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CN101710638B - Self-temperature compensating rectangular waveguide resonant cavity - Google Patents

Self-temperature compensating rectangular waveguide resonant cavity Download PDF

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CN101710638B
CN101710638B CN2009102325609A CN200910232560A CN101710638B CN 101710638 B CN101710638 B CN 101710638B CN 2009102325609 A CN2009102325609 A CN 2009102325609A CN 200910232560 A CN200910232560 A CN 200910232560A CN 101710638 B CN101710638 B CN 101710638B
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cavity
cavity wall
metal
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circuit board
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CN101710638A (en
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殷晓星
赵洪新
孙忠良
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Southeast University
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Abstract

自温度补偿矩形波导谐振腔涉及一种波导谐振腔,可以显著降低温度对谐振腔谐振频率的影响。其中;短路板(2)位于金属腔体(1)中,支撑体(3)的热膨胀系数大于金属腔体(1)的热膨胀系数,短路板(2)通过支撑体(3)和金属腔体(1)的一个顶面腔壁(5)相连,短路板(3)的形状与该顶面腔壁(5)相似,其大小略小于该顶面腔壁(5)的大小;短路板(2)、金属腔体(1)的另一顶面腔壁(8)、金属腔体的窄面腔壁(6)及宽面腔壁(7)构成了电磁波的谐振空间(9);输入输出耦合装置(4)位于谐振空间(9)内的金属腔体(1)的顶面腔壁(8)或窄面腔壁(6)或宽面腔壁(7)上。

Figure 200910232560

The self-temperature-compensated rectangular waveguide resonator relates to a waveguide resonator, which can significantly reduce the influence of temperature on the resonant frequency of the resonator. Wherein; the short circuit plate (2) is located in the metal cavity (1), the thermal expansion coefficient of the support body (3) is greater than the thermal expansion coefficient of the metal cavity (1), and the short circuit plate (2) passes through the support body (3) and the metal cavity A top cavity wall (5) of (1) is connected, and the shape of the short circuit plate (3) is similar to the top cavity wall (5), and its size is slightly smaller than the size of the top cavity wall (5); the short circuit plate ( 2), the other top cavity wall (8) of the metal cavity (1), the narrow cavity wall (6) and the wide cavity wall (7) of the metal cavity constitute a resonant space (9) for electromagnetic waves; input The output coupling device (4) is located on the top cavity wall (8) or the narrow cavity wall (6) or the wide cavity wall (7) of the metal cavity (1) in the resonance space (9).

Figure 200910232560

Description

自温度补偿矩形波导谐振腔Self-Temperature Compensated Rectangular Waveguide Resonator

技术领域 technical field

本发明专利涉及一种波导谐振腔,尤其是一种能减少谐振频率温度漂移的自温度补偿矩形波导谐振腔。The patent of the present invention relates to a waveguide resonator, especially a self-temperature-compensated rectangular waveguide resonator capable of reducing temperature drift of resonance frequency.

背景技术 Background technique

波导谐振腔的谐振频率取决于谐振腔的形状、尺寸、腔内填充媒质和谐振模式。当温度改变时,由于谐振腔腔壁材料的热胀冷缩效应,谐振腔的尺寸也会变化,由此导致谐振腔的谐振频率发生变化,对谐振腔性能造成不利的影响。目前,公知的减小温度变化对谐振腔谐振频率影响的方法主要是采用恒温措施,或者采用温度补偿装置,或者采用热膨胀系数小的腔体材料如殷钢等等。这些方法的主要问题是:所需设备复杂,或者腔体材料的磁性限制了应用场合,或者需要附加的温度补偿控制装置,或者不能大幅度降低温度对谐振腔谐振频率的影响。The resonant frequency of a waveguide resonant cavity depends on the shape, size, cavity filling medium and resonant mode of the resonant cavity. When the temperature changes, the size of the resonant cavity will also change due to thermal expansion and contraction of the wall material of the resonant cavity, which will cause a change in the resonant frequency of the resonant cavity, which will adversely affect the performance of the resonant cavity. At present, the known methods to reduce the influence of temperature changes on the resonant frequency of the resonator are mainly to adopt constant temperature measures, or use temperature compensation devices, or use cavity materials with small thermal expansion coefficients such as Invar and so on. The main problems of these methods are: the required equipment is complicated, or the magnetic properties of the cavity material limit the application occasions, or additional temperature compensation control devices are required, or the influence of temperature on the resonant frequency of the resonant cavity cannot be greatly reduced.

发明内容 Contents of the invention

技术问题:本发明的目的是提出一种自温度补偿矩形波导谐振腔,该谐振腔可以显著降低温度变化对谐振腔谐振频率的影响。Technical problem: The purpose of the present invention is to propose a self-temperature-compensated rectangular waveguide resonant cavity, which can significantly reduce the influence of temperature changes on the resonant frequency of the resonant cavity.

技术方案:本发明的自温度补偿矩形波导谐振腔由金属腔体、短路板、支撑体及输入输出耦合装置组成,其中:短路板位于金属腔体内;短路板通过支撑体与金属腔体的一个顶面腔壁连接,其形状与该顶面一样,大小近似等于该顶面腔壁的大小,只是比顶面腔壁稍微小一些,这样短路板与金属腔体的四个侧面腔壁之间的缝隙很小,可以保持良好的电接触;电磁波谐振发生在由短路板、金属腔体的另一顶面腔壁、金属腔体的两个窄面腔壁和两个宽面腔壁构成的长方体谐振空间中;谐振主模TE101模式以及高次谐振模式TEm0n的谐振频率与金属腔体短路板到金属腔体无支撑体的另一个顶面腔壁的距离有关,也与谐振腔一对窄面腔壁之间的距离有关,这两个距离越长,TE101和TEm0n模式的谐振频率越低;构成金属腔体及短路板的材料是导电性能好的金属材料;构成支撑体的材料的热膨胀系数大于腔体材料的热膨胀系数;当温度升高时,由于热膨胀,金属腔体在三个方向的长度都增加,支撑体的长度也增加,但由于支撑体材料的热膨胀系数大于金属腔体材料的热膨胀系数,当支撑体长度与金属腔体顶面腔壁之间距离的比值大于金属腔体材料的热膨胀系数与支撑体材料的热膨胀系数的比值时,温度增加会使得短路板到金属腔体无支撑体的另一个顶面腔壁之间的距离减小,这样可以补偿金属腔体两个窄面腔壁之间距离的增加而引起谐振频率的变化,因此在温度上升的情况下,可以保持TE101和TEm0n模式的谐振频率基本不变;同理温度下降时,TE101和TEm0n模式的谐振频率也可以保持基本不变。Technical solution: The self-temperature-compensated rectangular waveguide resonator of the present invention is composed of a metal cavity, a short circuit board, a support body and an input-output coupling device, wherein: the short circuit board is located in the metal cavity; the short circuit board passes through one of the support body and the metal cavity The top cavity wall is connected, its shape is the same as the top surface, and its size is approximately equal to the size of the top cavity wall, but slightly smaller than the top cavity wall, so that the gap between the short circuit board and the four side cavity walls of the metal cavity The gap is very small, which can maintain good electrical contact; the electromagnetic wave resonance occurs in the short circuit board, the other top cavity wall of the metal cavity, the two narrow cavity walls and the two wide cavity walls of the metal cavity In the cuboid resonance space; the resonant frequency of the resonant main mode TE 101 mode and the high-order resonant mode TE m0n is related to the distance from the short circuit board of the metal cavity to the other top cavity wall of the metal cavity without support, and is also related to the resonant cavity one It is related to the distance between the walls of the narrow cavity, the longer these two distances, the lower the resonant frequency of TE 101 and TE m0n modes; the material that constitutes the metal cavity and the short circuit board is a metal material with good electrical conductivity; the support body The thermal expansion coefficient of the material is greater than that of the cavity material; when the temperature rises, due to thermal expansion, the length of the metal cavity in three directions increases, and the length of the support also increases, but because the thermal expansion coefficient of the support material is greater than The thermal expansion coefficient of the metal cavity material, when the ratio of the length of the support to the distance between the top surface of the metal cavity and the wall of the metal cavity is greater than the ratio of the thermal expansion coefficient of the metal cavity material to the thermal expansion coefficient of the support material, the increase in temperature will make the short circuit board The distance between the other top wall of the metal cavity without support is reduced, which can compensate for the change of the resonant frequency caused by the increase in the distance between the two narrow walls of the metal cavity, so the temperature rises Under normal circumstances, the resonant frequencies of the TE 101 and TE m0n modes can be kept basically unchanged; similarly, when the temperature drops, the resonant frequencies of the TE 101 and TE m0n modes can also be kept basically unchanged.

有益效果:本发明的有益效果是,大幅度减小了矩形谐振腔的谐振频率随温度的变化,并且结构简单,适用频率范围宽,也不需要附加的温度补偿控制机构。Beneficial effect: the beneficial effect of the present invention is that the variation of the resonant frequency of the rectangular resonant cavity with temperature is greatly reduced, the structure is simple, the applicable frequency range is wide, and no additional temperature compensation control mechanism is required.

附图说明 Description of drawings

图1是本发明的结构示意图。Fig. 1 is a schematic structural view of the present invention.

图中有金属腔体1,短路板2,支撑体3,输入输出耦合装置4,与支撑体相连的腔体顶面腔壁5,腔体窄面腔壁6,腔体宽面腔壁7,无支撑体的腔体顶面腔壁8,谐振空间9。In the figure, there are a metal cavity 1, a short circuit board 2, a support body 3, an input and output coupling device 4, a cavity wall 5 on the top surface of the cavity connected to the support body, a cavity wall 6 on the narrow side of the cavity, and a cavity wall 7 on the wide side of the cavity , a cavity wall 8 on the top surface of the cavity without a support body, and a resonant space 9 .

具体实施方式 Detailed ways

下面结合附图和实施例对本发明作进一步说明。The present invention will be further described below in conjunction with drawings and embodiments.

本发明所采用的技术方案是:自温度补偿矩形波导谐振腔包括金属腔体、短路板、连接长方形腔体底面与短路板的支撑体及一个或数个输入输出耦合装置。金属腔体的形状可以是长方体,也可以是窄面和宽面相等的正方体。短路板位于金属腔体中,短路板的材料是导电金属,也可以在非金属材料表面上电镀金属,短路板通过支撑体和金属腔体的一个顶面腔壁相连,短路板的形状与该顶面相似,其大小略小于该顶面腔壁的大小,为了保持短路板和金属腔体窄面腔壁和宽面腔壁之间良好的电磁耦合,短路板与金属腔体的窄面腔壁和宽面腔壁之间的缝隙尽量小,只要保证在正常工作温度范围内,不至于短路板无法在金属腔体中滑动就可以。电磁波谐振发生在由短路板、金属腔体的另一顶面腔壁、金属腔体的两个窄面腔壁和两个宽面腔壁构成的长方体谐振空间中。输入输出耦合装置位于谐振空间的金属腔体的腔壁上,输入输出耦合装置数量可以是一个或多于一个。谐振主模TE101模式以及高次谐振模式TEm0n的谐振频率与金属腔体短路板到金属腔体无支撑体的另一个顶面腔壁的距离有关,也与金属腔体一对窄面腔壁之间的距离有关,这两个距离越长,TE101和TEm0n模式的谐振频率越低;支撑体的材料可以是金属,也可以是非金属,如塑料等等,支撑体的热膨胀系数大于金属腔体的热膨胀系数。当温度升高时,由于热膨胀,金属腔体在三个方向的长度都增加,支撑体的长度也增加,但由于支撑体材料的热膨胀系数大于金属腔体材料的热膨胀系数,当支撑体长度与金属腔体顶面腔壁之间距离的比值大于金属腔体材料的热膨胀系数与支撑体材料的热膨胀系数的比值时,温度增加会使得短路板到金属腔体无支撑体的另一个顶面腔壁的距离减小,可以补偿金属腔体两个窄面腔壁之间距离的增加而引起谐振频率的变化,这样温度上升的情况下,可以保持TE101和TEm0n模式的谐振频率基本不变;同理温度下降时,TE101和TEm0n模式的谐振频率也可以保持基本不变。The technical solution adopted in the present invention is: the self-temperature compensation rectangular waveguide resonant cavity includes a metal cavity, a short circuit board, a support body connecting the bottom surface of the rectangular cavity and the short circuit board, and one or several input and output coupling devices. The shape of the metal cavity can be a cuboid, or a cube with equal narrow and wide sides. The short circuit board is located in the metal cavity. The material of the short circuit board is conductive metal, and metal can also be plated on the surface of non-metallic materials. The short circuit board is connected with a top cavity wall of the metal cavity through the support body. The top surface is similar, and its size is slightly smaller than the size of the top cavity wall. In order to maintain good electromagnetic coupling between the short circuit board and the narrow cavity wall and wide cavity wall of the metal cavity, the short circuit plate and the narrow cavity wall of the metal cavity The gap between the wall and the wide cavity wall is as small as possible, as long as it is guaranteed within the normal operating temperature range, so that the short circuit board cannot slide in the metal cavity. The electromagnetic wave resonance occurs in the cuboid resonance space formed by the short circuit board, another top cavity wall of the metal cavity, two narrow cavity walls and two wide cavity walls of the metal cavity. The input-output coupling device is located on the cavity wall of the metal cavity in the resonant space, and the number of the input-output coupling device can be one or more than one. The resonant frequency of the resonant main mode TE 101 mode and the high-order resonant mode TE m0n is related to the distance from the short circuit board of the metal cavity to the other top cavity wall of the metal cavity without support, and is also related to the distance between a pair of narrow cavity surfaces of the metal cavity. The distance between the walls is related, the longer these two distances, the lower the resonance frequency of TE 101 and TE m0n modes; the material of the support body can be metal or non-metal, such as plastic, etc., and the thermal expansion coefficient of the support body is greater than The thermal expansion coefficient of the metal cavity. When the temperature rises, due to thermal expansion, the length of the metal cavity in three directions increases, and the length of the support body also increases, but because the thermal expansion coefficient of the support body material is greater than that of the metal cavity material, when the support body length and When the ratio of the distance between the top cavity wall of the metal cavity is greater than the ratio of the thermal expansion coefficient of the metal cavity material to the thermal expansion coefficient of the support material, the increase in temperature will cause the short circuit board to the other top cavity of the metal cavity without support. The distance between the walls is reduced, which can compensate for the change of the resonance frequency caused by the increase of the distance between the two narrow walls of the metal cavity, so that when the temperature rises, the resonance frequency of the TE 101 and TE m0n modes can be kept basically unchanged ; Similarly, when the temperature drops, the resonant frequencies of the TE 101 and TE m0n modes can also remain basically unchanged.

在结构上,自温度补偿矩形波导谐振腔由一个金属腔体1、一个短路板2、支撑体3及一个或数个输入输出耦合装置4组成。短路板2位于金属腔体1中,支撑体3的一头固定在金属腔体1的顶面腔壁5上,支撑体3的另一头固定在短路板2上,短路板2通过支撑体3和金属腔体1的顶面腔壁5相连。短路板2、金属腔体1的另一顶面腔壁8、金属腔体的窄面腔壁6及宽面腔壁7构成了电磁波的谐振空间9。输入输出耦合装置4位于谐振空间9内的金属腔体1的顶面腔壁8或窄面腔壁6或宽面腔壁7上,输入输出耦合装置数量可以是一个或多于一个。Structurally, the self-temperature-compensated rectangular waveguide resonator consists of a metal cavity 1 , a short circuit board 2 , a support 3 and one or several input-output coupling devices 4 . The short circuit board 2 is located in the metal cavity 1, one end of the support body 3 is fixed on the top cavity wall 5 of the metal cavity 1, the other end of the support body 3 is fixed on the short circuit board 2, and the short circuit board 2 passes through the support body 3 and the The top cavity wall 5 of the metal cavity 1 is connected. The short circuit board 2 , the other top cavity wall 8 of the metal cavity 1 , the narrow cavity wall 6 and the wide cavity wall 7 of the metal cavity constitute a resonant space 9 for electromagnetic waves. The input-output coupling device 4 is located on the top cavity wall 8 or narrow cavity wall 6 or wide cavity wall 7 of the metal cavity 1 in the resonant space 9 , and the number of input-output coupling devices can be one or more than one.

在制造上,金属腔体1和短路板2宜选用导电性能好的材料制造,金属腔体1和短路板2的表面可以镀金,短路板2与金属腔体顶面腔壁5平行,短路板2的形状与该顶面腔壁5相似,其大小略小于该顶面腔壁5的大小,短路板2与金属腔体1的窄面腔壁6和宽面腔壁7之间的缝隙尽量小,只要保证在正常工作温度范围内,不至于短路板无法在金属腔体中滑动就可以。支撑体3可以是一个或者多个,支撑体3的横截面可以是圆形或其它任意形状,支撑体3的材料可以是金属和非金属,支撑体3的热膨胀系数大于金属腔体1的热膨胀系数,支撑体3长度与金属腔体1顶面腔壁5到顶面腔壁8之间距离的比值大于金属腔体1材料的热膨胀系数与支撑体3材料的热膨胀系数的比值,以使得温度增加时,短路板2到金属腔体1无支撑体的另一个顶面腔壁8的距离减小,以补偿金属腔体1两个窄面腔壁6之间距离因热膨胀的增加而引起的谐振频率变化,因此温度上升或下降的情况下,都可以保持TE101模式的谐振频率基本不变。根据以上所述,便可实现本发明。In manufacturing, the metal cavity 1 and the short circuit board 2 should be made of materials with good electrical conductivity. The surfaces of the metal cavity 1 and the short circuit board 2 can be plated with gold, and the short circuit board 2 is parallel to the cavity wall 5 on the top surface of the metal cavity. The shape of 2 is similar to the top cavity wall 5, and its size is slightly smaller than the size of the top cavity wall 5. The gap between the short circuit board 2 and the narrow cavity wall 6 and the wide cavity wall 7 of the metal cavity 1 should be as far as possible. Small, as long as it is within the normal operating temperature range, the short circuit board cannot slide in the metal cavity. There can be one or more supports 3, the cross-section of the supports 3 can be circular or other arbitrary shapes, the material of the supports 3 can be metal and non-metal, and the thermal expansion coefficient of the supports 3 is greater than that of the metal cavity 1 coefficient, the ratio of the length of the support body 3 to the distance between the top cavity wall 5 and the top cavity wall 8 of the metal cavity 1 is greater than the ratio of the thermal expansion coefficient of the material of the metal cavity 1 to the thermal expansion coefficient of the support body 3 material, so that the temperature increases , the distance from the short circuit board 2 to the other top cavity wall 8 without support of the metal cavity 1 decreases to compensate for the resonance caused by the increase in the distance between the two narrow cavity walls 6 of the metal cavity 1 due to thermal expansion The frequency changes, so the resonance frequency of the TE 101 mode can be kept basically unchanged when the temperature rises or falls. According to the above, the present invention can be realized.

Claims (4)

1.一种自温度补偿矩形波导谐振腔,其特征在于该自温度补偿矩形波导谐振腔由金属腔体(1)、短路板(2)、支撑体(3)及一个或数个输入输出耦合装置(4)所组成,其中;短路板(2)位于金属腔体(1)中,短路板(2)通过支撑体(3)和金属腔体(1)的一个顶面腔壁(5)相连,支撑体(3)的一头固定在金属腔体(1)的顶面腔壁(5)上,支撑体(3)的另一头固定在短路板(2)上,短路板(3)的形状与该顶面腔壁(5)相似,其大小略小于该顶面腔壁(5)的大小,短路板(2)、金属腔体(1)的另一顶面腔壁(8)、金属腔体的窄面腔壁(6)及宽面腔壁(7)构成了电磁波的谐振空间(9),输入输出耦合装置(4)位于谐振空间(9)内的金属腔体(1)的顶面腔壁(8)或窄面腔壁(6)或宽面腔壁(7)上;1. A self-temperature-compensated rectangular waveguide resonator, characterized in that this self-temperature-compensated rectangular waveguide resonator consists of a metal cavity (1), a short circuit board (2), a support body (3) and one or several input-output couplings The device (4) is composed of, wherein; the short circuit board (2) is located in the metal cavity (1), and the short circuit board (2) passes through the support body (3) and a top cavity wall (5) of the metal cavity (1) connected, one end of the support body (3) is fixed on the top cavity wall (5) of the metal cavity (1), the other end of the support body (3) is fixed on the short circuit board (2), and the short circuit board (3) The shape is similar to the top cavity wall (5), and its size is slightly smaller than the size of the top cavity wall (5). The short circuit board (2), the other top cavity wall (8) of the metal cavity (1), The narrow cavity wall (6) and the wide cavity wall (7) of the metal cavity form a resonance space (9) for electromagnetic waves, and the input and output coupling device (4) is located in the metal cavity (1) in the resonance space (9). On the top cavity wall (8) or the narrow cavity wall (6) or the wide cavity wall (7); 金属腔体(1)的热膨胀系数小于支撑体(3)的热膨胀系数。The thermal expansion coefficient of the metal cavity (1) is smaller than the thermal expansion coefficient of the support body (3). 2.根据权利要求1所述的自温度补偿矩形波导谐振腔,其特征在于支撑体(3)材料的热膨胀系数与金属腔体(1)材料的热膨胀系数的比值大于金属腔体(1)顶面腔壁(5)到顶面腔壁(8)之间的距离与支撑体(3)长度的比值。2. The self-temperature-compensated rectangular waveguide resonator according to claim 1, characterized in that the ratio of the thermal expansion coefficient of the support body (3) material to the thermal expansion coefficient of the metal cavity (1) material is greater than that of the metal cavity (1) top The ratio of the distance between the surface cavity wall (5) to the top cavity wall (8) and the length of the support body (3). 3.根据权利要求1所述的自温度补偿矩形波导谐振腔,其特征在于短路板(2)与金属腔体(1)的窄面腔壁(6)和宽面腔壁(7)之间的缝隙尽量小,只要不至于短路板(2)无法在金属腔体(1)中滑动就可以。3. The self-temperature-compensated rectangular waveguide resonator according to claim 1, characterized in that between the short circuit board (2) and the narrow cavity wall (6) and wide cavity wall (7) of the metal cavity (1) The gap is as small as possible, as long as the short circuit board (2) cannot slide in the metal cavity (1). 4.根据权利要求1所述的自温度补偿矩形波导谐振腔,其特征在于电磁波的谐振时的能量存在于谐振空间(9)中。4. The self-temperature-compensated rectangular waveguide resonant cavity according to claim 1, characterized in that the energy of the resonance of the electromagnetic wave exists in the resonant space (9).
CN2009102325609A 2009-12-07 2009-12-07 Self-temperature compensating rectangular waveguide resonant cavity Expired - Fee Related CN101710638B (en)

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