CN102069013B - 金属合金催化剂组合物 - Google Patents
金属合金催化剂组合物 Download PDFInfo
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- CN102069013B CN102069013B CN2010105712983A CN201010571298A CN102069013B CN 102069013 B CN102069013 B CN 102069013B CN 2010105712983 A CN2010105712983 A CN 2010105712983A CN 201010571298 A CN201010571298 A CN 201010571298A CN 102069013 B CN102069013 B CN 102069013B
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- Prior art keywords
- catalyst
- perhaps
- metal alloy
- carbon monoxide
- olefin polymeric
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- 239000003054 catalyst Substances 0.000 title claims abstract description 58
- 229910001092 metal group alloy Inorganic materials 0.000 title claims description 39
- 239000000203 mixture Substances 0.000 title abstract description 21
- 229910052751 metal Inorganic materials 0.000 claims abstract description 36
- 239000002184 metal Substances 0.000 claims abstract description 36
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- 229920003303 ion-exchange polymer Polymers 0.000 claims abstract description 24
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 15
- 229910052799 carbon Inorganic materials 0.000 claims description 14
- 239000010931 gold Substances 0.000 claims description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 11
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 11
- 229910052697 platinum Inorganic materials 0.000 claims description 11
- 239000011324 bead Substances 0.000 claims description 10
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- 150000002739 metals Chemical class 0.000 claims description 7
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- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 2
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- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 claims description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 2
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 claims description 2
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Abstract
本发明涉及金属合金掺杂的非均相催化剂的制备及其使用方法。具体来说,本发明涉及廉价的金属合金掺杂的离子交换树脂催化剂的制备和使用方法,相对于之前使用的催化剂,本发明的催化剂能够提供类似的产率和选择性。
Description
技术领域
本发明涉及金属合金掺杂的催化剂的制备及其使用方法。具体来说,本发明涉及廉价的金属合金掺杂的离子交换树脂催化剂的制备和使用方法,相对于之前使用的催化剂,本发明的催化剂能够提供类似的产率和选择性。
背景技术
醇醛缩合反应包括使得一个羰基化合物的α-碳加成到另一个羰基化物的羰基碳上,由此使得羰基化合物(醛或酮)二聚,从而制得β-羟基羰基化合物。对于在存在酸性催化剂的条件下进行两个酮的缩合的情况,通常会在二聚之后发生脱水,制得α,β-不饱和酮;可以通过常规的方法还原双键,制得饱和酮加成物。
在美国专利第6,977,314号中描述了一种相较于使用常规的单磺化离子交换树脂催化剂的情况,提高丙酮缩合反应制得的甲基-异丁基酮的产率的尝试。美国专利第6,977,314号揭示了使用一种多磺化的离子交换树脂,所述树脂包含至少5.0毫当量的磺酸基/克催化剂,加载有钯之类的金属。选择的金属独立使用,是昂贵的材料。人们需要一种方法,该方法能够使用金属合金进行掺杂,同时保持催化剂的寿命、选择性和产率,并且提高成本效率。
本发明提供了一种可以用来制备各种反应产物的加载了廉价金属合金的催化剂,从而解决了现有技术的缺陷。
发明内容
本发明提供了一种非均相催化剂组合物,该组合物包含:
(a)离子交换树脂;和
(b)金属合金,以催化剂的干重为基准计;
其中在化学反应中,催化剂组合物与反应物反应。
具体实施方式
在本说明书中,除非上下文明确有不同的说明,以下术语具有下述含义:
术语″交联的聚合物基质″表示任何交联的聚合基材,所述基材可以很方便地进行官能化,提供多磺化的、单磺化的、或者部分磺化的芳环,以及任意的交联的聚合基材,所述基材可以很方便地官能化,提供具有胺官能团的芳环;通常所述交联的聚合物基质是交联的苯乙烯类聚合物,其中对芳环施加磺化条件,提供可以用于本发明工艺的催化剂。
术语“离子交换树脂”表示具有离子交换官能团的交联的聚合物基质。
术语″共聚物″表示包含两种或更多种不同的单体(包括位置异构体)的单元的聚合物组合物。
术语″交联的共聚物″表示由单体或单体混合物聚合形成的聚合物或共聚物,以单体总重量为基准计,所述单体或单体混合物包含至少1重量%的多乙烯基不饱和单体。
术语″大孔的″表示具有以下性质的材料:通过BET技术(基于StephenBrunauer,Paul Hugh Emmett和Edward Teller在1938的公开内容)测得表面积大于0.1m2/g且小于2000m2/g。通常本发明的大孔树脂催化剂的表面积为1-200m2/g。
术语″(甲基)丙烯酸烷基酯″表示相应的丙烯酸酯或甲基丙烯酸酯;类似地,术语″(甲基)丙烯酸类″表示丙烯酸类或甲基丙烯酸类以及相应的衍生物,例如酯或酰胺。
术语″掺杂的″表示在聚合物载体中加入金属物质。
术语″浸渍的″表示金属可以络合在聚合载体中,或者在聚合载体中作为金属结构。
术语“金属合金”的含义与‘金属钠米簇’或‘金属纳米合金’相同。如本文所定义,金属合金是结合在单独的纳米尺寸簇中的两种或更多种金属。金属合金的纳米簇尺寸为1-250纳米。另外,这是一种金属产物,其包含(1)作为固体、(2)作为金属间化合物、或(3)作为金属相混合物形式的两种或更多种元素。
除非另外说明,所有的百分数都是以包含的聚合物或组合物的总重量为基准计的重量百分数(%)。本发明中使用了以下缩写:g=克,μm=微米,cm=厘米,mm=毫米,m=米,nm=纳米,ml=毫升,meq/g=毫当量/克,L=升,1巴压力=105帕斯卡或105Pa,1巴=1MPa,LHSV=线性时空速(小时-1)=液体流速(毫升/小时)/柱内催化剂体积(毫升),长宽比=长度/宽度。
除非另外说明,所列的范围包括端值并且可以互相组合,温度的单位是摄氏度(℃)。
可以用于本发明的一步反应的反应工艺及其顺次组合的非限制性例子包括异构化,水合作用,醇醛缩合,脱水,氢解,硝酸盐还原,碳-碳偶连(即赫克-铃木反应(Heck and Suzuki reaction)),氧化,加氢甲酰化,烯烃、酮、醇、炔和酸的选择性还原。通过本发明的催化反应制备的产物包括但不限于过氧化氢,1,4-丁二醇,乙酸乙烯酯,烷基酚,甲基异丁基酮(MIBK),天然清洁剂醇。
可以用于本发明的反应工艺的掺杂了金属合金的非均相催化剂是具有磺化官能团的离子交换树脂;也即是说,负载着催化剂位点的交联的聚合物基质包含芳环,每个芳环上包含大于0的磺酸基。通常对于至少10%,或者至少15%,或者至少20%的芳环,每个芳环包含大于1个磺酸基。所述离子交换树脂可以是强碱性阴离子交换树脂或者强酸性阳离子交换树脂。或者,可以用于本发明的反应工艺的掺杂了金属合金的非均相催化剂是具有胺官能团的离子交换树脂;也即是说,负载着催化剂位点的交联的聚合物基质包含芳环,芳环上包含胺基。
可以用于本发明工艺的掺杂了金属合金的非均相催化剂可以是凝胶或者大孔珠粒、膜、片状物、薄膜或者纤维的形式。本发明合适的金属合金掺杂的非均相催化剂的平均粒径为10μm至1000μm,或者为500μm至1000μm,或者为750μm至1000μm;以离子交换树脂的干重为基准计,磺酸基团含量为1.0-7.0meq/g,或者为5.1-6.5meq/g,或者为5.2-6.0meq/g;通常其表面积为0-2000,或者0.1-2000,或者1-700,或者10-600平方米/克(m2/g);总孔隙率为0.1-0.9,或者为0.2-0.7,或者为0.25-0.5立方厘米孔/克聚合物(cm3/g);通常树脂中交联剂的比例占催化剂组合物总量的0.5-80%,5-30%,10-20%;水分保持容量为80-30%,或者为70-40%,或者为55-45%;重量容量为0.5-7.0meq/Kg,或者为1-6meq/Kg,或者为2-5meq/Kg;平均孔径为50-2,500埃单位,或者为150-1000埃单位。根据IUPAC(国际纯化学和应用化学联合会(International Union of Pure and AppliedChemistry))命名法,孔隙率定义如下:
微孔=小于20埃单位的孔;中孔=20-500埃单位的孔;大孔=大于500埃单位的孔。
以离子交换树脂的干重为基准计,本发明的催化剂加载了0.1-25%,或者0.5-15%,或者1.0-10.0%的金属合金。理想情况下,金属合金可以加载在离子交换树脂颗粒的外壳上,或者均匀地分散在颗粒中。对于金属合金本身,通常由0.5-100%的金属组成,或者由80-100%的金属组成,或者由90-100%的金属组成。本发明的金属合金组合物的金属簇尺寸为1-150纳米、或者1-50纳米、或者1-10纳米。
所述金属合金掺杂的离子交换树脂通常由交联的大孔共聚物制备,如美国专利第4,382,124号所述的那些,其中,通过在存在成孔剂(porogen)的情况下进行悬浮聚合,在共聚物珠粒中引入孔隙率(所述成孔剂也被称为″相补充剂″或″沉淀剂″),也即是说,所述成孔剂是用于单体的溶剂,但是对于聚合物来说不是溶剂。
例如,常规的交联大孔共聚物的制备可以包括制备包含悬浮助剂(例如分散剂,保护胶体和缓冲剂)的连续水相溶液,然后与包含以下组分的单体混合物混合:1-85%的多乙烯基芳族单体,自由基引发剂,以及通常0.2-5份、或者0.3-3份、或者0.4-1份的成孔剂(例如甲苯,二甲苯,(C4-C10)-链烷醇,(C6-C12)-饱和烃或聚亚烷基二醇)/1份单体。然后使得所述单体与成孔剂的混合物在升高的温度下聚合,然后通过各种方法将成孔剂从制得的聚合物珠粒中除去;例如,可以通过蒸馏或者溶剂洗涤除去甲苯、二甲苯和(C4-C10)醇,通过水洗除去聚亚烷基二醇。然后通过常规的方式,例如脱水、然后干燥,分离制得的大孔共聚物。
可以用来制备交联的共聚物的合适的多乙烯基芳族单体包括例如,选自以下的一种或多种单体:二乙烯基苯,三乙烯基苯,二乙烯基甲苯,二乙烯基萘和二乙烯基二甲苯;需要理解上述各种交联剂的任意的位置异构体也是合适的;或者所述多乙烯基芳族单体是二乙烯基苯。通常交联的共聚物包含1-85%,或者5-55%,或者10-25%的多乙烯基芳族单体单元。
任选的,除了多乙烯基芳族交联剂以外,还可以使用非芳族交联单体,例如二丙烯酸乙二醇酯,二甲基丙烯酸乙二醇酯,三丙烯酸三羟甲基丙烷酯,三甲基丙烯酸三羟甲基丙烷酯,二甘醇二乙烯基醚和三乙烯基环己烷。当使用的时候,以用来形成大孔共聚物的单体总重量为基准计,所述非芳族交联单体通常占大孔聚合物的0-10%,或者0-5%,或者0-2%,作为聚合单元。
可以用来制备交联的共聚物的合适的单不饱和乙烯基芳族单体包括例如苯乙烯,α-甲基苯乙烯,(C1-C4)烷基取代的苯乙烯,卤素取代的苯乙烯(例如二溴苯乙烯和三溴苯乙烯),乙烯基萘和乙烯基蒽;或者所述单不饱和的乙烯基芳族单体选自下组中的一种或更多种组分:苯乙烯和(C1-C4)烷基取代的苯乙烯。合适的(C1-C4)烷基取代的苯乙烯包括例如乙基乙烯基苯,乙烯基甲苯,二乙基苯乙烯,乙基甲基苯乙烯和二甲基苯乙烯;需要理解,上述各种乙烯基芳族单体的任意各种位置异构体都是合适的。
或者,所述共聚物包含15-99%,或者75-90%的单不饱和乙烯基芳族单体单元。
任选的,除了乙烯基芳族单体以外,还可以使用非芳族单不饱和乙烯基单体,例如脂族不饱和单体,例如氯乙烯,丙烯腈,(甲基)丙烯酸和(甲基)丙烯酸烷基酯。当使用的时候,以用来形成大孔共聚物的单体总重量为基准计,所述非芳族单不饱和乙烯基单体通常占大孔共聚物的0-10%,或者0-5%,或者0-2%,作为聚合单元。
可以用来制备大孔共聚物的成孔剂包括疏水性成孔剂,例如(C7-C10)芳族烃和(C6-C12)饱和烃;以及亲水性成孔剂,例如(C4-C10)链烷醇和聚亚烷基二醇。合适的(C7-C10)芳族烃包括例如以下的一种或多种:甲苯,乙基苯,邻二甲苯,间二甲苯和对二甲苯;需要理解,上述各种烃的各种位置异构体也是合适的。或者,所述芳族烃是甲苯或二甲苯或二甲苯混合物,或甲苯和二甲苯的混合物。合适的(C6-C12)饱和烃包括例如己烷、庚烷和异辛烷中的一种或多种;或者所述饱和烃是异辛烷。合适的(C4-C10)链烷醇包括例如以下的一种或多种:异丁醇,叔戊醇,正戊醇,异戊醇,甲基异丁基甲醇(4-甲基-2-戊醇),己醇和辛醇;或者,所述链烷醇选自一种或多种(C5-C8)链烷醇,例如甲基异丁基甲醇和辛醇。
可以用来制备共聚物的聚合引发剂包括可溶于单体的引发剂,例如过氧化物、氢过氧化物和相关的引发剂;例如过氧化苯甲酰基,氢过氧化叔丁基,过氧化枯烯,过氧化萘满,过氧化乙酰基,过氧化己酰基,过辛酸叔丁酯(也被称为叔丁基过氧基-2-乙基己酸酯),过辛酸叔戊酯,过苯甲酸叔丁酯,二过邻苯二甲酸叔丁酯,过氧化二碳酸二环己基酯,过氧化二碳酸二(4-叔丁基环己基)酯以及过氧化甲基乙基酮。还可以使用偶氮类引发剂,例如偶氮二异丁腈,偶氮二异丁酰胺,2,2′-偶氮-二(2,4-二甲基戊腈),偶氮-二(α-甲基丁腈)以及二甲基-,二乙基-或二丁基偶氮-二(甲基戊酸酯)。优选的过氧化物引发剂是过氧化二酰基,例如过氧化苯甲酰基,以及过酸酯,例如过辛酸叔丁酯和过苯甲酸叔丁酯;或者所述引发剂是过氧化苯甲酰基。以乙烯基单体的总重量为基准计,通常过氧化物引发剂的用量为0.3-5%,或者为0.5-3%,或者为0.7-2%。
或者交联的共聚物选自:二乙烯基苯共聚物,苯乙烯-二乙烯基苯共聚物,二乙烯基苯-乙基乙烯基苯共聚物和苯乙烯-乙基乙烯基苯-二乙烯基苯共聚物,用于本发明工艺所用的离子交换树脂催化剂的基材。
可以使用本领域技术人员公知的用于多磺化的常规方法,用强酸官能团对这些交联的共聚物进行官能化,例如可以用三氧化硫(SO3)、发烟硫酸(包含三氧化硫的浓硫酸)和氯代磺酸进行磺化;或者可以对单磺化的阳离子交换树脂聚合物施加常规的多磺化条件,以提供阳离子交换树脂催化剂。
或者,可以根据本领域技术人员已知的常规方法,用强碱或弱碱官能团对这些交联的共聚物进行官能化,例如可以将单烷基胺、二烷基胺或三烷基胺基团与树脂相连。胺取代基可以具有一个、两个或三个,结构可以是:-CH3,-(CH2)n-CH3(n>0,可以从n=1至n=8),-[(CH2-CH2)-O-]p-(CH2-CH3)(p>1),-CH2CH2OH,N-甲基葡糖胺,二乙基烯胺,三乙基烯胺官能团。
通常通过以下两种方法之一为所述掺杂了金属合金的离子交换树脂催化剂加载所需的金属合金:a)通过将两种或更多种金属混合起来,在离子交换聚合物结构内形成合金,从而在离子交换聚合物内形成纳米合金,或者b)通过使用离子交换聚合物金属氧化物纳米复合材料,将金属合金催化金属负载在载体表面上,然后进行还原。形成合金的时候的金属选择是一个重要的问题。
通常来说,通常使得包含金属盐或金属络合物中的两种或更多种的组合的溶液与离子交换树脂以间歇模式或者柱状模式接触,从而对金属合金掺杂的离子交换树脂催化剂进行加载。例如,所述催化剂可以由以下组分组成:两种金属盐,或者一种金属盐和一种金属络合物,或者两种金属络合物。另外,所述金属合金可以以金属-合金盐的形式提供。在此情况下,然后对加载后的阳离子交换树脂进行淋洗,直至其不含残留的盐或酸。对所用的金属-合金盐的量进行选择,使得金属或金属离子的含量最终为0.1-20%的离子交换树脂的加载量,或者约为0.5-10%加载量,或者约为1.0-5.0%加载量,可以通过常规的分析测试方法测定。
适合作为本发明方法的催化剂的一部分的金属离子包括例如钯(Pd),铂(Pt),铑(Rh),铱(Ir),钌(Ru),铜(Cu),镍(Ni),锌(Zn),铝(Al),金(Au),钛(Ti),钒(V),铬(Cr),锰(Mn),铁(Fe),钴(Co),硅(Si),银(Ag),铅(Pb),锡(Sn),铌(Nb),钼(Mo),汞(Hg),锑(Sb),钨(W),铪(Hf),镉(Cd),锡(Sn),锆(Zr),锇(Os)和砷(As)。本发明考虑在合金组成中可以使用两种或更多种独立的金属或金属络合物。例如,合金可以是双金属或三金属的。另外,可以在合金组合物中使用三种以上的独立的金属或者多种金属的络合物。本发明的金属合金的合适的例子包括但不限于Ni-Pt,Pd-Pt,Ni-Cu,Ni-Ag,Ni-Au,Cu-Pd,Cu-Pt,Pd-Ag,Pd-Au,Pt-Au,Pt-Au,Fe-Co,Fe-Ni,Co-Ni,Fe-Ag,Fe-Ag,Co-Ag,Co-Pd,Co-Rh,Co-Pd,Co-Rh,Ni-Rh,Cu-Ru,Fe-Pt,Co-Pt,Fe-Au,Co-Au,W-Au,Ni-Al,Cu-Zn,Ni-Zn,Ni-Pd,Ni-Pt,Pd-Pt,Ni-Au,Cu-Pd,Cu-Pt,Pd-Au,Pt-Au,Co-Ni,Co-Pt,Ru-Pd,Ru-Pt,Rh-Pt,Re-Ir,Mo-Pt,Fe-Zn和Cu-Zn。本发明特别有用的组合包括但不限于Pd-Au,Pd-Ag,Fe-Co,Fe-Ni,Fe-Zn,Ni-Cu,Ni-Al,Cu-Zn,Ni-Zn和Fe-Cu。
可以通过各种方法为离子交换树脂加载金属合金。一个例子是例如通过以下方式为阳离子交换树脂加载金属合金:使得金属合金盐的水溶液通过阳离子交换树脂柱,直至树脂保留了所需水平的金属合金,然后用水进行充分的清洗,除去残余的盐以及在加载过程中产生的酸。
在另一个实施方式中,本发明的催化剂使用硼烷(borone)还原树脂制造。在US 4,311,811中揭示了这样的树脂的例子。所述树脂与包含两种或更多种金属的溶液接触,所述金属可以被还原。当所述溶液与树脂接触的时候,金属盐进入树脂结构中,还原为0价的金属合金。以树脂干重为基准计,树脂中金属加载量可以为0.01重量%至55重量%干重,或者为5-25%,或者为8-15%。
或者通过对包含金属离子的离子交换树脂进行还原,使得金属合金沉积在催化剂中,从而制备所述催化剂。在此情况下,可以通过以下方式使得加载了金属的树脂“活化”(将金属还原至零价):使得加载了金属的树脂接触氢气(通常在室温、低氢气分压(例如小于1巴)条件下用肼还原)。通常的还原反应使用例如氢气、硼氢化钠、肼、乙二醇在反应中作为还原剂。然后可以对树脂进行热处理。
或者,所述活化可以在以下条件下进行,温度为室温40℃至200℃,优选为60℃至150℃,最优选为80-100℃,并且/或者氢气压力约为2-50巴。然后可以将包含还原形式的金属合金的加载的催化剂用于所需的催化反应,例如用于缩合反应。或者,可以在即将用于缩合反应之前,将加载的树脂(其中金属为离子形式)′活化′成还原金属形式。例如当Pd,Pt,Rh,Ir或Ru用于催化剂的金属合金组分的时候,可以在用于缩合反应之前,将加载的树脂活化成还原态金属形式。在一些情况下,可以对加载的树脂催化剂进行碳化。所谓碳化表示所述催化剂在还原性条件下加热至600-1000℃,发生热解,制得碳珠粒结构。
本发明的催化剂可以用于很多种催化反应。所述缩合反应包括例如异构化,水合,醇醛缩合,脱水,氢解,硝酸盐还原,碳-碳偶连(即赫克-铃木反应),氧化,加氢甲酰化,以及烯烃、酮、醇和炔的选择性还原反应。
理想情况下,在反应过程中,反应温度保持在50-800℃,或者75-600℃,或者75-175℃。压力保持在1-150巴,或者20-100巴,或者为30-80巴。LHSV(液时空速)为0.1-20小时-1,或者2-20小时-1,或者5-20小时-1。反应体系内的反应器结构可以是本领域技术人员已知的任意结构。所述结构包括但不限于填充柱,混合反应器,连续搅拌反应器(CSTR),回路反应器,以及移动珠粒反应器。另外,系统中可以流入气体、液体、或此二者的组合。所述反应可以以分批或连续的方式进行。
作为一个非限制性的例子,在一个实施方式中,金属合金掺杂的磺化树脂催化剂为容纳在容器中的珠粒的物理形式,所述珠粒形成催化剂床。在存在氢气(作为独立的进料流)的情况下,在足够的温度条件下,酮类反应物(例如丙酮)进料物流与催化剂床接触足够的时间,以发生酮的缩合反应。将包含反应产物(饱和酮加合物)、副产物(不饱和酮加合物)和可能存在的任何未反应的酮反应物的冷凝的液体流从催化剂床分离出来,通过常规的分离方法(例如蒸馏)从液体流回收所需的酮加合物。本领域技术人员能够选择合适的条件,例如(1)分批操作,例如其中在存在氢气的条件下对催化剂床加载液体流,然后在发生了所需的反应之后将液体流从催化剂移走,或者(2)更优选的连续操作,例如,以一定的速率将液体流(以及氢气)连续地通入柱状反应器的一端,所述速率使得在催化剂床内有足够的停留时间,使得能够发生所需的反应,冷凝的液体流连续地从床的另一端移出。类似的,本领域技术人员根据本文给出的指导以及公知常识,可以很容易地对反应设备、反应物流通过床的上流和下流方向选择、反应时间和温度、具体的反应物、以及回收酮加合物的方法进行选择。
一般来说,对柱状反应器内的温度和压力进行选择,使得酮反应物在催化剂床内处于沸点。利用酮反应物的温度/压力变化提供反应温度和条件的所需组合,使得在催化剂床中,缩合反应在液相中发生。可以改变条件,在催化剂床中提供气相条件;但是优选条件使得缩合反应可以在液相中进行。
本发明的金属合金掺杂的磺化的树脂催化剂可以用于缩合反应,其中酮反应物和氢气在间歇反应条件或连续反应条件下接触。在本发明的一个实施方式中,所述方法是基于催化蒸馏工艺的连续法,在重沸器阶段紧邻上方的柱状反应器的底部引入酮反应物;对于该种情况,产物馏分或者物流连续地从蒸馏设备的重沸器部分引出,用于进行进一步加工(参见美国专利第6,008,416号关于催化蒸馏工艺的一般和具体的描述)。或者,将要发生缩合反应的酮反应物通过催化剂床向下加入,氢气流沿着相同的方向通过反应区。但是还可以通过其它的不同方式引入反应物进料物流,例如同向和反向氢气流,漫溢法和气相法。
对于连续法,相对于反应物的量,催化剂的用量通常与反应的通过速率相关,用反应物的LHSV(液时空速)或者每单位时间内相对于催化剂体积的反应物液体流速来表示。通常需要高LHSV来尽可能提高设备应用以及产物的生成;但是,为了实现这个目标,原料转化百分数和制备所需产物的选择性百分数之间必须进行平衡。如果LHSV过低,则所需产物的生产率(空间产率)会降低,工艺不够经济。如果LHSV过高,则催化剂的活性不足以实现所需的转化率(工艺″动力学受限制″)。合适的LHSV的值通常为0.5-10小时-1,或者为1-8小时-1,或者为2.5-6小时-1。
通常在存在催化剂的情况下,在温度为110-170℃、氢气压力为1-100巴的条件下,使得酮反应物与氢气接触。用来实施本发明的催化的缩合反应的合适的温度为110-170℃,或者为120-160℃,或者为130-150℃。一般来说,酮反应物和氢气的反应区的氢气压力保持在1-100巴,或者5-60巴,或者为10-40巴。通常缩合反应的氢气/酮反应物摩尔比为0.1至1,或者为0.15至0.5。
在本发明的另一个实施方式中,所述方法可以是间歇法,在催化蒸馏设备的重沸器部分阶段,将酮反应物引入反应器柱内(与上文所述类似)。然后当重沸器部分中实现所需的酮加合物的产物组成的时候,可以终止反应过程。或者,缩合反应可以在间歇式高压釜反应器中进行特定的时间,然后冷却,通过蒸馏或者其它的常规方法回收所需的酮加合物。
实施例1
将50克购自罗门哈斯公司(Rohm and Hass COmpany)的强酸阳离子交换树脂(AmberlystTM35树脂)与20毫升包含50/50(w/w)的镍和锌盐的溶液混合。在与树脂混合之前,用HNO3将水溶液的pH值调节到1.2。在具有机械搅拌装置的反应器中,对树脂-液体浆液混合4小时。4小时后,排出多余的液体,用布氏漏斗将树脂抽干,在50℃的烘箱中干燥24小时。然后将树脂加入柱反应器中,用氮气吹扫。在吹扫后,氢气/氩气(15/85)的气体混合物在压力350psi、流速150毫升/分钟的速度下通过,加热至550℃。将该材料热解3小时,冷却至室温,用氮气吹扫,填充用于进一步的应用。
实施例2
将30毫升上述催化剂加入填充床柱式反应器中。使得环己烯和氢气混合物通过该柱。氢气流速为250毫升/分钟,标称条件,环己烯流速为1毫升/分钟。柱内的压力是400psi,温度为110℃。通过所述柱之后得到的产物中,环己烷的选择性为99%。
Claims (8)
1.一种催化剂组合物,其包含:
(a)磺化离子交换树脂;和
(b)金属合金,以催化剂的干重为基准计。
2.如权利要求1所述的催化剂组合物,其特征在于,所述金属合金包含选自以下的至少两种金属:
钯(Pd),铂(Pt),铑(Rh),铱(Ir),钌(Ru),铜(Cu),镍(Ni),锌(Zn),铝(Al),金(Au),钛(Ti),钒(V),铬(Cr),锰(Mn),铁(Fe),钴(Co),银(Ag),铅(Pb),锡(Sn),铌(Nb),钼(Mo),汞(Hg),锑(Sb),钨(W),铪(Hf),镉(Cd),锡(Sn),锆(Zr)和锇(Os)。
3.如权利要求2所述的催化剂组合物,其特征在于,所述至少两种金属中的至少一种的形式是多种金属的络合物形式。
4.如权利要求1所述的催化剂组合物,其特征在于,以催化剂的干重计,所述催化剂包含0.1-25%的金属合金。
5.如权利要求1所述的催化剂组合物,其特征在于,所述金属合金包括尺寸为1-250纳米的金属簇。
6.如权利要求1所述的催化剂组合物,其特征在于,所述催化剂是大孔珠粒的形式,所述大孔珠粒的总孔隙率为0.1-0.9立方厘米/克,表面积为10-100平方米/克,以催化剂的干重计。
7.如权利要求1所述的催化剂组合物,其特征在于,所述催化剂是凝胶珠粒的形式。
8.如权利要求1所述的催化剂组合物,其特征在于,所述催化剂是热解的。
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Also Published As
Publication number | Publication date |
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JP5554201B2 (ja) | 2014-07-23 |
CN102069013A (zh) | 2011-05-25 |
EP2332649A3 (en) | 2017-09-06 |
TW201119739A (en) | 2011-06-16 |
MX2010012594A (es) | 2011-05-24 |
JP2011136329A (ja) | 2011-07-14 |
KR101255845B1 (ko) | 2013-04-17 |
KR20110058697A (ko) | 2011-06-01 |
TWI428181B (zh) | 2014-03-01 |
BRPI1004590A2 (pt) | 2013-02-26 |
EP2332649A2 (en) | 2011-06-15 |
US8592340B2 (en) | 2013-11-26 |
ZA201008375B (en) | 2012-01-25 |
US20110124922A1 (en) | 2011-05-26 |
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