CN105762044B - Temperature fuse and organic temperature sensing body thereof - Google Patents

Abstract

The invention belongs to the technical field of fuses, and particularly relates to an organic compound type temperature fuse and an organic temperature-sensing body thereof; the organic temperature-sensing body comprises the following components in percentage by weight: 10-30% of organic acid, 40-60% of succinic anhydride, 20-40% of dimethyl terephthalate, 2-10% of an adhesive, 5-20% of an organic solvent and 1-10% of a thixotropic agent. Compared with the prior art, the organic temperature-sensing body can be prepared into the organic temperature-sensing body with the hot melting temperature of 60-180 ℃ by the components and the proportion, and the obtained organic temperature-sensing body has the advantages of high mechanical strength, strong oxidation resistance, high sensitivity of melting temperature and high fusing speed.

Description

A thermal fuse and its organic temperature-sensing body

technical field

The invention belongs to the technical field of fuses, and in particular relates to an organic compound type thermal fuse and an organic temperature sensing body thereof.

Background technique

As we all know, in household appliances and industrial equipment, in order to prevent fire caused by excessive electric heating, in addition to over-current protection, over-temperature protection is also required; due to the small size of the thermal fuse, mature technology, reliable operation and low price, therefore, Thermal fuses are widely used in home appliances as over-temperature protection components.

At present, thermal fuse products are roughly divided into two categories. One is an alloy-type thermal fuse that uses a low-melting point alloy as a temperature-sensing element; the other is an organic compound-type thermal fuse that uses an organic material as a temperature-sensing body. The strength of the temperature-sensing body is used to pass a thick The elastic force of the compression spring contacts the electrode sheet with a lead electrode to form a single-contact conductive structure. When the ambient temperature reaches a predetermined temperature, the organic temperature-sensing body melts, and another thin compression spring separates the electrode sheet from the lead electrode, thereby Cut off the circuit. Therefore, the organic temperature sensing body is the core component of the organic compound type thermal fuse to play the role of fusing, and its performance will directly determine the performance of the fuse.

However, the organic temperature-sensing bodies currently on the market have the following defects:

1) The mechanical strength is low, and it may break when it is crimped with the compressed thick spring, which will cause the fuse to fail;

2) The accuracy of the melting temperature is low and the fusing speed is slow, so that the fusing is not timely and the circuit is damaged, which greatly reduces the safety and reliability of the product;

3) The durability and continuity are poor, and there will be aging and deterioration, easy sublimation and smaller, etc., resulting in a short service life.

In view of this, it is indeed necessary to develop an organic temperature-sensing body with high mechanical strength, high accuracy of operating temperature, and fast fusing speed, and a thermal fuse using the organic temperature-sensing body.

Contents of the invention

One of the purposes of the present invention is to provide an organic temperature-sensing body with high mechanical strength, high sensitivity to melting temperature, fast fusing speed and good durability in view of the deficiencies in the prior art, and the organic temperature-sensing body can be adjusted Wide melting temperature range.

The second object of the present invention is to provide a thermal fuse using the organic temperature-sensing body, which has a wide range of applications, high operating temperature accuracy, good durability and continuity, large current carrying capacity, and quick response to ambient temperature , and the performance is stable and reliable.

In order to achieve the above object, the present invention adopts the following solutions:

An organic temperature-sensing body for a thermal fuse, comprising the following components by weight percentage:

Organic acid 10%～30%

Succinic anhydride 40%～60%

Dimethyl terephthalate 20%～40%

Adhesive 2%～10%

Organic solvent 5%～20%

Thixotropic agent 1% ~ 10%,

The organic acid is adipic acid, malonic acid, succinic acid, palmitic acid, oxalic acid, stearic acid, glutaric acid, pimelic acid, citric acid, benzoic acid, suberic acid, azelaic acid, sebacic acid At least one of , maleic acid and tartaric acid;

The adhesive is at least one of polyethylene, polypropylene, polystyrene, polycarbonate, polyvinyl acetate, polyamide and epoxy resin;

The organic solvent is at least one of ethanol, methanol, acetone, chloroform and carbon tetrachloride;

The thixotropic agent is at least one of polyamide wax, silicon dioxide, organic bentonite or hydrogenated castor oil.

The main materials in the formula of the present invention are organic acid, succinic anhydride and dimethyl terephthalate, wherein, the melting point of organic acid is 55-185°C, the melting point of succinic anhydride is 119.6°C, and dimethyl terephthalate The melting point is 140.6°C; the auxiliary materials are adhesives, organic solvents and thixotropic agents. Therefore, through the above-mentioned components and contents, it can be formulated into an organic temperature-sensing body with a thermal melting temperature of 60-180°C, and the operating temperature of each temperature-sensing body The accuracy can reach ±2℃. Wherein the adhesive mainly plays the role of bonding and thermal curing, and the organic solvent is used to dissolve the main material, the adhesive and the thixotropic agent. The thixotropic agent is added to the main material in the production process, which can make the main material have a high consistency when it is still; it will become a low-viscosity fluid under the action of external force, so that the main material and auxiliary materials are evenly mixed, and finally a product with excellent comprehensive performance is obtained. thermosensitive body.

Preferably, the organic temperature-sensing body of a thermal fuse includes the following composition by weight percentage:

Organic acid 10%～20%

Succinic anhydride 40%～50%

Dimethyl terephthalate 25%～35%

Adhesive 5%～10%

Organic solvent 5%～15%

Thixotropic agent 5% to 10%.

More preferably, the organic temperature-sensing body of a thermal fuse includes the following composition by weight percentage:

Organic Acids 12%

Succinic anhydride 40%

Dimethyl terephthalate 25%

Adhesive 8%

Organic solvent 10%

Thixotropic agent 5%.

Among them, the above-mentioned thermal fuse organic temperature-sensing body is prepared as follows: according to the weight ratio, first mix organic acid, succinic anhydride and dimethyl terephthalate, heat to melt, and then add Adhesive, organic solvent and thixotropic agent are uniformly stirred, and then the organic temperature-sensitive body is obtained through the steps of granulation, pressing and drying.

Wherein, the drying temperature is 30-45°C. If the drying temperature is too low, the drying speed will be slow; if the drying temperature is too high, the organic temperature sensing body will be melted.

A temperature fuse using the above-mentioned organic temperature-sensing body, comprising a metal case and a fuse arranged inside the metal case, one end of the metal case is provided with a first pin, and the other end of the metal case is provided with a There is a second pin, and the first pin is connected to the fuse body through a seal, and the fuse body includes an organic temperature-sensing body.

Wherein, the fuse link further includes a first disc, a second disc, a first spring, a second spring, an electrode piece, and a ceramic insulator, one end of the first spring is connected to the ceramic insulator, and the first spring is connected to the ceramic insulator. The other end of a spring is connected to the electrode sheet, the electrode sheet is in crimp contact with the first disc, the second disc is in crimp contact with the organic temperature-sensing body, and the second spring is arranged on the Between the first wafer and the second wafer.

Wherein, both the first spring and the second spring are in a compressed state.

The effective triggering part of the fuse in the present invention is a non-conductive organic inductive temperature body made of the above formula; under normal operating temperature, the solid organic temperature-sensitive body withstands the second spring, so that the first pin and the electrode The pieces are kept in contact to form a contact; at this time, the flow direction of the current is the first pin → contact → metal shell → second pin. When a predetermined temperature is reached, the organic temperature sensor will melt into a liquid state, so that the compressed second spring will relax, and the first spring will push the electrode piece away from the first pin, and the circuit will be safely cut off.

Preferably, the sealing material is at least one of epoxy resin, urea-formaldehyde resin, polyamide resin and phenolic resin.

Preferably, the metal shell is engraved with a logo, and the logo is at least one of lines, barcodes, characters, characters and patterns. Compared with conventional spraying or ink printing, the present invention engraves the product logo on the casing by laser marking and other technologies, which can prevent the logo from being corroded or peeled off at high temperature, and at the same time facilitate the after-sales maintenance and replacement of the product through the electrical parameters on the casing .

The beneficial effects of the present invention are:

1) An organic temperature-sensing body for a temperature fuse of the present invention comprises the following compositions in weight percent: 10% to 30% of organic acid, 40% to 60% of succinic anhydride, 20% to 40% of dimethyl terephthalate, Adhesive 2% to 10%, organic solvent 5% to 20%, thixotropic agent 1% to 10%; through the above components and proportions, it can be formulated into an organic temperature-sensitive body with a thermal melting temperature of 60-180°C, and the obtained organic The temperature sensing body has the advantages of high mechanical strength, strong oxidation resistance, high sensitivity to melting temperature, and fast fusing speed.

2) The thermal fuse using the above-mentioned organic temperature-sensing body of the present invention has a wide range of applications, high operating temperature accuracy, good durability and continuity, large current carrying capacity, fast response to ambient temperature, and stable and reliable performance.

Description of drawings

Fig. 1 is a schematic structural diagram of a thermal fuse in the present invention.

In the figure: 1-metal shell; 2-fuse link; 21-ceramic insulator; 22-first spring; 23-electrode sheet; 24-first disc; 25-second spring; 26-second disc; 27-organic temperature sensing body; 3-first pin; 4-second pin; 5-sealing.

Detailed ways

The present invention and its beneficial effects will be described in further detail below in conjunction with specific embodiments and accompanying drawings, but the specific embodiments of the present invention are not limited thereto.

Example 1

The preparation of organic temperature sensing body 27:

First mix 10% adipic acid, 60% succinic anhydride and 20% dimethyl terephthalate, heat to melt, then add 3% polyethylene, 5% ethanol and 2% poly The amide wax was stirred evenly, and then the organic temperature-sensitive body 27 of Example 1 was obtained through the steps of granulation, pressing and drying. The melting temperature analysis of the organic temperature-sensing body 27 shows that the melting temperature of the organic temperature-sensing body 27 is 142±2°C.

Preparation of thermal fuse:

The thermal fuse includes a metal case 1 and a fuse 2 arranged inside the metal case 1, the metal case 1 is engraved with a product logo; one end of the metal case 1 is provided with a first pin 3, and the metal case 1 The other end is provided with a second pin 4, the first pin 3 is connected to the fuse 2 through a seal 5, and the material of the seal 5 is epoxy resin; the fuse 2 includes an organic temperature sensing body 27, a first wafer 24, a second Disc 26, first spring 22, second spring 25, electrode sheet 23, and ceramic insulator 21, one end of first spring 22 is connected with ceramic insulator 21, and the other end of first spring 22 is connected with electrode sheet 23, and electrode sheet 23 is crimped with the first disc 24, the second disc 26 is crimped with the organic temperature sensing body 27, and the second spring 25 is arranged between the first disc 24 and the second disc 26; wherein, the first spring 22 and the second spring 25 are in a compressed state.

The specific operation is: put the organic temperature-sensing body 27, the second disc 26, the second spring 25, the first disc 24, the electrode sheet 23, the first spring 22, and the ceramic insulator 21 prepared above into the metal shell in sequence. Body 1, then the first pin 3 penetrates the ceramic and extends to the outside of the metal shell 1, and then seals it with epoxy resin as the sealing material 5, and finally engraves the product's electrical parameters, trademarks and other information on the metal shell by laser marking technology. On the housing 1, the thermal fuse of Example 1 is obtained. The operating temperature of the thermal fuse was tested to be 143±2°C, with an average value of 143.5°C.

Example 2

Different from Example 1 is the preparation of organic temperature sensing body 27:

First mix 30% malonic acid, 40% succinic anhydride and 20% dimethyl terephthalate, heat to melt, then add 4% polypropylene, 5% ethanol and 1% hydrogenated Castor oil was stirred evenly, and then the organic temperature-sensitive body 27 of Example 2 was obtained through the steps of granulation, compression and drying. The melting temperature analysis of the organic temperature-sensing body 27 shows that the melting temperature of the organic temperature-sensing body 27 is 132±2°C.

The rest are the same as in Embodiment 1, and will not be repeated.

The operating temperature of the thermal fuse was tested to be 133±2°C, with an average value of 132.6°C.

Example 3

Different from Example 1 is the preparation of organic temperature sensing body 27:

First mix 30% succinic acid, 40% succinic anhydride and 20% dimethyl terephthalate, heat to melt, then add 2% polystyrene, 6% methanol and 2% organic Stir the bentonite evenly, and then go through the steps of granulation, pressing and drying to obtain the organic temperature-sensitive body 27 of Example 3. The melting temperature analysis of the organic temperature-sensing body 27 shows that the melting temperature of the organic temperature-sensing body 27 is 178±2°C.

The rest are the same as in Embodiment 1, and will not be repeated.

The operating temperature of the thermal fuse was tested to be 179±2°C, with an average value of 178.8°C.

Example 4

Different from Example 1 is the preparation of organic temperature sensing body 27:

First mix 10% palmitic acid, 40% succinic anhydride and 20% dimethyl terephthalate, heat to melt, then add 5% polycarbonate, 20% acetone and 5% dimethicone Silicon oxide was stirred evenly, and then the organic temperature-sensitive body 27 of Example 4 was obtained through the steps of granulation, pressing and drying. The melting temperature analysis of the organic temperature-sensing body 27 shows that the melting temperature of the organic temperature-sensing body 27 is 85±2°C.

The rest are the same as in Embodiment 1, and will not be repeated.

The operating temperature of the thermal fuse was tested to be 86±2°C, with an average value of 86.4°C.

Example 5

Different from Example 1 is the preparation of organic temperature sensing body 27:

First mix 30% stearic acid, 40% succinic anhydride and 20% dimethyl terephthalate, heat to melt, then add 2% polyvinyl acetate, 5% ethanol and 3% The silicon dioxide was stirred evenly, and then the organic temperature-sensitive body 27 of Example 5 was obtained through the steps of granulation, pressing and drying. The melting temperature analysis of the organic temperature-sensing body 27 shows that the melting temperature of the organic temperature-sensing body 27 is 62±2°C.

The rest are the same as in Embodiment 1, and will not be repeated.

The operating temperature of the thermal fuse was tested to be 63±2°C, with an average value of 63.5°C.

Example 6

Different from Example 1 is the preparation of organic temperature sensing body 27:

First mix 10% glutaric acid, 50% succinic anhydride and 20% dimethyl terephthalate, heat to melt, then add 10% polyamide, 5% ethanol and 5% hydrogenated Castor oil was stirred evenly, and then the organic temperature-sensitive body 27 of Example 6 was obtained through the steps of granulation, pressing and drying. The melting temperature analysis of the organic temperature-sensing body 27 shows that the melting temperature of the organic temperature-sensing body 27 is 118±2°C.

The rest are the same as in Embodiment 1, and will not be repeated.

The operating temperature of the thermal fuse was tested to be 119±2°C, with an average value of 118.7°C.

Example 7

Different from Example 1 is the preparation of organic temperature sensing body 27:

First mix 10% pimelic acid, 40% succinic anhydride and 40% dimethyl terephthalate, heat to melt, then add 3% polycarbonate, 5% chloroform and 2 % hydrogenated castor oil, stirred evenly, and then the organic temperature-sensitive body 27 of Example 7 was obtained through the steps of granulation, compression and drying. The melting temperature analysis of the organic temperature-sensing body 27 shows that the melting temperature of the organic temperature-sensing body 27 is 122±2°C.

The rest are the same as in Embodiment 1, and will not be repeated.

The operating temperature of the thermal fuse was tested to be 123±2°C, with an average value of 122.2°C.

Example 8

Different from Example 1 is the preparation of organic temperature sensing body 27:

First mix 10% citric acid, 40% succinic anhydride and 30% dimethyl terephthalate, heat to melt, then add 5% polycarbonate, 5% carbon tetrachloride and 10 % polyamide wax, stirred evenly, and then the organic temperature-sensitive body 27 of Example 8 was obtained through the steps of granulation, pressing and drying. The melting temperature analysis of the organic temperature-sensing body 27 shows that the melting temperature of the organic temperature-sensing body 27 is 137±2°C.

The rest are the same as in Embodiment 1, and will not be repeated.

The operating temperature of the thermal fuse was tested to be 138±2°C, with an average value of 138.5°C.

Example 9

Different from Example 1 is the preparation of organic temperature sensing body 27:

First mix 20% benzoic acid, 40% succinic anhydride and 25% dimethyl terephthalate, heat to melt, then add 5% polypropylene, 5% acetone and 5% polyamide in sequence The wax was stirred evenly, and then the organic temperature-sensing body 27 of Example 9 was obtained through the steps of granulation, pressing and drying. The melting temperature analysis of the organic temperature-sensing body 27 shows that the melting temperature of the organic temperature-sensing body 27 is 128±2°C.

The rest are the same as in Embodiment 1, and will not be repeated.

The operating temperature of the thermal fuse was tested to be 129±2°C, with an average value of 128.6°C.

Example 10

Different from Example 1 is the preparation of organic temperature sensing body 27:

First mix 10% suberic acid, 45% succinic anhydride and 30% dimethyl terephthalate, heat to melt, then add 2% polypropylene, 10% acetone and 3% organic Stir the bentonite evenly, and then go through the steps of granulation, pressing and drying to obtain the organic temperature-sensing body 27 of Example 10. The melting temperature analysis of the organic temperature-sensing body 27 shows that the melting temperature of the organic temperature-sensing body 27 is 135±2°C.

The rest are the same as in Embodiment 1, and will not be repeated.

The operating temperature of the thermal fuse was tested to be 136±2°C, with an average value of 135.1°C.

Example 11

Different from Example 1 is the preparation of organic temperature sensing body 27:

First mix 15% azelaic acid, 40% succinic anhydride and 30% dimethyl terephthalate, heat to melt, then add 3% polyethylene, 8% ethanol and 4% organic Stir the bentonite evenly, and then go through the steps of granulation, pressing and drying to obtain the organic temperature-sensitive body 27 of Example 11. The melting temperature analysis of the organic temperature-sensing body 27 shows that the melting temperature of the organic temperature-sensing body 27 is 123±2°C.

The rest are the same as in Embodiment 1, and will not be repeated.

The operating temperature of the thermal fuse was tested to be 124±2°C, with an average value of 124.3°C.

Example 12

Different from Example 1 is the preparation of organic temperature sensing body 27:

First mix 10% sebacic acid, 40% succinic anhydride and 35% dimethyl terephthalate, heat to melt, then add 4% polystyrene, 5% ethanol and 6% Silica, stirred evenly, and then the organic temperature-sensitive body 27 of Example 12 was obtained through the steps of granulation, pressing and drying. The melting temperature analysis of the organic temperature-sensing body 27 shows that the melting temperature of the organic temperature-sensing body 27 is 130±2°C.

The rest are the same as in Embodiment 1, and will not be repeated.

The operating temperature of the thermal fuse was tested to be 131±2°C, with an average value of 131.4°C.

Example 13

Different from Example 1 is the preparation of organic temperature sensing body 27:

First mix 10% oxalic acid, 40% succinic anhydride and 30% dimethyl terephthalate, heat to melt, then add 8% epoxy resin, 7% acetone and 5% hydrogenated castor Stir the sesame oil evenly, and then go through the steps of granulation, pressing and drying to obtain the organic temperature-sensitive body 27 of Example 13. The melting temperature analysis of the organic temperature-sensing body 27 shows that the melting temperature of the organic temperature-sensing body 27 is 109±2°C.

The rest are the same as in Embodiment 1, and will not be repeated.

The operating temperature of the thermal fuse was tested to be 110±2°C, with an average value of 110.5°C.

Example 14

Different from Example 1 is the preparation of organic temperature sensing body 27:

First mix 12% maleic acid, 40% succinic anhydride and 32% dimethyl terephthalate, heat to melt, then add 4% epoxy resin, 8% acetone and 4% Hydrogenated castor oil was stirred evenly, and then the organic temperature-sensitive body 27 of Example 14 was obtained through the steps of granulation, compression and drying. The melting temperature analysis of the organic temperature-sensing body 27 shows that the melting temperature of the organic temperature-sensing body 27 is 134±2°C.

The rest are the same as in Embodiment 1, and will not be repeated.

The operating temperature of the thermal fuse was tested to be 135±2°C, with an average value of 135.8°C.

Example 15

Different from Example 1 is the preparation of organic temperature sensing body 27:

First mix 12% tartaric acid, 40% succinic anhydride and 25% dimethyl terephthalate, heat to melt, then add 8% polycarbonate, 10% ethanol and 5% polyamide in sequence The wax was stirred evenly, and then the organic temperature-sensitive body 27 of Example 15 was obtained through the steps of granulation, pressing and drying. The melting temperature analysis of the organic temperature-sensing body 27 shows that the melting temperature of the organic temperature-sensing body 27 is 172±2°C.

The rest are the same as in Embodiment 1, and will not be repeated.

The operating temperature of the thermal fuse was tested to be 173±2°C, with an average value of 172.6°C.

Comparative example 1

Different from Example 1 is the preparation of organic temperature sensing body 27:

First mix 12% tartaric acid, 40% succinic anhydride and 25% dimethyl terephthalate, heat to melt, then add 13% polycarbonate and 10% ethanol in turn, stir evenly, and then The steps of granulation, pressing and drying were to obtain the organic temperature-sensitive body 27 of Comparative Example 1. The melting temperature analysis of the organic temperature-sensing body 27 shows that the melting temperature of the organic temperature-sensing body 27 is 170±6°C.

The rest are the same as in Embodiment 1, and will not be repeated.

The operating temperature of the thermal fuse was tested to be 171±6°C, with an average value of 172.8°C.

Comparative example 2

Different from Example 1 is the preparation of organic temperature sensing body 27:

First heat 77% of tartaric acid to melt, then add 8% of polycarbonate, 10% of ethanol and 5% of polyamide wax in sequence, stir evenly, and then go through the steps of granulation, pressing and drying to obtain Comparative Example 2 The organic temperature sensing body 27 . The melting temperature analysis of the organic temperature-sensing body 27 shows that the melting temperature of the organic temperature-sensing body 27 is 171±4°C.

The rest are the same as in Embodiment 1, and will not be repeated.

The operating temperature of the thermal fuse was tested to be 173±4°C, with an average value of 169.8°C.

Comparative example 3

Different from Example 1 is the preparation of organic temperature sensing body 27:

First heat 77% of succinic anhydride to melt, then add 8% of polycarbonate, 10% of ethanol and 5% of polyamide wax in sequence, stir evenly, and then go through the steps of granulation, pressing and drying to obtain the Organic thermosensitive body 27 of ratio 3. The melting temperature analysis of the organic temperature-sensing body 27 shows that the melting temperature of the organic temperature-sensing body 27 is 119±5°C.

The rest are the same as in Embodiment 1, and will not be repeated.

The operating temperature of the thermal fuse was tested to be 120±5°C, with an average value of 117.8°C.

Comparative example 4

Different from Example 1 is the preparation of organic temperature sensing body 27:

First heat 77% dimethyl terephthalate to melt, then add 8% polycarbonate, 10% ethanol and 5% polyamide wax in sequence, stir evenly, then granulate, press and dry The steps are to obtain the organic temperature-sensing body 27 of Comparative Example 4. The melting temperature analysis of the organic temperature-sensing body 27 shows that the melting temperature of the organic temperature-sensing body 27 is 140±5°C.

The rest are the same as in Embodiment 1, and will not be repeated.

The operating temperature of the thermal fuse was tested to be 142±5°C, with an average value of 143.8°C.

The thermal fuses of Examples 1-15 and Comparative Examples 1-4 were subjected to experimental tests on fusing time, operating temperature and melting degree of the organic temperature-sensing body 27, and the test results are shown in Table 1.

The performance test result of table 1 embodiment and comparative example

As can be seen from the test results in Table 1, the temperature insurance of the present invention has the advantages of fast fusing time and high accuracy of operating temperature; it can be seen from Example 15 and Comparative Example 1 that adding a thixotropic agent can increase the accuracy of the operating temperature of the thermosensitive body. Sensitivity; From Example 15 and Comparative Examples 2 to 4, it can be seen that compared with using a single main material, the present invention adopts the mixed main material of organic acid, succinic anhydride and dimethyl terephthalate, and its comprehensive performance is obviously better Stable and reliable.

According to the disclosure and teaching of the above specification, those skilled in the art to which the present invention pertains can also change and modify the above embodiment. Therefore, the present invention is not limited to the above-mentioned specific implementation manners, and any obvious improvement, substitution or modification made by those skilled in the art on the basis of the present invention shall fall within the protection scope of the present invention. In addition, although some specific terms are used in this specification, these terms are only for convenience of description and do not constitute any limitation to the present invention.

Claims (10)

1. a kind of organic temperature sensor of Thermal Cutoffs, which is characterized in that include the composition of following weight percent：

Organic acid 10% ~ 30%

Succinic anhydride 40% ~ 60%

Dimethyl terephthalate (DMT) 20% ~ 40%

Adhesive 2% ~ 10%

Organic solvent 5% ~ 20%

Thixotropic agent 1% ~ 10%,

The organic acid be adipic acid, malonic acid, succinic acid, palmitic acid, oxalic acid, stearic acid, glutaric acid, pimelic acid, citric acid, At least one of benzoic acid, suberic acid, azelaic acid, decanedioic acid, maleic acid and tartaric acid；

The adhesive is polyethylene, polypropylene, polystyrene, makrolon, polyvinyl acetate, polyamide and epoxy resin At least one of；

The organic solvent is at least one of ethyl alcohol, methanol, acetone, chloroform and carbon tetrachloride；

The thixotropic agent is at least one of polyamide wax, silica, organobentonite or rilanit special；

Wherein, the fusing point of organic acid is 55 ~ 185 DEG C, and the fusing point of succinic anhydride is 119.6 DEG C, and dimethyl terephthalate (DMT) melts Point is 140.6 DEG C；Organic temperature sensor that heat fusing temperature is 60 ~ 180 DEG C is can be formulated by said components and content, and each The precision of temperature sensor operating temperature can reach ± 2 DEG C.

2. the organic temperature sensor of a kind of Thermal Cutoffs according to claim 1, which is characterized in that including following weight percent The composition of ratio：

Organic acid 10% ~ 20%

Succinic anhydride 40% ~ 50%

Dimethyl terephthalate (DMT) 25% ~ 35%

Adhesive 5% ~ 10%

Organic solvent 5% ~ 15%

Thixotropic agent 5% ~ 10%.

3. the organic temperature sensor of a kind of Thermal Cutoffs according to claim 2, which is characterized in that including following weight percent The composition of ratio：

Organic acid 12%

Succinic anhydride 40%

Dimethyl terephthalate (DMT) 25%

Adhesive 8%

Organic solvent 10%

Thixotropic agent 5%.

4. the organic temperature sensor of a kind of Thermal Cutoffs according to claim 1, which is characterized in that preparation method is as follows：It presses Organic acid, succinic anhydride and dimethyl terephthalate (DMT) are first mixed, after being heated to fusing, are sequentially added by the weight proportion Adhesive, organic solvent and thixotropic agent, stir evenly, and are then to obtain organic sense through granulation, compacting and baking step Wen Ti.

5. the organic temperature sensor of a kind of Thermal Cutoffs according to claim 4, it is characterised in that：The drying temperature is 30 ~45℃。

6. a kind of Thermal Cutoffs, including metal shell and the fuse-link that is arranged inside metal shell, the metal shell One end be provided with the first pin, the other end of the metal shell is provided with second pin, and first pin passes through sealing It is connect with the fuse-link, the fuse-link includes organic temperature sensor, it is characterised in that：Organic temperature sensor is claim The organic temperature sensor of 1 ~ 5 any one of them.

7. a kind of Thermal Cutoffs according to claim 6, it is characterised in that：The fuse-link further include the first disk, Second disk, the first spring, second spring, electrode slice and ceramic insulator, one end and the ceramics of first spring Insulator connects, and the other end of first spring is connect with the electrode slice, and the electrode slice is crimped with first disk, Second disk is crimped with organic temperature sensor, and the second spring is arranged in first disk and second disk Between.

8. a kind of Thermal Cutoffs according to claim 7, it is characterised in that：First spring and the second spring It is in compressive state.

9. a kind of Thermal Cutoffs according to claim 6, it is characterised in that：The joint filling material is epoxy resin, urea At least one of urea formaldehyde, polyamide and phenolic resin.

10. a kind of Thermal Cutoffs according to claim 6, it is characterised in that：The metal shell is imprinted with mark, institute It states and is identified as at least one of lines, bar code, character, word and pattern.