CN101833904B - Flexible display and manufacturing method thereof - Google Patents

Abstract

The invention relates to a flexible display, which comprises a flexible display panel, a driving chip and a shrinkage inhibiting component. The flexible display panel is provided with a display area and a driving chip joint area positioned outside the display area. The driving chip is electrically connected with the driving chip bonding area. The contraction restraining component is arranged around the driving chip bonding area, wherein the rigidity of the contraction restraining component is higher than that of the flexible display panel, and the thermal expansion coefficient of the contraction restraining component is lower than that of the flexible display panel. The thermal expansion coefficient of the shrinkage inhibiting component is lower than that of the flexible display panel, so that the shrinkage inhibiting component can inhibit the shrinkage of the flexible display panel to avoid the large shrinkage of the flexible display panel under the temperature change. Therefore, the invention can ensure the electrical connection between the flexible display panel and the driving chip.

Description

Flexible display and manufacturing method thereof

technical field

The invention relates to a display and a manufacturing method thereof, in particular to a flexible display and a manufacturing method thereof.

Background technique

With the rapid development of display technology, the display has gradually developed from the early cathode ray tube (CRT) display to the current flat panel display (Flat Panel Display, FPD). Compared with flat-panel displays composed of rigid substrates (such as glass substrates), since flexible substrates (such as plastic substrates) have the characteristics of flexibility and impact resistance, research has been carried out in recent years on the fabrication of active components in flexible substrates. Flexible displays on flexible substrates.

Generally speaking, if an active component is to be fabricated on a flexible substrate, the flexible substrate needs to be adhered to a rigid carrier first, and then a series of film-forming processes are performed to fabricate a flexible display panel. Next, the driving chips (such as scanning driving chips and data driving chips) are attached to the flexible display panel with different direction conductive adhesives, so that the conductive bumps of the driving chips are electrically connected through the conductive particles in the different direction conductive adhesives to the welding pad of the flexible display panel, so as to electrically connect the driving chip and the flexible display panel. After all the manufacturing processes are completed, the flexible display panel is removed from the hard carrier.

However, the flexible substrate usually has a large coefficient of thermal expansion, and thus has the disadvantage of poor thermal stability. Therefore, during the manufacturing process of the flexible display, the flexible substrate will expand or contract due to the change of the ambient temperature, and a large amount of stress will be accumulated on the flexible substrate. In this way, when the flexible display panel is removed from the hard carrier, the flexible substrate of the flexible display panel will shrink greatly to release the stress, resulting in a gap between the driver chip and the flexible display panel. The conductive bumps are peeled off or broken, which makes the electrical contact between the driver chip and the flexible display panel poor, and then causes the driver chip to fail. In addition, the connection between the flexible circuit board and the flexible display panel may also be subject to similar stress, resulting in poor electrical contact. Moreover, in another existing manufacturing process, after the active components are fabricated on the flexible substrate, the flexible display panel is firstly removed from the hard carrier to shrink the flexible substrate, and then Carry out the bonding of the driver chip and the flexible display panel and the subsequent packaging process. However, since the flexible substrate of the flexible display panel will still experience different process temperature changes during the bonding process of the driver chip and the flexible display panel or other subsequent processes, the flexible substrate may be damaged due to expansion. Either shrinkage affects the electrical contact between the driver chip and the flexible display panel, or affects the electrical contact between the flexible circuit board and the flexible display panel.

Contents of the invention

The invention provides a flexible display and a manufacturing method thereof, which enable a good electrical connection between the flexible display panel and the driving chip.

The invention provides a flexible display, which includes a flexible display panel, a driving chip and a shrinkage restraining member. The flexible display panel has a display area and a driving chip bonding area outside the display area. The driving chip is electrically connected to the bonding area of the driving chip, the driving chip has a plurality of conductive bumps, and the driving chip is electrically connected to the bonding area of the driving chip through the conductive bumps. The shrinkage restraining member is arranged around the bonding area of the driving chip, wherein the rigidity of the shrinkage restraining member is higher than that of the flexible display panel, and the thermal expansion coefficient of the shrinkage restraining member is lower than that of the flexible display panel, the shrinkage restraining member It includes at least one first shrinkage restraint bar and two second shrinkage restraint bars, the extension direction of the first shrinkage restraint bar is parallel to a pair of long sides of the drive chip, the second shrinkage restraint bar is respectively connected to both ends of the first shrinkage restraint bar, Wherein, the extension direction of each second shrinkage restraint bar is perpendicular to the first shrinkage restraint bar, and when the bottom of the second shrinkage restraint bar in the shrinkage restraint member and the bottom of the conductive bump are simultaneously located on the flexible When on the type display panel, the thickness of the second shrinkage restraining bar in the shrinkage restraining member is greater than the thickness of the conductive bump.

The invention also provides a method for manufacturing a flexible display. A flexible display panel is formed on a hard substrate, and the flexible display panel has a display area and a driving chip bonding area outside the display area. A driving chip is bonded to the driving chip bonding area, the driving chip has a plurality of conductive bumps, and the driving chip is electrically connected to the driving chip bonding area through the conductive bumps. A shrinkage suppression member is formed around the bonding area of the driving chip, wherein the rigidity of the shrinkage suppression member is higher than that of the flexible display panel, and the thermal expansion coefficient of the shrinkage suppression member is lower than that of the flexible display panel, the shrinkage suppression member The component includes at least one first shrinkage restraint strip and two second shrinkage restraint strips, the extension direction of the first shrinkage restraint strip is parallel to a pair of long sides of the drive chip, and the second shrinkage restraint strip is respectively connected to both ends of the first shrinkage restraint strip , wherein the extension direction of each second shrinkage restraint bar is perpendicular to the first shrinkage restraint bar, and when the bottom of the second shrinkage restraint bar in the shrinkage restraint member and the bottom of the conductive bump are simultaneously located on the When on the flexible display panel, the thickness of the second shrinkage restraining strip in the shrinkage restraining member is greater than the thickness of the conductive bump.

The present invention proposes another flexible display, which includes a flexible display panel, a driving chip and a shrinkage restraining member. The flexible display panel has a display area and a driving chip bonding area outside the display area. The driving chip is electrically connected to the bonding area of the driving chip, the driving chip has a plurality of conductive bumps, and the driving chip is electrically connected to the bonding area of the driving chip through the conductive bumps. A shrinkage suppression member arranged around the bonding area of the driving chip, wherein the thermal expansion coefficient of the shrinkage suppression member is CTE, the thermal expansion coefficient of the flexible display panel is CTE _SUB , and the thermal expansion coefficient of the driving chip is CTE _CHIP , and the difference in thermal expansion coefficients| CTE _SUB -CTE _CHIP | greater than the thermal expansion coefficient difference | CTE-CTE _CHIP |, the shrinkage suppression member includes at least one first shrinkage suppression strip and two second shrinkage suppression strips, the extension direction of the first shrinkage suppression strip is parallel to the drive chip a pair of long sides, the second shrinkage restraining strips are respectively connected to the two ends of the first shrinkage restraining strips, wherein the extension direction of each second shrinkage restraining strip is perpendicular to the first shrinkage restraining strips, and when the shrinkage restraining member is When the bottom of the second shrinkage restraining strip and the bottom of the conductive bump are located on the flexible display panel at the same time, the thickness of the second shrinkage restraint bar in the shrinkage restraint member is greater than the thickness of the conductive bump .

Based on the above, the present invention disposes a shrinkage restraining member between the flexible display panel and the driving chip. Since the thermal expansion coefficient of the shrinkage restraining member is lower than that of the flexible display panel, the shrinkage restraining member can restrain the shrinkage of the flexible display panel, so as to avoid large shrinkage of the flexible display panel under temperature changes. In this way, the present invention can ensure the electrical connection between the flexible display panel and the driving chip.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings.

Description of drawings

FIG. 1A to FIG. 1E are schematic top view diagrams of a manufacturing method of a flexible display according to an embodiment of the present invention;

2A to 2E are schematic cross-sectional views along the line A-A' of FIGS. 1A to 1E respectively;

3A to 7A are schematic top views of a flexible display according to an embodiment of the present invention, and FIGS. 3B to 7B are schematic cross-sectional views along line A-A' of FIGS. 1A to 7A .

Explanation of main component symbols

100, 100a, 100a', 100b, 100b', 100c: flexible display

102: Rigid carrier board

110: Flexible display panel

111: Flexible substrate

112: display area

113: display unit

114: driver chip bonding area

116: Flexible line bonding area

118: Anisotropic conductive film

120: Driver chip

121a, 121b: sides

122: Conductive bump

126: flexible circuit

130: Shrinkage suppression member

132, 134, 136: Shrinkage inhibition bar

140: encapsulation colloid

D1: Direction

t1, t2: Thickness

Detailed ways

FIGS. 1A to 1E are schematic top views of the process of a method for manufacturing a flexible display according to an embodiment of the present invention, and FIGS. 2A to 2E are cross sections along the line AA' of FIGS. 1A to 1E respectively. schematic diagram. Please refer to FIG. 1A and FIG. 2A at the same time. First, a flexible display panel 110 is formed on a rigid substrate 102. The flexible display panel 110 has a display area 112, and a driver chip located outside the display area 112 is bonded. area 114 and a flexible circuit bonding area 116 . In this embodiment, the hard carrier 102 is, for example, a hard material substrate such as a glass substrate, a quartz substrate, or a silicon substrate. The flexible display panel 110 includes a flexible substrate 111 and a display unit 113. The flexible substrate 111 is, for example, a plastic substrate with good flexibility. The flexible substrate 111 of the flexible display panel 110 is attached to Attached to the rigid carrier 102 , the display unit 113 is disposed on the flexible substrate 111 and located in the display area 112 . In this embodiment, the coefficient of thermal expansion CTE _SUB of the flexible display panel 110 is, for example, about 4 ppm/C to 100 ppm/C.

Please refer to FIG. 1B and FIG. 2B at the same time. Next, a driver chip 120 is bonded to the driver chip bonding area 114 . In this embodiment, the method of bonding the driving chip 120 and the driving chip bonding area 114 is, for example, to attach the anisotropic conductive film 118 on the driving chip bonding area 114 first, and then press-bond the driving chip 120 to the anisotropic conductive film. 118, the multiple conductive bumps 122 of the driving chip 120 are electrically connected to the bonding area 114 of the driving chip through the conductive particles in the anisotropic conductive film 118, so that the driving chip 120 and the flexible display panel 110 are electrically connected. connect. Wherein, the driving chip 120 is, for example, a silicon chip, and the driving chip 120 has a pair of long sides 121a, a pair of short sides 121b and a thickness t1. The coefficient of thermal expansion CTE _CHIP of the driver chip 120 is, for example, about 1 ppm/c to 20 ppm/c.

In addition, this step may further include bonding a flexible circuit 126 to the flexible circuit bonding area 116 of the flexible display panel 110. The method of bonding the flexible circuit 126 to the flexible circuit bonding area 116 is, for example, first Attach the anisotropic conductive film 118 on the flexible circuit bonding area 116, and then press the flexible circuit 126 onto the anisotropic conductive film 118, so that the flexible circuit 126 passes through the anisotropic conductive film 118 It is electrically connected with the flexible circuit bonding area 116 , and then the flexible circuit 126 is electrically connected with the flexible display panel 110 . Although in this embodiment, the anisotropic conductive film 118 is used to bond the driver chip 120 and the driver chip bonding area 114 and the flexible circuit 126 and the flexible circuit bonding area 116, those skilled in the art can also Use other methods such as Anisotropic Conductive Film (ACF) for bonding.

Please refer to FIG. 1C and FIG. 2C at the same time. Then, a shrinkage restraining member 130 is formed around the driving chip bonding area 114, wherein the rigidity of the shrinkage restraining member 130 is, for example, higher than the rigidity of the flexible display panel 110, and the shrinkage restraining member 130 The thermal expansion coefficient CTE of the flexible display panel 110 is, for example, lower than the thermal expansion coefficient CTE _CHIP of the flexible display panel 110 . In this embodiment, the coefficient of thermal expansion CTE of the shrinkage restraining member 130 is, for example, about 1 to 30 ppm/c, and the rigidity of the shrinkage restrainer 130 is, for example, between 3 GPa to 400 GPa, preferably 8 GPa to 400 GPa. Furthermore, the difference in coefficient of thermal expansion |CTE _SUB - CTE _CHIP | is eg larger than the difference in coefficient of thermal expansion |CTE - CTE _CHIP |. In this embodiment, the material of the shrinkage restraining member 130 may include metal, plastic, curing glue or other materials, wherein the curing glue may be light curing glue, heat curing glue or a mixture thereof. Therefore, when the material of the shrinkage inhibiting member 130 includes curing glue, the curing method of the shrinkage inhibiting member 130 also includes irradiation with light (including visible light or ultraviolet light) or heating.

In this embodiment, the shrinkage restraining member 130 includes at least one first shrinkage restraint bar 132 and two second shrinkage restraint bars 134 . The side 121 a and the second shrinkage restraining strip 134 are connected to both ends of the first shrinkage restraining strip 132 , for example. Wherein, the extending direction of each second shrinkage restraining strip 134 is, for example, substantially perpendicular to the first shrinkage restraint strip 132 , in other words, the shrinkage restraining member 130 is, for example, I-shaped. The thickness t2 of the shrinkage restraining member 130 is, for example, greater than the thickness t1 of the driving chip 120 , but in other embodiments, the thickness t2 of the shrinkage restraining member 130 may also be less than or equal to the thickness t1 of the driving chip 120 . In this embodiment, taking the long side 121a substantially parallel to the driving chip 120 as the first direction D1, the amount of shrinkage of the flexible display panel 110 along a first direction D1 is, for example, controlled by the shrinkage restraining member 130. inhibition. That is, since the rigidity of the shrinkage restraining member 130 is higher than that of the flexible display panel 110, and the thermal expansion coefficient CTE of the shrinkage restraining member 130 is lower than the thermal expansion coefficient CTE _CHIP of the flexible display panel 110, at the same temperature Under different circumstances, the contraction or expansion of the rigid shrinkage restraining member 130 is smaller than that of the flexible display panel 110 , so the shrinkage restraint member 130 can restrain the shrinkage and expansion of the flexible display panel 110 . In this embodiment, the second shrinkage restraining strip 134 of the shrinkage restraining member 130 may extend from the driving chip bonding area 114 to the flexible circuit bonding area 116 to enhance its effect of restraining the shrinkage and expansion of the flexible display panel 110 , but not limited thereto, the shrinkage restraining member 130 may also be covered only in the driving chip bonding area 114 or only in the flexible circuit bonding area 116 according to the designer's requirements.

Please refer to FIG. 1D and FIG. 2D at the same time. Next, an encapsulant 140 is formed on the bonding area 114 of the driving chip to cover the driving chip 120 . The material of the encapsulant 140 is, for example, epoxy resin or other insulating materials. Furthermore, in this embodiment, the encapsulant 140, for example, also covers the flexible circuit 126 connected to the flexible display panel 110, so that the driver chip 120, the flexible circuit 126 and the flexible circuit 126 can be protected. The electrical connection between the display panels 110 is not affected by the external environment. It should be noted that, according to the actual situation and the user's choice, the step of forming the encapsulant 140 may also be omitted in other embodiments.

Please refer to FIG. 1E and FIG. 2E at the same time. In this embodiment, after the shrinkage restraining structure 130 is formed, the flexible display panel 110 is removed from the hard carrier 102 to complete the flexible display 100. make.

In particular, although in the above-mentioned embodiment, the flexible display panel 110 is removed from the rigid carrier 102 after the shrinkage restraining structure 130 is formed, however, in another embodiment, it can also be Firstly, the flexible display panel 110 is removed from the rigid carrier 102, and then the shrinkage restraining structure 130 is formed on the flexible display panel 110. At this time, it is better to calculate the subsequent process temperature and the possible impact of the environment. The impact caused by the flexible display panel 110 enables the shrinkage restraining structure 130 to restrain the shrinkage or expansion of the flexible display panel 110 in subsequent manufacturing processes. In addition, in one embodiment, the bonding and packaging process between the driving chip 120 and the flexible display panel 110 may also be performed after the flexible display panel 110 is removed from the hard carrier 102, shrinking The suppression structure 130 can still effectively suppress the shrinkage or expansion of the flexible display panel 110 in the subsequent manufacturing process, so as to protect the electrical contact area between the flexible display panel 110 and the driving chip 120 from being damaged. Effects of subsequent thermal processing or environmental variability.

In this embodiment, the flexible display 100 includes a flexible display panel 110 , a driving chip 120 and a contraction restraining member 130 . The flexible display panel 110 has a display area 112 and a driver chip bonding area 114 outside the display area 112 . The driver chip 120 is electrically connected to the driver chip bonding area 114 . The shrinkage restraining member 130 is disposed around the driving chip bonding area 114, wherein the rigidity of the shrinkage restraining member 130 is, for example, higher than that of the flexible display panel 110, and the coefficient of thermal expansion CTE of the shrinkage restraining member 130 is, for example, lower than that of the flexible display panel. The coefficient of thermal expansion CTE _CHIP of the panel 110 . In addition, in this embodiment, the flexible display 100 may further include a flexible circuit 126 and an encapsulant 140, the flexible circuit 126 is disposed on the flexible circuit bonding area 116 of the flexible display panel 110, and the encapsulation The colloid 140 covers the driver chip 120 .

In particular, in this embodiment, the rigidity of the shrinkage restraining member 130 is higher than that of the flexible display panel 110 , and the coefficient of thermal expansion CTE of the shrinkage restraining member 130 is lower than the coefficient of thermal expansion CTE of the flexible display panel 110 _CHIP is taken as an example, but in another embodiment, the rigidity of the shrinkage restraining member 130 may not be limited, but only the coefficient of thermal expansion CTE of the shrinkage restraining member 130 must meet the following conditions: the thermal expansion of the flexible display panel 110 and the driver chip 120 The coefficient difference |CTE _SUB −CTE _CHIP | is, for example, greater than the thermal expansion coefficient difference |CTE−CTE _CHIP | of the shrinkage suppression member 130 and the driving chip 120 . In other words, the difference in degree of thermal expansion between the shrinkage restraining member 130 and the driver chip 120 must be smaller than the difference in degree of thermal expansion between the flexible display panel 110 and the driver chip 120 , so the shrinkage restrainer 130 can restrain the shrinkage of the flexible display panel 110 quantity. Wherein, the coefficient of thermal expansion CTE of the shrinkage restraining member 130 is, for example, between the coefficient of thermal expansion CTE _CHIP of the flexible display panel 110 and the coefficient of thermal expansion CTE _CHIP of the driver chip 120 , or the coefficient of thermal expansion CTE of the shrinkage restraining member 130 is, for example, less than The coefficient of thermal expansion CTE _CHIP of the driver chip 120, wherein, CTE is, for example, about 1ppm/c to 30ppm/c, CTE _SUB is, for example, about 4ppm/c to 100ppm/c and CTE _CHIP , for example, is about 1ppm/c c to 20ppm/c, and the rigidity of the shrinkage restraining member 130 is, for example, between 3GPa to 400GPa, preferably 8GPa to 400GPa.

Furthermore, although in this embodiment the shrinkage suppression member 130 is formed after the driver chip 120 is bonded to the driver chip bonding region 114, in another embodiment, the shrinkage suppression member 130 may also be formed before the driver chip is bonded. 120 is bonded to the driving chip bonding area 114 . In other words, the present invention does not limit the sequence of forming the shrinkage restraining member 130 and bonding the driving chip 120 and the driving chip bonding area 114 . In addition, the present invention does not limit the material, shape, thickness t2 and other conditions of the shrinkage restraining member 130 , as well as whether the encapsulant 140 is formed or the range covered by the encapsulant 140 . 3A to 7A are schematic top views of a flexible display according to an embodiment of the present invention, and FIGS. 3B to 7B are schematic cross-sectional views along line A-A' of FIGS. 1A to 7A . 3A and 3B, in an embodiment of the flexible display 100a, the shrinkage restraining member 130 includes, for example, a first shrinkage restraint bar 132, two second shrinkage restraint bars 134 and a third shrinkage restraint bar 136, wherein The second shrinkage restraint bar 134 is connected to both ends of the first shrinkage restraint bar 132 , and the third shrinkage restraint bar 136 is connected to the tops of the first shrinkage restraint bar 132 and the second shrinkage restraint bar 134 and is located on the driver chip 120 , in other words, With the first shrinkage restraining bar 132 and the second shrinkage restraining bar 134 as the side walls and the third shrinkage restraining bar 136 as the upper cover, the shrinkage restraining member 130 has a cover-like structure. In this way, the shrinkage restraining member 130 can restrain the amount of shrinkage of the flexible display panel 110, and since the shrinkage restraining member 130 is in the form of a cover to cover the driver chip 120 and part of the flexible circuit 126, it can further protect the driver chip 120. And the electrical connection between the flexible circuit 126 and the flexible display panel 110 is not affected by the external environment.

In particular, although the flexible display 100a shown in FIG. 3A and FIG. 3B is taken as an example without the encapsulant 140, in another embodiment, as shown in FIG. 4A and FIG. 4B, the flexible display 100a' may further include an encapsulant 140, and the encapsulant 140, for example, fills the space surrounded by the shrinkage restraining member 130 to cover the driver chip 120, and covers the shrinkage restraint member 130 and part of the flexible circuit 126, of course, in other In an embodiment (not shown), the encapsulant 140 may only cover the shrinkage restraining member 130 without filling the space surrounded by the shrinkage restraint member 130 .

5A and 5B, in an embodiment of the flexible display 100b, the shrinkage restraining member 130 includes two first shrinkage restraint bars 132 and two second shrinkage restraint bars 134, wherein each second shrinkage restraint The strips 134 are respectively connected to both ends of each first shrinkage restraining strip 134 . In this embodiment, the thickness t2 of the shrinkage restraining member 130 is smaller than the thickness t1 of the driving chip 120 as an example, but the thickness t2 of the shrinkage restraining member 130 may also be equal to or greater than the thickness t1 of the driving chip 120 . The material of the shrinkage restraining member 130 may include metal, plastic, curing glue or other materials, wherein the curing glue may be light curing glue, heat curing glue or a mixture of the above. When the material of the shrinkage restraining member 130 includes curing glue, the curing method of the shrinkage restraining member 130 also includes irradiation with light (such as visible light or ultraviolet light) or heating. Wherein, the flexible display 100b shown in FIG. 5A and FIG. 5B is an example that does not include the encapsulant 140, but in another embodiment, as shown in FIG. 6A and FIG. 6B, the flexible display 100b' can also The encapsulant 140 is included, and the encapsulant 140 covers the driver chip 120 and covers the shrinkage restraining member 130 and part of the flexible circuit 126 . Generally speaking, in the manufacturing process of the flexible display 100b, 100b', the shrinkage restraining member 130 is formed first, and then the driving chip 120 is formed in order.

Please refer to FIG. 7A and FIG. 7B. In an embodiment of the flexible display 100c, the shrinkage restraining member 130 includes, for example, a first shrinkage restraint bar 132, two second shrinkage restraint bars 134, and a third shrinkage restraint bar 136, wherein The second shrinkage restraint bar 134 is connected to both ends of the first shrinkage restraint bar 132, the third shrinkage restraint bar 136 is connected to the top of the second shrinkage restraint bar 134 and is located on the flexible circuit 126, and the third shrinkage restraint bar 136 is at least partially Partially shields the flexible circuit bonding area 116 and the flexible circuit 126 . In this way, the shrinkage restraining member 130 can restrain the amount of shrinkage of the flexible display panel 110, and since the shrinkage restraining member 130 covers the flexible circuit 126, the connection between the flexible circuit 126 and the flexible display panel 110 can be further protected. The electrical connection between them is not affected by the external environment. Wherein, the flexible display 100c shown in FIG. 7A and FIG. 7B is an example that does not include the encapsulant 140, but in another embodiment (not shown), the flexible display 100c may further include the encapsulant 140, The encapsulant 140 covers the driving chip 120 and covers the shrinkage restraining member 130 .

In the above-mentioned embodiments, since the rigidity of the shrinkage restraining member 130 is higher than that of the flexible display panel 110, and the thermal expansion coefficient CTE of the shrinkage restraining member 130 is lower than the thermal expansion coefficient CTE _CHIP of the flexible display panel 110, or The thermal expansion coefficient difference |CTE _SUB -CTE _CHIP | of the flexible display panel 110 and the driver chip 120 is greater than the thermal expansion coefficient difference |CTE-CTE _CHIP | The amount of shrinkage of the flexible display panel 110 is used to avoid the large shrinkage of the flexible display panel 110 under temperature changes. In this way, the contact between the flexible display panel 110 and the driving chip 120 can be ensured, so that there is a good electrical connection between the flexible display panel 110 and the driving chip 120 . In addition, when the flexible display panel 110 is removed from the rigid carrier 102, since the shrinkage restraining member 130 can restrain the amount of shrinkage of the flexible display panel 110, the flexible display panel 110 will not be greatly shrunk. Releasing the stress can prevent the conductive bump 122 between the driver chip 120 and the flexible display panel 110 from peeling off or breaking, so that there is a good electrical connection between the flexible display panel 110 and the driver chip 120, thereby enabling The driver chip 120 can work normally.

Moreover, since the shrinkage restraining member 130 is also disposed around the flexible circuit 126 , the electrical connection between the flexible display panel 110 and the flexible circuit 126 can be further ensured. Therefore, the present invention enables the flexible display to have good electrical characteristics, thereby improving the yield of the flexible display.

To sum up, in the present invention, a shrinkage restraining member is arranged between the flexible display panel and the driving chip. Since the rigidity of the shrinkage suppression member is higher than that of the flexible display panel, and the thermal expansion coefficient of the shrinkage suppression member is lower than that of the flexible display panel, or the difference between the thermal expansion coefficient of the flexible display panel and the driver chip|CTE _SUB -CTE _CHIP | is greater than the difference in coefficient of thermal expansion |CTE-CTE _CHIP | of the shrinkage restraining member and the driver chip, so the shrinkage restraining member can restrain the shrinkage of the flexible display panel to prevent the flexible display panel from appearing under temperature changes Significant contraction or expansion. In particular, when the flexible display panel is removed from the hard carrier, since the shrinkage restraining member can suppress the amount of shrinkage of the flexible display panel, the flexible display panel does not shrink greatly to release stress, and can Avoid peeling or breaking of the conductive bumps between the driver chip and the flexible display panel, thereby ensuring a good electrical connection between the flexible display panel and the driver chip, so that the driver chip can operate normally. In addition, since the shrinkage restraining member is also disposed around the flexible circuit, the electrical connection between the flexible display panel and the flexible circuit can be further ensured. Moreover, in the process of firstly removing the flexible display panel from the hard carrier and then bonding the flexible display panel to the driving chip, the shrinkage restraining member can also effectively prevent the flexible display panel from The contraction or expansion of the manufacturing process protects the area of electrical contact between the flexible display panel and the driver chip or between the flexible display panel and the driver chip so that it will not be affected by the subsequent thermal process or environmental variation. Therefore, the present invention enables the flexible display to have good electrical characteristics, thereby improving the yield of the flexible display.

Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the scope of the appended patent application.

Claims (17)

1. a flexible display is characterized in that, comprising:

One flexible type display panel has a viewing area and and is positioned at driving chip bonding land outside the described viewing area;

One drives chip, is electrically connected with described driving chip bonding land, and described driving chip has a plurality of conductive projections, and described driving chip sees through described conductive projection and described driving chip bonding land is electrically connected; And

One shrinks the inhibition member, be configured in around the described driving chip bonding land, the rigidity of wherein said contraction inhibition member is higher than the rigidity of described flexible type display panel, and the thermal expansivity of described contraction inhibition member is lower than the thermal expansivity of described flexible type display panel, described contraction suppresses member and comprises that at least one first shrinks inhibition bar and 2 second contraction inhibition bars, first shrinks the bearing of trend that suppresses bar is parallel to a pair of long limit that drives chip, second shrinks the inhibition bar is connected with the first contraction inhibition bar two ends respectively, wherein, each second bearing of trend that shrinks the inhibition bar shrinks perpendicular to first and suppresses bar, and when described contraction suppressed bottom that second in the member shrink the bottom that suppresses bar and described conductive projection and is positioned at simultaneously on the described flexible type display panel, described contraction suppressed second in the member and shrinks the thickness that suppresses bar greater than the thickness of described conductive projection.

2. flexible display as claimed in claim 1 is characterized in that, described contraction suppresses the rigidity of member between between the 3Gpa to 400Gpa.

3. flexible display as claimed in claim 1 is characterized in that, the thermal expansivity that described contraction suppresses member is CTE, and the thermal expansivity of described flexible type display panel is CTE _SUB, the thermal expansivity of described driving chip is CTE _CHIP, and thermal expansion coefficient difference | CTE _SUB-CTE _CHIP| greater than thermal expansion coefficient difference | CTE-CTE _CHIP|.

4. flexible display as claimed in claim 1 is characterized in that, described contraction suppresses the thickness of member greater than the thickness of described driving chip.

5. flexible display as claimed in claim 1 is characterized in that, the thickness of described contraction inhibition member is less than or equal to the thickness of described driving chip.

6. flexible display as claimed in claim 1, it is characterized in that, described flexible type display panel is suppressed member in the amount of contraction on a first direction by described contraction and suppresses, described driving chip has a pair of long limit and pair of short edges, and described first direction is parallel to described a pair of long limit, wherein said contraction suppresses member and comprises that at least one first shrinks the inhibition bar, described first shrinks the bearing of trend that suppresses bar is parallel to described a pair of long limit, wherein said contraction suppresses member and comprises that also 2 second shrink inhibition bar and one the 3rd contraction inhibition bar, each described second contraction suppresses bar and is connected with described the first contraction inhibition bar two ends respectively, described the 3rd contraction suppresses bar and described the first contraction inhibition bar and described 2 second tops of shrinking the inhibition bars and is connected, and wherein each described second bearing of trend that shrinks the inhibition bar suppresses bar perpendicular to described the first contraction.

7. flexible display as claimed in claim 1 is characterized in that, the material that described contraction suppresses member comprises metal or plastics.

8. flexible display as claimed in claim 1, it is characterized in that, comprise that also one is configured in the anisotropic conductive film on the described driving chip bonding land, wherein said driving chip sees through described anisotropic conductive film and described driving chip bonding land is electrically connected, also comprise a packing colloid, wherein said packing colloid coats described driving chip.

9. flexible display as claimed in claim 1, it is characterized in that, also comprise a pliability circuit, wherein said flexible type display panel also has a pliability circuit bonding land that is positioned at outside the described viewing area, and described pliability circuit and the electric connection of described pliability circuit bonding land.

10. the manufacture method of a flexible display is characterized in that, comprising:

Form a flexible type display panel at a hard support plate, described flexible type display panel has a viewing area and and is positioned at driving chip bonding land outside the described viewing area;

Drive chip with one and engage with described driving chip bonding land, described driving chip has a plurality of conductive projections, and described driving chip sees through described conductive projection and described driving chip bonding land is electrically connected; And

Around described driving chip bonding land, form one and shrink the inhibition member, the rigidity of wherein said contraction inhibition member is higher than the rigidity of described flexible type display panel, and the thermal expansivity of described contraction inhibition member is lower than the thermal expansivity of described flexible type display panel, described contraction suppresses member and comprises that at least one first shrinks inhibition bar and 2 second contraction inhibition bars, first shrinks the bearing of trend that suppresses bar is parallel to a pair of long limit that drives chip, second shrinks the inhibition bar is connected with the first contraction inhibition bar two ends respectively, wherein, each second bearing of trend that shrinks the inhibition bar shrinks perpendicular to first and suppresses bar, and when described contraction suppressed bottom that second in the member shrink the bottom that suppresses bar and described conductive projection and is positioned at simultaneously on the described flexible type display panel, described contraction suppressed second in the member and shrinks the thickness that suppresses bar greater than the thickness of described conductive projection.

11. the manufacture method of flexible display as claimed in claim 10 is characterized in that, it is in described driving chip and formation before described driving chip bonding land engages that described contraction suppresses member.

12. the manufacture method of flexible display as claimed in claim 10 is characterized in that, described contraction suppresses member in described driving chip and formation after described driving chip bonding land engages.

13. the manufacture method of flexible display as claimed in claim 10 is characterized in that, also comprises a pliability circuit is engaged with a pliability circuit bonding land of described flexible type display panel.

14. the manufacture method of flexible display as claimed in claim 10 is characterized in that, also is included in to form after the described contraction inhibition structure, and described flexible type display panel is taken off from described hard support plate.

15. a flexible display comprises:

One flexible type display panel has a viewing area and and is positioned at driving chip bonding land outside the described viewing area;

One drives chip, is electrically connected with described driving chip bonding land, and described driving chip has a plurality of conductive projections, and described driving chip sees through described conductive projection and described driving chip bonding land is electrically connected; And

One shrinks the inhibition member, is configured in around the described driving chip bonding land, and the thermal expansivity that wherein said contraction suppresses member is CTE, and the thermal expansivity of described flexible type display panel is CTE _SUB, the thermal expansivity of described driving chip is CTE _CHIP, and thermal expansion coefficient difference | CTE _SUB-CTE _CHIP| greater than thermal expansion coefficient difference | CTE-CTE _CHIP|, described contraction suppresses member and comprises that at least one first shrinks inhibition bar and 2 second contraction inhibition bars, first shrinks the bearing of trend that suppresses bar is parallel to a pair of long limit that drives chip, second shrinks the inhibition bar is connected with the first contraction inhibition bar two ends respectively, wherein, each second bearing of trend that shrinks the inhibition bar shrinks perpendicular to first and suppresses bar, and when described contraction suppressed bottom that second in the member shrink the bottom that suppresses bar and described conductive projection and is positioned at simultaneously on the described flexible type display panel, described contraction suppressed second in the member and shrinks the thickness that suppresses bar greater than the thickness of described conductive projection.

16. flexible display as claimed in claim 15 is characterized in that, described CTE is between the 1ppm/c to 30ppm/c, described CTE _SUBFor between the 4ppm/C to 100ppm/C and described CTE _CHIPBetween 1ppm/c to 20ppm/c.

17. flexible display as claimed in claim 15 is characterized in that, described contraction suppresses the rigidity of member between between the 3Gpa to 400Gpa.

Images