CN102163597A - Diode series-parallel connection protection component for solar cell array - Google Patents
Diode series-parallel connection protection component for solar cell array Download PDFInfo
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- CN102163597A CN102163597A CN 201110000606 CN201110000606A CN102163597A CN 102163597 A CN102163597 A CN 102163597A CN 201110000606 CN201110000606 CN 201110000606 CN 201110000606 A CN201110000606 A CN 201110000606A CN 102163597 A CN102163597 A CN 102163597A
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- 239000002184 metal Substances 0.000 claims abstract description 38
- 229910052751 metal Inorganic materials 0.000 claims abstract description 38
- 238000000034 method Methods 0.000 claims abstract description 9
- 238000005245 sintering Methods 0.000 claims abstract description 7
- 238000010438 heat treatment Methods 0.000 claims description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 230000005855 radiation Effects 0.000 abstract description 4
- 230000000903 blocking effect Effects 0.000 abstract 5
- 239000000919 ceramic Substances 0.000 abstract 4
- 230000007704 transition Effects 0.000 abstract 4
- 230000000191 radiation effect Effects 0.000 abstract 1
- 238000003466 welding Methods 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Photovoltaic Devices (AREA)
Abstract
The invention discloses a diode series-parallel connection protection component for a solar cell array, and the diode series-parallel connection protection component comprises a plurality of series-connected bypass diodes arranged between the master positive pole end and the master negative pole end of the solar cell array, a plurality of parallel-connected blocking diodes led out from the master positive pole end, a master conductive tape, first output terminals led out from the bypass diodes and second output terminals led out from the blocking diodes, wherein a first metal transition sheet and a first ceramic sheet are arranged below each bypass diode respectively; a second metal transition sheet and a second ceramic sheet are arranged below each blocking diode respectively; the master conductive tape is electrically connected with the bypass diodes and the blocking diodes respectively by adopting the sintering process; the bypass diodes, the first metal transition sheets, the first ceramic sheets, the blocking diodes, the second metal transition sheets, the second ceramic sheets are connected with the master conductive tape and then are jointly filled on a heat radiation plate; and the first output terminals and the second output terminals are arranged on the periphery of the heat radiation plate. The diode series-parallel connection protection component is convenient to mount and excellent in heat radiation effect.
Description
Technical field
The present invention relates to integrated circuit and make the field, particularly relate to a kind of solar cell array and protect assembly with the diode connection in series-parallel.
Background technology
In recent years, the solar cell power generation The Application of Technology is promptly toward marketing development, and corresponding thereupon solar cell array is with matching component also consequentiality.These matching components occur with the form of terminal board, terminal board the inside serial connection or and connect the solar cell array protection device, link to each other with the solar cell array of outside more afterwards.At present, normally carry out heat loss through conduction by welding between the diode of terminal board and the fin, conventional manual welding is to the height of welding temperature, what of scolder, the poor timing of welding.Temperature is low excessively, weld time too short sealing-off, the rosin joint of causing easily; Temperature is too high, and weld time is oversize will cause damage to diode; In addition, the manual welding work efficiency is too slow, is not suitable for tissue production.Therefore, group's welding technology of terminal board diode being tackled key problems is the crux place that is related to quality control and organization of production.
In application number was 200510071703.4 Chinese patent, a kind of terminal board and installation method thereof of solar module disclosed.In this patent application, bypass diode constitutes by mesa naked core diode with the described mesa naked core diode pair of conductors plate that simultaneously the naked core diode is remained on therebetween that links together.Each conductor plate is superimposed upon on the terminal board on the substrate that is set up in parallel along their in-plane, applies ultrasonic wave to connect it and corresponding terminal board to the part of each stack.Therefore, welding operation can be carried out in more short-period time, has suppressed the rising of temperature thus.Do not guaranteed the reliability that connects there being connection between negative effect rectifying device and the conductor plate.And, since conductor plate by ultra-sonic welded and terminal board be connected area big than resistance welded usually, so be good at the heat dissipation characteristics that will put to get rid of terminal board by the heat extraction that the rectifying device main body produces.But, described naked core diode is that bypass two utmost points are connected in series, do not comprise solar cell array must with counnter attack fill diode, and all diodes all are installed in the terminal box, be subjected to the restriction of limited heat-dissipating space and junction box structure and material in the box, diode hot property in the box is had relatively high expectations, and solder joint is more in the box, installs inconvenient.
Summary of the invention
The objective of the invention is to, provide a kind of solar cell array easy for installation, that heat dispersion is good to protect assembly with the diode connection in series-parallel.
For solving the problems of the technologies described above, the invention provides a kind of solar cell array and protect assembly with the diode connection in series-parallel, comprise: be arranged on the total positive terminal of solar cell array and the bypass diode of a plurality of series connection between total negative pole end, each described bypass diode below is respectively arranged with the first metal transfer sheet and first potsherd; Diode is filled in the counnter attack of a plurality of parallel connections of being drawn by described total positive terminal, and the counnter attack of described a plurality of parallel connections is filled the diode below and is provided with the second metal transfer sheet and second potsherd; Adopt sintering process to fill total conductive strips that diode electrically is connected with bypass diode and counnter attack respectively; Diode, the second metal transfer sheet, second potsherd are filled in described bypass diode, the first metal transfer sheet, first potsherd, counnter attack and after described total conductive strips were connected, common can was on a heating panel; First lead-out terminal of being drawn by described bypass diode and fill second lead-out terminal that diode is drawn by described counnter attack, described first lead-out terminal and second lead-out terminal are provided with around the described heating panel.
Optionally; protect in the assembly with the diode connection in series-parallel at described solar cell array; described bypass diode, the first metal transfer sheet, first potsherd, counnter attack are filled diode, the second metal transfer sheet, second potsherd and described total conductive strips and are encapsulated in a shell inside, and described total positive terminal, total negative pole end, first lead-out terminal and second lead-out terminal are encapsulated in described shell outside.
Optionally, protect in the assembly with the diode connection in series-parallel at described solar cell array, described bypass diode is a Schottky diode, and it is big electric current diode that diode is filled in described counnter attack.
Optionally, protect in the assembly with the diode connection in series-parallel at described solar cell array, the quantity that diode is filled in described bypass diode and counnter attack is three.
Optionally, protect in the assembly with the diode connection in series-parallel at described solar cell array, the quantity of the described first metal transfer sheet and first potsherd is three, and the quantity of the described second metal transfer sheet and second potsherd is one.
Optionally, protect in the assembly with the diode connection in series-parallel at described solar cell array, described total conductive strips are the nickel plating copper strips.
Compared with prior art, the present invention has the following advantages: at first, described bypass diode, the first metal transfer sheet, first potsherd, counnter attack are filled diode, the second metal transfer sheet, second potsherd and after described total conductive strips are connected, common can is on a heating panel, that is, a plurality of bypass diodes are cascaded, a plurality of counnter attacks are filled after diode is connected in parallel, adopt can half job contract skill to be encapsulated on the heating panel, easy for installation, and help heat radiation; In addition, adopt the total conductive strips of sintering process directly to fill diode and be connected, can reduce the loss that causes because of solder joint more with bypass diode and counnter attack.
Description of drawings
Fig. 1 is the structural representation of solar cell array of the present invention with diode connection in series-parallel protection assembly;
Fig. 2 is the housing schematic diagram of solar cell array of the present invention with diode connection in series-parallel protection assembly;
Fig. 3 is the circuit diagram of solar cell array of the present invention with diode connection in series-parallel protection assembly.
Embodiment
Please refer to Fig. 1 to shown in Figure 3; wherein; Fig. 1 is the structural representation of solar cell array of the present invention with diode connection in series-parallel protection assembly; Fig. 2 is the housing schematic diagram of solar cell array of the present invention with diode connection in series-parallel protection assembly, and Fig. 3 is the circuit diagram of solar cell array of the present invention with diode connection in series-parallel protection assembly.
Described solar cell array comprises with diode connection in series-parallel protection assembly: be arranged on the total positive terminal 10 of solar cell array and the bypass diode 110 of a plurality of series connection between total negative pole end 20, each bypass diode 110 below is respectively arranged with the first metal transfer sheet 111 and first potsherd 112; Diode 120 is filled in the counnter attack of a plurality of parallel connections of being drawn by total positive terminal 10, and the counnter attack of described a plurality of parallel connections is filled diode 120 belows and is provided with the second metal transfer sheet 121 and second potsherd 122;
Described solar cell array also comprises with diode connection in series-parallel protection assembly: adopt sintering process to fill total conductive strips that diode 120 is electrically connected with bypass diode 110 and counnter attack respectively; After bypass diode 110, the first metal transfer sheet 111, first potsherd 112, counnter attack were filled diode 120, the second metal transfer sheet 121, second potsherd 122 and total conductive strips and be connected, can was on heating panel 140 jointly;
Described solar cell array also comprises with diode connection in series-parallel protection assembly: first lead-out terminal 113 of being drawn by bypass diode 110 and fill second lead-out terminal 123 that diode 120 is drawn by counnter attack, described first lead-out terminal 113 and second lead-out terminal 123 are provided with around the heating panel 140.
Described bypass diode 110, the first metal transfer sheet 111, first potsherd 112, counnter attack are filled diode 120, the second metal transfer sheet 121, second potsherd 122 and after described total conductive strips are connected, common can is on heating panel 140, promptly, a plurality of bypass diodes 110 are cascaded, a plurality of counnter attacks are filled after diode 120 is connected in parallel, and adopt can half job contract skill to be encapsulated on the heating panel 140, and are easy for installation, and, help uniform heat radiation.
Described total conductive strips employing sintering process directly fills diode 120 with bypass diode 110 and counnter attack and is connected, and can reduce the loss that causes because of solder joint more.Specifically, can adopt special-purpose scolder, the clamping apparatus sintering by special use to form, can reduce the deficiency that artificial now welding causes.Wherein, described total conductive strips are preferably the nickel plating copper strips, and described total conductive strips are made of jointly first branch 131, second branch 132, the 3rd branch 133, the 4th branch 134, quintafurcation 135, the 6th branch 136, the 7th branch 137, the 8th branch 138.Certainly, the shape of described total conductive strips and numbers of branches also are confined to foregoing description, and it can do corresponding the adjustment according to quantity and distribution situation that diode 120 is filled in bypass diode 110 and counnter attack.
Continue reference as Fig. 2, and in conjunction with Fig. 1, described bypass diode 110, the first metal transfer sheet 111, first potsherd 112, counnter attack are filled diode 120, the second metal transfer sheet 121, second potsherd 122 and described total conductive strips can on heating panel 140, and mutual encapsulation is in a shell 30 inside, and described total positive terminal 10, total negative pole end 20, first lead-out terminal 113 and 123 of second lead-out terminals are encapsulated in shell 30 outsides.Optionally, described shell 30 can by the installing hole on the heating panel 140 141 and 142 and heating panel 140 be fixedly installed togather, yet will be appreciated that described shell 30 also can adopt alternate manner to be fixed together with heating panel 140.
In a specific embodiment of the present invention, described bypass diode 110 is a Schottky diode, and counnter attack is filled diode 120 and is big electric current diode.To prevent that solar cell from producing the Schottky diode of hot spot effect; and protect the counnter attack of solar cell array to fill diode, by series connection and mode in parallel, effectively form each road terminal; can play the protection solar array, reduce the effect of discrete device loss in circuit simultaneously.Further, described bypass diode 110 is selected the less Schottky diode chip of leakage current under normal temperature and high temperature for use, and described counnter attack is filled diode 120 and selected the big and little diode chip for backlight unit of repercussion leakage current of anti-electric current for use; Further, can select process consistency preferably diode chip for backlight unit with after total conductive strips are connected, be potted on the heating panel 140 more jointly, process consistency its internal resistance of diode chip for backlight unit preferably is identical or comparatively approaching, can further eliminate the phenomenon of dispersing that causes because of each diode internal resistance is different.
Preferable, the quantity that diode 120 is filled in described bypass diode 110 and counnter attack is three, that is and, three bypass diodes 110 are cascaded, and three counnter attacks are filled diode 120 and are connected in parallel.That is, six diodes are divided into two groups, wherein, one group is the bypass diode 110 of three series connection, another group is that the counnter attack of three parallel connections is filled 120, one groups of diodes six pads are arranged, and another group also has six pads, can adopt bonding machine with two plumb joints, once weld six pads, two plumb joints are worked simultaneously, wherein one group of previous plumb joint welding, the plumb joint in back welds another group, adopts the welding manner of pipeline system; Also can be provided with plumb joint automatic temperature-adjusting control on the described bonding machine, control the welding of plumb joint automatic lifting automatically weld time, scolder is given automatically, and weldment is sent automatically and waited device, with the welding quality of each diode in the raising production process.
Accordingly, the quantity of the described first metal transfer sheet 111 and first potsherd 112 also is three, and the quantity of the described second metal transfer sheet 121 and second potsherd 122 then is one.That is, each bypass diode 110 below is disposed with one the first metal transfer sheet 111 and first potsherd 112; It then is second potsherd 122 that then shared one second metal transfer sheet, 121, the second metal transfer sheets of diode 120 121 belows are filled in the counnter attack of three parallel connections; After above-mentioned device linked together with total conductive strips, common again can was on heating panel 140, and detailed, described can promptly is with fill material (as resin glue) above-mentioned device all to be cast in together.The described first metal transfer sheet 111 and the second metal transfer sheet 121 can be used for eliminating chip and the damage that cause different with the conducting metal thermal coefficient of expansion.
Need to prove, be example although the foregoing description fills diode with three bypass diodes and three counnter attacks, and the quantity of diode of the present invention is not restricted to this, and described bypass diode and counnter attack are filled the quantity of diode and also can be adjusted accordingly.
Obviously, those skilled in the art can carry out various changes and modification to the present invention and not break away from the spirit and scope of the present invention.Like this, if of the present invention these are revised and modification belongs within the scope of claim of the present invention and equivalent technologies thereof, then the present invention also is intended to comprise these changes and modification interior.
Claims (6)
1. a solar cell array is protected assembly with the diode connection in series-parallel, comprising:
Be arranged on the total positive terminal of described solar cell array and the bypass diode of a plurality of series connection between total negative pole end, each described bypass diode below is respectively arranged with the first metal transfer sheet and first potsherd;
Diode is filled in the counnter attack of a plurality of parallel connections of being drawn by described total positive terminal, and the counnter attack of described a plurality of parallel connections is filled the diode below and is provided with the second metal transfer sheet and second potsherd;
Adopt sintering process to fill total conductive strips that diode electrically is connected with described bypass diode and counnter attack respectively;
Diode, the second metal transfer sheet, second potsherd are filled in described bypass diode, the first metal transfer sheet, first potsherd, counnter attack and after described total conductive strips were connected, common can was on a heating panel;
First lead-out terminal of being drawn by described bypass diode and fill second lead-out terminal that diode is drawn by described counnter attack, described first lead-out terminal and second lead-out terminal are provided with around the described heating panel.
2. solar cell array as claimed in claim 1 is protected assembly with the diode connection in series-parallel; it is characterized in that; described bypass diode, the first metal transfer sheet, first potsherd, counnter attack are filled diode, the second metal transfer sheet, second potsherd and described total conductive strips and are encapsulated in a shell inside, and described total positive terminal, total negative pole end, first lead-out terminal and second lead-out terminal are encapsulated in described shell outside.
3. the solar cell array described in claim 1 is characterized in that with diode connection in series-parallel protection assembly described bypass diode is a Schottky diode, and it is big electric current diode that diode is filled in described counnter attack.
4. solar cell array as claimed in claim 3 is characterized in that with diode connection in series-parallel protection assembly the quantity that diode is filled in described bypass diode and counnter attack is three.
5. solar cell array as claimed in claim 4 is characterized in that with diode connection in series-parallel protection assembly the quantity of the described first metal transfer sheet and first potsherd is three, and the quantity of the described second metal transfer sheet and second potsherd is one.
6. solar cell array as claimed in claim 1 is characterized in that with diode connection in series-parallel protection assembly described total conductive strips are the nickel plating copper strips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110000606 CN102163597A (en) | 2011-01-04 | 2011-01-04 | Diode series-parallel connection protection component for solar cell array |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110000606 CN102163597A (en) | 2011-01-04 | 2011-01-04 | Diode series-parallel connection protection component for solar cell array |
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| Publication Number | Publication Date |
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| CN102163597A true CN102163597A (en) | 2011-08-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201110000606 Pending CN102163597A (en) | 2011-01-04 | 2011-01-04 | Diode series-parallel connection protection component for solar cell array |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103560158A (en) * | 2013-11-05 | 2014-02-05 | 深圳市昂特尔太阳能投资有限公司 | Brink type high-power concentrating solar power thermoelectric separation receiver |
| CN108010975A (en) * | 2017-12-30 | 2018-05-08 | 常州星海电子股份有限公司 | A kind of solar power generation component bypass diode |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2924794Y (en) * | 2006-07-05 | 2007-07-18 | 阿特斯太阳能光电(苏州)有限公司 | solar cell module |
| CN101271982A (en) * | 2007-03-19 | 2008-09-24 | 思柏科技股份有限公司 | Fuel cell with protective device |
| US20100282293A1 (en) * | 2009-01-21 | 2010-11-11 | Tenksolar | Illumination agnostic solar panel |
| CN201936880U (en) * | 2011-01-04 | 2011-08-17 | 黑龙江八达通用微电子有限公司 | Diode series-parallel connection protection component for solar cell array |
-
2011
- 2011-01-04 CN CN 201110000606 patent/CN102163597A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2924794Y (en) * | 2006-07-05 | 2007-07-18 | 阿特斯太阳能光电(苏州)有限公司 | solar cell module |
| CN101271982A (en) * | 2007-03-19 | 2008-09-24 | 思柏科技股份有限公司 | Fuel cell with protective device |
| US20100282293A1 (en) * | 2009-01-21 | 2010-11-11 | Tenksolar | Illumination agnostic solar panel |
| CN201936880U (en) * | 2011-01-04 | 2011-08-17 | 黑龙江八达通用微电子有限公司 | Diode series-parallel connection protection component for solar cell array |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103560158A (en) * | 2013-11-05 | 2014-02-05 | 深圳市昂特尔太阳能投资有限公司 | Brink type high-power concentrating solar power thermoelectric separation receiver |
| CN103560158B (en) * | 2013-11-05 | 2015-10-21 | 深圳市昂特尔太阳能投资有限公司 | A kind of avris type high concentration solar thermoelectricity is separated receiver |
| CN108010975A (en) * | 2017-12-30 | 2018-05-08 | 常州星海电子股份有限公司 | A kind of solar power generation component bypass diode |
| CN108010975B (en) * | 2017-12-30 | 2024-01-26 | 常州星海电子股份有限公司 | A bypass diode for solar power generation components |
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Application publication date: 20110824 |