CN101901740A - Electronic component cutting and stripping machine and method thereof - Google Patents

Abstract

The invention provides an electronic component cutting stripper and a method thereof, comprising a feeding device, a conveying device, a material moving device, a cutting device, a cleaning device and a material receiving device, wherein the feeding device accommodates a plurality of lead frames with electronic components, the conveying device is provided with a conveying mechanism and a stripping platform with break angles, and conveys adhesive tapes by the conveying mechanism, the material moving device takes out the lead frames with the electronic components from the feeding device by a taking and placing device and transfers the lead frames to the adhesive tapes adhered to the conveying device, then the conveying mechanism conveys the adhesive tapes and the lead frames to the lower part of the cutting device, the cutting device cuts the lead frames on the adhesive tapes by a cutter to separate a plurality of independent electronic components, the conveying mechanism conveys the separated electronic components and the adhesive tapes to the lower part of the cleaning device, the cleaning device cleans dust and sundries on the electronic components by a cleaner, and then the conveying mechanism turns the adhesive tapes downwards along the break angles of the stripping platform, and stripping the electronic element to make the electronic element fall into the receiving device for receiving.

Description

Electronic component cutting and stripping machine and method thereof

technical field

The invention relates to an electronic component cutting and stripping machine and a method thereof, in particular to an electronic component cutting and stripping machine and a method thereof that can reduce the manufacturing process and working time, and can easily strip electronic components, thereby improving production efficiency and saving costs.

Background technique

Nowadays, in the back-end process of LED electronic components, multiple well-tested dies are sucked onto the lead frame for die bonding, and then wire bonded and molded. And cutting/forming (Trim/Form), final testing (test) and packaging, that is to complete the back-end process of LEDs. Among them, the cutting/forming process is to separate the LEDs assembled on the lead frame independently, in order to prevent the LED from cutting To move freely during the operation, the method is to glue a hollow ring frame 12 on the tape 11 first, and cut off the tape edges outside the ring frame 12, and then manually place the lead frame 13 with multiple LEDs 14. Put it into the ring frame 12, and paste it on the adhesive tape 11 (as shown in Figure 1), then send the ring frame 12 into the cutting machine to perform the cutting operation, to separate a plurality of independent LED14, after cutting, Then the pick-and-place device of the material transfer device can be utilized to take out the divided LED14, because the suction force of the pick-and-place device is not enough to peel off the adhesive tape 11 for the LED14, that is, the adhesive force of the adhesive tape 11 is greater than the adsorption force of the pick-and-place device (as shown in Fig. 2), in order to facilitate the separation of the LED from the tape, the industry must use a special U-V tape for pasting the LED. After cutting, irradiate the tape with UV light to release the stickiness of the tape, so that the suction and release device of the material transfer device can be used. Pick up the LED peel tape for storage; however, this cutting/shaping process has the following drawbacks:

In this cutting/forming process, in order to prevent the LED from moving during the cutting operation, a ring-shaped frame must be pasted on the tape first, and the tape edge outside the ring-shaped frame must be cut off before the lead frame with LED can be pasted on the tape In addition, it not only consumes cost, but also increases the procedures such as affixing the ring frame and cutting the tape edge material, which consumes operating time.

The cutting/forming process manually sticks the lead frames with LEDs on the tape inside the ring frame one by one, and then transfers each ring frame to the cutting machine for cutting. When the number of lead frames is large, the manual sticking operation It is quite time-consuming and labor-intensive, resulting in the loss of production efficiency.

The cutting/forming process requires the use of special U-V tapes and irradiating the tapes with UV lamps to remove the adhesiveness of the tapes. Not only is the cost of the tapes high, but additional UV lamp equipment is required, resulting in increased costs and time-consuming work.

As the size of LEDs is becoming smaller and smaller, it is quite difficult for the picker and placer of the material transfer device to take out the tiny LEDs on the tape, resulting in the loss of materials that are not easy to collect.

Therefore, how to design a cutting and stripping machine that can consistently automate placement, cutting, stripping, and receiving to reduce manufacturing processes and save costs, and improve production efficiency is the subject of research and development by the industry.

Contents of the invention

The first object of the present invention is to provide an electronic component cutting and stripping machine and its method, including a feeding device, a conveying device, a material shifting device, a cutting device and a receiving device, the feeding device accommodates a plurality of electronic components Lead frame, the conveying device is equipped with a conveying mechanism and a stripping table with corners, and the tape is conveyed by the conveying mechanism, and the material transfer device uses a pick-and-place device to take out the lead frame with electronic components at the feeding device, and transfer and paste On the tape of the conveying device, the conveying mechanism conveys the tape and the lead frame to the lower part of the cutting device. The cutting device uses a cutter to cut the lead frame on the tape to separate several independent electronic components. The conveying mechanism then uses The adhesive tape turns downward along the corner of the stripping table to peel off the electronic components, so that the electronic components fall into the receiving device for storage; thereby, the automatic placement, cutting, stripping and receiving can be consistently automated to effectively improve production efficiency practical benefits.

The second object of the present invention is that the conveying device of the cutting and stripping machine uses a conveying mechanism to make the adhesive tape be conveyed from the front to the rear in a platform shape, for directly affixing the lead frame with LEDs, and conveying the lead frame and the tape to the cutting device for execution The cutting operation does not need to stick the ring frame and the cutting tape edge material, and can reduce the manufacturing process and components, and achieve the practical benefits of saving costs and reducing operating time.

The third object of the present invention is that the cutting and stripping machine is provided with a feeding device for accommodating a plurality of lead frames with LEDs, and the lead frame is taken out from the feeding device by the picker and placer of the material transfer device, and transferred and pasted On the tape, there is no need to manually paste the lead frame, which effectively reduces the working time and achieves the practical benefit of improving production efficiency.

The fourth object of the present invention is that the conveying device of the cutting and stripping machine is provided with a stripping table with corners, and the tape can be pulled from below so that the tape turns downward along with the corners of the stripping table, so that the tape and the LED gradually Peel off to reduce the adhesion area, without using special U-V tape and irradiating UV lamps, so as to achieve the practical benefits of saving costs and reducing operating time.

Object five of the present invention is that a material receiving device is provided behind the conveying device of the cutting and stripping machine, and the material receiving device is provided with a vibrating screener, which can filter LEDs and directly fall into the finished product material receiving device below, and The leftovers of the lead frame are separated and dropped into the front waste collector for storage, eliminating the need to pick up tiny LEDs with a picker and placer, achieving the practical benefit of easy material collection.

The sixth object of the present invention is to provide a cleaning device with a plurality of cleaners behind the cutting device of the cutting and stripping machine to remove the dust and debris attached to the LED during the cutting operation, so as to avoid affecting the next detection process. Quality, to achieve the practical benefit of improving the convenience of use.

In order to achieve the above object, the invention provides a cutting and stripping machine for electronic components, which comprises:

Feeding device: a lead frame for accommodating at least one electronic component;

Conveying device: a conveying mechanism is provided, and the conveying mechanism is provided with a first shaft at the front, and a second shaft is provided at the rear of the conveying mechanism, and a roll of adhesive tape is erected on the first shaft, and on the first shaft A conveyor pulley set is provided between the shaft and the second shaft, and the conveyor pulley conveys the adhesive tape from the front to the rear for pasting the lead frame with the electronic components, and the conveyor belt on the conveyor mechanism A stripping table with corners is provided at the rear of the tape to peel off the adhesive tape from the lead frame and the electronic components;

Material shifting device: equipped with a pick-and-place device for transferring the lead frame with electronic components between the feeding device and the conveying device, and pasting the lead frame on the tape of the conveying device ;

Cutting device: set above the conveying device, and equipped with a carrying mechanism and a cutter, the carrying mechanism is used to drive the cutter to cut the lead frame;

Material receiving device: it is arranged at the rear of the conveying device, and is equipped with a material receiving device for storing electronic components.

The present invention also provides a method for electronic component cutting and stripping machine, which comprises the following steps:

A. The conveying mechanism of the conveying device extends one end of the rolled tape on the front first shaft to the conveyor belt wheel set, and uses the conveyor belt wheel set to convey the tape from the front to the rear for the wire of the electronic component to be pasted. shelf;

B. Use the pick-and-place device of the material transfer device to transfer and paste the lead frame with electronic components at the feeding device on the adhesive tape of the conveying device;

C. The conveying mechanism of the conveying device conveys the tape and the lead frame with electronic components to the cutting device;

D. The cutting device uses a cutter to cut the lead frame on the tape to separate a plurality of independent electronic components;

E. The conveying mechanism of the conveying device conveys the tape and the lead frame with electronic components through the corner

The stripping table makes the tape bend down along the corner of the stripping table, and gradually peels off the lead frame and electronic components;

F. The conveying mechanism of the conveying device conveys each electronic component to the receiving device for storage.

Compared with the prior art, the electronic component cutting and stripping machine and the method thereof in the present invention can reduce the manufacturing process and operation time, and can easily strip the electronic components, thereby improving production efficiency and saving costs.

Description of drawings

Figure 1 The schematic diagram of the existing LED before cutting;

Figure 2 is a schematic diagram of the existing LED after cutting;

Fig. 3 is the appearance diagram of the present invention;

The side view of the present invention of Fig. 4;

The use schematic diagram (1) of Fig. 5 of the present invention;

Fig. 6 is a schematic diagram of the use of the present invention (2);

Fig. 7 is a schematic diagram of the use of the present invention (3);

The use schematic diagram (four) of Fig. 8 of the present invention;

Fig. 9 is a schematic diagram of the use of the present invention (5).

Explanation of reference signs: adhesive tape-11; ring frame-12; lead frame-13; LED-14; feeding device-20; magazine box-21; pushing mechanism-22; -40; carrying mechanism-41; pick-and-place device-42; conveying device-30; first shaft-31; second shaft-32; first motor-33; second motor-34; conveyor pulley set -35; motor-36; sucker-37; first pressure roller-38A; second pressure roller-38B; third pressure roller-38C; stripping table-39; -51; cutter-52; cleaning device-60; first cleaner-61; second cleaner-62; third cleaner-63; sink-64; receiving device-70; screener-71; finished product Receiver-72; Waste Receiver-73; Lead Holder-80; LED-90; Adhesive Tape-100.

Detailed ways

In order to enable your examiner to have a further understanding of the present invention, a preferred embodiment and accompanying drawings are described in detail as follows:

Referring to Fig. 3 and Fig. 4, the cutting and stripping machine of the present invention includes a feeding device 20, a conveying device 30, a material shifting device 40, a cutting device 50, a cleaning device 60 and a receiving device 70, wherein the feeding device 20 A magazine 21 is provided for accommodating a plurality of lead frames 80 with LEDs 90 ; and the feeding device 20 is provided with a pushing mechanism 22 with a pusher 221 for pushing out the lead frames 80 for retrieving. The pushing mechanism 22 can be driven by a driving source to drive the pushing member 221 to move up and down or to move laterally. To convey the adhesive tape 100 , the conveying mechanism is provided with a first shaft 31 at the front, and the conveying mechanism is provided with a second shaft 32 at the rear. The adhesive tape 100 that rolls is erected on this first shaft bar 31, and the first shaft bar 31 is connected with a first motor 33 for tightening the tape, and the second shaft bar 32 is connected with a second motor 34 for tightening the tape. , and between the first shaft 31 and the second shaft 32 there is a set of conveyor pulleys 35 . The conveying pulley set 35 is driven to rotate by a driving motor 36 for conveying the adhesive tape 100 from the front to the rear. In addition, a locator for positioning the lead frame 80 is provided at an appropriate position between the front and rear conveyor wheels of the conveyor pulley group 35, and the locator of the present embodiment is a suction cup 37 with a plurality of suction nozzles. In order to transport the adhesive tape 100 smoothly, a plurality of pressure rollers may be provided between the first and second shafts 31, 32 and the conveyor pulley set 35 depending on the needs of the application. In this embodiment, a first pressure wheel 38A is provided between the first shaft 31 and the conveyor pulley set 35 , and second and third pressure wheels 38B and 38C are provided between the conveyor pulley set 35 and the second shaft 32 . In addition, the conveying device 30 is provided with a material stripping platform 39 with a corner 391 behind the conveyor pulley group 35, so that the adhesive tape 100 can be peeled off from the lead frame 80 and the LED 90, so that the adhesive tape 100 on the first shaft 31 can pass through the second The bottom of the first pressure roller 38A is stretched on the conveyor belt wheel set 35, and then the adhesive tape 100 is turned downward along the corner 391 of the stripping table 39, and is rewound by the second and third pressure rollers 38B and 38C. on the second shaft 32 . The material shifting device 40 is provided with a carrying mechanism 41 for driving the pick-and-place device 42 to perform X-Y-Z axial displacement, so that the pick-and-place operation of the lead frame 80 can be performed between the feeding device 20 and the conveying device 30 . The cutting device 50 is located above the conveying device 30, and relative to the position of the suction cup 37, a carrying mechanism 51 is provided to drive the cutter 52 with a saw blade to perform X-Y-Z axial displacement and θ angle rotation, so as to cut the lead frame 80. This cleaning device 60 is positioned at the rear of cutting device 50, and is provided with a plurality of cleaners, and its first cleaner 61 can spray water mist, in order to clean the dust debris on LED90, and the second cleaner 62 is a brush tool, In order to brush off the dust and debris on the LED90, the third cleaner 63 can blow air to dry the LED90. In addition, the cleaning device 60 is provided with a water tank 64 at the conveyor pulley group 35 of the conveying device 30 for Contain sewage, miscellaneous debris, etc.; the receiving device 70 is installed behind the stripping table 39 of the conveying device 30, and is provided with a vibrating filter 71, which can filter LED90 and directly fall into the finished product receiving device 72 below Storage, the finished product receiver 72 can be an alignment machine, and a waste receiver 73 is provided behind the screener 71 in addition to receive the leftover material of the lead frame.

Please refer to Fig. 5, when the present invention is feeding, the feeding device 20 pushes the lead frame 80 to move upwards with the pushing member 221 of the pushing mechanism 22, and the carrying mechanism 41 of the moving device 40 drives the pick-and-place device 42 Take out the lead frame 80 with LED 90 from the magazine 21 of the feeding device 20, and transfer it to the conveying device 30, and stick the lead frame 80 on the adhesive tape 100 above the conveyor pulley set 35. Please refer to FIG. 6 , the conveyor pulley set 35 of the conveying device 30 conveys the adhesive tape 100 pasted with the lead frame 80 to the bottom of the cutting device 50, and uses the suction cup 37 to absorb the adhesive tape 100 from below, so that the lead frame 80 is positioned. The cutting device 50 uses the carrying mechanism 51 to drive the cutter 52 to perform X-Y-Z axial displacement and θ angle rotation to cut the lead frame 80 on the tape 100. The surface of the tape 100 is slightly cut, but it is still a whole strip , and a plurality of independent LED90s that have been cut and adhered on the surface. Please refer to Fig. 7, this conveyor pulley set 35 then transports the lead frame 80 and LED90 pasted on the adhesive tape 100 to the cleaning device 60, because the lead frame 80 will make the LED90 adhere to dust and debris when it is cut, and it can Utilize the first and second cleaners 61, 62 of the cleaning device 60 to spray and brush the dust and debris on the LED90 respectively, and then dry the LED90 with the third cleaner 63 to keep the LED90 clean and avoid affecting the next detection The testing quality of the workstation, and the water mist sprayed by the first cleaner 61 can flow into the water tank 64 below the adhesive tape 100 . Please refer to FIG. 8 , the conveyor pulley group 35 then transports the adhesive tape 100 together with the lead frame 80 and the LED 90 through the stripping table 39, and the adhesive tape 100 is pulled by the second pressure roller 38B, and can be moved along the corner of the stripping table 39. 391 turns downward, and gradually peels off from the lead frame 80 and LED90 to reduce the adhesion area, making it easy to completely peel off the adhesive tape 100 from the lead frame 80 and LED90; please refer to FIG. Above, when the lead frame 80 and LED90 are separated from the adhesive tape 100, they fall directly onto the filter 71 of the receiving device 70, and the filter 71 screens the LED90 in a vibrating manner and falls into the finished product receiver 72 below for storage. , and the trimmed lead frame 90 leftovers are separated and dropped into the waste receiver 73 located in front of the screener 71 for collection, so as to achieve the purpose of automatic collection.

Accordingly, the present invention can reduce the manufacturing process and operation time, and is easy to strip the electronic components, thereby improving the production efficiency and saving costs. It is really a practical and progressive design, but no similar products and publications have been published. In this way, the requirements for applying for a patent for invention are allowed, and the application is filed in accordance with the law.

Claims (10)

1. A cutting and stripping machine for electronic components, characterized in that it comprises: Feeding device: a lead frame for accommodating at least one electronic component; Conveying device: a conveying mechanism is provided, and the conveying mechanism is provided with a first shaft at the front, and a second shaft is provided at the rear of the conveying mechanism, and a roll of adhesive tape is erected on the first shaft, and on the first shaft A conveyor pulley set is provided between the shaft and the second shaft, and the conveyor pulley conveys the adhesive tape from the front to the rear for pasting the lead frame with the electronic components, and the conveyor belt on the conveyor mechanism A stripping table with corners is provided at the rear of the tape to peel off the adhesive tape from the lead frame and the electronic components; Material shifting device: equipped with a pick-and-place device for transferring the lead frame with electronic components between the feeding device and the conveying device, and pasting the lead frame on the tape of the conveying device ; Cutting device: set above the conveying device, and equipped with a carrying mechanism and a cutter, the carrying mechanism is used to drive the cutter to cut the lead frame; Material receiving device: it is arranged at the rear of the conveying device, and is equipped with a material receiving device for storing electronic components. 2. The electronic component cutting and stripping machine according to claim 1, wherein the feeding device is provided with a magazine for accommodating a plurality of lead frames with electronic components; the feeding device is also provided with A pushing mechanism with pushing parts is used to push out the lead frame for taking out materials; in addition, the material moving device is provided with a carrying mechanism to drive the pick-and-place device for X-Y-Z axial displacement. 3. The electronic component cutting and stripping machine as claimed in claim 1, characterized in that, The conveyor pulley set of the conveying mechanism of the conveying device is driven to rotate by a driving motor, and the first shaft is connected with a first motor for tightening the tape, and the second shaft is connected with a motor for tightening the tape. The second motor of the conveyor belt wheel set is provided with a locator for positioning the lead frame, and the stripping table with knuckles is arranged at the rear of the conveyor pulley set, and the conveying mechanism is provided with Multiple rollers. 4. The cutting and stripping machine for electronic components as claimed in claim 1, wherein the receiving device is provided with a vibrating screen, which can screen electronic components; and the receiving device is provided with a finished product receiving device , for storing electronic components; the other said material receiving device is provided with a waste material receiver for storing scraps of lead frames. 5. The cutting and stripping machine for electronic components as claimed in claim 1, characterized in that it also includes a cleaning device, which is arranged at the rear of the cutting device and has a plurality of cleaners for cleaning electronic components. In addition, the cleaning device is provided with a water tank at the conveyor pulley set of the conveying device. 6. A method for electronic component cutting and stripping machine, characterized in that, comprising the following steps: A. The conveying mechanism of the conveying device extends one end of the rolled tape on the front first shaft to the conveyor belt wheel set, and uses the conveyor belt wheel set to convey the tape from the front to the rear for the wire of the electronic component to be pasted. shelf; B. Use the pick-and-place device of the material transfer device to transfer and paste the lead frame with electronic components at the feeding device on the adhesive tape of the conveying device; C. The conveying mechanism of the conveying device conveys the tape and the lead frame with electronic components to the cutting device; D. The cutting device uses a cutter to cut the lead frame on the tape to separate a plurality of independent electronic components; E. The conveying mechanism of the conveying device conveys the adhesive tape and the lead frame with electronic components through the stripping table with knuckles, so that the tape bends downward along the kink of the stripping table, and gradually peels off the lead frame and electronic components; F. The conveying mechanism of the conveying device conveys each electronic component to the receiving device for storage. 7. The method for electronic component cutting and stripping machine as claimed in claim 6, characterized in that, said feeding device pushes the lead frame with electronic components in the magazine with the pushing member of the pushing mechanism, so as to provide The material transfer device takes out the lead frame, and the material transfer device drives the pick-and-place device to make X-Y-Z axial displacement with the conveying mechanism, takes out the lead frame from the feeding device, and transfers and pastes it on the tape of the conveying device. 8. The method of electronic component cutting and stripping machine according to claim 6, wherein the adhesive tape of the conveying device is placed on the second shaft at the rear, and the cutting device can use The positioner of the conveying device locates the tape and the lead frame with electronic components. 9. The method of electronic component cutting and stripping machine as claimed in claim 6, characterized in that, it also includes after the cutting of the lead frame is completed, the separated electronic components and the leftovers of the lead frame can be dropped into the screening of the receiving device In the finished product receiver, the electronic components slide down through the filter to the finished product receiver below, and after the lead frame is cut, the lead frame corner material can slide from the filter to the waste receiver in front. . 10. The method of electronic component cutting and stripping machine according to claim 6, characterized in that, it also comprises that after the lead frame is cut, the electronic component can be passed through a cleaning device, and the cleaning device uses a plurality of cleaners, Remove dust and debris from electronic components.

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