CN101876839B - Electronic device and assembly method thereof - Google Patents
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Abstract
Description
技术领域 technical field
本发明是有关于一种电子装置,且特别是有关于一种电子装置的组装结构与方法。The present invention relates to an electronic device, and in particular to an assembly structure and method of the electronic device.
背景技术 Background technique
笔记本电脑具有体积小,重量轻,携带方便等优点,所以也越来越受广大电脑消费者的青睐。正因为如此,许多电脑生产商也将生产重点转移到笔记本电脑的生产上。在笔记本电脑的生产过程中,由于作业人员须将许多的零组件组装在一起,才能让这些零组件互相配合运作。因此,组装过程的流畅与否,便会影响到生产的效率。Notebook computer has advantages such as volume is little, light weight, easy to carry, so also more and more is subjected to the favor of broad computer consumer. Because of this, many computer manufacturers have also shifted their production focus to the production of notebook computers. In the production process of notebook computers, operators have to assemble many parts and components together so that these parts and components can work together. Therefore, whether the assembly process is smooth or not will affect the production efficiency.
一般而言,在笔记本电脑的前置手板(palm rest)的内侧,会配置有众多的电子单元。当作业人员要组装前置手板时,便需要逐一地将这些电子单元通过导线连接至主机板。此举不但费时且耗费人力。此外,在组装的过程中,机壳或前置手板常会遮挡住主机板、这些电子单元及导线等零组件,所以作业人员不易目视零组件的位置。如此一来,作业人员只能配合触摸的方式来将导线连接至主机板。此种视觉上的盲点对作业人员来说相当不便,也会造成组装效率降低,或甚至发生零件损坏的情形。Generally speaking, numerous electronic units are arranged on the inner side of the front palm rest of the notebook computer. When the operator wants to assemble the front prototype, it is necessary to connect these electronic units to the main board through wires one by one. This is not only time-consuming but also labor-intensive. In addition, during the assembly process, the case or the front hand panel often blocks components such as the motherboard, these electronic units, and wires, so it is difficult for operators to visually see the positions of the components. As a result, operators can only connect wires to the motherboard by touching them. Such visual blind spots are quite inconvenient for operators, and may also result in reduced assembly efficiency, or even damage to parts.
发明内容 Contents of the invention
本发明提供一种电子装置,能够方便使用者进行组装。The invention provides an electronic device, which is convenient for users to assemble.
本发明提供一种电子装置的组装方法,用以提高使用者组装电子装置的效率与便利性。The invention provides an assembly method of an electronic device, which is used to improve the efficiency and convenience for users to assemble the electronic device.
本发明提出一种电子装置,其包括一第一电子模块、一第二电子模块以及一转接件。第一电子模块包括多个电子单元、多个导线(lead wire)、一电路子板(daughterboard)与一第一连接器。第一连接器配置于电路子板。导线分别连接于电子单元与电路子板之间。电路子板电性连接于导线与第一连接器之间。第二电子模块包括一电路母板(motherboard)与一第二连接器。第二连接器配置于电路母板,且与电路母板电性连接。转接件组装于第一连接器与第二连接器之间,且电性连接于第一连接器与第二连接器,以连接第一电子模块与第二电子模块。The invention provides an electronic device, which includes a first electronic module, a second electronic module and an adapter. The first electronic module includes a plurality of electronic units, a plurality of lead wires, a daughter board and a first connector. The first connector is configured on the sub-board. The wires are respectively connected between the electronic unit and the sub-board. The sub-board is electrically connected between the wire and the first connector. The second electronic module includes a motherboard and a second connector. The second connector is configured on the circuit motherboard and is electrically connected to the circuit motherboard. The adapter is assembled between the first connector and the second connector, and is electrically connected to the first connector and the second connector to connect the first electronic module and the second electronic module.
在本发明的一实施例中,转接件包括一软性连接件、一第三连接器与一第四连接器。软性连接件电性连接于第三连接器与第四连接器之间,且第三连接器与第四连接器分别用以组装于第一连接器与第二连接器。In an embodiment of the present invention, the adapter includes a flexible connector, a third connector and a fourth connector. The flexible connector is electrically connected between the third connector and the fourth connector, and the third connector and the fourth connector are respectively used for assembling with the first connector and the second connector.
在本发明的一实施例中,第一连接器与第二连接器分别朝向一第一方向,而第三连接器与第四连接器分别沿着一第二方向组装于第一连接器与第二连接器。第一方向与第二方向彼此相对。In one embodiment of the present invention, the first connector and the second connector face a first direction respectively, and the third connector and the fourth connector are respectively assembled on the first connector and the second connector along a second direction. Two connectors. The first direction and the second direction are opposite to each other.
在本发明的一实施例中,电路母板具有一第一开口,且此第一开口位于第一连接器与第三连接器的一组装路径上。In an embodiment of the present invention, the circuit board has a first opening, and the first opening is located on an assembly path of the first connector and the third connector.
在本发明的一实施例中,第一连接器与第三连接器位于电路母板的一侧。In an embodiment of the invention, the first connector and the third connector are located on one side of the circuit board.
在本发明的一实施例中,电子装置还包括一第一壳体与一第二壳体。第一电子模块配置于第一壳体,而第二电子模块配置于第二壳体。第一电子模块与第二电子模块位于第一壳体与第二壳体之间。In an embodiment of the present invention, the electronic device further includes a first casing and a second casing. The first electronic module is configured in the first casing, and the second electronic module is configured in the second casing. The first electronic module and the second electronic module are located between the first casing and the second casing.
在本发明的一实施例中,电子装置还包括一盖板,而第二壳体具有一第二开口,暴露出转接件。盖板组装于第二壳体以封闭第二开口。In an embodiment of the present invention, the electronic device further includes a cover plate, and the second housing has a second opening exposing the adapter. The cover plate is assembled on the second casing to close the second opening.
本发明还提出一种电子装置,其包括一第一电子模块、一第二电子模块以及一转接件。第一电子模块包括多个电子单元与一第一连接器,其中电子单元整合地连接至第一连接器。第二电子模块包括一电路母板与一第二连接器。第二连接器电性连接电路母板。转接件包括一软性连接件、一第三连接器与一第四连接器。软性连接件电性连接于第三连接器与第四连接器之间,且第三连接器与第四连接器分别用以组装于第一连接器与第二连接器。The present invention also provides an electronic device, which includes a first electronic module, a second electronic module, and an adapter. The first electronic module includes a plurality of electronic units and a first connector, wherein the electronic units are integrally connected to the first connector. The second electronic module includes a circuit board and a second connector. The second connector is electrically connected to the circuit board. The adapter includes a flexible connector, a third connector and a fourth connector. The flexible connector is electrically connected between the third connector and the fourth connector, and the third connector and the fourth connector are respectively used for assembling with the first connector and the second connector.
在本发明的一实施例中,第一电子模块还包括一电路子板与多个导线。电路子板电性连接第一连接器,且电路子板经由这些导线电性连接电子单元。In an embodiment of the present invention, the first electronic module further includes a circuit board and a plurality of wires. The sub-board is electrically connected to the first connector, and the sub-board is electrically connected to the electronic unit through the wires.
在本发明的一实施例中,第一连接器与第二连接器分别朝向一第一方向。第三连接器与第四连接器分别沿着一第二方向组装于第一连接器与第二连接器。第一方向与第二方向彼此相对。In an embodiment of the present invention, the first connector and the second connector respectively face a first direction. The third connector and the fourth connector are respectively assembled to the first connector and the second connector along a second direction. The first direction and the second direction are opposite to each other.
在本发明的一实施例中,电路母板具有一第一开口,且此第一开口位于第一连接器与第三连接器的一组装路径上。In an embodiment of the present invention, the circuit board has a first opening, and the first opening is located on an assembly path of the first connector and the third connector.
在本发明的一实施例中,第一连接器与第三连接器位于电路母板的一侧。In an embodiment of the invention, the first connector and the third connector are located on one side of the circuit board.
在本发明的一实施例中,电子装置还包括一第一壳体与一第二壳体。第一电子模块配置于第一壳体,而第二电子模块配置于第二壳体。第一电子模块与第二电子模块位于第一壳体与第二壳体之间。In an embodiment of the present invention, the electronic device further includes a first casing and a second casing. The first electronic module is configured in the first casing, and the second electronic module is configured in the second casing. The first electronic module and the second electronic module are located between the first casing and the second casing.
在本发明的一实施例中,电子装置还包括一盖板,而第二壳体具有一第二开口,暴露出转接件。盖板组装于第二壳体以封闭第二开口。In an embodiment of the present invention, the electronic device further includes a cover plate, and the second housing has a second opening exposing the adapter. The cover plate is assembled on the second casing to close the second opening.
本发明还提出一种电子装置,其包括一第一壳体、一第二壳体、一第一电子模块、一第二电子模块、一转接件以及一盖板。第二壳体具有一第二开口。第一电子模块配置于第一壳体上,且位于第一壳体与第二壳体之间。第一电子模块包括多个电子单元与一第一连接器。电子单元整合地连接至第一连接器。第二电子模块配置于第二壳体上,且位于第一壳体与第二壳体之间。第二电子模块包括一电路母板与一第二连接器。第二连接器电性连接电路母板。转接件暴露于第二开口,且组装于第一连接器与第二连接器之间。转接件电性连接于第一连接器与第二连接器,以连接第一电子模块与第二电子模块。盖板组装于第二壳体以封闭第二开口。The present invention also provides an electronic device, which includes a first casing, a second casing, a first electronic module, a second electronic module, an adapter and a cover. The second casing has a second opening. The first electronic module is configured on the first casing and located between the first casing and the second casing. The first electronic module includes a plurality of electronic units and a first connector. The electronic unit is integrally connected to the first connector. The second electronic module is configured on the second casing and located between the first casing and the second casing. The second electronic module includes a circuit board and a second connector. The second connector is electrically connected to the circuit board. The adapter is exposed to the second opening and assembled between the first connector and the second connector. The adapter is electrically connected to the first connector and the second connector to connect the first electronic module and the second electronic module. The cover plate is assembled on the second casing to close the second opening.
在本发明的一实施例中,转接件包括一软性连接件、一第三连接器与一第四连接器。软性连接件电性连接于第三连接器与第四连接器之间,且第三连接器与第四连接器分别用以组装于第一连接器与第二连接器。In an embodiment of the present invention, the adapter includes a flexible connector, a third connector and a fourth connector. The flexible connector is electrically connected between the third connector and the fourth connector, and the third connector and the fourth connector are respectively used for assembling with the first connector and the second connector.
在本发明的一实施例中,第一连接器与第二连接器分别朝向一第一方向,而第三连接器与第四连接器分别沿着一第二方向组装于第一连接器与第二连接器。第一方向与第二方向彼此相对。In one embodiment of the present invention, the first connector and the second connector face a first direction respectively, and the third connector and the fourth connector are respectively assembled on the first connector and the second connector along a second direction. Two connectors. The first direction and the second direction are opposite to each other.
在本发明的一实施例中,电路母板具有一第一开口,其位于第一连接器与第三连接器的一组装路径上。In an embodiment of the present invention, the circuit board has a first opening located on an assembly path of the first connector and the third connector.
在本发明的一实施例中,第一连接器与第三连接器位于电路母板的一侧。In an embodiment of the invention, the first connector and the third connector are located on one side of the circuit board.
在本发明的一实施例中,第一电子模块还包括一电路子板与多个导线。电路子板电性连接第一连接器,且电路子板经由导线电性连接电子单元。In an embodiment of the present invention, the first electronic module further includes a circuit board and a plurality of wires. The circuit sub-board is electrically connected to the first connector, and the circuit sub-board is electrically connected to the electronic unit through wires.
本发明还提出一种电子装置,其包括一第一壳体、一第二壳体、一第一电子模块、一第二电子模块、一转接件以及一盖板。第二壳体具有一第二开口。第一电子模块配置于第一壳体上,且位于第一壳体与第二壳体之间。第一电子模块包括多个电子单元、多个导线、一电路子板以及一第一连接器。电路子板经由导线电性连接电子单元。第一连接器配置于电路子板且朝向一第一方向。这些导线分别连接于电子单元与电路子板之间,且电路子板电性连接于导线与第一连接器之间。第二电子模块配置于第二壳体上,且位于第一壳体与第二壳体之间。第二电子模块包括一电路母板以及一第二连接器。电路母板具有一第一开口,以暴露第一连接器。第二连接器配置于电路母板且电性连接电路母板。第二连接器朝向第二方向。转接件暴露于第二开口,且包括一软性连接件、一第三连接器与一第四连接器。软性连接件电性连接于第三连接器与第四连接器之间,且第三连接器与第四连接器分别沿着一第二方向组装于第一连接器与第二连接器,且第一方向与第二方向彼此相对。盖板组装于第二壳体以封闭第二开口。The present invention also provides an electronic device, which includes a first casing, a second casing, a first electronic module, a second electronic module, an adapter and a cover. The second casing has a second opening. The first electronic module is configured on the first casing and located between the first casing and the second casing. The first electronic module includes a plurality of electronic units, a plurality of wires, a circuit board and a first connector. The sub-board is electrically connected to the electronic unit via wires. The first connector is disposed on the sub-board and faces a first direction. The wires are respectively connected between the electronic unit and the sub-board, and the sub-board is electrically connected between the wires and the first connector. The second electronic module is configured on the second casing and located between the first casing and the second casing. The second electronic module includes a circuit board and a second connector. The motherboard has a first opening for exposing the first connector. The second connector is configured on the circuit motherboard and electrically connected to the circuit motherboard. The second connector faces the second direction. The adapter is exposed to the second opening, and includes a flexible connector, a third connector and a fourth connector. The flexible connector is electrically connected between the third connector and the fourth connector, and the third connector and the fourth connector are respectively assembled on the first connector and the second connector along a second direction, and The first direction and the second direction are opposite to each other. The cover plate is assembled on the second casing to close the second opening.
本发明还提出一种电子装置的组装方法,其包括下列步骤。首先,提供组装有一第一电子模块的一第一壳体。第一电子模块包括多个电子单元与一第一连接器,且这些电子单元整合地连接至第一连接器。接着,提供组装有一第二电子模块的一第二壳体。第二电子模块包括一电路母板与一第二连接器,且第二连接器配置并电性连接于电路母板。然后,提供一转接件。接着,组装第一壳体至第二壳体,使得第一电子模块与第二电子模块位于第一壳体与第二壳体之间。之后,组装转接件于第一连接器与第二连接器之间,使得转接件电性连接于第一连接器与第二连接器,以连接第一电子模块与第二电子模块。The invention also proposes an assembly method of an electronic device, which includes the following steps. Firstly, a first housing assembled with a first electronic module is provided. The first electronic module includes a plurality of electronic units and a first connector, and the electronic units are integrally connected to the first connector. Next, a second housing assembled with a second electronic module is provided. The second electronic module includes a circuit motherboard and a second connector, and the second connector is configured and electrically connected to the circuit motherboard. Then, an adapter is provided. Next, assemble the first casing to the second casing, so that the first electronic module and the second electronic module are located between the first casing and the second casing. After that, the adapter is assembled between the first connector and the second connector, so that the adapter is electrically connected to the first connector and the second connector, so as to connect the first electronic module and the second electronic module.
在本发明的一实施例中,提供组装有第一电子模块的第一壳体的步骤包括下列步骤。首先,提供第一电子模块。第一电子模块还包括一电路子板与多个导线。第一连接器配置并电性连接于电路子板,并且分别连接这些导线于电子单元与第一连接器之间,使得电子单元整合地连接至第一连接器。接着,组装这些电子单元、电路子板与这些导线于该第一壳体上。In an embodiment of the present invention, the step of providing the first housing assembled with the first electronic module includes the following steps. First, a first electronic module is provided. The first electronic module also includes a circuit board and a plurality of wires. The first connector is configured and electrically connected to the sub-board, and respectively connects the wires between the electronic unit and the first connector, so that the electronic unit is integrally connected to the first connector. Next, assemble the electronic units, the circuit sub-board and the wires on the first casing.
在本发明的一实施例中,第一连接器与第二连接器分别朝向一第一方向。第二壳体具有一第二开口,且转接件包括一软性连接件、一第三连接器与一第四连接器。软性连接件电性连接于第三连接器与第四连接器之间。组装转接件于第一连接器与第二连接器之间的步骤包括下列步骤。首先,使第三连接器与第四连接器以一第二方向面向第二开口,其中第一方向与第二方向相对。接着,使转接件沿着一组装路径并以第二方向移动,以经由第二开口,让第三连接器与第四连接器分别组装至第一连接器与第二连接器。In an embodiment of the present invention, the first connector and the second connector respectively face a first direction. The second housing has a second opening, and the adapter includes a flexible connection, a third connector and a fourth connector. The flexible connector is electrically connected between the third connector and the fourth connector. The step of assembling the adapter between the first connector and the second connector includes the following steps. First, make the third connector and the fourth connector face the second opening in a second direction, wherein the first direction is opposite to the second direction. Then, the adapter is moved along an assembling path in a second direction so as to allow the third connector and the fourth connector to be assembled to the first connector and the second connector respectively through the second opening.
在本发明的一实施例中,电子装置的组装方法还包括提供一盖板,接着组装此盖板于第二开口以封闭第二开口。In an embodiment of the present invention, the method for assembling the electronic device further includes providing a cover plate, and then assembling the cover plate on the second opening to close the second opening.
基于上述,在本发明的电子装置及其组装方法中,由于利用一第一电子模块先将多个电子单元及其导线整合,然后再以一转接件将此第一电子模块与电子装置的一第二电子模块连接。因此,节省了使用者组装此电子装置所需耗费的时间与人力,并同时在组装过程中所操作的各个零件均能清楚地目视操作,此举亦降低了组装过程中组装错误与零件损坏的发生率。Based on the above, in the electronic device and its assembly method of the present invention, a plurality of electronic units and their wires are first integrated by using a first electronic module, and then the first electronic module and the electronic device are connected by an adapter. A second electronic module is connected. Therefore, it saves the time and labor required for the user to assemble the electronic device, and at the same time, each part operated during the assembly process can be clearly visually operated, which also reduces assembly errors and parts damage during the assembly process incidence rate.
为让本发明的上述特征和优点能更明显易懂,下文特举实施例,并配合附图作详细说明如下。In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail with reference to the accompanying drawings.
附图说明 Description of drawings
图1是依照本发明一实施例的一种电子装置的剖面示意图。FIG. 1 is a schematic cross-sectional view of an electronic device according to an embodiment of the invention.
图2A是图1的电子装置中第一电子模块的连接方块图。FIG. 2A is a connection block diagram of a first electronic module in the electronic device of FIG. 1 .
图2B是图2A中部分电子单元的配置示意图。FIG. 2B is a schematic diagram of the configuration of some electronic units in FIG. 2A .
图3是图1的电子装置的组装流程图。FIG. 3 is a flow chart of assembling the electronic device of FIG. 1 .
图4~图6是图1的电子装置对应图3的组装流程的剖面示意图。4 to 6 are schematic cross-sectional views of the assembly process of the electronic device of FIG. 1 corresponding to FIG. 3 .
图7是本发明另一实施例的电子装置的剖面示意图。FIG. 7 is a schematic cross-sectional view of an electronic device according to another embodiment of the present invention.
图8是本发明又一实施例的电子装置的剖面示意图。FIG. 8 is a schematic cross-sectional view of an electronic device according to another embodiment of the present invention.
主要元件符号说明Description of main component symbols
100、200、300:电子装置100, 200, 300: Electronics
110、310:第一电子模块110, 310: the first electronic module
112a:键盘112a: Keyboard
112b:指纹辨识器112b: Fingerprint reader
112c:触控板112c: Touchpad
112d:多媒体控制板112d: Multimedia Control Panel
112e:电源供应板112e: Power supply board
112f:扬声器112f: speaker
114a、114b、114c、114d、114e、114f:导线114a, 114b, 114c, 114d, 114e, 114f: wires
116:电路子板116: circuit board
118、318:第一连接器118, 318: first connector
120、220、320:第二电子模块120, 220, 320: second electronic module
122、222、322:电路母板122, 222, 322: Motherboard
122a:第一开口122a: first opening
124、324:第二连接器124, 324: Second connector
130:转接件130: Adapter
132:软性连接件132: Flexible connector
134:第三连接器134: Third connector
136:第四连接器136: Fourth connector
140:第一壳体140: First shell
150、170:第二壳体150, 170: second housing
152:第二开口152: second opening
160:盖板160: cover plate
180、190:锁固件180, 190: locking piece
A:第一方向A: First direction
B:第二方向B: Second direction
C:下表面C: lower surface
L:组装路径L: assembly path
具体实施方式 Detailed ways
图1是依照本发明一实施例的一种电子装置的剖面示意图。图2A是图1的电子装置中第一电子模块的连接方块图。请同时参考图1及图2A,电子装置100例如是一笔记本电脑,其包括一第一电子模块110、一第二电子模块120以及一转接件130。第一电子模块110包括多个电子单元112a、112b、112c、112d、112e与112f、多个导线114a、114b、114c、114d、114e与114f、一电路子板116与一第一连接器118。第一连接器118安装配置于电路子板116下表面C。导线114a~114f分别连接于电子单元112a~112f与电路子板116之间,通过电路子板116将各导线传递的信号集中而导接至第一连接器118。FIG. 1 is a schematic cross-sectional view of an electronic device according to an embodiment of the invention. FIG. 2A is a connection block diagram of a first electronic module in the electronic device of FIG. 1 . Please refer to FIG. 1 and FIG. 2A at the same time. The
在此予以进一步说明。图2B是图2A中部份电子单元的配置示意图,且其中第一壳体14的的方位适与图1相反,亦即下表面朝上,以明示安装于其下表面的元件,例如电路子板116、电子单元112f及导线114f等。请同时参考图2A及图2B,其中图2B仅显示部分电子单元以作为说明,然本发明并不以此为限。在本实施例中,这些电子单元112a~112f例如分别为键盘112a、指纹辨识器(fingerprint reader)112b、触控板(touchpad)112c、多媒体控制板(media dash board)112d、电源供应板(power board)112e以及扬声器(speaker)112f。这些电子单元112a~112f借由相对应的导线114a~114f而集中导接至电路子板116。虽然,本实施例将这些电子单元112a~112f列举如上,但并未限定这些电子单元112a~112f的种类,设计者仍可依照实际需求而予以增减。It is further explained here. FIG. 2B is a schematic diagram of the configuration of some electronic units in FIG. 2A, and the orientation of the first housing 14 is opposite to that in FIG.
就第二模块120而言,第二电子模块120包括一电路母板122与一第二连接器124。第二连接器124配置于电路母板122下表面C,且与电路母板122电性连接。在本实施例中,此电路母板122例如配置有中央处理单元(Central Processing Unit,CPU,未示出)、存储器(未示出)、南桥芯片组(southbridge chipset,未示出)以及北桥芯片组(north bridge chipset,未示出)等。另外,转接件130组装于第一连接器118与第二连接器124之间,且电性连接于第一连接器118与第二连接器124,以连接第一电子模块110与第二电子模块120。Regarding the
再者,电子装置100还可包括一第一壳体140与一第二壳体150。在本实施例中,第一电子模块110可借由多个锁固件180例如螺丝而支撑固定于第一壳体140。同样的,第二电子模块120可借由多个锁固件190而支撑固定于第二壳体150。在第一壳体140组装于第二壳体150后,第一电子模块110与第二电子模块120位于第一壳体140与第二壳体150之间。此外,在本实施例中,第一壳体140例如为笔记本电脑的一前置手板(palm rest)。Furthermore, the
值得一提的是,由于这些电子单元112a~112f分别通过导线114a~114f整合地连接于电路子板116,且转接件130连接于电路子板116与电路母板122之间。因此,这些电子单元112a~112f便能够通过转接件130连接至电路母板122。如此一来,当使用者组装电子装置100时,使用者不需逐一地将这些电子单元112a~112f通过导线114a~114f组装于电路母板122,使得组装效率得以提升。此举不但减少耗费的人力与时间,也能有效地降低组装成本。It is worth mentioning that these
进一步来说,请再参考图1,转接件130可包括一软性连接件132、一第三连接器134与一第四连接器136。软性连接件132电性连接于第三连接器134与第四连接器136之间,且第三连接器134与第四连接器136分别用以组装于第一连接器118与第二连接器124。在本实施例中,软性连接件132例如是一软排线(flex cable)或是一软性线路板(Flex Printed Circuit Board,FPCB)。软性连接件132可借由其可挠曲的特性,来吸收第一电子模块110与第二电子模块120之间的组装公差。亦即,软性连接件132不但可作为第一电子模块110与第二电子模块120之间的转接媒介之外,也能让使用者更方便地进行组装。Further, please refer to FIG. 1 again, the
另一方面,上述这些连接器118、124、134与136例如是板对板连接器(Board To Board connector,BTB connector),可让不同的电路板能借由这些连接器进行电性连接,以达到信号传输的目的。此板对板连接器已于业界广泛地使用,其相关结构与说明可参考美国专利US6,293,805或US5,735,696,但不以此为限。On the other hand, the above-mentioned
此外,在第一壳体140组装至第二壳体150之后,第一连接器118与第二连接器124分别朝向一第一方向A。此时,使用者可将第三连接器134与第四连接器136分别沿着相对第一方向A的一第二方向B组装于第一连接器118与第二连接器124,而完成第一电子模块110与第二电子模块120的连接。In addition, after the
进一步来说,电路母板122具有一第一开口122a,且此第一开口122a位于第一连接器118与第三连接器134的一组装路径L上。当第一壳体140组装于第二壳体150时,至少部分的第一连接器118穿过第一开口122a。此外,第二壳体150具有一第二开口152,以借此暴露出转接件130。使用者可通过第二开口152将转接件130连接至第一连接器118与第二连接器124。换句话说,第二开口152的尺寸设计,以至少能便于组装者将转接件130自外部连接至第一连接器118与第二连接器124为佳,当然,第二开口152亦可配合其他元件或操作所需的开口一并开设,以避免开设过多开口。另外,电子装置100还可包括一盖板160,当上述零件完成组装后,使用者便可组装此盖板160于第二开口152以封闭第二开口152,而达到保护壳体140、150内电子模块110、120的目的。Further, the
图3是图1的电子装置的组装流程图,图4~图6是图1的电子装置对应图3的组装流程的剖面示意图。以下,将配合图3~图6对组装的流程进行说明。此外,由于电子装置100的结构已于上述文字中提及,在此便不再赘述。FIG. 3 is an assembly flowchart of the electronic device of FIG. 1 , and FIGS. 4 to 6 are schematic cross-sectional views of the assembly process of the electronic device of FIG. 1 corresponding to FIG. 3 . Hereinafter, the assembly process will be described with reference to FIGS. 3 to 6 . In addition, since the structure of the
请先参考图3及图4。首先进行步骤S300a,提供组装有第一电子模块110的第一壳体140。详细来说,步骤S300a可包括S310~S330等三个子步骤。首先进行步骤S310,提供第一电子模块110,其包括多个电子单元112a~112f、第一连接器118、电路子板116与多个导线114a~114f,第一连接器118配置并电性连接于电路子板116。接着进行步骤S320,分别连接导线114a~114f于电子单元112a~112f与第一连接器118之间,使得电子单元112a~112f整合地连接至第一连接器118(如图2A或图2B)。之后进行步骤S330,组装电子单元112a~112f、电路子板116与导线114a~114f于第一壳体140上。Please refer to Figure 3 and Figure 4 first. First, step S300a is performed to provide the
然后进行步骤S340,提供组装有第二电子模块120的第二壳体150。第二电子模块120包括电路母板122与第二连接器124,且第二连接器124配置并电性连接于电路母板122。电路母板122具有一第一开口122a,第二壳体150具有一第二开口152。Then proceed to step S340 , providing the
请参考图4与图5,接着进行步骤S350,可沿着第一方向A将第一壳体140组装至第二壳体150,使得第一电子模块110与第二电子模块120位于第一壳体140与第二壳体150之间。此时,第一连接器118与第二连接器124分别朝向第一方向A,且第一开口122a暴露出第一连接器118。Please refer to FIG. 4 and FIG. 5 , and proceed to step S350, the
然后进行步骤S360,提供转接件130,其具有一第三连接器134、一第四连接器136与一软性连接件132。Then proceed to step S360 , providing the
请参考图5与图6,再来进行步骤S300b,组装转接件130于第一连接器118与第二连接器124。详细来说,步骤S300b可包括S370与S380等两个子步骤。首先进行步骤S370,使第三连接器134与第四连接器136以第二方向B面向第二开口152。接着进行步骤S380,使转接件130沿着组装路径L并以第二方向B移动。如此一来,转接件130便可经由第二开口152组装于第一电子模块110与第二电子模块120之间,使得第三连接器134与第四连接器136分别组装至第一连接器118与第二连接器124。Please refer to FIG. 5 and FIG. 6 , and then proceed to step S300 b , assembling the
值得一提的是,由于转接件130可在第一壳体140组装至第二壳体150后,通过第二开口152组装至第一连接器118与第二连接器124。因此,使用者可通过第二开口152目视第一连接器118与第二连接器124的位置,而能够方便地将转接件130组装上去。此外,如前所述,虽然本实施例的第二开口152只有用来组装转接件130,但在另一未示出的实施例中,第二开口152的尺寸可以放大,而可用来更换电路母板126上的存储器或中央处理器。也就是说,第二开口152可与第二壳体150上原有的开口(未示出)整合在一起,而减少开孔的数量。It is worth mentioning that the
此外,在组装完转接件130后,还可进行步骤S390以及步骤S400。提供盖板160,并组装盖板160于第二开口152。如此一来,盖板160便会封闭第二开口152。至此,便完成电子装置100的组装流程。In addition, after the
图7是本发明另一实施例的电子装置的剖面示意图。请参考图1与图7,图1的电子装置100是以第一开口122a暴露出第一连接器118,而在本实施例的电子装置200中,第二电子模块220的电路母板222并未具有图1中的第一开口122a,第一连接器118与第三连接器134是位于电路母板222的一侧。亦即,在电子装置200中,可省略如图1的第一开口122a。FIG. 7 is a schematic cross-sectional view of an electronic device according to another embodiment of the present invention. Please refer to FIG. 1 and FIG. 7, the
图8是本发明又一实施例的电子装置的剖面示意图。请参考图1与图8,在此实施例中,电子装置300的第一连接器318可直接对接于第二连接器324,而可省略如图1的转接件130以及位于第二壳体170上的第一开口122a与盖板160。详细来说,相较于图1的实施例,在本实施例中,配置于电路母板322上的第二连接器324是朝向第二方向B,且第二连接器324与第一连接器318彼此互为公母插座。因此,使用者仅需将第一连接器318直接连接至第二连接器324,即可将第一电子模块310电性连接至第二电子模块320。FIG. 8 is a schematic cross-sectional view of an electronic device according to another embodiment of the present invention. Please refer to FIG. 1 and FIG. 8, in this embodiment, the first connector 318 of the electronic device 300 can be directly connected to the second connector 324, and the
综上所述,本发明的电子装置及其组装方法,借由将多个电子单元及其导线整合于第一电子模块上,并经由一转接件连接至第二电子模块。此举简化了传统需逐一将电子单元及导线连接至第二电子模块的繁复步骤。再者,利用转接件中软性连接件的可挠曲特性,因而能吸收第一电子模块与第二电子模块之间的组装公差。另外,由于第一电子模块与第二电子模块的连接器均朝向同一方向,且第二电子模块具有第一开口以暴露出第一电子模块上的第一连接器,因此使用者于组装时能避免目视上的盲点,以借此提高组装电子装置的准确性与达成率。To sum up, the electronic device and its assembly method of the present invention integrate a plurality of electronic units and their wires on the first electronic module, and connect to the second electronic module through an adapter. This simplifies the traditional complicated steps of connecting the electronic unit and wires to the second electronic module one by one. Furthermore, the flexibility of the flexible connector in the adapter can be used to absorb the assembly tolerance between the first electronic module and the second electronic module. In addition, since the connectors of the first electronic module and the second electronic module face the same direction, and the second electronic module has a first opening to expose the first connector on the first electronic module, the user can Avoid visual blind spots, thereby improving the accuracy and completion rate of assembling electronic devices.
虽然本发明已以实施例公开如上,然其并非用以限定本发明,任何所属技术领域中具有通常知识者,在不脱离本发明的精神和范围内,当可作些许的更动与润饰,故本发明的保护范围当视权利要求书所界定者为准。Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the claims.
Claims (9)
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