CN102010799A - Furnace cleaning solution for high-efficiency SMT reflow soldering furnace and wave soldering furnace and its preparation method - Google Patents

Abstract

The invention relates to a cleaning solution and a preparation method thereof, in particular to a high-efficiency hearth cleaning solution for an SMT (surface mount technology) reflow soldering furnace and a wave soldering furnace applied to an SMT production line in the electronic industry and a preparation method thereof. The composition comprises the following raw materials in parts by weight: 40-60 parts of pure water; 1-5 parts of inorganic base; 1-3 parts of corrosion inhibitor; 10-25 parts of organic amine; 10-20 parts of an alcohol ether solvent; 3-8 parts of a penetrating agent; 1-3 parts of a nonionic surfactant; 3-6 parts of an anionic surfactant. The preparation method sequentially comprises the following steps: (1) dissolving 1-5 parts of inorganic base in 40-60 parts of pure water, and uniformly stirring until the solution is transparent; (2) adding 10-25 parts of organic amine and 1-3 parts of corrosion inhibitor into the mixture and uniformly stirring the mixture; (3) adding 10-20 parts of alcohol ether solvent into the mixture and uniformly stirring the mixture; (4) adding 3-8 parts of penetrant into the mixture and stirring the mixture until the mixture is transparent; (5) adding 1-3 parts of nonionic surfactant and 3-6 parts of anionic surfactant, stirring uniformly, and filtering to obtain the finished product.

Description

Furnace cleaning solution for high-efficiency SMT reflow soldering furnace and wave soldering furnace and its preparation method

Technical field:

The invention relates to a cleaning solution and a preparation method thereof, in particular to a furnace cleaning solution for a high-efficiency SMT reflow soldering furnace and a wave soldering furnace used in an SMT production line in the electronic industry and a preparation method thereof.

Background technique:

SMT is the abbreviation of Surface Mounted Technology (SMT), which is the most popular technology and process in the electronic assembly industry. In the SMT production line, reflow soldering and wave soldering are a relatively large and important link. In the process of reflow soldering and wave soldering, tin wires and tin bars are melted by high temperatures above 250°C and soldered on the PCB board sprayed with flux. This process is completed in a semi-enclosed space, that is, our In reflow soldering furnaces and wave soldering furnaces, if the temperature in the furnace is at 250-300°C for a long time, the flux and flux in the tin wire will oxidize and volatilize, and coke on the inner wall of the furnace, gradually forming carbon deposits , it is difficult to remove; and the chain oil used in the chain of the furnace, due to long-term use at high temperature, will also oxidize and coke and deposit carbon. If it is not cleaned in time, the chain will run abnormally.

In the early cleaning process, many electronics factories disassembled the parts to be cleaned, soaked them in solvents such as isopropanol and alcohol for 1-2 hours, and then brushed them manually. Firstly, this method uses volatile solvents, which is highly dangerous; secondly, it takes a long time, is inconvenient to operate, high in cost, and not thorough in cleaning, so it is rarely used now.

As the demand for cleaning continues to increase, a large number of related foreign water-based furnace cleaning solutions have entered the Chinese market. However, because their related products are all imported, they are expensive and cannot meet the market demand.

Invention content:

The technical problem to be solved by the present invention is to overcome the above-mentioned deficiencies, and provide a furnace cleaning solution for high-efficiency SMT reflow soldering furnace and wave soldering furnace and its preparation method.

In order to solve the above-mentioned technical problems, the technical solution adopted in the present invention is: the constituent raw materials and the weight ratio of the hearth cleaning solution for the high-efficiency SMT reflow furnace and wave soldering furnace are:

Pure water 40-60 parts;

Inorganic base 1-5 parts;

Corrosion inhibitor 1-3 parts;

Organic amine 10-25 parts;

Alcohol ether solvent 10-20 parts;

Penetrant 3-8 parts;

1-3 parts of nonionic surfactant;

Anionic surfactant 3-6 parts.

In the above technical scheme, the constituent raw materials and weight ratio of the hearth cleaning solution for the high-efficiency SMT reflow oven and wave soldering oven are:

50 parts of pure water;

Inorganic base 4 parts;

Corrosion inhibitor 1.1 parts;

Organic amine 18 parts;

Alcohol ether solvent 18 parts;

Penetrant 2 parts;

2 parts of nonionic surfactant;

Anionic surfactant 5 parts.

In the above technical solution, the inorganic base is one or both of sodium hydroxide and potassium hydroxide.

In the above technical solution, the corrosion inhibitor is one or more of sodium metasilicate, benzotriazole derivatives and alkanolamides.

In the above technical scheme, the organic amines are: monoethanolamine, triethanolamine, monoisopropanolamine, diisopropanolamine, triisopropanolamine, diglycolamine, 2-amino-1-butanol one or more of.

In the above technical solution, the alcohol ether solvent is: one or more of ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, propylene glycol methyl ether, and dipropylene glycol methyl ether.

In the above technical solution, the penetrating agent is one or more of: C ₇ -C ₁₀ secondary alcohol polyoxyethylene ether, isomeric alcohol ether phosphate, and dioctyl maleate sulfonate.

In the above technical solution, the nonionic surfactant is one or two of fatty alcohol polyoxyethylene ether and fatty acid polyoxyethylene ester.

In the above technical solution, the anionic surfactant is: one or more of sodium alkylbenzenesulfonate, sodium alkylsulfate, sodium secondary alkylbenzenesulfonate.

The preparation method steps of making this efficient SMT reflow soldering furnace and wave soldering furnace furnace cleaning solution are as follows:

(1) Dissolve 1-5 parts of inorganic base in 40-60 parts of pure water, and stir until transparent;

(2) Add 10-25 parts of organic amine and 1-3 parts of corrosion inhibitor into it and stir evenly;

(3) Add 10-20 parts of alcohol ether solvent into it and stir evenly;

(4) Add 3-8 parts of penetrant into it and stir until transparent;

(5) Add 1-3 parts of nonionic surfactant and 3-6 parts of anionic surfactant, stir evenly and filter to obtain the finished product.

The present invention has the following advantages:

1. The invention is safe and environment-friendly, easy to use, and has remarkable effects. It can be directly sprayed for use, or soaked in water in proportion, or ultrasonic cleaning and manual scrubbing.

2. The present invention can quickly and effectively clean the residual solder paste, solder flux volatile residues and oil products at high temperature in the furnace of the SMT production line, and it has good compatibility with equipment materials and does not corrode , Does not affect equipment materials.

3. The present invention can be used to clean carbon-deposited parts such as furnaces and chains in reflow soldering and wave soldering equipment in SMT processes. It can be directly sprayed and used, or the parts to be cleaned can be disassembled for soaking and cleaning.

4. The invention is a unique water-based formula, which has no flash point, no burning, super cleaning power, no corrosion to equipment, no harm to human body, no halogen, meets ROHS requirements, and is safe and environmentally friendly.

Detailed ways:

The present invention is further described below in conjunction with specific embodiment:

Embodiment one

Present embodiment one concrete raw material and weight are:

Pure water 50 kg;

Sodium hydroxide 4 kg;

Sodium metasilicate 1 kg;

Benzotriazole derivatives 0.1 kg;

Triethanolamine 18 kg;

Ethylene glycol monobutyl ether 18 kg;

Isomerized alcohol ether phosphate 2 kg;

Fatty alcohol polyoxyethylene ether 2 kg;

Sodium alkylbenzene sulfonate 5 kg.

The preparation method steps of making this efficient SMT reflow soldering furnace and wave soldering furnace furnace cleaning solution are as follows:

(1) Dissolve 4 kg of sodium hydroxide in 50 kg of pure water, and stir until transparent;

(2) 18 kg of triethanolamine, 1 kg of sodium metasilicate and 0.1 kg of benzotriazole derivatives are added and stirred evenly;

(3) 18 kg of ethylene glycol monobutyl ether is added therein and stirred;

(4) 2 kilograms of isomeric alcohol ether phosphates are added therein and stirred until transparent;

(5) Add 2 kg of fatty alcohol polyoxyethylene ether and 5 kg of sodium alkylbenzene sulfonate, stir evenly and filter to obtain the finished product.

Embodiment two

Present embodiment two concrete raw materials and weight are:

Pure water 47 kg;

Sodium hydroxide 2 kg;

Potassium hydroxide 2 kg;

Sodium metasilicate 2 kg;

Benzotriazole derivatives 0.1 kg;

Monoethanolamine 10 kg;

Triethanolamine 15 kg;

Ethylene glycol monobutyl ether 5 kg;

Propylene glycol methyl ether 10 kg;

Dioctyl maleate sulfonate 3 kg;

Fatty alcohol polyoxyethylene ether 1 kg;

Sodium alkylbenzene sulfonate 3 kg.

The preparation method steps of making this efficient SMT reflow soldering furnace and wave soldering furnace furnace cleaning solution are as follows:

(1) Dissolve 2 kilograms of sodium hydroxide and 2 kilograms of potassium hydroxide in 47 kilograms of pure water, and stir until transparent;

(2) 15 kg of triethanolamine, 10 kg of monoethanolamine, 2 kg of sodium metasilicate and 0.1 kg of benzotriazole derivatives were added and stirred evenly;

(3) 5 kilograms of ethylene glycol monobutyl ether, 10 kilograms of propylene glycol methyl ether are added therein and stirred;

(4) 3 kilograms of dioctyl maleate sulfonate are added therein and stirred until transparent;

(5) Add 1 kg of fatty alcohol polyoxyethylene ether and 3 kg of sodium alkylbenzene sulfonate, stir evenly and filter to obtain the finished product.

Of course, the above descriptions are only a few examples of the present invention, and are not intended to limit the scope of the present invention. All equivalent changes or modifications made according to the structure, features and principles described in the patent scope of the present invention shall include Within the patent scope of the present invention.

Claims (10)

1. efficient SMT reflow soldering and wave-soldering furnace burner hearth ablution, it is characterized in that: this efficient SMT reflow soldering and wave-soldering furnace with the formation raw material and the weight proportion of burner hearth ablution are:

Pure water 40-60 part;

Mineral alkali 1-5 part;

Inhibiter 1-3 part;

Organic amine 10-25 part;

Alcohol ether solvents 10-20 part;

Permeate agent 3-8 part;

Nonionogenic tenside 1-3 part;

Anion surfactant 3-6 part.

2. efficient SMT reflow soldering according to claim 1 and wave-soldering furnace burner hearth ablution is characterized in that: described efficient SMT reflow soldering and wave-soldering furnace with the formation raw material and the weight proportion of burner hearth ablution are:

50 parts of pure water;

4 parts of mineral alkalis;

1.1 parts of inhibiter;

18 parts of organic amines;

18 parts of alcohol ether solvents;

2 parts of permeate agents;

2 parts of nonionogenic tensides;

5 parts of anion surfactants.

3. efficient SMT reflow soldering according to claim 1 and 2 and wave-soldering furnace burner hearth ablution, it is characterized in that: described mineral alkali is: one or both in sodium hydroxide, the potassium hydroxide.

4. efficient SMT reflow soldering according to claim 1 and 2 and wave-soldering furnace burner hearth ablution, it is characterized in that: described inhibiter is: one or more in Starso, 124 Triazole derivative, the alkylolamide.

5. efficient SMT reflow soldering according to claim 1 and 2 and wave-soldering furnace burner hearth ablution, it is characterized in that: described organic amine is: one or more in Monoethanolamine MEA BASF, trolamine, a Yi Bingchunan, diisopropanolamine (DIPA), tri-isopropanolamine, diglycolamine, the 2-amino-1-butanols.

6. efficient SMT reflow soldering according to claim 1 and 2 and wave-soldering furnace burner hearth ablution, it is characterized in that: described alcohol ether solvents is: one or more in ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, the dipropylene glycol methyl ether.

7. efficient SMT reflow soldering according to claim 1 and 2 and wave-soldering furnace burner hearth ablution, it is characterized in that: described permeate agent is: C ₇-C ₁₀In secondary alcohol Soxylat A 25-7, isomery alcohol ether phosphate, the dioctyl maleate sulfonate one or more.

8. efficient SMT reflow soldering according to claim 1 and 2 and wave-soldering furnace burner hearth ablution, it is characterized in that: described nonionogenic tenside is: a kind of in fatty alcohol-polyoxyethylene ether, the polyoxyethylene carboxylate or two kinds.

9. efficient SMT reflow soldering according to claim 1 and 2 and wave-soldering furnace burner hearth ablution, it is characterized in that: described anion surfactant is: one or more in sodium alkyl benzene sulfonate, sodium alkyl sulfate, the secondary sodium alkyl benzene sulfonate.

10. efficient SMT reflow soldering and wave-soldering furnace are with the preparation method of burner hearth ablution, and it is characterized in that: this preparation method's steps in sequence is:

(1) mineral alkali with 1-5 part is dissolved in the pure water of 40-60 part, and stirs to transparent;

(2) inhibiter of the organic amine of 10-25 part and 1-3 part is added wherein and stir;

(3) alcohol ether solvents of 10-20 part is added wherein and stir;

(4) permeate agent of 3-8 part is added wherein and be stirred to transparent;

(5) add nonionogenic tenside of 1-3 part and the anion surfactant of 3-6 part, stir filter finished product.