CN101819888A - Method for preparing solid electrolytic capacitor - Google Patents
Method for preparing solid electrolytic capacitor Download PDFInfo
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- CN101819888A CN101819888A CN 201010136355 CN201010136355A CN101819888A CN 101819888 A CN101819888 A CN 101819888A CN 201010136355 CN201010136355 CN 201010136355 CN 201010136355 A CN201010136355 A CN 201010136355A CN 101819888 A CN101819888 A CN 101819888A
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Abstract
The invention discloses a method for preparing a solid electrolytic capacitor, which comprises the following steps of: forming an oxide film medium and solid electrolytic layers on the anode surface in turn, wherein the first cathode layer is a carbon layer and a second cathode layer is a silver layer, and preparing each single capacitor element; welding the anodes of single capacitor elements together to prepare an anode electrode part and welding the anode electrode part on an anode lead frame; adhering the cathodes of the single capacitor elements together to prepare a cathode electrode part and adhering the cathode electrode part on a cathode lead frame; and finally encapsulating to prepare the solid electrolytic capacitor through encapsulation materials, wherein an adhesive adopted for the adhesion between cathodes of single capacitor element and the adhesion between the cathode electrode part and the cathode lead frame is silver-coated copper conductive paste. By adopting the silver-coated copper conductive paste as the adhesive, the method for preparing the solid electrolytic capacitor overcomes the defect that the copper powder is easily oxidized, solves the problem that the price of the silver powder is high, and effectively reduces the cost.
Description
[technical field]
The present invention relates to a kind of preparation method of solid electrolytic capacitor.
[background technology]
Solid electrolytic capacitor is installed in the electric power loop of CPU, the peripheral loop in various pictorial information machines such as various portable data assistances such as notebook personal computer, desktop PC, mobile phone, digital camera etc.Its miniaturization, the low back of the bodyization, big electric capacityization are widely used in many electronic information machines in recent years.
The preparation method of solid electrolytic capacitor in the prior art generally is to be that the carbon-coating and second cathode layer are silver layer by forming oxide film dielectric, solid electrolyte layer, first cathode layer on the anode body surface successively, makes single capacitor element.Weld together the anode electrode portion that makes between the anode of single capacitor element, anode electrode portion is welded on the anode lead frame again, bond together between the negative electrode of single capacitor element and make cathode electrode portion, cathode electrode portion is bonded on the cathode leg frame again, seals by plastic packaging material at last and is made into solid electrolytic capacitor; Bonding between the described single capacitor element negative electrode, the bonding agent of bonding employing is a silver conductive adhesive between cathode electrode portion and the cathode leg frame, the silver conductive adhesive good conductivity, but price is very expensive, has accounted for a big chunk of capacitor cost.If directly adopt copper powder easily oxidized again.
[summary of the invention]
Technical problem to be solved by this invention is to provide a kind of preparation method of solid electrolytic capacitor, bonding between the single capacitor element negative electrode, the bonding agent of bonding employing is silver-colored copper-clad conductive paste between cathode electrode portion and the cathode leg frame, the lower and non-oxidizability raising of its cost.
The present invention solves the problems of the technologies described above by the following technical solutions:
A kind of preparation method of solid electrolytic capacitor is that the carbon-coating and second cathode layer are silver layer by forming oxide film dielectric, solid electrolyte layer, first cathode layer on the anode body surface successively, makes single capacitor element; Weld together the anode electrode portion that makes between the anode of single capacitor element, anode electrode portion is welded on the anode lead frame again, bond together between the negative electrode of single capacitor element and make cathode electrode portion, cathode electrode portion is bonded on the cathode leg frame again, seals by plastic packaging material at last and is made into solid electrolytic capacitor; The bonding agent of bonding employing is silver-colored copper-clad conductive paste between bonding, cathode electrode portion between the described single capacitor element negative electrode and the cathode leg frame.
Described silver-colored copper-clad conductive paste carries out needing when bonding dry under 80 ℃ of-200 ℃ of temperature as bonding agent; Slurry solids content is 30-80%; Silver is 1 with the mass content ratio of copper in the slurry: 50-3: 1.
Silver is 1 with the mass content ratio of copper in the slurry: 20-1: 1.
Described anode bodies is valve metal or oxide.
Described valve metal is a kind of in aluminium, tantalum, niobium, the titanium; Described oxide is a columbium monoxide.
Described solid electrolyte is electric conductive polymer or oxide, and conducting polymer is a polypyrrole, polythiophene, and polyaniline or derivatives thereof, oxide are manganese dioxide.
The invention has the advantages that: adopt silver-colored copper-clad conductive paste as bonding agent, silver copper-clad conductive paste is to cooperate resin and auxiliary material allotment to form with special silver-coated copper powder, it had both overcome the defective of the easy oxidation of copper powder, had solved the expensive problem of silver powder again, effectively reduced cost.
[description of drawings]
The invention will be further described in conjunction with the embodiments with reference to the accompanying drawings.
Fig. 1 is the structural representation after the solid aluminum electrolytic capacitor encapsulation of the present invention.
[embodiment]
Embodiment 1
A kind of preparation method of solid electrolytic capacitor is that the carbon-coating and second cathode layer are silver layer by forming oxide film dielectric, solid electrolyte layer, first cathode layer on the anode body surface successively, makes single capacitor element.Weld together the anode electrode portion that makes between the anode of single capacitor element, anode electrode portion is welded on the anode lead frame again, bond together between the negative electrode of single capacitor element and make cathode electrode portion, cathode electrode portion is bonded on the cathode leg frame again, seals by plastic packaging material at last and is made into solid electrolytic capacitor; Bonding between the described single capacitor element negative electrode, the bonding agent of bonding employing is silver-colored copper-clad conductive paste between cathode electrode portion and the cathode leg frame.Adopt silver-colored copper-clad conductive paste as bonding agent, it had both overcome the defective of the easy oxidation of copper powder, had solved the expensive problem of silver powder again, effectively reduced cost.
In concrete practice, the capacitor chip of solid electrolytic capacitor is valve metal or the oxide that surface coverage has dielectric layer, and valve metal is aluminium, tantalum, niobium or titanium etc., and oxide is a columbium monoxide etc.Solid electrolyte is electric conductive polymer or oxide, and conducting polymer is a polypyrrole, polythiophene, and polyaniline or derivatives thereof, oxide are manganese dioxide.
See also shown in Figure 1, the structural representation after the solid aluminum electrolytic capacitor encapsulation.Form oxide film dielectric (figure do not show) on aluminium foil 10 surfaces successively, solid electrolyte layer is polypyrrole 11, carbon-coating 12 and silver layer 13, is prepared into single capacitor element.Weld together the anode electrode portion that makes between the anode of single capacitor element, anode electrode portion is welded on the anode lead frame 15 again, bond together between the negative electrode of single capacitor element and make cathode electrode portion, cathode electrode portion is bonded on the cathode leg frame 16 again, seals by plastic packaging material 17 at last and is made into solid electrolytic capacitor; Bonding between the described single capacitor element negative electrode, the bonding agent of bonding employing is silver-colored copper-clad conductive paste 14 between cathode electrode portion and the cathode leg frame 16, seals by plastic packaging material 17 at last and makes solid electrolytic capacitor.The solid content of used silver-colored copper-clad conductive paste is 43% among this embodiment, and silver is 1: 20 with the mass ratio of copper, and the curing temperature of silver-colored copper-clad conductive paste is 150 ℃, uses behind the curing 30min.
Embodiment 2
The solid content of used silver-colored copper-clad conductive paste is 30% among this embodiment, and silver is 3: 1 with the mass ratio of copper, and all the other steps are all identical with embodiment 1.
Embodiment 3
The solid content of used silver-colored copper-clad conductive paste is 80% among this embodiment, and silver is 1: 50 with the mass ratio of copper, and all the other steps are all identical with embodiment 1.
Embodiment 4
Used silver-colored copper-clad conductive paste among this embodiment, silver is 1: 1 with the mass ratio of copper, curing temperature is 80 ℃, uses after solidifying 120min.All the other steps are all identical with embodiment 1.
Embodiment 5
Used silver-colored copper-clad conductive paste among this embodiment, silver is 1: 3 with the mass ratio of copper, curing temperature be 200 ℃, use after solidifying 5min.All the other steps are all identical with embodiment 1.
Comparative Examples 1 (prior art)
According to conventional method, preparing solid electrolyte layer successively is polypyrrole 11, carbon-coating 12 and silver layer 13, makes single capacitor element with the aluminium foil 10 of capping oxidation film medium.Weld together between the anode of single capacitor element, make anode electrode portion, anode electrode portion is welded on the anode lead frame 15 again, bond together between the negative electrode of single capacitor element and make cathode electrode portion, cathode electrode portion is bonded on the cathode lead frame 16 again, seals by plastic packaging material 17 and makes solid aluminum electrolytic capacitor.Bonding between the described single capacitor element negative electrode, the bonding agent of bonding employing is conventional silver conductive adhesive between cathode electrode portion and the cathode leg frame 16.The solid content of conventional silver conductive adhesive is 60%, and curing temperature is 150 ℃, uses behind the curing 30min.
Be prepared into 6.3V/120 μ F solid aluminum electrolytic capacitor, choose capacitor testing capacity, loss, ESR (equivalent series resistance) and the leakage current electricity of 30 embodiment 1-5 and Comparative Examples 1 and also average respectively, as shown in the table:
| LC value/μ A | Capacity/μ F | Loss | ??ESR/mΩ | |
| Embodiment 1 | ??0.39 | ??119.2 | ??0.011 | ??10.3 |
| Embodiment 2 | ??0.46 | ??118.4 | ??0.012 | ??11.2 |
| Embodiment 3 | ??0.41 | ??116.2 | ??0.012 | ??13.2 |
| Embodiment 4 | ??0.46 | ??117.3 | ??0.010 | ??9.8 |
| Embodiment 5 | ??0.43 | ??116.5 | ??0.012 | ??10.5 |
| Comparative Examples 1 | ??0.43 | ??118.6 | ??0.010 | ??10.4 |
Above data declaration, bonding among the embodiment 1-5 between the single capacitor element negative electrode, the bonding agent of 15 bonding employings is a copper-clad silver conductive paste between cathode electrode portion and the cathode leg frame, making the bonding agent that adopts in capacity, loss, ESR and the leakage current mean value of solid aluminum electrolytic capacitor and the Comparative Examples 1 is conventional silver conductive adhesive, all very approaching.And embodiment 1, and the mass ratio 1 of silver and copper in the copper-clad silver conductive paste among embodiment 4 and the embodiment 5: 20-1: the 1 capacitor ESR that makes is lower.
Therefore, the present invention is compared to prior art, and is with low cost, both overcome the defective of the easy oxidation of copper powder, solved the expensive problem of silver powder again.
Claims (5)
1. the preparation method of a solid electrolytic capacitor is that the carbon-coating and second cathode layer are silver layer by forming oxide film dielectric, solid electrolyte layer, first cathode layer on the anode body surface successively, makes single capacitor element; Weld together the anode electrode portion that makes between the anode of single capacitor element, anode electrode portion is welded on the anode lead frame again, bond together between the negative electrode of single capacitor element and make cathode electrode portion, cathode electrode portion is bonded on the cathode leg frame again, seals by plastic packaging material at last and is made into solid electrolytic capacitor; It is characterized in that: the bonding agent of bonding employing is silver-colored copper-clad conductive paste between bonding, cathode electrode portion between the described single capacitor element negative electrode and the cathode leg frame.
2. the preparation method of a kind of solid electrolytic capacitor as claimed in claim 1 is characterized in that: described silver-colored copper-clad conductive paste carries out needing dry under 80 ℃ of-200 ℃ of temperature when bonding as bonding agent, and slurry solids content is 30-80%; Silver is 1 with the mass content ratio of copper in the slurry: 50-3: 1.
3. the preparation method of a kind of solid electrolytic capacitor as claimed in claim 2 is characterized in that: silver is 1 with the mass content ratio of copper in the slurry: 20-1: 1.
4. as the preparation method of each described a kind of solid electrolytic capacitor in the claim 1 to 3, it is characterized in that: described anode bodies is valve metal or oxide.
5. the preparation method of a kind of solid electrolytic capacitor as claimed in claim 4 is characterized in that: described valve metal is a kind of in aluminium, tantalum, niobium, the titanium; Described oxide is a columbium monoxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010136355 CN101819888A (en) | 2010-03-30 | 2010-03-30 | Method for preparing solid electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010136355 CN101819888A (en) | 2010-03-30 | 2010-03-30 | Method for preparing solid electrolytic capacitor |
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| CN101819888A true CN101819888A (en) | 2010-09-01 |
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| CN 201010136355 Pending CN101819888A (en) | 2010-03-30 | 2010-03-30 | Method for preparing solid electrolytic capacitor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114446651A (en) * | 2020-11-03 | 2022-05-06 | 钰邦科技股份有限公司 | Stacked solid-state capacitors, integrated circuit products and electronic products |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3095427B2 (en) * | 1990-12-04 | 2000-10-03 | 東芝ケミカル株式会社 | Solid electrolytic capacitors |
| CN1327246A (en) * | 2000-05-26 | 2001-12-19 | 松下电器产业株式会社 | Solid electrolytic capacitor |
| CN1350313A (en) * | 2000-10-24 | 2002-05-22 | 松下电器产业株式会社 | Solid electrolytic capacitor and method for manufacturing the same |
| CN1876282A (en) * | 2006-07-07 | 2006-12-13 | 清华大学 | Chemical method for silver coating on copper powder surface |
| CN101409157A (en) * | 2008-11-21 | 2009-04-15 | 福建国光电子科技股份有限公司 | Packaging technique for solid electrolyte capacitor |
| CN101494119A (en) * | 2008-01-22 | 2009-07-29 | 阿维科斯公司 | Electrolytic capacitor anode treated with an organometallic compound |
-
2010
- 2010-03-30 CN CN 201010136355 patent/CN101819888A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3095427B2 (en) * | 1990-12-04 | 2000-10-03 | 東芝ケミカル株式会社 | Solid electrolytic capacitors |
| CN1327246A (en) * | 2000-05-26 | 2001-12-19 | 松下电器产业株式会社 | Solid electrolytic capacitor |
| CN1350313A (en) * | 2000-10-24 | 2002-05-22 | 松下电器产业株式会社 | Solid electrolytic capacitor and method for manufacturing the same |
| CN1876282A (en) * | 2006-07-07 | 2006-12-13 | 清华大学 | Chemical method for silver coating on copper powder surface |
| CN101494119A (en) * | 2008-01-22 | 2009-07-29 | 阿维科斯公司 | Electrolytic capacitor anode treated with an organometallic compound |
| CN101409157A (en) * | 2008-11-21 | 2009-04-15 | 福建国光电子科技股份有限公司 | Packaging technique for solid electrolyte capacitor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114446651A (en) * | 2020-11-03 | 2022-05-06 | 钰邦科技股份有限公司 | Stacked solid-state capacitors, integrated circuit products and electronic products |
| CN114446651B (en) * | 2020-11-03 | 2024-03-22 | 钰邦科技股份有限公司 | Stacked solid-state capacitor, integrated circuit product and electronic product |
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Open date: 20100901 |