CN101764002B - Fluxing agent as well as preparation method and application thereof - Google Patents
Fluxing agent as well as preparation method and application thereof Download PDFInfo
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- CN101764002B CN101764002B CN200910200960.1A CN200910200960A CN101764002B CN 101764002 B CN101764002 B CN 101764002B CN 200910200960 A CN200910200960 A CN 200910200960A CN 101764002 B CN101764002 B CN 101764002B
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- acid
- flux
- rosin
- fusing
- fluxing agent
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- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 23
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 23
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 23
- 150000007524 organic acids Chemical class 0.000 claims abstract description 20
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 claims abstract description 15
- 230000004907 flux Effects 0.000 claims description 37
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 15
- 229910000743 fusible alloy Inorganic materials 0.000 claims description 11
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 10
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 claims description 10
- VKOBVWXKNCXXDE-UHFFFAOYSA-N icosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCC(O)=O VKOBVWXKNCXXDE-UHFFFAOYSA-N 0.000 claims description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 7
- 239000012467 final product Substances 0.000 claims description 7
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 6
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 6
- 239000013008 thixotropic agent Substances 0.000 claims description 6
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims description 5
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 claims description 5
- 235000021357 Behenic acid Nutrition 0.000 claims description 5
- 235000021355 Stearic acid Nutrition 0.000 claims description 5
- 239000001361 adipic acid Substances 0.000 claims description 5
- 235000011037 adipic acid Nutrition 0.000 claims description 5
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims description 5
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 claims description 5
- 229940116226 behenic acid Drugs 0.000 claims description 5
- 239000001630 malic acid Substances 0.000 claims description 5
- 235000011090 malic acid Nutrition 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 5
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 5
- 239000008117 stearic acid Substances 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 5
- ZEYHEAKUIGZSGI-UHFFFAOYSA-N 4-methoxybenzoic acid Chemical compound COC1=CC=C(C(O)=O)C=C1 ZEYHEAKUIGZSGI-UHFFFAOYSA-N 0.000 claims description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims description 4
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 claims description 4
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 claims description 4
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 claims description 4
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 claims description 4
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 claims description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 claims description 4
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 claims description 4
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 4
- 239000005711 Benzoic acid Substances 0.000 claims description 2
- 239000005632 Capric acid (CAS 334-48-5) Substances 0.000 claims description 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 2
- 229920000305 Nylon 6,10 Polymers 0.000 claims description 2
- 235000021314 Palmitic acid Nutrition 0.000 claims description 2
- 239000004952 Polyamide Substances 0.000 claims description 2
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 2
- 235000010233 benzoic acid Nutrition 0.000 claims description 2
- POULHZVOKOAJMA-UHFFFAOYSA-M dodecanoate Chemical compound CCCCCCCCCCCC([O-])=O POULHZVOKOAJMA-UHFFFAOYSA-M 0.000 claims description 2
- 239000001530 fumaric acid Substances 0.000 claims description 2
- 229940070765 laurate Drugs 0.000 claims description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 2
- 239000011976 maleic acid Substances 0.000 claims description 2
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 claims description 2
- 235000006408 oxalic acid Nutrition 0.000 claims description 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 claims description 2
- 229960004889 salicylic acid Drugs 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 229960005137 succinic acid Drugs 0.000 claims description 2
- 239000011975 tartaric acid Substances 0.000 claims description 2
- 235000002906 tartaric acid Nutrition 0.000 claims description 2
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 claims description 2
- 229910052736 halogen Inorganic materials 0.000 abstract description 11
- 150000002367 halogens Chemical class 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 7
- 239000003795 chemical substances by application Substances 0.000 abstract 6
- XGSQVNLLKDVOAZ-UHFFFAOYSA-N bromic acid;n-ethylethanamine Chemical compound OBr(=O)=O.CCNCC XGSQVNLLKDVOAZ-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- -1 amine halogen Chemical class 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007716 flux method Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- CBPYOHALYYGNOE-UHFFFAOYSA-M potassium;3,5-dinitrobenzoate Chemical compound [K+].[O-]C(=O)C1=CC([N+]([O-])=O)=CC([N+]([O-])=O)=C1 CBPYOHALYYGNOE-UHFFFAOYSA-M 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a fluxing agent as well as a preparation method and application thereof. The fluxing agent comprises the following components in percentage by weight: 60-80 percent of rosin, 2-20 percent of organic acid and 10-30 percent of octadecanamide. The fluxing agent can be applied to temperature fuse elements to promote the fusing of a fusible ally wire. Compared with the prior art, the fluxing agent does not contain halogen and accords with the development tendency of environment protection. When applied to temperature fuse, the fluxing agent can achieve the effect of using a fluxing agent containing halogen.
Description
Technical field
The present invention relates to a kind of flux, relate in particular to a kind of Thermal Cutoffs no-halogen type flux.
Background technology
People also more and more pay attention to for the fail safe of electronics, electric equipment, require these equipment that excess temperature, overcurrent protective device must be installed.At present, Thermal Cutoffs is over-temperature protection element commonly used.
The Thermal Cutoffs major part is the fusible alloy silk, and when ambient temperature is elevated to the fusible alloy fusing point, the fusing of fusible alloy silk disconnects, thereby cuts off circuit protection electrical equipment.Therefore, whether the fusing of fusible alloy silk can disconnect in time fully, is the key problem in technology of Thermal Cutoffs.In order to improve the fusing of fusible alloy silk, common way is to wrap up flux around the fusible alloy silk.The flux main component is rosin, comprise natural rosin, Foral, synthetic rosin etc., and add the organic amine halogen acid salt as activator, such as diethylamine hydrochloride, diethylamine bromate etc., in addition, also add paraffin, stearic amide etc. to regulate softening point.
Along with the growing interest of people to environmental protection, halogen-containing electronic component has been limited to enter European market at present, the most worldwide forbids.But the organic amine halogen acid salt in above-mentioned flux, play vital effect for the activity of flux, if lack, the fusing speed of fusible alloy silk is slack-off, the phenomenon do not disconnected after fusing even likely occurs.
Summary of the invention
The purpose of this invention is to provide a kind of activity good, and do not contain the flux of halogen, the above-mentioned defect existed to overcome prior art.
Another object of the present invention is to provide a kind of preparation method of above-mentioned flux.
A further object of the present invention is to provide a kind of purposes of above-mentioned flux.
The present invention adopts following technical scheme to solve above-mentioned technical problem:
A kind of flux comprises following component by weight percentage:
Rosin 60%～80%;
Organic acid 2%～20%;
Stearic amide 10%～30%.
In described flux, described rosin is selected from natural rosin, Foral or synthetic rosin; Described organic acid is the organic carboxyl acid of carbon containing, hydrogen, oxygen element only; Be selected from one or more in benzoic acid, salicylic acid, anisic acid, citric acid, malic acid, capric acid, laurate, myristic acid, palmitic acid, stearic acid, arachidic acid, behenic acid, oxalic acid, malonic acid, butanedioic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, decanedioic acid, fumaric acid, maleic acid or tartaric acid.
Preferably, in described flux, described rosin is Foral.
Preferably, in described flux, described organic acid is selected from one or more in malic acid, citric acid, glutaric acid, adipic acid, stearic acid, arachidic acid or behenic acid.
Preferably, by weight percentage, can also comprise the thixotropic agent of 1%-5% in described flux, described thixotropic agent can be polyamide wax, silicon dioxide, organobentonite or rilanit special, can play the effect that improves the mobility after flux melts.
The preparation method of the flux described in a kind of the present invention comprises the following steps: by described weight proportion, first rosin and stearic amide are mixed, after being heated to fusing, add organic acid, stir until organic acid dissolves, then cooling getting final product.
In above-mentioned preparation method, when selected organic acid fusing point during higher than 180 ℃, after can first described organic acid being dissolved with ethanol, then join in rosin after fusing and stearic amide and mix, then ethanol is steamed to cooling getting final product.
Flux of the present invention can be used in the Thermal Cutoffs element, promotes the fusing of fusible alloy silk to disconnect.
Compared with prior art, not halogen-containing in flux of the present invention, meet the development trend of safety and environmental protection, use it in Thermal Cutoffs, can reach the effect of using the flux that contains halogen.
Embodiment
Further set forth the present invention below in conjunction with specific embodiment, should be understood that these embodiment only are not used in and limit the scope of the invention for the present invention is described.
Embodiment 1-7
Rosin, organic acid and stearic amide are weighed in the ratio of table 1, by after rosin and stearic amide mixing, be heated to fusing, then add organic acid, and stir, until organic acid dissolves.Get final product the gained mixed liquor is cooling.
While in described flux, also containing thixotropic agent, described thixotropic agent, with after rosin and stearic amide mix, is heated to fusing, then adds organic acid, and stir, until organic acid dissolves.Get final product the gained mixed liquor is cooling.
Composition (the unit: wt%) of table 1 flux
| Embodiment | 1 | 2 | 3 | 4 | 5 | 6 | 7 |
| Foral | 60％ | 80％ | 70％ | 60％ | 77％ | 70％ | 70％ |
| Stearic amide | 30％ | 18％ | 10％ | 30％ | 16％ | 10％ | 10％ |
| Stearic acid | 8％ | 19％ | 8％ | ||||
| Adipic acid | 2％ | 1％ | 1％ | 1％ | |||
| Malic acid | 2％ | ||||||
| Citric acid | 2％ | ||||||
| Glutaric acid | 1％ | 1％ | |||||
| Arachidic acid | 19％ | ||||||
| Behenic acid | 18％ | ||||||
| Organobentonite | 1％ | ||||||
| Rilanit special | 5％ |
The contrast experiment:
Comparative example 8
Rosin, diethylamine bromate and stearic amide are weighed in the ratio of table 2, by after rosin and stearic amide mixing, be heated to fusing.Then add the diethylamine bromate, and stir until dissolve.Get final product the gained mixed liquor is cooling.
Composition (the unit: wt%) of table 2 flux
| Numbering | Foral | Stearic amide | The diethylamine bromate |
| 8 | 80％ | 19.5％ | 0.5％ |
Comparative example 9
Utilize pure Foral to make flux.
The test of flux activity:
Flux is placed on slide, then being placed on the heating station of 100 ℃ heating sprawls the flux fusing to come, by 91～96 ℃ of fusion temperatures, diameter 0.5mm, the fusible alloy silk of length 10mm is thrown on the flux of above-mentioned fusing, and starts timing, records the fusible alloy silk and melts rear until contract the glomerate time, each formula is surveyed 5 times, averages.Test result is in Table 3.
The active testing result of table 3 flux
| Fusing time | Phenomenon | |
| Embodiment 1 | 5.2s | The fusing balling-up |
| Embodiment 2 | 6.6s | The fusing balling-up |
| Embodiment 3 | 5.1s | The fusing balling-up |
| Embodiment 4 | 5.6s | The fusing balling-up |
| Embodiment 5 | 6.3s | The fusing balling-up |
| Embodiment 6 | 5.5s | The fusing balling-up |
| Embodiment 7 | 5.3 | The fusing balling-up |
| Comparative example 8 | 5.5s | The fusing balling-up |
| Comparative example 9 | ＞3min | It is banded that melt is |
From contrast and experiment, the result of use of halogen flux of the present invention has reached the level that the halogen flux is arranged.
Claims (7)
1. a flux comprises following component by weight percentage:
Rosin 60%～80%;
Organic acid 2%～20%;
Stearic amide 10%～16%;
Thixotropic agent 1%-5%, described thixotropic agent is selected from a kind of in polyamide wax, silicon dioxide, organobentonite or rilanit special.
2. flux as claimed in claim 1, is characterized in that, described rosin is selected from a kind of in natural rosin, Foral or synthetic rosin.
3. flux as claimed in claim 1, it is characterized in that, described organic acid is selected from one or more in benzoic acid, salicylic acid, anisic acid, citric acid, malic acid, capric acid, laurate, myristic acid, palmitic acid, stearic acid, arachidic acid, behenic acid, oxalic acid, malonic acid, butanedioic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, decanedioic acid, fumaric acid, maleic acid or tartaric acid.
4. flux as claimed in claim 1, is characterized in that, described rosin is Foral; Described organic acid is selected from one or more in malic acid, citric acid, glutaric acid, adipic acid, stearic acid, arachidic acid or behenic acid.
5. the preparation method as the described flux of arbitrary claim in claim 1-4, comprise the following steps: by described weight proportion, first rosin and stearic amide are mixed, after being heated to fusing, add organic acid, stir until organic acid dissolves, then cooling getting final product.
6. preparation method as claimed in claim 5, is characterized in that, when described organic acid fusing point during higher than 180 ℃, after first described organic acid being dissolved with ethanol, join again in rosin after fusing and stearic amide and mix, then ethanol is steamed to cooling getting final product.
7. be used for the Thermal Cutoffs element as the described flux of arbitrary claim in claim 1-4, promote the fusing of fusible alloy silk to disconnect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910200960.1A CN101764002B (en) | 2009-12-25 | 2009-12-25 | Fluxing agent as well as preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910200960.1A CN101764002B (en) | 2009-12-25 | 2009-12-25 | Fluxing agent as well as preparation method and application thereof |
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| Publication Number | Publication Date |
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| CN101764002A CN101764002A (en) | 2010-06-30 |
| CN101764002B true CN101764002B (en) | 2014-01-01 |
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| CN200910200960.1A Active CN101764002B (en) | 2009-12-25 | 2009-12-25 | Fluxing agent as well as preparation method and application thereof |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5807969B2 (en) * | 2012-11-07 | 2015-11-10 | エヌイーシー ショット コンポーネンツ株式会社 | Flux composition for protective element and circuit protective element using the same |
| CN103239140A (en) * | 2013-05-27 | 2013-08-14 | 江阴市志翔电子科技有限公司 | Temperature sensing particle for thermal link for electric rice cooker |
| CN103280379A (en) * | 2013-05-27 | 2013-09-04 | 江阴市志翔电子科技有限公司 | Thermal link for electric cooker |
| CN105762044B (en) * | 2016-03-29 | 2018-09-11 | 东莞市贝特电子科技股份有限公司 | Temperature fuse and organic temperature sensing body thereof |
| CN106825982B (en) * | 2017-02-07 | 2019-04-16 | 深圳市斯特纳新材料有限公司 | A kind of anti-collapse leadless soldering tin paste of low viscosity and preparation method thereof |
| CN115873386A (en) * | 2023-02-20 | 2023-03-31 | 广东金驭科技有限公司 | Composite organic temperature sensing material, preparation method thereof and fuse |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001293594A (en) * | 1994-09-29 | 2001-10-23 | Fujitsu Ltd | Solder alloy, solder powder, solder paste, printed wiring board, electronic component, soldering method and soldering apparatus |
| CN101049662A (en) * | 2007-05-09 | 2007-10-10 | 昆山成利焊锡制造有限公司 | Soldering flux without halogen in use for soft welding wire without lead, and preparation method |
| CN101197224A (en) * | 2006-12-08 | 2008-06-11 | 比亚迪股份有限公司 | Fusing agent and temperature fuse containing the same |
| CN100492574C (en) * | 2001-06-05 | 2009-05-27 | 松下电器产业株式会社 | Thermal cutoff and the battery using it |
| CN101585118A (en) * | 2009-03-09 | 2009-11-25 | 郴州金箭焊料有限公司 | Soldering flux for low-temperature lead-free soldering paste |
-
2009
- 2009-12-25 CN CN200910200960.1A patent/CN101764002B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001293594A (en) * | 1994-09-29 | 2001-10-23 | Fujitsu Ltd | Solder alloy, solder powder, solder paste, printed wiring board, electronic component, soldering method and soldering apparatus |
| CN100492574C (en) * | 2001-06-05 | 2009-05-27 | 松下电器产业株式会社 | Thermal cutoff and the battery using it |
| CN101197224A (en) * | 2006-12-08 | 2008-06-11 | 比亚迪股份有限公司 | Fusing agent and temperature fuse containing the same |
| CN101049662A (en) * | 2007-05-09 | 2007-10-10 | 昆山成利焊锡制造有限公司 | Soldering flux without halogen in use for soft welding wire without lead, and preparation method |
| CN101585118A (en) * | 2009-03-09 | 2009-11-25 | 郴州金箭焊料有限公司 | Soldering flux for low-temperature lead-free soldering paste |
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| Publication number | Publication date |
|---|---|
| CN101764002A (en) | 2010-06-30 |
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Effective date of registration: 20240318 Address after: Block A, Building 1, No. 180 Chengye Road, Sheshan Town, Songjiang District, Shanghai, February 2016 Patentee after: SHANGHAI KETER NEW MATERIALS CO.,LTD. Country or region after: China Patentee after: SHANGHAI SHENWO ELECTRONICS CO.,LTD. Address before: 201108, No. 1165, Lane 123, Jin Du Road, Shanghai, Minhang District Patentee before: SHANGHAI SHENWO ELECTRONICS CO.,LTD. Country or region before: China |