CN106161885A - Camera module - Google Patents
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- CN106161885A CN106161885A CN201510162449.2A CN201510162449A CN106161885A CN 106161885 A CN106161885 A CN 106161885A CN 201510162449 A CN201510162449 A CN 201510162449A CN 106161885 A CN106161885 A CN 106161885A
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Abstract
Description
技术领域 technical field
本发明涉及摄像领域,尤其涉及一种摄像头模组。 The invention relates to the field of photography, in particular to a camera module.
背景技术 Background technique
现今手机、平板电脑等电子装置设有前摄像头模组与后摄像头模组,组装时,通常将前摄像头模组和后摄像头模组的电路板分别组装在手机的主板上。然而,将两个摄像头模组的电路板分别组装在手机的主板上会浪费工时,降低生产效率。此外,传统电子装置的前摄像头和后摄像头模组均需要一个电路板及双面图像传感器,增加了电子装置的生产成本。 Nowadays, electronic devices such as mobile phones and tablet computers are equipped with a front camera module and a rear camera module. During assembly, the circuit boards of the front camera module and the rear camera module are usually assembled on the main board of the mobile phone respectively. However, assembling the circuit boards of the two camera modules separately on the main board of the mobile phone will waste man-hours and reduce production efficiency. In addition, both the front camera and rear camera modules of conventional electronic devices require a circuit board and double-sided image sensors, which increases the production cost of the electronic device.
发明内容 Contents of the invention
鉴于上述内容,有必要提供一种能够节约组装工时及节约生产成本的摄像头模组。 In view of the above, it is necessary to provide a camera module that can save assembly man-hours and production costs.
一种摄像头模组,该摄像头模组包括电路板、镜头组件和双面图像传感器,该镜头组件的数量为两个,该两个镜头组件分别电连接该电路板且该两个镜头组件的轴线重合,该电路板上贯通开设通孔,该双面图像传感器包括两相对设置的感光面,该双面图像传感器装设在该通孔处且位于该两个镜头组件之间,以使该两个镜头组件分别朝向该双面图像传感器对应的感光面。 A camera module, the camera module includes a circuit board, a lens assembly and a double-sided image sensor, the number of the lens assembly is two, the two lens assemblies are electrically connected to the circuit board respectively and the axis of the two lens assemblies overlap, the circuit board is opened through a through hole, and the double-sided image sensor includes two opposite photosensitive surfaces, and the double-sided image sensor is installed at the through hole and is located between the two lens components, so that the two Each lens assembly faces the photosensitive surface corresponding to the double-sided image sensor.
一种摄像头模组,该摄像头模组包括电路板、镜头组件和双面图像传感器,该双面图像传感器设在该电路板的一侧,该双面图像传感器包括两相对设置的感光面,该镜头组件的数量为两个,该两个镜头组件分别电连接该电路板且该两个镜头组件的轴线重合,该双面图像传感器位于该两个镜头组件之间以使该两个镜头组件分别朝向该双面图像传感器对应的感光面。 A camera module, the camera module includes a circuit board, a lens assembly and a double-sided image sensor, the double-sided image sensor is arranged on one side of the circuit board, the double-sided image sensor includes two opposite photosensitive surfaces, the The number of lens assemblies is two, and the two lens assemblies are respectively electrically connected to the circuit board and the axes of the two lens assemblies are coincident, and the double-sided image sensor is located between the two lens assemblies so that the two lens assemblies are respectively Towards the photosensitive surface corresponding to the double-sided image sensor.
本发明的摄像头模组,通过将两个镜头组件共用一个电路板及双面图像传感器,节约了生产成本的同时能够减少组装工时。 In the camera module of the present invention, two lens components share a circuit board and a double-sided image sensor, saving production costs and reducing assembly man-hours.
附图说明 Description of drawings
图1是本发明实施例提供的电子装置的立体示意图。 FIG. 1 is a schematic perspective view of an electronic device provided by an embodiment of the present invention.
图2是本发明第一实施例的电子装置的摄像头模组的立体示意图。 FIG. 2 is a schematic perspective view of the camera module of the electronic device according to the first embodiment of the present invention.
图3是图2所示摄像头模组的立体分解示意图。 FIG. 3 is an exploded perspective view of the camera module shown in FIG. 2 .
图4是本发明第二实施例的摄像头模组的分解示意图。 FIG. 4 is an exploded schematic diagram of a camera module according to a second embodiment of the present invention.
图5是本发明第三实施例的摄像头模组的分解示意图。 FIG. 5 is an exploded schematic diagram of a camera module according to a third embodiment of the present invention.
主要元件符号说明 Explanation of main component symbols
电子装置 100 Electronics 100
壳体 10 Shell 10
摄像头模组 30、50、70 Camera module 30, 50, 70
电路板 32、52、72 Circuit board 32, 52, 72
第一表面 322 first surface 322
第二表面 324 Second Surface 324
通孔 326、726 Through hole 326, 726
镜头组件 34、54、74 Lens Assembly 34, 54, 74
镜头 342 Lens 342
基座 344 Base 344
连接器 37、57、77 Connector 37, 57, 77
双面图像传感器 36、56、76 Double-sided image sensor 36, 56, 76
感光面 362、562、762 Photosensitive side 362, 562, 762
如下具体实施方式将结合上述附图进一步说明本发明。 The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings.
具体实施方式 detailed description
请参阅图1,本发明实施方式提供一种电子装置100,其包括壳体10及收容并装设在壳体10内的摄像头模组30。在本实施方式中,电子装置100为手机,可以理解,电子装置100也可以为其它电子装置,例如平板电脑。 Referring to FIG. 1 , an embodiment of the present invention provides an electronic device 100 , which includes a casing 10 and a camera module 30 housed and installed in the casing 10 . In this embodiment, the electronic device 100 is a mobile phone, and it can be understood that the electronic device 100 may also be other electronic devices, such as a tablet computer.
请同时参阅图2至图3,本发明第一实施例提供一种摄像头模组30,其包括电路板32、电性连接在电路板32上的镜头组件34、双面图像传感器36和连接器37。电路板32用以与电子装置100的主板(图未示)连接。镜头组件34的数量为两个,两个镜头组件34分别电连接电路板32,分别作为电子装置100的前摄像头和后摄像头。双面图像传感器36连接在电路板32上且位于两个镜头组件34之间,以使其能够感测由两个镜头组件34进入的光线并产生数位信号。连接器37连接在电路板32上且与镜头组件34间隔设置。连接器37与双面图像传感器36电性连接,以将双面图像传感器36上产生的数位信号传输至电子装置100主板上的处理器(图未示)进行处理。 Please refer to FIGS. 2 to 3 at the same time. The first embodiment of the present invention provides a camera module 30, which includes a circuit board 32, a lens assembly 34 electrically connected to the circuit board 32, a double-sided image sensor 36 and a connector. 37. The circuit board 32 is used to connect with the main board (not shown) of the electronic device 100 . There are two lens assemblies 34 , and the two lens assemblies 34 are respectively electrically connected to the circuit board 32 , and serve as a front camera and a rear camera of the electronic device 100 respectively. The double-sided image sensor 36 is connected to the circuit board 32 and located between the two lens assemblies 34 so that it can sense the light entering from the two lens assemblies 34 and generate digital signals. The connector 37 is connected to the circuit board 32 and spaced apart from the lens assembly 34 . The connector 37 is electrically connected to the double-sided image sensor 36 to transmit the digital signal generated by the double-sided image sensor 36 to a processor (not shown) on the mainboard of the electronic device 100 for processing.
在本实施方式中,电路板32为柔性电路板。电路板32包括相对的第一表面322及第二表面324。电路板32贯通第一表面322和第二表面324形成通孔326。两个镜头组件34分别连接在第一表面322和第二表面324上且两个镜头组件34的轴线重合。在本实施方式中,每一个镜头组件34包括镜头342及基座344。基座344与电路板32连接。镜头342及基座344设有相配的螺纹,镜头342通过螺纹收容并装设在基座344内。双面图像传感器36包括两个相对设置的感光面362。双面图像传感器36装设在通孔326处且位于两个镜头组件34之间,以使两个镜头组件54分别朝向双面图像传感器36对应的感光面362,从而使得由两个镜头342入射的光线均能照射在双面图像传感器36上以产生数位信号。在本实施方式中,双面图像传感器36装设在电路板32的第一表面322上且盖设通孔326。可以理解,双面图像传感器36也可以设置在电路板32的第二表面324上。连接器37装设在第一表面322上且与双面图像传感器36电性连接。两个镜头组件34在双面图像传感器36上产生的数位信号均通过连接器37传输至电子装置100主板上的处理器进行处理。 In this embodiment, the circuit board 32 is a flexible circuit board. The circuit board 32 includes a first surface 322 and a second surface 324 opposite to each other. The circuit board 32 forms a through hole 326 through the first surface 322 and the second surface 324 . The two lens assemblies 34 are respectively connected to the first surface 322 and the second surface 324 and the axes of the two lens assemblies 34 coincide. In this embodiment, each lens assembly 34 includes a lens 342 and a base 344 . The base 344 is connected to the circuit board 32 . The lens 342 and the base 344 are provided with matching threads, and the lens 342 is received and installed in the base 344 through the threads. The double-sided image sensor 36 includes two opposite photosensitive surfaces 362 . The double-sided image sensor 36 is installed at the through hole 326 and between the two lens assemblies 34, so that the two lens assemblies 54 are respectively directed towards the photosensitive surface 362 corresponding to the double-sided image sensor 36, so that the incident light from the two lenses 342 All the light can be irradiated on the double-sided image sensor 36 to generate digital signals. In this embodiment, the double-sided image sensor 36 is mounted on the first surface 322 of the circuit board 32 and covered with a through hole 326 . It can be understood that the double-sided image sensor 36 can also be disposed on the second surface 324 of the circuit board 32 . The connector 37 is installed on the first surface 322 and is electrically connected to the double-sided image sensor 36 . The digital signals generated by the two lens assemblies 34 on the double-sided image sensor 36 are transmitted to the processor on the main board of the electronic device 100 through the connector 37 for processing.
请参阅图4,本发明第二实施例提供的摄像头模组50,其结构与第一实施例的摄像头模组30大致相同,均包括电路板52、镜头组件54、双面图像传感器56和连接器57。双面图像传感器56包括两相对设置的感光面562。镜头组件54的数量为两个,两个镜头组件54分别电连接电路板52且两个镜头组件54的轴线重合。双面图像传感器56位于两个镜头组件54之间以使两个镜头组件54分别朝向双面图像传感器56对应的感光面562。连接器37连接在电路板32上且与双面图像传感器36电性连接。不同点在于,摄像头模组50的双面图像传感器56设在电路板52的一侧上。 Please refer to Fig. 4, the camera module 50 that the second embodiment of the present invention provides, its structure is roughly the same as the camera module 30 of the first embodiment, all comprises circuit board 52, lens assembly 54, double-sided image sensor 56 and connection device 57. The double-sided image sensor 56 includes two opposite photosensitive surfaces 562 . There are two lens assemblies 54 , the two lens assemblies 54 are respectively electrically connected to the circuit board 52 and the axes of the two lens assemblies 54 coincide. The double-sided image sensor 56 is located between the two lens assemblies 54 so that the two lens assemblies 54 respectively face the photosensitive surface 562 corresponding to the double-sided image sensor 56 . The connector 37 is connected to the circuit board 32 and is electrically connected to the double-sided image sensor 36 . The difference is that the double-sided image sensor 56 of the camera module 50 is disposed on one side of the circuit board 52 .
请参阅图5,本发明第三实施例提供的摄像头模组70,其结构与第一实施例的摄像头模组30大致相同,均包括电路板72、镜头组件74、双面图像传感器76和连接器77。镜头组件74的数量为两个,两个镜头组件74分别电连接电路板72且两个镜头组件74的轴线重合。双面图像传感器76包括两相对设置的感光面762。双面图像传感器56位于两个镜头组件74之间以使两个镜头组件74分别朝向双面图像传感器76对应的感光面762。连接器77连接在电路板72上且与双面图像传感器76电性连接。不同点在于,摄像头模组70的双面图像传感器76内嵌在电路板72的通孔726中。 Please refer to Fig. 5, the camera module 70 that the third embodiment of the present invention provides, its structure is roughly the same as the camera module 30 of the first embodiment, all comprises circuit board 72, lens assembly 74, double-sided image sensor 76 and connection device 77. There are two lens assemblies 74 , the two lens assemblies 74 are respectively electrically connected to the circuit board 72 and the axes of the two lens assemblies 74 coincide. The double-sided image sensor 76 includes two opposite photosensitive surfaces 762 . The double-sided image sensor 56 is located between the two lens assemblies 74 so that the two lens assemblies 74 respectively face the corresponding photosensitive surface 762 of the double-sided image sensor 76 . The connector 77 is connected to the circuit board 72 and is electrically connected to the double-sided image sensor 76 . The difference is that the double-sided image sensor 76 of the camera module 70 is embedded in the through hole 726 of the circuit board 72 .
组装时,首先,将双面图像传感器36及连接器37间隔连接在电路板32上且将双面图像传感器36与连接器37电性连接。然后,将两个基座344分别连接在电路板32的相对两表面上且与双面图像传感器36同轴设置。其次,将两个镜头342分别收容并装设在对应的基座344内。最后,将电路板32与电子装置100的主板连接即可。 When assembling, firstly, the double-sided image sensor 36 and the connector 37 are connected to the circuit board 32 at intervals, and the double-sided image sensor 36 and the connector 37 are electrically connected. Then, the two bases 344 are respectively connected to two opposite surfaces of the circuit board 32 and arranged coaxially with the double-sided image sensor 36 . Secondly, the two lenses 342 are respectively accommodated and installed in the corresponding bases 344 . Finally, it is sufficient to connect the circuit board 32 to the main board of the electronic device 100 .
本发明的摄像头模组30,其将两个镜头组件34均安装在一个电路板32上,因此将两个镜头组件34组装在电子装置100的主板上时,只需要将一个电路板32与主板连接,不仅提高了生产效率,还节约了生产成本。本发明的两个镜头组件34轴线重合,双面图像传感器36位于两个镜头组件34之间,此种设计使得两个镜头组件34能够共用一个双面图像传感器36,进一步节约摄像头模组30的生产成本,且能够减小摄像头模组30的高度,从而使得采用该摄像头模组的电子装置100更加轻薄化。另外,本发明的摄像头模组30将两个镜头组件34共用一个连接器37,能够进一步节约摄像头模组30的生产成本。 In the camera module 30 of the present invention, two lens assemblies 34 are installed on a circuit board 32, so when the two lens assemblies 34 are assembled on the main board of the electronic device 100, only one circuit board 32 and the main board need to be connected. Connection not only improves production efficiency, but also saves production costs. The axes of the two lens assemblies 34 of the present invention are coincident, and the double-sided image sensor 36 is located between the two lens assemblies 34. This design enables the two lens assemblies 34 to share a double-sided image sensor 36, further saving the cost of the camera module 30. The production cost can be reduced, and the height of the camera module 30 can be reduced, so that the electronic device 100 using the camera module can be thinner and lighter. In addition, in the camera module 30 of the present invention, the two lens assemblies 34 share one connector 37 , which can further save the production cost of the camera module 30 .
可以理解,镜头组件34还可以包括滤光片,该滤光片可以装设在基座344靠近电路板32的端部。该滤光片可以为红外滤光片。 It can be understood that the lens assembly 34 may also include a filter, and the filter may be installed at the end of the base 344 close to the circuit board 32 . The filter can be an infrared filter.
可以理解,镜头342上还贴设有保护膜。 It can be understood that a protective film is also pasted on the lens 342 .
可以理解,连接器37可以替换为金手指。可以理解,两个镜头组件34的镜头可以为相同类型的镜头,也可以为不同类型的镜头。 It can be understood that the connector 37 can be replaced by gold fingers. It can be understood that the lenses of the two lens assemblies 34 may be of the same type, or may be of different types.
另外,本领域技术人员还可在本发明精神内做其它变化,当然,这些依据本发明精神所做的变化,都应包含在本发明所要求保护的范围内。 In addition, those skilled in the art can also make other changes within the spirit of the present invention. Of course, these changes made according to the spirit of the present invention should be included in the scope of protection claimed by the present invention.
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CN109167911B (en) * | 2018-09-03 | 2020-12-04 | 歌尔光学科技有限公司 | Image acquisition device, method and device |
CN109167911A (en) * | 2018-09-03 | 2019-01-08 | 歌尔股份有限公司 | Image acquiring device, method and apparatus |
CN112995438A (en) * | 2019-12-02 | 2021-06-18 | 北京小米移动软件有限公司 | Camera module, terminal equipment and control method of camera module |
CN112995447A (en) * | 2019-12-16 | 2021-06-18 | 三赢科技(深圳)有限公司 | Lens module and electronic device |
CN113965688A (en) * | 2021-11-30 | 2022-01-21 | 维沃移动通信有限公司 | Image sensor, camera module, camera device and control method |
CN114040080A (en) * | 2021-11-30 | 2022-02-11 | 维沃移动通信有限公司 | Camera module and electronic equipment |
CN114040080B (en) * | 2021-11-30 | 2024-09-24 | 维沃移动通信有限公司 | Camera module and electronic equipment |
CN115580672A (en) * | 2022-09-30 | 2023-01-06 | 维沃移动通信有限公司 | Electronic device |
CN116841032A (en) * | 2023-05-31 | 2023-10-03 | 极限人工智能有限公司 | Endoscope lens, electronic endoscope and image acquisition method |
CN116841032B (en) * | 2023-05-31 | 2024-06-04 | 极限人工智能有限公司 | Endoscope lens, electronic endoscope and image acquisition method |
WO2024244876A1 (en) * | 2023-05-31 | 2024-12-05 | 极限人工智能有限公司 | Endoscope lens, electronic endoscope and image collection method |
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