CN101829850A - Method for processing blind hole - Google Patents
Method for processing blind hole Download PDFInfo
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- CN101829850A CN101829850A CN201010141245A CN201010141245A CN101829850A CN 101829850 A CN101829850 A CN 101829850A CN 201010141245 A CN201010141245 A CN 201010141245A CN 201010141245 A CN201010141245 A CN 201010141245A CN 101829850 A CN101829850 A CN 101829850A
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- blind hole
- laser
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- set amount
- described method
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- 238000000034 method Methods 0.000 title claims abstract description 31
- 239000011347 resin Substances 0.000 claims abstract description 8
- 229920005989 resin Polymers 0.000 claims abstract description 8
- 238000003698 laser cutting Methods 0.000 claims abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052802 copper Inorganic materials 0.000 claims abstract description 4
- 239000010949 copper Substances 0.000 claims abstract description 4
- 238000005520 cutting process Methods 0.000 claims description 6
- 241000931526 Acer campestre Species 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 description 8
- 238000005553 drilling Methods 0.000 description 4
- 238000003754 machining Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The invention relates to a method for processing a blind hole, the blind hole processing is carried out by a CO2 laser emitting the laser with the wavelength of 9.4mu m on a printed circuit board, and the method comprises the following steps: most resin of the blind hole is removed by laser of a first set quantity in a processing mode of concentric circular path; and residual resin of the blind hole is removed by laser of a second set quantity in a processing mode of spiral path, thus exposing bottom copper. The aperture of the blind hole can be greater than 250mu m. The CO2 laser is arranged on a laser cutting machine. By adopting the method, the blind hole with a large aperture can be processed with low cost.
Description
Technical field
The present invention relates to the processing technology of printed circuit board, particularly relate to the processing technology of the blind hole in the printed circuit board.
Background technology
Because in recent years along with the develop rapidly of microelectric technique, the extensive use of extensive and super large-scale integration, the progress of little package technique, modern electronic product is day by day to portable, miniaturization, high integrated, high performance trend development, the manufacturing of printed circuit board is developed towards laminationization, multifunction direction, at the printed circuit board industry, just have higher requirement for the demand of blind hole.The mechanical system bore process technology that is adopted in the existing processing can not satisfy the requirement of the high-end wiring board of this kind, and the technology that can be competent at this blind hole processing mode is exactly the laser drill technology.
Existing laser blind hole process technology mainly contains two class process equipments: a class is that wavelength is the infrared CO2 laser drilling machine of 9.4um, is mainly used in processing hardboard blind hole, and the processing aperture is at 75um-200um; Another kind of is that wavelength is the UV laser drilling machine of 355nm, is mainly used in processing flexibility wiring board blind hole, is fit to the less Microvia of processing 50um-200um.
Yet existing blind hole drilling machine all only is fit to bore the following blind hole of 200um, can't process bigger blind hole.
Summary of the invention
The technical problem to be solved in the present invention is to overcome above-mentioned the deficiencies in the prior art, and proposes a kind ofly can realize wide-aperture blind hole method for processing with lower cost.
The technical scheme that the present invention solves the problems of the technologies described above employing is, a kind of method for processing blind hole is proposed, be that to adopt the optical maser wavelength send be that the CO2 laser instrument of 9.4um carries out blind hole processing on printed circuit board (PCB), comprise step: with the laser of first set amount, with the concentric circular tracks processing mode, remove most of resin of blind hole; And,, remove the remaining resin of blind hole with the spiral trajectory processing mode with the laser of second set amount, expose end copper.
The aperture of this blind hole can be greater than 250um.This CO2 laser instrument is arranged on the laser cutting machine.
Compared with prior art, adopt method for processing blind hole of the present invention, can realize wide-aperture blind hole processing with lower cost.
Description of drawings
Fig. 1 is the FB(flow block) of method for processing blind hole embodiment of the present invention.
The specific embodiment
Be described in further detail below in conjunction with the most preferred embodiment shown in the accompanying drawing.
Method for processing blind hole embodiment of the present invention is the equipment that utilizes existing cutting profile: IRMAKER-650, and it is that wavelength is the infrared CO2 laser cutting machine of 9.4um, is mainly used to cut the auxilliary material of wiring boards such as PP sheet, gummed paper.In order to realize the function of this equipment processing blind hole, finish large aperture blind hole machining functions by machining locus, the light beam stack size of software control light beam and the technological method for processing that cuts step by step.Concrete measure comprises: revise the software function that increases this equipment, increase the corresponding function of cutting blind hole on the basis of original software function: increase the function that the control light beam is walked the helical cut track; Increase the control light beam and walk the function of concentric circles cutting track; And increase light beam overlaying function is provided with.
As shown in Figure 1, method for processing blind hole embodiment of the present invention comprises that step has:
Step 10: routine processes, required processing blind hole is carried out programmed process, the input computerized control system;
Step 20: printed circuit board to be processed is placed on the equipment processing table top fixes;
Step 30: use (first set amount) laser than macro-energy, remove the most of resin of blind hole with the concentric circular tracks processing mode, the concrete parameter of laser is provided with as follows: pulse frequency is 30-40KHz; Pulse width is 5-6us; Power is 30W-40W; Cutting speed is 200-800mm/s; And
Step 40: with (second set amount) laser of less energy, remove the remaining resin in blind hole bottom with the helical trajectory processing mode, expose end copper, the concrete parameter of laser is provided with as follows: pulse frequency is 50-60KHz; Pulse width is 2-3us; Power is 20W-30W; Cutting speed is 200-800mm/s.
Compared with prior art, adopt method for processing blind hole of the present invention, the aperture of blind hole can and not have maximum constraints greater than 250um, owing to adopt laser cutting machine, compare the CO2 laser drilling machine, light channel structure is simple, do not need light beam is carried out shaping, cost is low.
More than, only be the present invention's preferred embodiment, be intended to further specify the present invention, but not it is limited.All simple substitution of carrying out according to above-mentioned literal and the disclosed content of accompanying drawing are all at the row of the scope of the present invention.
Claims (10)
1. method for processing blind hole is that to adopt the optical maser wavelength of sending be that the CO2 laser instrument of 9.4um carries out blind hole processing on printed circuit board (PCB), it is characterized in that, comprises step:
With the laser of first set amount,, remove most of resin of blind hole with the concentric circular tracks processing mode; And
With the laser of second set amount, with the spiral trajectory processing mode, remove the remaining resin of blind hole, expose end copper.
2. method for processing blind hole as claimed in claim 1 is characterized in that the aperture of this blind hole can be greater than 250um.
3. method for processing blind hole as claimed in claim 2 is characterized in that, this CO2 laser instrument is arranged on the laser cutting machine.
4. method for processing blind hole as claimed in claim 3 is characterized in that, the cutting speed of the laser of this first set amount and second set amount is 200-800mm/s.
5. as each described method for processing blind hole of claim 1 to 4, it is characterized in that the pulse frequency of the laser of this first set amount is 30-40KHz.
6. as each described method for processing blind hole of claim 1 to 4, it is characterized in that the pulse width of the laser of this first set amount is 5-6us.
7. as each described method for processing blind hole of claim 1 to 4, it is characterized in that the power of the laser of this first set amount is 30-40W.
8. as each described method for processing blind hole of claim 1 to 4, it is characterized in that the pulse frequency of the laser of this second set amount is 50-60KHz.
9. as each described method for processing blind hole of claim 1 to 4, it is characterized in that the pulse width of the laser of this second set amount is 2-3us.
10. as each described method for processing blind hole of claim 1 to 4, it is characterized in that the power of the laser of this second set amount is 20-30W.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010141245A CN101829850A (en) | 2010-04-01 | 2010-04-01 | Method for processing blind hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010141245A CN101829850A (en) | 2010-04-01 | 2010-04-01 | Method for processing blind hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101829850A true CN101829850A (en) | 2010-09-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010141245A Pending CN101829850A (en) | 2010-04-01 | 2010-04-01 | Method for processing blind hole |
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| CN (1) | CN101829850A (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102500927A (en) * | 2011-09-30 | 2012-06-20 | 武汉克瑞斯光电技术有限公司 | Optical vibrating mirror type laser tablet drilling method |
| CN103212857A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Method for processing FPC (Flexible Printed Circuit) blind hole |
| CN103231171A (en) * | 2013-04-24 | 2013-08-07 | 梅州市志浩电子科技有限公司 | Processing method of blind hole of printed circuit board |
| CN103537803A (en) * | 2012-07-16 | 2014-01-29 | 深圳市木森科技有限公司 | Method and device for solder ball shaping |
| CN104703397A (en) * | 2015-03-27 | 2015-06-10 | 大族激光科技产业集团股份有限公司 | Method for processing blind hole in flexible circuit board |
| CN104959776A (en) * | 2015-05-21 | 2015-10-07 | 中冶陕压重工设备有限公司 | Machining method for large-sized inner-hexagon blind hole |
| CN105263266A (en) * | 2015-10-30 | 2016-01-20 | 江苏博敏电子有限公司 | Laser processing method of blind drilling |
| CN103152984B (en) * | 2013-02-02 | 2016-05-11 | 汕头超声印制板（二厂）有限公司 | The processing method of installation opening on wiring board |
| CN105728949A (en) * | 2016-04-18 | 2016-07-06 | 江苏博敏电子有限公司 | Laser cutting method |
| CN108055793A (en) * | 2017-11-09 | 2018-05-18 | 建业科技电子（惠州）有限公司 | A kind of blind hole processing method |
| CN111822887A (en) * | 2020-07-14 | 2020-10-27 | 深圳中科光子科技有限公司 | Processing system and method for laser drilling thick glass |
| CN113165118A (en) * | 2018-11-27 | 2021-07-23 | 琳得科株式会社 | Method for manufacturing semiconductor device |
| CN113441852A (en) * | 2021-06-24 | 2021-09-28 | 中国科学院西安光学精密机械研究所 | Laser spiral scanning blind hole manufacturing method |
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| JP2002081141A (en) * | 2000-09-11 | 2002-03-22 | Misawa Homes Co Ltd | Sheath pipe holding jig, positioning jig therefor, and method for positioning sheath pipe holding jig |
| US20030201260A1 (en) * | 2002-02-21 | 2003-10-30 | Steur Hubert De | Method for drilling holes in a substrate |
| EP1480780A1 (en) * | 2002-03-05 | 2004-12-01 | Siemens Aktiengesellschaft | Laser machining method |
| CN1946266A (en) * | 2005-10-06 | 2007-04-11 | Mec株式会社 | Method of manufacturing a printed circuit board |
| JP2007268576A (en) * | 2006-03-31 | 2007-10-18 | Hitachi Via Mechanics Ltd | Laser beam machining method |
| JP4186926B2 (en) * | 2003-03-17 | 2008-11-26 | 三菱電機株式会社 | Laser processing method |
| CN101372071A (en) * | 2008-09-12 | 2009-02-25 | 上海美维科技有限公司 | Method for directly drilling blind hole by laser using carbon dioxide |
| CN101610643A (en) * | 2009-07-14 | 2009-12-23 | 华中科技大学 | A method of laser processing blind hole |
-
2010
- 2010-04-01 CN CN201010141245A patent/CN101829850A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002081141A (en) * | 2000-09-11 | 2002-03-22 | Misawa Homes Co Ltd | Sheath pipe holding jig, positioning jig therefor, and method for positioning sheath pipe holding jig |
| US20030201260A1 (en) * | 2002-02-21 | 2003-10-30 | Steur Hubert De | Method for drilling holes in a substrate |
| EP1480780A1 (en) * | 2002-03-05 | 2004-12-01 | Siemens Aktiengesellschaft | Laser machining method |
| JP4186926B2 (en) * | 2003-03-17 | 2008-11-26 | 三菱電機株式会社 | Laser processing method |
| CN1946266A (en) * | 2005-10-06 | 2007-04-11 | Mec株式会社 | Method of manufacturing a printed circuit board |
| JP2007268576A (en) * | 2006-03-31 | 2007-10-18 | Hitachi Via Mechanics Ltd | Laser beam machining method |
| CN101372071A (en) * | 2008-09-12 | 2009-02-25 | 上海美维科技有限公司 | Method for directly drilling blind hole by laser using carbon dioxide |
| CN101610643A (en) * | 2009-07-14 | 2009-12-23 | 华中科技大学 | A method of laser processing blind hole |
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102500927B (en) * | 2011-09-30 | 2015-01-14 | 武汉克瑞斯光电技术有限公司 | Optical vibrating mirror type laser tablet drilling method |
| CN102500927A (en) * | 2011-09-30 | 2012-06-20 | 武汉克瑞斯光电技术有限公司 | Optical vibrating mirror type laser tablet drilling method |
| CN103212857A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Method for processing FPC (Flexible Printed Circuit) blind hole |
| CN103212857B (en) * | 2012-01-19 | 2015-09-30 | 昆山思拓机器有限公司 | A kind of FPC method for processing blind hole |
| CN103537803A (en) * | 2012-07-16 | 2014-01-29 | 深圳市木森科技有限公司 | Method and device for solder ball shaping |
| CN103537803B (en) * | 2012-07-16 | 2016-10-12 | 深圳市木森科技有限公司 | A kind of method and apparatus of stannum ball shaping |
| CN103152984B (en) * | 2013-02-02 | 2016-05-11 | 汕头超声印制板（二厂）有限公司 | The processing method of installation opening on wiring board |
| CN103231171A (en) * | 2013-04-24 | 2013-08-07 | 梅州市志浩电子科技有限公司 | Processing method of blind hole of printed circuit board |
| CN104703397B (en) * | 2015-03-27 | 2018-03-09 | 大族激光科技产业集团股份有限公司 | A kind of method of flexible circuitry board blind hole processing |
| CN104703397A (en) * | 2015-03-27 | 2015-06-10 | 大族激光科技产业集团股份有限公司 | Method for processing blind hole in flexible circuit board |
| CN104959776A (en) * | 2015-05-21 | 2015-10-07 | 中冶陕压重工设备有限公司 | Machining method for large-sized inner-hexagon blind hole |
| CN105263266A (en) * | 2015-10-30 | 2016-01-20 | 江苏博敏电子有限公司 | Laser processing method of blind drilling |
| CN105728949A (en) * | 2016-04-18 | 2016-07-06 | 江苏博敏电子有限公司 | Laser cutting method |
| CN108055793A (en) * | 2017-11-09 | 2018-05-18 | 建业科技电子（惠州）有限公司 | A kind of blind hole processing method |
| CN113165118A (en) * | 2018-11-27 | 2021-07-23 | 琳得科株式会社 | Method for manufacturing semiconductor device |
| CN111822887A (en) * | 2020-07-14 | 2020-10-27 | 深圳中科光子科技有限公司 | Processing system and method for laser drilling thick glass |
| CN111822887B (en) * | 2020-07-14 | 2022-04-26 | 深圳中科光子科技有限公司 | Processing system and method for laser drilling thick glass |
| CN113441852A (en) * | 2021-06-24 | 2021-09-28 | 中国科学院西安光学精密机械研究所 | Laser spiral scanning blind hole manufacturing method |
| CN113441852B (en) * | 2021-06-24 | 2022-07-19 | 中国科学院西安光学精密机械研究所 | Laser spiral scanning blind hole manufacturing method |
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Application publication date: 20100915 |