CN101807632B - LED Packaging - Google Patents

Abstract

A light emitting diode package includes a substrate, a plurality of light emitting diode chips, and a plurality of sets of electrode pairs. The light emitting diode chips are arranged on the substrate and electrically insulated from each other. The electrode pairs are arranged on the substrate and are electrically insulated from each other. The number of the electrode pairs is the same as that of the light emitting diode chips, and each electrode pair is electrically connected with the corresponding light emitting diode chip.

Description

LED Packaging

technical field

The present invention relates to a light emitting diode package, and in particular to a light emitting diode package having a plurality of light emitting diode chips electrically insulated from each other.

Background technique

The light-emitting diode package uses III-V elements as the main material of the light-emitting layer, and applies current to the light-emitting layer to combine electrons and holes to release excess energy in the form of light, thereby achieving the purpose of light emission . Different from traditional lighting methods such as heating or discharging, since the lighting phenomenon of the LED package is cold lighting, its service life is longer and there is no need for idling time. In addition, light-emitting diode packaging also has the advantages of fast response, small size, low power consumption, low pollution (mercury-free), high reliability, and suitable for mass production, so it can be used in a wide range of fields. In recent years, due to the continuous improvement of the luminous efficiency of light-emitting diode packages, white light-emitting diode packages have gradually replaced traditional fluorescent lamps and incandescent bulbs in applications such as scanner light sources, LCD screen backlights, or lighting equipment. the trend of. Commonly known white light emitting diode packages mainly include the following types:

1. Use a blue light-emitting diode chip with a yellow phosphor to generate white light. Among them, the yellow inorganic phosphor can emit yellow fluorescence after being irradiated by the blue light emitted by the blue light-emitting diode chip, and when the yellow fluorescence is mixed with the original blue light, white light with two wavelengths can be obtained. The white light emitting diode package has a plurality of blue light emitting diode chips, and the blue light emitting diode chips are electrically connected to each other in parallel. However, since these blue light emitting diode chips are electrically connected to each other in parallel, it is difficult to conduct electrical tests on individual blue light emitting diode chips, so that the manufacturing cost increases. In addition, when one or more blue light emitting diode chips in the white light emitting diode package are damaged, the load current of other blue light emitting diode chips connected in parallel with it will increase, so that other blue light emitting diode chips in parallel with it are easily damaged.

2. Use red light, blue light and green light-emitting diode chips at the same time to generate white light. Because this kind of white light emitting diode package needs to use a plurality of single-color light-emitting diode chips at the same time, and different single-color light-emitting diode chips, such as red light-emitting diode chips, blue light-emitting diode chips and green light-emitting diode chips, the applicable driving voltage They are not the same, therefore, red light, blue light and green light emitting diode chips are mostly connected in parallel in the form of common cathode or common anode. When one or more single-color light-emitting diode chips in the white light-emitting diode package are damaged, the load current of other single-color light-emitting diode chips connected in parallel with it will increase and be easily damaged.

Contents of the invention

The object of the present invention is to provide a light emitting diode package in which the light emitting diode chips are electrically insulated from each other.

To achieve the above object, the LED package provided by the present invention includes a substrate, a plurality of LED chips and a plurality of electrode pairs. The LED chips are disposed on the substrate, and the LED chips are electrically insulated from each other. The electrode pairs are arranged on the substrate, the electrode pairs are electrically insulated from each other, the number of the electrode pairs is the same as the number of the LED chips, and each electrode pair is electrically connected to the corresponding LED chip.

In one embodiment of the present invention, the light emitting diode chip includes a first light emitting diode chip, a second light emitting diode chip and a third light emitting diode chip, and the electrode pair includes a first electrode pair, a second electrode pair and A third electrode pair, and the first electrode pair is electrically connected to the first LED chip, the second electrode pair is electrically connected to the second LED chip, and the third electrode pair is electrically connected to the third LED chip.

In one embodiment of the present invention, the first electrode pair has a first anode and a first cathode electrically connected to the first LED chip, and the second electrode pair has a first electrode electrically connected to the second LED chip. The second anode and a second cathode, the third electrode pair has a third anode and a third cathode electrically connected to the third LED chip.

In an embodiment of the present invention, the LED package further includes a plurality of heat conduction pillars, which pass through the substrate, and part of the heat conduction pillars are located under the LED chip.

In an embodiment of the present invention, the LED package further includes a first heat conduction layer disposed between the LED chip and the substrate, and covering a first end of each heat conduction column.

In an embodiment of the present invention, the LED package further includes a second heat conduction layer disposed on a surface of the substrate facing away from the LED chip and covering a second end of each heat conduction column.

In an embodiment of the present invention, the LED package further includes a heat dissipation component, and the second heat conduction layer is located between the heat dissipation component and the substrate.

In an embodiment of the present invention, the LED package further includes a plurality of via holes, which penetrate through the substrate and are respectively electrically connected to the electrode pairs.

In an embodiment of the present invention, the LED package further includes a reflective component disposed on the substrate, and the reflective component and the substrate form a groove, and the LED chip is disposed at the bottom of the groove.

In an embodiment of the present invention, the LED package further includes an encapsulant disposed in the groove and covering the LED chip.

In summary, the LED chips of the present invention are electrically insulated from each other, so electrical tests can be performed on each LED chip to detect the electrical quality of each LED chip.

Description of drawings

FIG. 1A shows a top view of a light emitting diode package according to an embodiment of the present invention.

FIG. 1B is a bottom view of the LED package shown in FIG. 1A .

FIG. 1C is a cross-sectional view of the LED package shown in FIG. 1A .

FIG. 2 is a cross-sectional view of a light emitting diode package according to another embodiment of the present invention.

Explanation of main component symbols in the drawings

100: LED package;

110: Substrate

112: surface

120: LED chip

122: The first LED chip

124: Second LED chip

126: The third LED chip

130: electrode pair

132: first electrode pair

132a: first anode

132b: first cathode

134: Second electrode pair

134a: second anode

134b: second cathode

136: third electrode pair

136a: third anode

136b: third cathode

140: via hole

150: thermal column

152: First End

154: second end

160: The first heat conduction layer

170: second heat conduction layer

180: cooling components

190: circuit board

B: Pad

E: encapsulation colloid

F: reflection component

R: Groove

W: welding wire

Detailed ways

In order to make the above and other features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings.

Please refer to FIG. 1A , the light emitting diode package 100 of this embodiment includes a substrate 110 , a plurality of light emitting diode chips 120 and a plurality of electrode pairs 130 . The LED chips 120 are disposed on the substrate 110 , and the LED chips 120 are electrically insulated from each other. The substrate 110 may be an insulating substrate (such as a ceramic substrate).

In this embodiment, the LED chip 120 includes a first LED chip 122 , a second LED chip 124 and a third LED chip 126 . It should be noted that the present embodiment takes three light emitting diode chips 122 , 124 , 126 as an example for illustration, but it is not intended to limit the present invention. For example, there may be two or more light emitting diode chips 120 .

In this embodiment, the first LED chip 122 , the second LED chip 124 and the third LED chip 126 may be a red LED chip, a blue LED chip and a green LED chip, respectively. In other embodiments, the first LED chip 122 , the second LED chip 124 and the third LED chip 126 may all be LED chips that emit the same color light (such as blue LED chips).

The electrode pairs 130 are disposed on the substrate 110 , the electrode pairs 130 are electrically insulated from each other, and are adapted to be electrically connected to a plurality of independent power sources respectively. In other words, each independent power source is only electrically connected to one electrode pair 130 . The number of electrode pairs 130 is the same as the number of LED chips 120 , and each electrode pair 130 is electrically connected to the corresponding LED chip 120 by, for example, wire bonding.

It is worth noting that, unlike the parallel-connected LED chips in the prior art, the LED chips 120 in this embodiment are electrically insulated from each other, so electrical tests can be performed on each LED chip 120 to detect each light emitting diode chip. The electrical quality of the diode chip 120 . In addition, when one or more LED chips 120 in the LED package 100 are damaged, other LED chips 120 will not be affected.

Furthermore, in this embodiment, the magnitudes of the current input to the first LED chip 122 , the second LED chip 124 and the third LED chip 126 can be individually controlled to control their brightness. Moreover, changing the brightness of the first, second and third LED chips 122 , 124 , 126 individually can change the color of the colored light emitted by the LED package 100 . Therefore, compared with the conventional LED package that can only emit a single color of light (for example, white), the light emitting diode package 100 of this embodiment can change the color of the emitted color light according to the situation.

In this embodiment, the electrode pair 130 includes a first electrode pair 132, a second electrode pair 134, and a third electrode pair 136, and the first electrode pair 132 is electrically connected to the first LED chip 122, and the second electrode pair 132 is electrically connected to the first LED chip 122. The electrode pair 134 is electrically connected to the second LED chip 124 , and the third electrode pair 136 is electrically connected to the third LED chip 126 .

In detail, in this embodiment, the first electrode pair 132 has a first anode 132 a and a first cathode 132 b electrically connected to the first LED chip 122 . The second electrode pair 134 has a second anode 134 a and a second cathode 134 b electrically connected to the second LED chip 124 . The third electrode pair 136 has a third anode 136 a and a third cathode 136 b electrically connected to the third LED chip 126 .

Please refer to FIG. 1A , FIG. 1B and FIG. 1C at the same time. In this embodiment, a plurality of conductive through holes 140 (conductive through holes) penetrate the substrate 110 . And respectively with the first anode 132a and the first cathode 132b of the first electrode pair 132, the second anode 134a and the second cathode 134b of the second electrode pair 134, the third anode 136a and the third cathode 136b of the third electrode pair 136 electrical connection. It should be noted that the conductive vias 140 connected to different electrode pairs 130 are electrically insulated from each other.

In this embodiment, the LED package 100 can transmit the heat energy generated by the first, second and third LED chips 122, 124, 126 to the external environment through a plurality of thermally conductive pillars 150 penetrating the substrate 110, thereby improving the light emission. The heat dissipation capability of the diode package 100 . In detail, in the present embodiment, part of the heat conduction column 150 is located under the LED chip 120 . The material of the thermally conductive pillar 150 is, for example, silver, copper or other metals with good thermal conductivity.

In addition, in this embodiment, a first heat conduction layer 160 can be disposed between the LED chip 120 and the substrate 110, and the first heat conduction layer 160 covers a first end 152 of each heat conduction column 150, so that the LED chip The thermal energy generated by 120 can be evenly transferred to the heat conducting column 150 . The material of the first heat conduction layer 160 is, for example, silver, copper or other metals with good heat conduction properties.

In order to improve the efficiency of the thermal conduction column 150 in transferring the aforementioned heat energy to the external environment, a second thermal conduction layer 170 can be disposed on a surface 112 of the substrate 110 facing away from the LED chip 120 , and the second thermal conduction layer 170 covers each thermal conduction column 150 A second end 154 of. In this way, the second heat conduction layer 170 can increase the heat dissipation area of the LED package 100 , thereby improving its heat dissipation capability. The material of the second heat conduction layer 170 is, for example, silver, copper or other metals with good heat conduction properties.

In addition, referring to FIG. 2 , the substrate 110 can be disposed on a heat dissipation component 180 so that the second heat conduction layer 170 is located between the heat dissipation component 180 and the substrate 110 . Therefore, the aforementioned heat energy can be transferred to the external environment through the first heat conduction layer 160 , the heat conduction column 150 , the second heat conduction layer 170 and the heat dissipation component 180 in sequence. Furthermore, a circuit board 190 can be disposed around the heat dissipation component 180, and the conductive hole 140 can electrically connect the circuit board 190 through a plurality of pads B and solder (not shown) disposed between the pads B and the circuit board 190. sexual connection. In addition, a solder resist layer S can be disposed on the surface 112 of the substrate 110, which is located between the pad B and the second heat conduction layer 170, so as to prevent solder from overflowing from the pad B to the second heat conduction layer 170 during the soldering process. .

Please refer to FIG. 1A and FIG. 1C again. In this embodiment, a reflective component F can be disposed on the substrate 110, and the reflective component F and the substrate 110 form a groove R, and the LED chip 120 is disposed at the bottom of the groove R. . In order to protect the LED chip 120 and the bonding wires W electrically connecting the LED chip 120 and the electrode pair 130 , an encapsulant E can be disposed in the groove R to cover the LED chip 120 and the bonding wires W. The material of the encapsulant E is, for example, silicone or epoxy.

In addition, in other embodiments, when the LED chips 120 are all blue LED chips, the phosphor powder and the blue LED chips can be packaged in the encapsulant E to generate white light. The aforementioned fluorescent powder is suitable for being excited by part of the blue light emitted by the blue light emitting diode chip to emit yellow light.

In summary, the LED chips of the present invention are electrically insulated from each other, so electrical tests can be performed on each LED chip to detect the electrical quality of each LED chip. In addition, when one or more LED chips in the LED package are damaged, other LED chips will not be affected. Furthermore, since the LED chips of the present invention are electrically insulated from each other, the magnitude of the current input to each LED chip can be controlled separately. In this way, when the LED chip package has more than two LED chips that can emit light of different colors, the color of the colored light emitted by the LED package can be changed as needed.

Although the present invention has been described above with the embodiments, it is not intended to limit the present invention. Those skilled in the art can make some changes and modifications without departing from the spirit and scope of the present invention, so the protection scope of the present invention The content defined in the scope of the claims of the application shall prevail.

Claims (7)

1. A light-emitting diode package, comprising: a substrate; A plurality of light emitting diode chips are arranged on the substrate, and the light emitting diode chips are electrically insulated from each other; A plurality of electrode pairs are arranged on the substrate, the electrode pairs are electrically insulated from each other, and the number of the electrode pairs is the same as the number of the light emitting diode chips, and each electrode pair is connected to the corresponding light emitting diode chip electrical connection; A plurality of heat conduction columns penetrate the substrate, and some of the heat conduction columns are located under the light emitting diode chips; A first heat conduction layer is disposed between the light emitting diode chips and the substrate, and covers a first end of each heat conduction column; and a second heat conduction layer, disposed on a surface of the substrate facing away from the light emitting diode chips, and covering a second end of each heat conduction column, Wherein the heat conducting columns, the first heat conducting layer and the second heat conducting layer are electrically insulated from the electrode pairs. 2. The light emitting diode package according to claim 1, wherein the light emitting diode chips comprise a first light emitting diode chip, a second light emitting diode chip and a third light emitting diode chip, and the electrode pairs comprise a first light emitting diode chip An electrode pair, a second electrode pair and a third electrode pair, and the first electrode pair is electrically connected to the first light emitting diode chip, the second electrode pair is electrically connected to the second light emitting diode chip, the The third electrode pair is electrically connected with the third LED chip. 3. The light emitting diode package according to claim 2, wherein the first electrode pair has a first anode and a first cathode electrically connected to the first light emitting diode chip, and the second electrode pair has a first electrode connected to the first light emitting diode chip. The second LED chip is electrically connected to a second anode and a second cathode, and the third electrode pair has a third anode and a third cathode electrically connected to the third LED chip. 4. The LED package of claim 1, comprising: A heat dissipation component, the second heat conduction layer is located between the heat dissipation component and the substrate. 5. The LED package of claim 1, comprising: A plurality of via holes penetrate the substrate and are respectively electrically connected to the electrode pairs. 6. The LED package of claim 1, comprising: A reflection component is arranged on the substrate, and the reflection component and the substrate form a groove, and the LED chips are arranged at the bottom of the groove. 7. The LED package of claim 6, comprising: An encapsulation colloid is arranged in the groove and covers the LED chips.

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