CN102147421B - Thermal type wind sensor based on anisotropic heat-conducting substrate and preparation method therefor - Google Patents
Thermal type wind sensor based on anisotropic heat-conducting substrate and preparation method therefor Download PDFInfo
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Abstract
本发明公开一种基于各向异性导热衬底的热式风传感器，传感器芯片包含各向异性导热衬底，在各向异性导热衬底上表面于中心对称分布有4个加热元件，4个加热元件四周对称分布有4个热传感测温元件，各向异性导热衬底背面与外界环境进行接触，对风速和风向进行检测，在各向异性导热衬底中加热元件和热传感测温元件下方硅衬底之间镶嵌有玻璃隔热内环，在热传感测温元件下方硅衬底和芯片边缘硅衬底之间镶嵌有玻璃隔热外环，这两个玻璃隔热环一方面能够保证各向异性衬底利用减薄工艺减薄至100微米左右厚度，另一方面能够降低传感器的总功耗，使得传感器在较低功耗下保持较大的信号灵敏度和较小的热响应时间。
The invention discloses a thermal wind sensor based on an anisotropic heat-conducting substrate. The sensor chip includes an anisotropic heat-conducting substrate. On the upper surface of the anisotropic heat-conducting There are 4 heat-sensing and temperature-measuring elements symmetrically distributed around the element. The back of the anisotropic heat-conducting substrate is in contact with the external environment to detect the wind speed and direction. A glass heat-insulating inner ring is inlaid between the silicon substrates under the element, and a glass heat-insulating outer ring is inlaid between the silicon substrate under the heat-sensing and temperature-measuring element and the silicon substrate on the edge of the chip. These two glass heat-insulating rings are one On the one hand, it can ensure that the anisotropic substrate is thinned to a thickness of about 100 microns by thinning process; Response time.
Description
Technical field
The present invention relates to a kind of hot type wind speed wind direction sensor that is prepared in a kind of anisotropy thermal conductive substrate structure, relate in particular to realizing from wind speed wind direction sensor that encapsulates and preparation method thereof of a kind of low-power consumption.
Background technology
In the design of hot type wind speed wind direction sensor, encapsulation is the technical bottleneck that hinders its development all the time.Its encapsulating material namely requires to have good heat-conductive characteristic on the one hand; require that again sensor is had protective effect; and also need to consider encapsulating material to the impact of the aspects such as transducer sensitivity, reliability and price in the design, this has just limited the degree of freedom of sensor self package design.On the other hand, thermal flow rate sensor requires the responsive part of sensor to be exposed in the measurement environment, requires again the isolation for the treatment of circuit and environment simultaneously, in order to avoid affect the performance for the treatment of circuit, both have produced contradiction to the requirement of encapsulation.
The silicon wind speed wind direction sensor of report mostly was directly exposed to the sensing surface of silicon chip in the physical environment in the past, in order to can change by the extraneous wind speed of perception.So, silicon chip is easy to be subject to various pollutions, causes the unstable of its performance, even damages.If adopt the higher ceramic substrate of thermal conductivity, the mode of utilizing flip chip bonding encapsulation or heat-conducting glue to attach encapsulates the sensor silicon, just can avoid preferably above-mentioned contradiction, but the heat overwhelming majority that sensor produces after the encapsulation dissipates from silicon-based substrate in heat conducting mode, only there is a very little part to carry out heat interchange by pottery and outside air, greatly reduce the amplitude of output sensitive signal, can improve the amplitude of sensitive signal by the power consumption that increases sensor, but cause the larger power consumption of whole sensing system.
Summary of the invention
The purpose of this invention is to provide a kind of prepare the anisotropy thermal conductive substrate structural can realize from encapsulation based on hot type wind sensor of anisotropy thermal conductive substrate and preparation method thereof, the sensor construction of design and packing forms are conducive to when guaranteeing larger sensitive signal amplitude, and sensing system has lower power consumption.
The present invention adopts following technical scheme:
A kind of hot type wind sensor based on the anisotropy thermal conductive substrate, comprise the anisotropy thermal conductive substrate, be inlaid with ring and glass heat-proof outer shroud in the glass heat-proof around Central Symmetry in the substrate of described anisotropy thermal conductive substrate, and, ring is divided into the silicon substrate between the ring and glass heat-proof outer shroud in the center silicon substrate of anisotropy thermal conductive substrate and the glass heat-proof with the anisotropy thermal conductive substrate in the described glass heat-proof, the center silicon substrate lower surface of anisotropy thermal conductive substrate is provided with 4 heating elements around Central Symmetry, silicon substrate lower surface in the glass heat-proof between ring and the glass heat-proof outer shroud is provided with 4 hot sensing temperature elements around 4 heating elements, being provided with electricity at the border area of anisotropy thermal conductive substrate draws and uses pad, wherein electricity is drawn with pad and is comprised of platinum layer and gold layer, and 4 heating elements are drawn with pad with electricity by the metal lead wire at the anisotropy thermal conductive substrate back side with 4 hot sensing temperature elements and linked to each other.
A kind of preparation method of the hot type wind sensor based on the anisotropy thermal conductive substrate is as follows:
The first step, the preparation of anisotropy thermal conductive substrate
Step 1 utilizes the DRIE dry etch process to prepare annular inside groove and annular water jacket about 100 microns at the silicon front surface;
Step 4, utilize mechanical reduction technique remove in the annular inside groove and annular water jacket in beyond other glass;
Second step, the preparation of heating element and hot sensing temperature element
Step 1 is coated with photoresist and exposure at the anisotropy thermal conductive substrate upper surface for preparing and carries out graphically, exposes preparation heating element, hot sensing temperature element and electricity and draws zone with pad;
Step 4 is coated with photoresist and exposure and carries out graphically, exposes the electric zone of drawing with pad of preparation;
In the 3rd step, manufacturing of the fiber grating sensors is finished in scribing.
The present invention is that a kind of anisotropy thermal conductive substrate structure in design realizes from the wind speed wind direction sensor of encapsulation and the scheme of preparation thereof.The back side of the anisotropy thermal conductive substrate of sensor chip contacts with the wind facies in the external environment, 4 heating elements and 4 hot sensing temperature elements utilize stripping technology to be prepared in the front surface of anisotropy thermal conductive substrate, the heat that heating element produces carries out heat interchange by the silica-based back side and the external environment that conducts to the anisotropy thermal conductive substrate in the anisotropy thermal conductive substrate, when external environment has wind to exist, will form the temperature gradient distribution along the wind direction direction at the back side of anisotropy thermal conductive substrate, this Temperature Distribution field can be by the silica-based front surface that conducts to the anisotropy thermal conductive substrate in the anisotropy thermal conductive substrate, hot sensing temperature element just can detect the variation in this temperature field, and then obtains the information of wind speed and direction.In the preparation process of anisotropy thermal conductive substrate, utilize embedding glass technique in silicon substrate, to prepare ring and glass heat-proof outer shroud in the glass heat-proof, the interior ring of glass heat-proof and glass heat-proof outer shroud can intercept the transverse heat transfer effect of chip substrate on the one hand, ring and glass heat-proof outer shroud also provide necessary mechanical support for silicon substrate in the glass heat-proof in attenuate and chip scribing processes on the other hand, guaranteed silicon substrate can be thinned to about 100 microns state and in scribing processes so that chip do not break, the overall thermal capacity that is conducive to reduce the overall power of chip and reduces chip, the thermal response time of shortening sensor.The heat insulation interior ring of incrusted glass between the silicon substrate of the heating element of anisotropy thermal conductive substrate upper surface and below, hot sensing temperature element position, can intercept heating element and hot sensing temperature element the below silicon substrate between transverse heat transfer, so that the heat overwhelming majority that heating element produces can conduct to the anisotropy thermal conductive substrate back side and produce heat interchange with external environment, with the size and Orientation for detection of the external environment wind speed, ring can increase the heat of heating element generation in the conduction total amount of longitudinal direction in the glass heat-proof, and then can increase the heat interchange total amount of heating element and external environment, be conducive to reduce the overall power consumption of sensor.Be inlaid with the glass heat-proof outer shroud between the silicon substrate of the hot sensing temperature element below of anisotropy thermal conductive substrate upper surface and the chip edge silicon substrate, heat and the conduction of the heat between the chip exterior environment for the silicon substrate that intercepts hot sensing temperature element below, and then so that the signal of the Temperature Distribution field that forms at the anisotropy thermal conductive substrate back side can the heat-conduction effect of the semaphore overwhelming majority by silicon substrate be conducted to hot sensing temperature element by the silicon substrate below the hot sensing temperature element, therefore the structural design of glass heat-proof outer shroud can be so that sensor keeps a larger semaphore and signal sensitivity in the situation of lower power consumption, and reduces the thermal response time of sensor.The structure of sensor of the present invention is applicable to prepare the wind speed wind direction sensor of two dimension.
The present invention obtains following effect:
1. in the preparation process of anisotropy thermal conductive substrate, utilize embedding glass technique in silicon substrate, to prepare ring and glass heat-proof outer shroud in the glass heat-proof, the interior ring of glass heat-proof and glass heat-proof outer shroud can intercept the transverse heat transfer effect of chip substrate on the one hand, ring and glass heat-proof outer shroud also provide necessary mechanical support for silicon substrate in the glass heat-proof in attenuate and chip scribing processes on the other hand, guaranteed silicon substrate can be thinned to about 100 microns state and in scribing processes so that chip do not break, the overall thermal capacity that is conducive to reduce the overall power of chip and reduces chip, the thermal response time of shortening sensor.
The heating element of anisotropy thermal conductive substrate upper surface and hot sensing temperature element position the below silicon substrate between the heat insulation interior ring of incrusted glass, can intercept heating element and hot sensing temperature element the below silicon substrate between transverse heat transfer, so that the heat overwhelming majority that heating element produces can conduct to the anisotropy thermal conductive substrate back side and produce heat interchange with external environment, with the size and Orientation for detection of the external environment wind speed, ring can increase the heat of heating element generation in the conduction total amount of longitudinal direction in the glass heat-proof, and then can increase the heat interchange total amount of heating element and external environment, be conducive to reduce the overall power consumption of sensor.
3. be inlaid with the glass heat-proof outer shroud between the silicon substrate of the hot sensing temperature element below of anisotropy thermal conductive substrate upper surface and the chip edge silicon substrate, heat and the conduction of the heat between the chip exterior environment for the silicon substrate that intercepts hot sensing temperature element below, and then so that the signal of the Temperature Distribution field that forms at the anisotropy thermal conductive substrate back side can the heat-conduction effect of the semaphore overwhelming majority by silicon substrate be conducted to hot sensing temperature element by the silicon substrate below the hot sensing temperature element, therefore the structural design of glass heat-proof outer shroud can be so that sensor keeps a larger semaphore and signal sensitivity in the situation of lower power consumption, and reduces the thermal response time of sensor.
Traditional hot type wind speed wind direction sensor, heating element is produced on the silicon base chip surface, aspect the hot conduction of reduction silicon-based substrate, a kind of method is to utilize wet corrosion technique to prepare heat insulation cavity at the silicon back side and heating element corresponding region, its shortcoming is that the thermoinduction film of preparing is too fragile, thermal stress is larger on the impact of input, and can't realize packaging of the fiber grating sensors.Another kind method is preparation porous silicon thermofin below heating element, because preparation technology's consistance of hole silicon is relatively poor, has therefore improved the difficulty of rear end sensor signal conditioning.The sensor construction that the present invention proposes, in silicon substrate, utilize embedding glass technique to prepare in the glass heat-proof ring structure outside ring and the glass heat-proof, can guarantee in the process of silicon substrate being carried out attenuate and chip scribing, to provide the mechanical support of necessity, make the Anisotropic substrate of chip reach thickness about 100 microns by reduction process, greatly reduce the power consumption of sensor, and guarantee that sensor has good signal sensitivity and less thermal response time; Ring is between the silicon substrate below heating element and the hot sensing temperature element in the glass heat-proof, the glass heat-proof outer shroud is below the hot sensing temperature element between silicon substrate and the chip edge silicon substrate, what the structural design of ring and glass heat-proof outer shroud can make heat maximal efficiency that heating element produces on the one hand in the glass heat-proof conducts to the anisotropy thermal conductive substrate back side and external environment generation heat interchange and then the size of detection external environment wind speed and the information of wind direction, on the other hand so that the Temperature Distribution field energy that the anisotropy thermal conductive substrate back side forms conducts to hot sensing temperature element with temperature distribution signal by silicon substrate enough effectively, maximal efficiency the Temperature Distribution field is detected, the power consumption that the structural design of ring and glass heat-proof outer shroud can effectively reduction sensor in such glass heat-proof, and so that sensor has larger output signal and less thermal response time in the lower power consumption situation.
Description of drawings
Fig. 1 is the preparation flow of anisotropy thermal conductive substrate.
Fig. 2 is the preparation flow at anisotropy thermal conductive substrate preparation heating element and temperature element.
Fig. 3 is for preparing the top view of the silicon of finishing.
Monolithic sensor chip after the final scribing of Fig. 4.
Embodiment
Embodiment 1
A kind of preparation method of the hot type wind sensor based on the anisotropy thermal conductive substrate is as follows:
The first step, the preparation of anisotropy thermal conductive substrate, as shown in Figure 1
Step 1 utilizes the DRIE dry etch process to prepare annular inside groove 2 and annular water jacket 3 about 100 microns at silicon 1 front surface;
Step 4, utilize mechanical reduction technique remove in the annular inside groove 2 and annular water jacket 3 in beyond other glass;
Second step, the preparation of heating element and hot sensing temperature element, as shown in Figure 2
Step 1 is coated with photoresist 8 and exposure at anisotropy thermal conductive substrate 7 upper surfaces that prepare and carries out graphically, exposes preparation heating element 10, hot sensing temperature element 11 and electricity and draws zone with pad 15;
Step 4 is coated with photoresist 13 and exposure and carries out graphically, exposes the electric zone of drawing with pad 15 of preparation;
In the 3rd step, manufacturing of the fiber grating sensors is finished in scribing, as shown in Figure 4.
Traditional hot type wind speed wind direction sensor, the form and the ceramic chip that generally directly utilize flip chip bonding upside-down mounting or heat-conducting glue to attach are realized encapsulation.Because the thermal conductivity far of silicon is much larger than the thermal conductivity of pottery, therefore the heat overwhelming majority that heating element produces on the silicon after the encapsulation dissipates in heat conducting mode from silicon substrate, only only have a small amount of heat to produce the thermal convection heat exchange by ceramic chip and air, greatly reduce so on the one hand the output signal of sensor, improve on the other hand the operating power of sensor, reduced the usefulness of sensor.Based on this problem, forefathers propose at silicon substrate back side making cavity or make one deck porous silicon for reducing the heat conduction of silicon substrate under heating element, like this because preparation technology's consistance of porous silicon is very poor, the signal condition of later stage sensor has been brought very large difficulty.
The present invention is that a kind of anisotropy thermal conductive substrate structure in design realizes the scheme from the wind speed wind direction sensor preparation of encapsulation.The back side of the anisotropy thermal conductive substrate 7 of sensor chip contacts with the wind facies in the external environment, 4 heating elements 10 and 4 hot sensing temperature elements 11 utilize stripping technology to be prepared in the front surface of anisotropy thermal conductive substrate 7, it is symmetrical to be four limits in chip center, the heat that heating element 10 produces carries out heat interchange by the back side and external environment that the silicon substrate in the anisotropy thermal conductive substrate 7 conducts to anisotropy thermal conductive substrate 7, when external environment has wind to exist, will form the temperature gradient distribution along the wind direction direction at the back side of anisotropy thermal conductive substrate 7, this Temperature Distribution field can be by the silica-based front surface that conducts to anisotropy thermal conductive substrate 7 in the anisotropy thermal conductive substrate 7, hot sensing temperature element 11 just can detect the variation in this temperature field, and then obtains the information of wind speed and direction.Below the position of the heating element 10 of anisotropy thermal conductive substrate 7 upper surfaces and hot sensing temperature element 11, be inlaid with ring 5 and glass heat-proof outer shroud 6 in the glass heat-proof between the silicon substrate, be used for intercepting the transverse heat transfer between heating element 10 and the hot sensing temperature element 11 below silicon substrates, strengthen the heat of heating element 10 generations in the conduction total amount of longitudinal direction, so such structural design can increase the heat of heating element 10 generations and the heat interchange total amount of external environment, and the conduction of the heat between the heat in the obstruct chip and the chip external environment, and then can make sensor can under lower power consumption, obtain the signal of larger sensitivity, and keep lower thermal response time.
A kind of hot type wind speed wind direction sensor based on anisotropy thermal conductive substrate structure, comprise anisotropy thermal conductive substrate 7, be inlaid with ring 5 and glass heat-proof outer shroud 6 in the glass heat-proof around Central Symmetry in described anisotropy thermal conductive substrate 7 substrates, and, ring 5 is divided into the silicon substrate between the ring 5 and glass heat-proof outer shroud 6 in the center silicon substrate of anisotropy thermal conductive substrate 7 and the glass heat-proof with anisotropy thermal conductive substrate 7 in the described glass heat-proof, the center silicon substrate lower surface of anisotropy thermal conductive substrate 7 is provided with 4 heating elements 10 around Central Symmetry, silicon substrate lower surface in the glass heat-proof between ring 5 and the glass heat-proof outer shroud 6 is provided with 4 hot sensing temperature elements 11 around 4 heating elements 10, being provided with electricity at the border area of anisotropy thermal conductive substrate 7 draws with pad 15, wherein electricity is drawn with pad 15 and is comprised of platinum layer 12 and gold layer 16, and 4 heating elements 10 are drawn with pad 15 with electricity by the metal lead wire at anisotropy thermal conductive substrate 7 back sides with 4 hot sensing temperature elements 11 and linked to each other.
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| TWI495056B (en) * | 2012-04-24 | 2015-08-01 | Genesis Photonics Inc | Substrate structure |
| CN105628619B (en) * | 2015-12-28 | 2018-11-06 | 太仓耀华玻璃有限公司 | The monitoring method of vacuum glass insulation performance |
| CN105547371B (en) * | 2016-01-19 | 2018-05-08 | 东南大学 | Two-dimentional hot type wind speed wind direction sensor based on ceramic package and preparation method thereof |
| CN105675917B (en) * | 2016-01-19 | 2018-11-16 | 东南大学 | A kind of hot type air velocity transducer and its packaging method |
| JP7365049B2 (en) * | 2020-03-25 | 2023-10-19 | ホルトプラン合同会社 | Thermal flow rate/flow sensor |
| CN113092809B (en) * | 2021-04-09 | 2022-07-22 | 东南大学 | Membrane wind speed and direction sensor with front-side wind-sensing back-lead and its manufacturing method |
| CN115655478B (en) * | 2022-12-23 | 2023-03-21 | 苏州森斯缔夫传感科技有限公司 | Infrared sensor, temperature fluctuation resistance method and temperature measuring instrument |
| CN116639644B (en) * | 2023-05-18 | 2024-10-29 | 南京理工大学 | Thermoelectric refrigeration substrate structure for MEMS inertial sensor and manufacturing method thereof |
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| CN1588091A (en) * | 2004-10-14 | 2005-03-02 | 东南大学 | Wind speed sensor based on micro mechanic working and its producing method |
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