CN203055984U - COB LED packaging structure - Google Patents
COB LED packaging structure Download PDFInfo
- Publication number
- CN203055984U CN203055984U CN 201320015621 CN201320015621U CN203055984U CN 203055984 U CN203055984 U CN 203055984U CN 201320015621 CN201320015621 CN 201320015621 CN 201320015621 U CN201320015621 U CN 201320015621U CN 203055984 U CN203055984 U CN 203055984U
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- CN
- China
- Prior art keywords
- quoit
- cob led
- glass fiber
- wafer
- encapsulating structure
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- 238000004806 packaging method and process Methods 0.000 title abstract 3
- 239000003365 glass fiber Substances 0.000 claims abstract description 24
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 19
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000011152 fibreglass Substances 0.000 claims description 19
- 239000004411 aluminium Substances 0.000 claims description 17
- 239000011889 copper foil Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 239000004568 cement Substances 0.000 claims description 7
- 241000218202 Coptis Species 0.000 claims description 4
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 4
- 239000003292 glue Substances 0.000 abstract description 8
- 239000000758 substrate Substances 0.000 abstract description 3
- 229910052751 metal Inorganic materials 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 3
- 235000012431 wafers Nutrition 0.000 abstract 2
- 238000000605 extraction Methods 0.000 description 8
- 238000012536 packaging technology Methods 0.000 description 7
- 238000007598 dipping method Methods 0.000 description 5
- 230000008033 biological extinction Effects 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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Abstract
The utility model relates to a COB LED packaging structure, comprising an aluminum substrate. Glass fiber layers and wafers are arranged on the aluminum substrate. Glass fiber surfaces at the inner sides of the glass fiber layers are provided with metal rings. The metal rings are adhered onto the glass fiber surfaces through die bonding glue. The wafers are located at the inner sides of the metal rings. The COB LED packaging structure is high in light emission efficiency and simple in structure.
Description
Technical field
The utility model relates to the LED encapsulation field, relates in particular to a kind of COB LED encapsulating structure.
Background technology
COB LED(Chip On Board, the chip on board encapsulation), being about to bare chip and sticking on the interconnected substrate with conduction or non-conductive adhesive, the bonding that goes between is then realized its electrical connection, COB LED is COB LED source again, or COB LED module.
As shown in Figure 1, existing C OB LED encapsulation, the aluminium bases 5 of high reflectance that adopt as substrate more, on aluminium base 5, be bonded with wafer 1 by crystal-bonding adhesive 2, pressing one deck plays the fiberglass layer 4 of insulating effect on aluminium base 5, fiberglass layer 4 is provided with Copper Foil 3, and wafer 1 is positioned at the inboard of the glass fiber surface 8 of fiberglass layer 4, and this wafer 1 is electrically connected with Copper Foil 3 by gold thread 6; Also be provided with reflective surface 7 on the aluminium base 5, this encapsulation is simple, can promote the bright dipping light efficiency.But because the thickness of fiberglass layer 4 is generally about 0.2mm, expose outside between the glass fiber surface 8 of fiberglass layer 4, after baking, its color can become black or dark brown; When encapsulation, this fiberglass layer 4 combines with the fluorescent glue colloid of bright dipping, makes to become black or auburn part is encapsulated in the colloid of packaging bright dipping, forms serious extinction, and absorptance reaches 5%～10%, has a strong impact on the light extraction efficiency of product.
The utility model content
The purpose of this utility model is to provide a kind of light extraction efficiency height, COB LED encapsulating structure simple in structure.
For reaching this purpose, the utility model by the following technical solutions:
A kind of COB LED encapsulating structure, comprise aluminium base, described aluminium base is provided with fiberglass layer, wafer, and the glass fiber surface of described fiberglass layer inboard is provided with quoit, described quoit is bonding by insulating cement and described glass fiber surface, and described wafer is positioned at the inboard of described quoit.
Wherein, described wafer is bonding by crystal-bonding adhesive and described aluminium base.
Wherein, described quoit is the thin quoit of high reflecting rate.
Wherein, be bonded with Copper Foil on the described fiberglass layer, described wafer is electrically connected with described Copper Foil by gold thread.
Wherein, described aluminium base is provided with reflective surface.
The beneficial effects of the utility model are: COB LED encapsulating structure of the present utility model, by the quoit that arranges at glass fiber surface, and quoit is adhesively fixed by insulating cement and glass fiber surface, make wafer be positioned at the inboard of quoit, not only glass fiber surface and wafer are kept apart, avoid glass fiber surface exposed outside, and then the fluorescent glue of fiberglass layer and bright dipping combines can avoid encapsulating the time, thereby avoid the fiberglass layer extinction, improved the light extraction efficiency of encapsulating structure, and this encapsulating structure is simple, realizes easily; Simultaneously, this thin quoit as high reflecting rate of quoit also can improve the light reflection efficiency, further improves the light extraction efficiency of COB LED encapsulating structure.COB LED packaging technology of the present utility model is simple, compares with the encapsulating structure that traditional packaging technology obtains, and the light extraction efficiency of COB LED encapsulating structure can be able to be improved 5～10%.
Description of drawings
Fig. 1 is the schematic cross-section of existing C OB LED encapsulating structure;
Fig. 2 is the schematic cross-section of COB LED encapsulating structure of the present utility model;
Fig. 3 is the I place enlarged diagram among Fig. 2.
Among the figure: the 1-wafer; The 2-crystal-bonding adhesive; The 3-Copper Foil; The 4-fiberglass layer; The 5-aluminium base; The 6-gold thread; The 7-reflective surface; The 8-glass fiber surface; The 1'-wafer; The 2'-crystal-bonding adhesive; The 3'-Copper Foil; The 4'-fiberglass layer; The 5'-aluminium base; The 6'-gold thread; The 7'-reflective surface; The 8'-glass fiber surface; The 9-insulating cement; The 10-quoit.
Embodiment
The utility model is described in further detail below in conjunction with the drawings and specific embodiments.
As Fig. 2, shown in Figure 3, a kind of COB LED encapsulating structure, comprise aluminium base 5', aluminium base 5' is provided with fiberglass layer 4', wafer 1', the glass fiber surface 8' of fiberglass layer 4' inboard is provided with quoit 10, quoit 10 is bonding with glass fiber surface 8' by insulating cement 9, and wafer 1' is positioned at the inboard of quoit 10.This COB LED encapsulating structure, by at glass fiber surface 8' quoit 10 being set, and quoit 10 is adhesively fixed by crystal-bonding adhesive 2' and glass fiber surface 8', make wafer 1' be positioned at the inboard of quoit 10, not only glass fiber surface 8' and wafer 1' are kept apart, avoid glass fiber surface 8' exposed outside, and then the fluorescent glue of fiberglass layer 8' and bright dipping combines can avoid encapsulating the time, thereby avoid fiberglass layer 4' extinction, improved the light extraction efficiency of encapsulating structure, and this encapsulating structure is simple.
In the utility model, wafer 1' is bonding by crystal-bonding adhesive 2' and aluminium base 5'.
Wherein, be bonded with Copper Foil 3' on the fiberglass layer 4', wafer 1' is electrically connected with Copper Foil 3' by gold thread 6'.
Wherein, be provided with reflective surface 7' on the aluminium base 5' again, the light that wafer 1' sends guarantees light extraction efficiency by reflective surface 7' reflection, reduces light loss; Simultaneously, quoit 10 is the thin quoit of high reflecting rate, makes in the bright dipping zone of wafer 1', substantially the material that does not have any extinction, and be the reflective surface of high reflecting rate, and also can improve the light reflection efficiency, further improve the light extraction efficiency of COB LED encapsulating structure.
A kind of for the COB LED packaging technology of making above-mentioned COB LED encapsulating structure, may further comprise the steps:
Steps A: substrate manufacture, in advance with after aluminium base 5' and the fiberglass layer 4' pressing, quoit 10 is set in the glass fiber surface 8' place of fiberglass layer 4' inboard, by insulating cement 9 that quoit 10 is bonding with glass fiber surface 8';
Step B: Gu brilliant bonding wire, the solid brilliant bonding wire of aluminium base 5' after handling in steps A makes wafer 1' be positioned at the inboard of quoit 10.
Wherein, after the steps A, also comprise before the step B:
Steps A 1: solidify, the aluminium base 5' of bonding quoit 10 in the steps A is sent into the baking box baking, insulating cement 9 is solidified.
Wherein, the solid brilliant bonding wire among the step B is specially:
Pass through the bonding wafer 1' of crystal-bonding adhesive 2' at aluminium base 5';
Bonding Copper Foil 3' on fiberglass layer 4', wafer 1' is electrically connected with Copper Foil 3' by gold thread 6'.
Wherein, also comprise after the step B:
Step B1: sealing, 1' applies fluorescent glue at wafer, treat that fluorescent glue solidifies after, outside fluorescent glue, apply covering glue, finish the LED encapsulation.
This COB LED packaging technology is by when substrate manufacture, in advance with after aluminium base 5' and the fiberglass layer 4' pressing, at the sheathed quoit 10 in the glass fiber surface 8' place of fiberglass layer 4' inboard, by insulating cement 2' that quoit 10 is affixed with glass fiber surface 4', finally by quoit 10 glass fiber surface 8' and wafer 1' are kept apart, avoid glass fiber surface 8' exposed outside, and then the fluorescent glue of fiberglass layer 4' and bright dipping combines and causes extinction can avoid encapsulating the time, also can avoid after baking, becoming black or dark brown and absorb light, and then can improve the bright dipping light efficiency of encapsulating structure, the operation of this COB LED packaging technology is simple, realizes easily.This COB LED packaging technology is simple, compares with the encapsulating structure that traditional packaging technology obtains, and the light extraction efficiency of COB LED encapsulating structure can be able to be improved 5～10%.
Know-why of the present utility model has below been described in conjunction with specific embodiments.These are described just in order to explain principle of the present utility model, and can not be interpreted as the restriction to the utility model protection range by any way.Based on explanation herein, those skilled in the art does not need to pay performing creative labour can associate other embodiment of the present utility model, and these modes all will fall within the protection range of the present utility model.
Claims (5)
1. COB LED encapsulating structure, comprise aluminium base (5'), it is characterized in that: described aluminium base (5') is provided with fiberglass layer (4'), wafer (1'), the inboard glass fiber surface (8') of described fiberglass layer (4') is provided with quoit (10), described quoit (10) is bonding by insulating cement (9) and described glass fiber surface (8'), and described wafer (1') is positioned at the inboard of described quoit (10).
2. a kind of COB LED encapsulating structure according to claim 1 is characterized in that: described wafer (1') is bonding by crystal-bonding adhesive (2') and described aluminium base (5').
3. a kind of COB LED encapsulating structure according to claim 1, it is characterized in that: described quoit (10) is the thin quoit of high reflecting rate.
4. a kind of COB LED encapsulating structure according to claim 1 is characterized in that: be bonded with Copper Foil (3') on the described fiberglass layer (4'), described wafer (1') is electrically connected with described Copper Foil (3') by gold thread (6').
5. a kind of COB LED encapsulating structure according to claim 1, it is characterized in that: described aluminium base (5') is provided with reflective surface (7').
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320015621 CN203055984U (en) | 2013-01-11 | 2013-01-11 | COB LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320015621 CN203055984U (en) | 2013-01-11 | 2013-01-11 | COB LED packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203055984U true CN203055984U (en) | 2013-07-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320015621 Expired - Fee Related CN203055984U (en) | 2013-01-11 | 2013-01-11 | COB LED packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203055984U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104538510A (en) * | 2014-12-19 | 2015-04-22 | 重庆新天阳照明科技股份有限公司 | LED mirror surface aluminum substrate packaging process |
| CN108538996A (en) * | 2018-03-07 | 2018-09-14 | 广州硅能照明有限公司 | A method of improving COB light outputs |
-
2013
- 2013-01-11 CN CN 201320015621 patent/CN203055984U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104538510A (en) * | 2014-12-19 | 2015-04-22 | 重庆新天阳照明科技股份有限公司 | LED mirror surface aluminum substrate packaging process |
| CN108538996A (en) * | 2018-03-07 | 2018-09-14 | 广州硅能照明有限公司 | A method of improving COB light outputs |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130710 Termination date: 20160111 |