CN101916810B - SMD type LED encapsulation method - Google Patents
SMD type LED encapsulation method Download PDFInfo
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- CN101916810B CN101916810B CN 201010247956 CN201010247956A CN101916810B CN 101916810 B CN101916810 B CN 101916810B CN 201010247956 CN201010247956 CN 201010247956 CN 201010247956 A CN201010247956 A CN 201010247956A CN 101916810 B CN101916810 B CN 101916810B
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- support
- type led
- smd type
- led chip
- pressure injection
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- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000005538 encapsulation Methods 0.000 title abstract description 9
- 238000002347 injection Methods 0.000 claims abstract description 39
- 239000007924 injection Substances 0.000 claims abstract description 39
- 241000218202 Coptis Species 0.000 claims abstract description 8
- 235000002991 Coptis groenlandica Nutrition 0.000 claims abstract description 8
- 239000003822 epoxy resin Substances 0.000 claims abstract description 8
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 8
- 238000009713 electroplating Methods 0.000 claims abstract description 3
- 239000003292 glue Substances 0.000 claims description 15
- 239000007787 solid Substances 0.000 claims description 13
- 238000007747 plating Methods 0.000 claims description 12
- 238000012856 packing Methods 0.000 claims description 11
- 238000005452 bending Methods 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 9
- 230000032683 aging Effects 0.000 claims description 7
- 238000004804 winding Methods 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 5
- 238000004381 surface treatment Methods 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 8
- 238000001746 injection moulding Methods 0.000 abstract description 7
- 238000012545 processing Methods 0.000 abstract description 4
- 239000003963 antioxidant agent Substances 0.000 abstract description 3
- 230000003078 antioxidant effect Effects 0.000 abstract description 3
- 238000005265 energy consumption Methods 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 235000006708 antioxidants Nutrition 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 238000009877 rendering Methods 0.000 description 2
- 238000004078 waterproofing Methods 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to an SMD type LED encapsulation method, including the following steps: electroplating, namely silver is plated on local functional region of the support surface on an SMD tape; die bonding, namely a die bonding machine is adopted to fix corresponding SMD type LED chip at the effective surface position of the support after dispensing is carried out on the bottom of the support; short baking, namely the support of SMD type LED chip after being dispensed and fixed is baked and solidified; bonding wire, namely a gold thread is connected with the SMD type LED chip and the positive pole and the negative pole of the support; pressure injection, namely the well welded SMD type LED chip support is arranged in an injection moulding mould, and epoxy resin is used for pressure injection and rapid encapsulation is carried out; and encapsulated SMD type LED chip is obtained, and pressure injection is carried out for less than 3min. Pressure injection is completed in SMD type LED encapsulation process in one step, PPA material used in the traditional injection moulding is spared; and short baking after dispensing in follow-up processes is spared, equipment investment is reduced, and energy consumption is saved. Tinplating process ensures the product to be antioxidant and antirust, and product application processing weldability is improved.
Description
Technical field
The present invention relates to a kind of LED encapsulation technology, particularly a kind of SMD type LED method for packing.Background technology
Tradition SMD type LED encapsulation flow process is as follows: support punching press-platings-section-packing-employings PPA injection moulding (adopting horizontal press injector monolithic to use the moulding of PPA injection moulding an actor's rendering of an operatic tune SMD type LED support)-go is residual-and surveys inspection (choosing defectiveness substandard products support processes or scrap)-die bond-short roasting (will put after glue solid good SMD type LED chip support put into 150 ℃ of baking boxs bakings solidified in 90 minutes)-bonding wire-glue (adopting glue-injection machine dispensing method pointwise point silica gel)-short baking (with having put silica gel support, put into 150 ℃ of baking boxs and toast curing in 120 minutes)-aging baking-zinc-plated-bending-survey to examine material toggling-sorting-tape package.
[its medium-height trestle adopts the moulding of horizontal press injector monolithic injection moulding (PPA) an actor's rendering of an operatic tune, adopts cold notes method injecting products, and qualification rate is low, yields 70%; Adopt hot notes method yield height, but the investment of equipment, mould is big.Later stage is finished the part process operation with the support product of moulding in processing line.Adopt glue-injection machine dispensing method pointwise point glue, the highest production capacity 12K/h of production equipment unit, and equipment is many, requires the equipment precision height, has high input, and operating personnel are many, and glue amount consistency is difficult to control.
In product applications, it is big because of PPA plastics and silica gel material difference that above-mentioned secondary is sealed moulding patch SMD type LED, be used for outdoor lighting because of weather, aging, the different easy layering of shrinkage ratio, must adopt outer sealing to make water-proofing treatment, thereby influence the product poor heat radiation, reduced its useful life, phenomenons such as dead lamp.
Summary of the invention
It is few that a kind of SMD type LED method for packing provided by the invention, production and traditional handicraft are compared equipment investment, and technical process is economized, the qualification rate height; The product light transmission is good, the brightness height, and emission angle is big.
1), electroplate for solving technical problem, the object of the present invention is achieved like this: a kind of SMD type LED method for packing may further comprise the steps:: to the functional areas local silver-plating of the rack surface in the SMD winding; 2), solid brilliant: as behind frame bottom point glue, to adopt solid brilliant machine that corresponding SMD type led chip is fixed on support active surface position; 3), short roasting: the support baking-curing that fixes SMD type led chip behind the some glue; 4), bonding wire: gold thread connects the positive and negative electrode of SMD type led chip and support; 5), pressure injection: the support that has welded SMD type led chip enters injection mold, uses the epoxy resin pressure injection also to seal fast; SMD type led chip after obtaining encapsulating by above step.
The pressure injection time is in 3 minutes.
Plating step is with the functional areas local silver-plating on SMD winding support material surface, and functional areas are to be used for the zone that pressure injection is sealed on the support.
Also contain slicing step between plating step and the solid brilliant step, slicing step is that the plating after-poppet is long with mould sanction standard.
The bonding wire step is that the support of solid good SMD type led chip is put into the bonding machine, adopts gold thread to connect the positive and negative electrode of SMD type led chip and support.
Also contain residual step and aging roasting step between pressure injection step and the zinc-plated step, going residual step is pressure injection to be sealed after-poppet put into mould and handle burr automatically; Aging roasting step is to seal after-poppet and put into baking oven and carry out long roasting curing of epoxy handling pressure injection behind the burr.
Be the bending step after the zinc-plated step, the bending step is to adopt precision die to cut off electrode, bending and molding on the zinc-plated support of surface treatment.
A kind of SMD type LED method for packing that apparatus of the present invention provide, effectively effect is as follows: 1, the pressure injection technology is once finished in patch SMD type LED encapsulation process, saves the used PPA material of traditional injection moulding; Follow-up flow process is that weak point is roasting after saving a glue.SMD type LED method for packing seals the PPA plastics and silica gel SMD needs 63.00 yuan/K, only needs 12.00 yuan/K and once seal epoxy, reduces equipment investment, energy efficient.
2, zinc-plated flow process guarantees that product is anti-oxidant, antirust, improves product and uses processing weldability.
3, adopt low pressure to consolidate the epoxide-resin glue cake soon and produce patch SMD type LED, it can fully derive luminous energy, avoids luminous energy to be absorbed into heat energy in encapsulated layer, to reach best, optimal luminous flux; Because of epoxy resin intensity height, good, high temperature resistant with the support contact, anti-UV, the good coefficient of expansion is difficult for xanthochromia etc., is used for outdoor street lighting and need make water-proofing treatment, and radiating effect is excellent, and is anti-aging, advantages such as life-span length.
Description of drawings
Fig. 1 is rack assumption diagram of the present invention; Fig. 2 is the solid crystal structure figure of the present invention; Fig. 3 is bonding wire structure chart of the present invention; Fig. 4 is pressure injection structure chart of the present invention; Fig. 5 is structure chart of the present invention.
Embodiment
1), electroplate a kind of SMD type LED method for packing is characterized in that may further comprise the steps:: to the functional areas local silver-plating on support 1 surface in the SMD winding; 2), solid brilliant: as behind support 1 base point glue, to adopt solid brilliant machine that corresponding SMD type led chip 2 is fixed on support 1 active surface position; 3), short roasting: support 1 baking-curing that fixes SMD type led chip 2 behind the some glue; 4), bonding wire: gold thread 3 connects the positive and negative electrode of SMD type led chip 2 and support 1; 5), pressure injection: the support 1 that has welded SMD type led chip 2 enters injection mold, uses epoxy resin 4 pressure injections also to seal fast; SMD type led chip 2 after obtaining encapsulating by above step.
The described pressure injection time is in 3 minutes.
Described plating step is the functional areas local silver-plating with SMD winding support 1 material surface, and functional areas are to be used for the zone that pressure injection is sealed on the support 1.
Also contain slicing step between described plating step and the solid brilliant step, slicing step is that plating after-poppet 1 usefulness mould sanction standard is long.
Described bonding wire step is that the support 1 of solid good SMD type led chip 2 is put into the bonding machine, adopts gold thread 3 to connect the positive and negative electrode of SMD type led chip 2 and support 1.
Also contain residual step and aging roasting step between described pressure injection step and the zinc-plated step, going residual step is pressure injection to be sealed after-poppet 1 put into mould and handle burr automatically; Aging roasting step is to seal after-poppet 1 and put into baking oven and carry out long roasting curing of epoxy handling pressure injection behind the burr.
Be the bending step after the described zinc-plated step, the bending step is to adopt precision die to cut off electrode, bending and molding on the zinc-plated support 1 of surface treatment.
Embodiment: SMD type LED method for packing of the present invention, concrete implementation step is as follows: step 1: support 1 punching press: adopt the accurate band of 0.2*50mm alloy 194 mould appearance electrode mouldings.
Step 2: electroplate: with the functional areas local silver-plating on SMD winding support 1 material surface, functional areas are to be used for the zone that pressure injection is sealed on the support 1, easily weldering and as the light emitting source reflecting surface of bonding gold thread 3.
Step 3: section: it is long to electroplate after-poppet 1 usefulness mould sanction standard.
Step 4: standard long stent 1 is used waterproof paper packing, prevent silver-plated support 1 surface oxidation, corrosion.
Step 5: Gu brilliant: behind support 1 base point glue, adopt full-automatic solid brilliant machine that corresponding SMD type led chip 2 is put in support 1 active surface position.
Step 6: short roasting: will put the support 1 that fixes SMD type led chip 2 behind the glue and put into 150 ℃ of baking boxs bakings and solidified in 90 minutes.
Step 7: bonding wire: the support 1 that will consolidate SMD type led chip 2 is put into full-automatic bonding machine, adopts 99.99% φ, 23 gold threads 3 to connect the positive and negative electrode of SMD type led chip 2 and support 1.
Step 8: pressure injection: the support 1 that has welded SMD type led chip 2 enters injection mold, uses epoxy resin 4 pressure injections also to seal fast, in 3 minutes time.
Step 9: go residual: pressure injection is sealed after-poppet 1 put into mould and handle burr automatically.
Step 10: aging roasting: will handle pressure injection behind the burr and seal after-poppet 1 and put into 120 ℃ of baking boxs bakings and carried out the long roasting curing of epoxy in 8 hours, step 10: zinc-plated: pressure injection is sealed support 1 behind the SMD type led chip 2 carry out electroplating surfaces with tin and handle, guarantee that product is anti-oxidant, antirust, improve product and use processing weldability.
Step 11: bending: adopt precision die to cut off electrode, bending and molding on the zinc-plated support 1 of surface treatment.
Step 12: survey the inspection material toggling: with support 1 range estimation of forming, choose distortion, defective, put into mould then and eject product pan feeding box.
Step 13: sorting: pour the magazine product into the light splitting color scanner and carry out photoelectricity test and divide Bin, ensure product consistency.
Step 14: tape package: detection braider encapsulation carrier band is packaged into the dish warehouse-in with adopting automatically with the Bin product after the light splitting color separation.
SMD type LED method for packing encapsulation process of the present invention is once finished, and saves the traditional injection moulding process; Save the roasting flow process of weak point behind the conventional point glue, adopt mold low pressure soon admittedly epoxy resin 4 seal, every mould reaches 3K, stripping forming in 3 minutes.
Claims (1)
1. SMD type LED method for packing is characterized in that may further comprise the steps:
1), electroplate: to the functional areas local silver-plating of the rack surface in the SMD winding, functional areas are to be used for the zone that pressure injection is sealed on the support;
2), section: it is long with mould sanction standard to electroplate after-poppet;
3), solid brilliant: as behind frame bottom point glue, to adopt solid brilliant machine that corresponding SMD led chip is fixed on support active surface position;
4), short roasting: as will to put the support that fixes SMD type led chip behind the glue and put into 150 ℃ of baking boxs bakings and solidified in 90 minutes;
5), bonding wire: the support that will consolidate SMD type led chip is put into the bonding machine, adopts 99.99% φ, 23 gold threads to connect the positive and negative electrode of SMD type led chip and support;
6), pressure injection: the support that has welded the SMD led chip enters injection mold, uses the epoxy resin pressure injection also to seal fast, and the pressure injection time is in 3 minutes;
7), go residual: pressure injection is sealed after-poppet puts into mould and handle burr automatically;
8), aging roasting: as will to handle pressure injection behind the burr and seal after-poppet 1 and put into 120 ℃ of baking boxs bakings and carried out the long roasting curing of epoxy in 8 hours;
9), zinc-plated: as pressure injection to be sealed support behind the SMD type led chip carry out electroplating surfaces with tin and handle;
10), bending: adopt precision die to cut off electrode, bending and molding on the zinc-plated support of surface treatment;
SMD type led chip after obtaining encapsulating by above step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010247956 CN101916810B (en) | 2010-08-06 | 2010-08-06 | SMD type LED encapsulation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010247956 CN101916810B (en) | 2010-08-06 | 2010-08-06 | SMD type LED encapsulation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101916810A CN101916810A (en) | 2010-12-15 |
| CN101916810B true CN101916810B (en) | 2013-07-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201010247956 Expired - Fee Related CN101916810B (en) | 2010-08-06 | 2010-08-06 | SMD type LED encapsulation method |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102368514A (en) * | 2011-09-16 | 2012-03-07 | 湖北匡通电子有限公司 | Packaging method of SMD type LED with lens |
| KR101575139B1 (en) | 2011-12-09 | 2015-12-08 | 삼성전자주식회사 | Backlight Unit and Liquid Crystal Display Including Same |
| CN103427001B (en) * | 2013-08-20 | 2016-02-24 | 揭阳市云腾电子商务有限公司 | The manufacture method of a kind of omnidirectional luminous LED lamp pearl |
| CN104128299B (en) * | 2014-05-30 | 2016-08-17 | 广州市金钟汽车零件制造有限公司 | A kind of car trim processing technique |
| CN104810450A (en) * | 2015-03-31 | 2015-07-29 | 长治虹源光电科技有限公司 | Light emitting diode (LED) packaging technology based on silver alloy wires |
| CN104810457A (en) * | 2015-03-31 | 2015-07-29 | 长治虹源光电科技有限公司 | Light emitting diode (LED) packaging technology based on palladium plated copper wire |
| CN108155247B (en) * | 2017-12-22 | 2019-06-25 | 珠海市大鹏电子科技有限公司 | A kind of photoelectrical coupler encapsulation electroplating technology |
| WO2021134239A1 (en) * | 2019-12-30 | 2021-07-08 | 重庆康佳光电技术研究院有限公司 | Light emitting device and manufacturing method therefor, and display apparatus |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| EP2267797A1 (en) * | 1997-07-29 | 2010-12-29 | OSRAM Opto Semiconductors GmbH | Optoelectronic device |
| US7339196B2 (en) * | 2005-06-25 | 2008-03-04 | Industrial Technology Research Institute | Packaging of SMD light emitting diodes |
| CN1901238A (en) * | 2005-07-20 | 2007-01-24 | 桦晶科技股份有限公司 | Light-emitting diode (LED) packaging structure without wire bonding |
| CN200990389Y (en) * | 2006-12-01 | 2007-12-12 | 亿光电子工业股份有限公司 | Packaging Structure of Light Emitting Diodes |
| CN201053591Y (en) * | 2007-04-10 | 2008-04-30 | 佛山市高明祥新电子科技有限公司 | SMD LED lamp fixture |
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| CN101916810A (en) | 2010-12-15 |
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Address after: 443600 Zigui City, Yichang province Mao Ping Town, East Road, building Applicant after: HUBEI KUANGTONG LIMITED BY SHARE LTD. Address before: 443600 Zigui City, Yichang province Mao Ping Town, East Road, building Applicant before: HUBEI KUANGTONG ELECTRONIC Co.,Ltd. |
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Inventor after: Peng Huiyin Inventor after: Li Shenggang Inventor after: Qin Shiying Inventor after: Chen Zuobing Inventor before: Peng Huiyin Inventor before: Li Shenggang Inventor before: Qin Yingshi Inventor before: Chen Zuobing |
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