CN101771186B - Self-Temperature Compensated Circular Waveguide TE011 Mode Resonator - Google Patents
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Abstract
本发明是一种自温度补偿圆形波导TE011模谐振腔,可以显著降低温度对谐振腔谐振频率的影响。该谐振腔中,金属腔体(1)为空心的圆柱形,短路板(2)位于金属腔体(1)中,短路板(2)通过支撑体(3)与金属腔体(1)的下底面腔壁(5)相连,支撑体(3)的热膨胀系数大于金属腔体(1)的热膨胀系数,支撑体(3)的一头固定在金属腔体(1)的底面腔壁(5)上,另一头固定在短路板(2)上,短路板(2)的形状为圆盘形,其大小略小于该底面腔壁(5)的大小;短路板(2)、金属腔体(1)的上底面腔壁(6)、金属腔体(1)的侧壁(7)构成了电磁波的谐振空间(8),输入输出耦合装置(4)位于谐振空间(8)的金属腔体(1)的侧壁(7)上或上底面腔壁(6)上。
The invention is a self-temperature-compensated circular waveguide TE 011 mode resonant cavity, which can significantly reduce the influence of temperature on the resonant frequency of the resonant cavity. In the resonant cavity, the metal cavity (1) is a hollow cylinder, the short circuit plate (2) is located in the metal cavity (1), and the short circuit plate (2) passes through the connection between the support body (3) and the metal cavity (1). The lower bottom cavity wall (5) is connected, the thermal expansion coefficient of the support body (3) is greater than the thermal expansion coefficient of the metal cavity body (1), and one end of the support body (3) is fixed on the bottom surface cavity wall (5) of the metal cavity body (1). The other end is fixed on the short circuit board (2), the shape of the short circuit board (2) is disc-shaped, and its size is slightly smaller than the size of the bottom cavity wall (5); the short circuit board (2), the metal cavity (1 The cavity wall (6) on the upper bottom surface of ) and the side wall (7) of the metal cavity (1) constitute the resonance space (8) of electromagnetic waves, and the input and output coupling device (4) is located in the metal cavity ( 1) on the side wall (7) or on the cavity wall (6) of the upper bottom surface.
Description
技术领域 technical field
本发明涉及一种波导谐振腔,尤其是一种能减少谐振频率温度漂移的自温度补偿圆形波导TE011模(也称H011模,为圆形波导谐振腔中的一种谐振模式)谐振腔。The invention relates to a waveguide resonant cavity, in particular to a self-temperature-compensated circular waveguide TE 011 mode (also called H 011 mode, which is a resonant mode in a circular waveguide resonant cavity) resonance capable of reducing the temperature drift of the resonant frequency cavity.
背景技术 Background technique
谐振腔的谐振频率取决于谐振腔的形状、尺寸、腔内填充媒质和谐振模式。当温度改变时,由于谐振腔腔壁材料的热胀冷缩效应,谐振腔的尺寸也会变化,由此导致谐振腔的谐振频率发生变化,对谐振腔性能造成不利的影响。目前,公知的减小温度变化对谐振腔谐振频率影响的方法主要是采用恒温措施,或者采用附加的温度补偿装置,或者采用热膨胀系数小的腔体材料如殷钢等等。这些方法的主要问题是:所需设备复杂,或者需要附加的温度补偿控制装置,或者不能大幅度降低温度对谐振腔谐振频率的影响。The resonant frequency of the resonant cavity depends on the shape, size, cavity filling medium and resonant mode of the resonant cavity. When the temperature changes, the size of the resonant cavity will also change due to thermal expansion and contraction of the wall material of the resonant cavity, which will cause a change in the resonant frequency of the resonant cavity, which will adversely affect the performance of the resonant cavity. At present, the known methods for reducing the influence of temperature changes on the resonant frequency of the resonator are mainly to adopt constant temperature measures, or use additional temperature compensation devices, or use cavity materials with small thermal expansion coefficients such as Invar and so on. The main problems of these methods are: the required equipment is complex, or an additional temperature compensation control device is required, or the influence of temperature on the resonant frequency of the resonant cavity cannot be greatly reduced.
发明内容 Contents of the invention
技术问题:本发明的目的是提出一种自温度补偿的圆形波导TE011模谐振腔,该谐振腔可以显著降低温度变化对谐振腔谐振频率的影响。Technical problem: The purpose of this invention is to propose a self-temperature-compensated circular waveguide TE 011 mode resonant cavity, which can significantly reduce the influence of temperature changes on the resonant frequency of the resonant cavity.
技术方案:本发明的自温度补偿圆形波导TE011模谐振腔包括金属腔体、短路板、支撑体及一个或数个输入输出耦合装置;其中,金属腔体为空心的圆柱形,短路板位于金属腔体中,短路板通过支撑体与金属腔体的下底面腔壁相连,支撑体的一头固定在金属腔体的底面腔壁上,另一头固定在短路板上,短路板的形状为圆盘形,其大小略小于该底面腔壁的大小;短路板、金属腔体的上底面腔壁、金属腔体的侧壁构成了电磁波的谐振空间,输入输出耦合装置位于谐振空间中金属腔体的侧壁上或上底面腔壁上。Technical solution: The self-temperature-compensated circular waveguide TE 011 mode resonator of the present invention includes a metal cavity, a short circuit board, a support body and one or several input and output coupling devices; wherein, the metal cavity is a hollow cylinder, and the short circuit board Located in the metal cavity, the short circuit board is connected to the lower bottom wall of the metal cavity through the support body. One end of the support body is fixed on the bottom wall of the metal cavity, and the other end is fixed on the short circuit board. The shape of the short circuit board is Disc-shaped, its size is slightly smaller than the size of the bottom cavity wall; the short circuit board, the upper bottom cavity wall of the metal cavity, and the side wall of the metal cavity form a resonance space for electromagnetic waves, and the input and output coupling devices are located in the metal cavity in the resonance space On the side wall of the body or on the cavity wall of the upper bottom surface.
金属腔体的热膨胀系数小于支撑体的热膨胀系数。The thermal expansion coefficient of the metal cavity is smaller than that of the support body.
支撑体材料的热膨胀系数与金属腔体材料的热膨胀系数的比值大于下底面腔壁到上底面腔壁之间的距离与支撑体长度的比值。The ratio of the thermal expansion coefficient of the support body material to the thermal expansion coefficient of the metal cavity material is greater than the ratio of the distance between the cavity wall on the lower bottom surface to the cavity wall on the upper bottom surface and the length of the support body.
短路板与金属腔体侧壁之间为紧密的滑动配合,只要短路板不至于无法在金属腔体中滑动就可以。并且在工作温度范围内,热膨胀不会使得这些缝隙消失。There is a tight sliding fit between the short circuit board and the side wall of the metal cavity, as long as the short circuit board does not fail to slide in the metal cavity. And within the operating temperature range, thermal expansion will not make these gaps disappear.
短路板为圆盘形,它通过支撑体与圆柱形金属腔体的一个底面腔壁连接,大小近似等于该底面腔壁的大小,只是比底面腔壁稍微小一些,这样短路板与圆柱形金属腔体的腔壁之间有很微小的缝隙,由于谐振模式TE011模式的腔壁电流都是围绕着腔体侧壁的圆周方向流动,因此短路板与金属腔体侧壁之间的缝隙不影响TE011模式的电磁波;电磁波谐振发生在由短路板、金属腔体的另一底面腔壁、金属腔体的侧壁构成的圆柱形谐振空间中;谐振模式TE011模的谐振频率与金属腔体短路板到金属腔体无支撑体的另一个底面腔壁的距离有关,也与谐振腔的半径有关,这两个参数越长,TE011模式的谐振频率越低;构成金属腔体及短路板的材料是导电性能好的金属材料;构成支撑体的材料的热膨胀系数大于腔体材料的热膨胀系数;当温度升高时,由于热膨胀,金属腔体的长度和半径都增加,支撑体的长度也增加,但由于支撑体材料的热膨胀系数大于金属腔体材料的热膨胀系数,当支撑体长度与金属腔体底面腔壁之间距离的比值大于金属腔体材料的热膨胀系数与支撑体材料的热膨胀系数的比值时,温度增加会使得短路板到金属腔体无支撑体的另一个底面腔壁之间的距离减小,这样可以补偿金属腔体侧壁半径的增加而引起谐振频率的变化,因此在温度上升的情况下,可以保持TE011模式的谐振频率基本不变;同理温度下降时,TE011模式的谐振频率也可以保持基本不变。The short circuit board is disc-shaped, and it is connected with a bottom cavity wall of a cylindrical metal cavity through a support body, and its size is approximately equal to the size of the bottom cavity wall, but slightly smaller than the bottom cavity wall, so that the short circuit board and the cylindrical metal cavity There is a very small gap between the cavity walls of the cavity. Since the cavity wall current in the resonant mode TE 011 mode flows around the circumferential direction of the cavity side wall, the gap between the short circuit board and the metal cavity side wall is not large. The electromagnetic wave affecting the TE 011 mode; the electromagnetic wave resonance occurs in the cylindrical resonant space composed of the short circuit board, the other bottom wall of the metal cavity, and the side wall of the metal cavity; the resonant frequency of the resonant mode TE 011 mode and the metal cavity The distance between the body short circuit plate and the other bottom cavity wall of the metal cavity without support is also related to the radius of the resonant cavity. The longer these two parameters are, the lower the resonant frequency of the TE 011 mode; the formation of the metal cavity and the short circuit The material of the plate is a metal material with good electrical conductivity; the thermal expansion coefficient of the material constituting the support is greater than that of the cavity material; when the temperature rises, the length and radius of the metal cavity increase due to thermal expansion, and the length of the support also increases, but because the thermal expansion coefficient of the support material is greater than the thermal expansion coefficient of the metal cavity material, when the ratio of the length of the support to the distance between the bottom wall of the metal cavity is greater than the thermal expansion coefficient of the metal cavity material and the thermal expansion of the support material When the ratio of the coefficient is , the increase in temperature will reduce the distance between the short circuit board and the other bottom cavity wall of the metal cavity without support, which can compensate for the increase in the radius of the side wall of the metal cavity and cause the change in resonance frequency, so When the temperature rises, the resonance frequency of the TE 011 mode can be kept basically unchanged; similarly, when the temperature drops, the resonance frequency of the TE 011 mode can also be kept basically unchanged.
有益效果:本发明大幅度减小了圆柱形谐振腔的谐振频率随温度的变化,并且结构简单,适用频率范围宽,也不需要附加的温度补偿控制机构。Beneficial effects: the invention greatly reduces the variation of the resonant frequency of the cylindrical resonant cavity with temperature, has simple structure, wide applicable frequency range, and does not need additional temperature compensation control mechanism.
附图说明 Description of drawings
图1是本发明的结构示意图。Fig. 1 is a schematic structural view of the present invention.
图中有:金属腔体1,短路板2,支撑体3,输入输出耦合装置4,下底面腔壁5,上底面腔壁6,腔体侧壁7,谐振空间8。In the figure there are: a
具体实施方式 Detailed ways
下面结合附图和实施例对本发明作进一步说明。The present invention will be further described below in conjunction with drawings and embodiments.
自温度补偿圆形波导TE011模谐振腔包括金属腔体、短路板、连接圆柱形腔体底面与短路板的支撑体及一个或数个输入输出耦合装置。金属腔体的形状是圆柱体。短路板的材料可以是与金属腔体一样的材料,也可以是其它导电金属材料,还可以在非金属材料表面上电镀金属,短路板通过支撑体和金属腔体的一个底面腔壁相连,短路板的形状为圆盘,其大小略小于该底面腔壁的大小,短路板与金属腔体的侧壁之间的缝隙尽量小,只要保证在正常工作温度范围内,短路板不至于无法在金属腔体中滑动就可以,由于谐振模式TE011模式的腔壁电流都是围绕着腔体侧壁的圆周方向流动,因此短路板与金属腔体侧壁之间的缝隙不影响TE011模式的电磁波。电磁波谐振发生在由短路板、金属腔体的另一底面腔壁、金属腔体的侧壁构成的圆柱体谐振空间中。输入输出耦合装置位于谐振空间的金属腔体的底面腔壁或侧壁上,输入输出耦合装置数量可以是一个或多于一个。谐振模式TE011模的谐振频率与金属腔体短路板到金属腔体无支撑体的另一个底面腔壁的距离有关,也与金属腔体腔壁的半径有关,这两个参数越大,TE011模式的谐振频率越低;支撑体的材料可以是金属,也可以是非金属,支撑体的热膨胀系数大于金属腔体的热膨胀系数。当温度升高时,由于热膨胀,金属腔体在各个方向的长度都增加,支撑体的长度也增加,但由于支撑体材料的热膨胀系数大于金属腔体材料的热膨胀系数,当支撑体长度与金属腔体底面腔壁之间距离的比值大于金属腔体材料的热膨胀系数与支撑体材料的热膨胀系数的比值时,温度增加会使得短路板到金属腔体无支撑体的另一个底面腔壁的距离减小,可以补偿金属腔体侧壁半径的增加而引起谐振频率的变化,这样温度上升的情况下,可以保持TE011模式的谐振频率基本不变;同理温度下降时,TE011模式的谐振频率也可以保持基本不变。The self-temperature-compensated circular waveguide TE 011 mode resonant cavity includes a metal cavity, a short circuit board, a support body connecting the bottom surface of the cylindrical cavity and the short circuit board, and one or several input and output coupling devices. The shape of the metal cavity is a cylinder. The material of the short circuit board can be the same material as the metal cavity, or other conductive metal materials. It can also be electroplated on the surface of the non-metallic material. The short circuit board is connected to a bottom cavity wall of the metal cavity through the support body, and the short circuit The shape of the board is a disk, and its size is slightly smaller than the size of the bottom cavity wall. The gap between the short circuit board and the side wall of the metal cavity should be as small as possible. As long as it is within the normal operating temperature range, the short circuit board will not fail Just slide in the cavity, because the cavity wall current of the resonant mode TE 011 mode flows around the circumferential direction of the cavity side wall, so the gap between the short circuit board and the metal cavity side wall does not affect the electromagnetic wave of the TE 011 mode . The electromagnetic wave resonance occurs in the cylindrical resonance space formed by the short circuit board, the other bottom cavity wall of the metal cavity, and the side wall of the metal cavity. The input-output coupling device is located on the cavity wall or side wall of the bottom surface of the metal cavity in the resonant space, and the number of the input-output coupling device can be one or more than one. The resonant frequency of the resonant mode TE 011 mode is related to the distance from the short circuit board of the metal cavity to the other bottom wall of the metal cavity without support, and is also related to the radius of the cavity wall of the metal cavity. The greater these two parameters, the TE 011 The lower the resonance frequency of the mode is; the material of the support body can be metal or non-metal, and the thermal expansion coefficient of the support body is greater than that of the metal cavity. When the temperature rises, due to thermal expansion, the length of the metal cavity in all directions increases, and the length of the support body also increases, but because the thermal expansion coefficient of the support body material is greater than that of the metal cavity material, when the length of the support body is equal to that of the metal cavity When the ratio of the distance between the cavity walls on the bottom of the cavity is greater than the ratio of the thermal expansion coefficient of the metal cavity material to the thermal expansion coefficient of the support material, the increase in temperature will make the distance between the short circuit board and the other bottom cavity wall of the metal cavity without support Decrease can compensate for the change of resonance frequency caused by the increase of the radius of the side wall of the metal cavity, so that when the temperature rises, the resonance frequency of the TE 011 mode can be kept basically unchanged; similarly, when the temperature drops, the resonance frequency of the TE 011 mode The frequency may also remain substantially unchanged.
在结构上,自温度补偿圆形波导TE011模谐振腔由一个金属腔体1、一个短路板2、支撑体3及一个或数个输入输出耦合装置4组成。支撑体3的一头固定在金属腔体1的下底面腔壁5上,支撑体3的另一头固定在短路板2上,短路板2通过支撑体3下底面腔壁5相连,短路板2与下底面腔壁5平行,短路板2的形状为圆盘,其直径略小于下底面腔壁5的直径,由于谐振模式TE011模式的腔壁电流都是围绕着腔体侧壁的圆周方向流动,因此短路板与金属腔体侧壁之间的缝隙不影响TE011模式的电磁波。短路板2、上底面腔壁6、金属腔体1的侧壁7构成了电磁波的谐振空间8。输入输出耦合装置4位于谐振空间8内的上底面腔壁6或金属腔体1侧壁7上,输入输出耦合装置数量可以是一个或多于一个。Structurally, the self-temperature-compensated circular waveguide TE 011 mode resonator consists of a
在制造上,金属腔体1和短路板2宜选用导电性能好的材料制造,金属腔体1和短路板2的表面可以镀金,短路板2与金属腔体1的侧壁7之间的缝隙尽量小,只要保证在正常工作温度范围内,短路板2不至于无法在金属腔体1中滑动就可以,支撑体3可以是一个或者多个,支撑体3的横截面可以是圆形或其它任意形状,支撑体3的材料可以是金属和非金属,支撑体3的热膨胀系数大于金属腔体1的热膨胀系数,支撑体3长度与金属腔体1底面腔壁5到底面腔壁8之间距离的比值大于金属腔体1材料的热膨胀系数与支撑体3材料的热膨胀系数的比值,可依据TE011模式谐振频率的公式和自温度补偿圆形波导TE011模谐振腔所使用的材料参数,具体计算自温度补偿圆形波导TE011模谐振腔的尺寸参数,以使得温度增加时,短路板2到金属腔体1无支撑体的上底面腔壁6的距离减小,以补偿金属腔体1侧壁7的半径因热膨胀长度的增加而引起的谐振频率变化,因此温度上升或下降的情况下,都可以保持TE011模式的谐振频率基本不变。根据以上所述,便可实现本发明。In manufacturing, the
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CN201285792Y (en) * | 2008-11-04 | 2009-08-05 | 中国传媒大学 | Temperature compensation mechanism for resonator cavity |
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