CN101848624B - 液冷散热装置 - Google Patents
液冷散热装置 Download PDFInfo
- Publication number
- CN101848624B CN101848624B CN200910301137XA CN200910301137A CN101848624B CN 101848624 B CN101848624 B CN 101848624B CN 200910301137X A CN200910301137X A CN 200910301137XA CN 200910301137 A CN200910301137 A CN 200910301137A CN 101848624 B CN101848624 B CN 101848624B
- Authority
- CN
- China
- Prior art keywords
- heat
- heat absorbing
- liquid
- flow
- absorbing part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 31
- 239000007788 liquid Substances 0.000 title claims abstract description 28
- 239000000110 cooling liquid Substances 0.000 claims abstract description 29
- 230000017525 heat dissipation Effects 0.000 claims description 23
- 239000006096 absorbing agent Substances 0.000 claims description 6
- 230000007423 decrease Effects 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 230000005855 radiation Effects 0.000 abstract 1
- 230000001965 increasing effect Effects 0.000 description 6
- 239000002826 coolant Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910301137XA CN101848624B (zh) | 2009-03-25 | 2009-03-25 | 液冷散热装置 |
US12/475,527 US20100243216A1 (en) | 2009-03-25 | 2009-05-31 | Liquid-cooling device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910301137XA CN101848624B (zh) | 2009-03-25 | 2009-03-25 | 液冷散热装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101848624A CN101848624A (zh) | 2010-09-29 |
CN101848624B true CN101848624B (zh) | 2013-07-03 |
Family
ID=42773030
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200910301137XA Expired - Fee Related CN101848624B (zh) | 2009-03-25 | 2009-03-25 | 液冷散热装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20100243216A1 (zh) |
CN (1) | CN101848624B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5720712B2 (ja) * | 2013-03-22 | 2015-05-20 | トヨタ自動車株式会社 | 冷却器 |
KR20160120651A (ko) * | 2015-03-30 | 2016-10-18 | 가부시키가이샤 고마쓰 세이사쿠쇼 | 케이싱의 냉각액 드레인 구조, 축전 장치 및 건설 기계 |
CN112954989B (zh) * | 2021-05-18 | 2021-09-10 | 四川斯艾普电子科技有限公司 | 一种雷达液冷装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4750086A (en) * | 1985-12-11 | 1988-06-07 | Unisys Corporation | Apparatus for cooling integrated circuit chips with forced coolant jet |
US5263536A (en) * | 1991-07-19 | 1993-11-23 | Thermo Electron Technologies Corp. | Miniature heat exchanger |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2028360A (en) * | 1933-06-19 | 1936-01-21 | Logan Gear Company | Pump |
US2937855A (en) * | 1958-09-11 | 1960-05-24 | Frank D Hazen | Recuperator structures |
US3283811A (en) * | 1964-09-08 | 1966-11-08 | Babcock & Wilcox Co | Spur tube heat exchanger |
NL7214642A (zh) * | 1972-10-28 | 1974-05-01 | ||
US4310303A (en) * | 1980-07-11 | 1982-01-12 | W. B. Combustion, Inc. | Plug-in recuperator and method |
US4455504A (en) * | 1981-04-02 | 1984-06-19 | Iversen Arthur H | Liquid cooled anode x-ray tubes |
US4479534A (en) * | 1981-12-07 | 1984-10-30 | The Air Preheater Company, Inc. | Transparent radiation recuperator |
US4452233A (en) * | 1982-03-04 | 1984-06-05 | Goodman Jr Maurice | Solar energy collector |
US4521903A (en) * | 1983-03-09 | 1985-06-04 | Micronix Partners | High power x-ray source with improved anode cooling |
US4561040A (en) * | 1984-07-12 | 1985-12-24 | Ibm Corporation | Cooling system for VLSI circuit chips |
US5228502A (en) * | 1991-09-04 | 1993-07-20 | International Business Machines Corporation | Cooling by use of multiple parallel convective surfaces |
JP2792304B2 (ja) * | 1992-01-22 | 1998-09-03 | 日本電気株式会社 | 集積回路用冷却装置 |
JP2745948B2 (ja) * | 1992-04-06 | 1998-04-28 | 日本電気株式会社 | 集積回路の冷却構造 |
JP2853481B2 (ja) * | 1992-09-30 | 1999-02-03 | 日本電気株式会社 | 半導体素子の冷却構造 |
US6580780B1 (en) * | 2000-09-07 | 2003-06-17 | Varian Medical Systems, Inc. | Cooling system for stationary anode x-ray tubes |
US6431260B1 (en) * | 2000-12-21 | 2002-08-13 | International Business Machines Corporation | Cavity plate and jet nozzle assemblies for use in cooling an electronic module, and methods of fabrication thereof |
JP2003051689A (ja) * | 2001-08-06 | 2003-02-21 | Toshiba Corp | 発熱素子用冷却装置 |
US7597135B2 (en) * | 2006-05-23 | 2009-10-06 | Coolit Systems Inc. | Impingement cooled heat sink with low pressure drop |
-
2009
- 2009-03-25 CN CN200910301137XA patent/CN101848624B/zh not_active Expired - Fee Related
- 2009-05-31 US US12/475,527 patent/US20100243216A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4750086A (en) * | 1985-12-11 | 1988-06-07 | Unisys Corporation | Apparatus for cooling integrated circuit chips with forced coolant jet |
US5263536A (en) * | 1991-07-19 | 1993-11-23 | Thermo Electron Technologies Corp. | Miniature heat exchanger |
Also Published As
Publication number | Publication date |
---|---|
CN101848624A (zh) | 2010-09-29 |
US20100243216A1 (en) | 2010-09-30 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Free format text: FORMER OWNER: HONGZHUN PRECISION INDUSTRY CO., LTD. Effective date: 20141115 Owner name: STATE GRID CORPORATION OF CHINA Free format text: FORMER OWNER: SHENZHEN QICHUANGMEI TECHNOLOGY CO., LTD. Effective date: 20141115 Owner name: KAIFENG POWER SUPPLY COMPANY STATE GRID HENAN ELE Effective date: 20141115 Owner name: SHENZHEN QICHUANGMEI TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: FUHUAI (SHENZHENG) PRECISION INDUSTRY CO., LTD. Effective date: 20141115 |
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Free format text: CORRECT: ADDRESS; FROM: 518109 SHENZHEN, GUANGDONG PROVINCE TO: 518000 SHENZHEN, GUANGDONG PROVINCE Free format text: CORRECT: ADDRESS; FROM: 518000 SHENZHEN, GUANGDONG PROVINCE TO: 100031 XICHENG, BEIJING |
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TR01 | Transfer of patent right |
Effective date of registration: 20141115 Address after: 100031 Xicheng District West Chang'an Avenue, No. 86, Beijing Patentee after: State Grid Corporation of China Patentee after: KAIFENG POWER SUPPLY COMPANY, STATE GRID HENAN ELECTRIC POWER Co.,Ltd. Patentee after: QIXIAN POWER SUPPLY BUREAU Address before: 518000 Guangdong city of Shenzhen province Futian District Che Kung Temple Tairan nine road Haisong building B block 1205 Patentee before: Shenzhen Qichuangmei Technology Co.,Ltd. Effective date of registration: 20141115 Address after: 518000 Guangdong city of Shenzhen province Futian District Che Kung Temple Tairan nine road Haisong building B block 1205 Patentee after: Shenzhen Qichuangmei Technology Co.,Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Patentee before: Fuzhun Precision Industry (Shenzhen) Co.,Ltd. Patentee before: Foxconn Technology Co.,Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130703 Termination date: 20170325 |
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CF01 | Termination of patent right due to non-payment of annual fee |