing density of heat flow rate, be transmitted to the evaporation heat-absorbent surface 14 of the micro capillary groove evaporator 4 of being close to the outer side plane of photo-thermal sub-assembly, liquid working media in the micro capillary groove evaporator microflute is vaporized into steam after absorbing latent heat of phase change, steam enters little groove condenser 6 through connecting pipeline 10, change liquid state in 16 surface condensations of groove fin and after discharging latent heat of phase change, flow to the condenser bottom along groove fin the lowest point, through reservoir 15 and the microflute group 13 that connecting tube 5 flows back to micro capillary groove evaporator 4, finish a phase transformation circulation.The heat that the condensation surface of little groove condenser 6 discharges, by the chill surface absorption of the TEC electrothermal module 9 of being close to its back of the body surface 17, the heat delivery surface from TEC electrothermal module 9 spills into surrounding environment by fin radiator 8 and fan 7 again.Thermal control subsystem 12 is implemented power control according to the temperature value that photo-thermal sub-assembly surface and little groove condenser condensation front outer surface film temperature sensor measure to TEC electrothermal module 9, guarantees that photo-thermal crystal sub-assembly 1 working temperature is constant.
Claims (8)
1. the composite phase-change of a novel high-power slab laser cools off integrated system, it is characterized in that: described high-power slab laser composite phase-change cooling integrated system, its slab laser working media is the photo-thermal crystal sub-assembly that special process is processed into; Its composite phase-change cooling system is by micro capillary groove evaporator, little groove condenser, the TEC electrothermal module, and film temperature sensor, the thermal control subsystem, parts such as the outer heat dissipation subsystem of connecting tube and air cooling are formed.The composite phase-change cooling system carries out " efficiently radiates heat " cooling to photo-thermal crystal sub-assembly.
2. high-power slab laser composite phase-change cooling integrated system according to claim 1 is characterized in that described photo-thermal crystal sub-assembly is combined by slab laser crystal and high thermal conductance wafer.Slab laser crystal and high thermal conductance wafer thickness are at 0.5～1.5mm, and two big faces of slab laser crystal and high thermal conductance wafer fit tightly, and high thermal conductance wafer compares greater than 2 with the area of slab laser crystal binding face.Photo-thermal crystal sub-assembly outer surface is integrated with film temperature sensor.
3. high-power slab laser composite phase-change cooling integrated system according to claim 1, it is characterized in that described micro capillary groove evaporator, its evaporating surface is that structure is the microflute group of various cross sectional shapes, but cross sectional shape comprises triangle, rectangle, trapezoidal other cross sectional shapes that reach machine-shaping, and the characteristic dimension of interface shape is between 0.2～1.0mm.Be provided with reservoir in the micro capillary groove evaporator.
4. high-power slab laser composite phase-change cooling integrated system according to claim 1 is characterized in that described little groove condenser working surface is spaced by the little fin in trapezoid cross section to form, and forms little groove between little fin.
5. high-power slab laser composite phase-change cooling integrated system according to claim 1, it is characterized in that described TEC electrothermal module is close to the outer surface of little groove condenser condensation front with heat-conducting glue, the condensation front outer surface is integrated with film temperature sensor.
6. high-power slab laser composite phase-change cooling integrated system according to claim 1 is characterized in that described thermal control subsystem is made up of control circuit board and the film temperature sensor that is arranged at photo-thermal crystal sub-assembly surface and little groove condenser condenses surface.Control circuit board is implemented refrigeration work consumption control according to the temperature value that photo-thermal sub-assembly and little groove condenser condenses surface film temperature sensor measure to the TEC refrigeration module.
7. high-power slab laser composite phase-change cooling integrated system according to claim 1 is characterized in that heat dissipation subsystem is made up of fin radiator and fan outside the described air cooling.The fin radiator plane is close to by the radiating surface of heat-conducting glue and TEC electrothermal module, and the heat of condensation spills into the ambient atmosphere environment by fin radiator and fan in the condenser.
8. high-power slab laser composite phase-change cooling integrated system according to claim 1, it is characterized in that the present invention not only can be used for the high-power lath of profile pump (slab) laser, and can be conveniently used in high-power thin slice (disk) laser and high power semiconductor lasers.Its formed patent and the present invention be person roughly the same mutually, all falls into scope of patent protection of the present invention.
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| CN2010101130485A CN102163788A (en) | 2010-02-24 | 2010-02-24 | Microstructural composite phase-transition cooling integrated system for high-power slab laser |
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| CN2010101130485A CN102163788A (en) | 2010-02-24 | 2010-02-24 | Microstructural composite phase-transition cooling integrated system for high-power slab laser |
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| CN104218435A (en) * | 2014-09-19 | 2014-12-17 | 中国运载火箭技术研究院 | High-density heat-flow phase-change heat accumulation/heat dissipation system based on slatted laser |
| CN104518424A (en) * | 2015-01-12 | 2015-04-15 | 赵立华 | Package structure of high-power semiconductor laser |
| CN107204563A (en) * | 2016-03-18 | 2017-09-26 | 清华大学 | A kind of cooling device for solid state laser gain medium |
| CN107634441A (en) * | 2017-09-14 | 2018-01-26 | 中国人民解放军国防科技大学 | A phase-change cold storage thermal management system for high-power fiber lasers |
| CN107666106A (en) * | 2017-10-18 | 2018-02-06 | 哈尔滨工业大学 | A kind of 2 microns of Solid State Laser generating means of hectowatt grade |
| CN107800029A (en) * | 2017-10-18 | 2018-03-13 | 哈尔滨工业大学 | A kind of automatic temperature-controlled solid laser system with an automatic light meter |
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| CN110829159A (en) * | 2019-10-30 | 2020-02-21 | 湖南大科激光有限公司 | Composite heat dissipation water-cooling-free laser |
| CN112310801A (en) * | 2020-11-09 | 2021-02-02 | 中国工程物理研究院应用电子学研究所 | Phase-change cooling semiconductor laser device |
| CN112670805A (en) * | 2020-12-31 | 2021-04-16 | 中国空间技术研究院 | Laser crystal direct-impact cooling type micro-channel radiator |
| CN113023666A (en) * | 2021-02-23 | 2021-06-25 | 太原理工大学 | Encapsulating method for silicon-based flat micro heat pipe |
| CN115360568A (en) * | 2022-08-25 | 2022-11-18 | 湖北华中长江光电科技有限公司 | Heat transfer device, laser module, laser array system and design method |
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| CN104218435B (en) * | 2014-09-19 | 2017-11-07 | 中国运载火箭技术研究院 | A kind of high density hot-fluid phase-change thermal storage cooling system based on strip type laser |
| CN104218435A (en) * | 2014-09-19 | 2014-12-17 | 中国运载火箭技术研究院 | High-density heat-flow phase-change heat accumulation/heat dissipation system based on slatted laser |
| CN104518424A (en) * | 2015-01-12 | 2015-04-15 | 赵立华 | Package structure of high-power semiconductor laser |
| CN107204563B (en) * | 2016-03-18 | 2019-09-20 | 清华大学 | A cooling device for solid-state laser gain medium |
| CN107204563A (en) * | 2016-03-18 | 2017-09-26 | 清华大学 | A kind of cooling device for solid state laser gain medium |
| CN110100358B (en) * | 2016-09-07 | 2021-11-12 | 罗芬新纳激光有限公司 | Resonator mirror for an optical resonator of a laser device and laser device |
| US11171461B2 (en) | 2016-09-07 | 2021-11-09 | Rofin-Sinar Laser Gmbh | Wavelength discriminating slab laser |
| CN110100358A (en) * | 2016-09-07 | 2019-08-06 | 罗芬新纳激光有限公司 | The resonator mirror and laser device of optical resonantor for laser device |
| CN107634441A (en) * | 2017-09-14 | 2018-01-26 | 中国人民解放军国防科技大学 | A phase-change cold storage thermal management system for high-power fiber lasers |
| CN107666106A (en) * | 2017-10-18 | 2018-02-06 | 哈尔滨工业大学 | A kind of 2 microns of Solid State Laser generating means of hectowatt grade |
| CN107800029A (en) * | 2017-10-18 | 2018-03-13 | 哈尔滨工业大学 | A kind of automatic temperature-controlled solid laser system with an automatic light meter |
| CN107968316A (en) * | 2017-12-27 | 2018-04-27 | 芜湖凌梦电子商务有限公司 | A kind of highly efficient cooling device of high power semiconductor medical lasers |
| US11611192B2 (en) | 2019-10-04 | 2023-03-21 | Accelsius, Llc | Embedded microfluidic distribution apparatus for passively cooling optoelectronic devices |
| CN110829159A (en) * | 2019-10-30 | 2020-02-21 | 湖南大科激光有限公司 | Composite heat dissipation water-cooling-free laser |
| CN112310801A (en) * | 2020-11-09 | 2021-02-02 | 中国工程物理研究院应用电子学研究所 | Phase-change cooling semiconductor laser device |
| CN112670805A (en) * | 2020-12-31 | 2021-04-16 | 中国空间技术研究院 | Laser crystal direct-impact cooling type micro-channel radiator |
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| CN115360568A (en) * | 2022-08-25 | 2022-11-18 | 湖北华中长江光电科技有限公司 | Heat transfer device, laser module, laser array system and design method |
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Application publication date: 20110824 |