CN101737662A - Method for manufacturing integrated packaged high-power LED illuminating light source, and LED illuminating lamp - Google Patents

Abstract

A manufacturing method for an integrated package high-power LED lighting source and an LED lighting lamp. Manufacturing steps: ①Choose a number of single white LED chips and place them on the substrate, and bond them with silver glue to form light-emitting chips. ②Connect more than one light-emitting chip in series or/and in parallel to become a light source chip after reaching the required power. ③ Mix the light source chip and the substrate with epoxy resin glue, scattering agent and phosphor powder and package them as a whole. ④ Paste the overall packaged chip on the substrate and install it on the radiator, then put it into the lampshade to become a high-power LED lighting source, and then connect the control circuit to the lamp housing to become a high-power LED lighting lamp. Compared with the existing LED multi-spot lighting source which is independently packaged and combined with single small lamp beads, the packaging material of the present invention is only 1/10; the light is obviously soft and close to natural light; the light is uniform, glare-free, light-pollution-free, No radiation; anti-visual fatigue; slow attenuation, the attenuation is less than 5% within three years. Compared with traditional incandescent lamps, sodium lamps and energy-saving lamps: energy saving, long life, environmental protection, safety, solid-state packaging, convenient transportation, etc., especially suitable for outdoor high-power street lamps with a power of 30-120W.

Description

Manufacturing method of integrated package high-power LED lighting source and LED lighting lamp

(1) Technical field: the present invention relates to a method for manufacturing an LED lighting source used for lamps and an LED lighting lamp. It belongs to the category of lighting device parts (F21V).

(two) background technology:

LED lighting has become a lighting development trend. Compared with traditional lighting incandescent lamps, sodium lamps, and energy-saving lamps, LED lighting has the following advantages: energy saving, long life, environmental protection and safety, healthy light sources, large voltage fluctuations, and convenient use. At present, the commonly used LED lighting systems are all using commercially available small lamp pearl points that are individually packaged into single grains, and each of them is connected in series and parallel to make the lighting source of the required power. The power of this LED light source is low, and the maximum can only be 2 Watts, equivalent to 20 watts of incandescent lamps, basically meet the requirements for indoor lighting; but for outdoor high-power street lighting, the traditional sodium lamp is generally 250W-400W, corresponding to the above-mentioned LED street light source needs 20-40W, the required small lamp pearl point Too many (as few as 50, as many as 200 or more). Therefore, corresponding to the above-mentioned LED high-power lighting lamp, there are the following disadvantages: 1) Because there are too many light spots and too dazzling, glare is generated, and visual fatigue is easy to occur. 2) There are too many luminous points, it is inevitable that there will be uneven luminous light at each point, and because the light attenuation of each point is seriously out of sync, and the luminous intensity of each point is seriously uneven, so it is easy to produce scattered spots on the ground. 3) Only simple series-parallel connections can be adopted between the various light-emitting points of multiple points: the voltage distribution of light points in series cannot meet the needs of each point; the parallel connection cannot guarantee the power of each circuit. The current does not exceed the limit, so its life cannot be guaranteed. After one year, it is found that at least 20% of the street lamps have been extinguished, and the illumination attenuation is serious; There are too many scattering agents and phosphors, so the light is unnatural, too white, and beyond a certain limit, there will be chemical radiation to the human body.

(3) Contents of the invention

The manufacturing method of the integrated package high-power LED lighting source provided by the present invention and the LED lighting lamp are to overcome glare and light pollution caused by the multi-point light-emitting diode LED light source composed of low-power lamp beads, short life, serious light decay, unnatural light, and chemical radiation. The technical solution is as follows:

The manufacturing method of an integrated package high-power LED lighting source is characterized by the following steps: 1) According to the power required by the lighting lamp, a number of single white LED chips 1 are selected, placed on a substrate 2 made of non-metallic materials at a certain distance, and used The conductive colloid silver glue 3 bonds and fixes several single white light LED chips into light-emitting chips 4, and the power of each chip is 0.01-3 watts; 2) connect more than one light-emitting chip in series or/and in parallel to reach the required power ; Become a light source chip; 3) The light source chip and the substrate are packaged as a whole with a mixture of epoxy resin glue 6, scattering agent and phosphor powder 7, and become a square or rectangular overall package chip 8 with a side length less than 40 mm; 4) Paste the above overall package chip on the substrate 9 made of metal material; then install it on the radiator 10 together with the substrate; finally put it into the metal lampshade 11 as a whole, and then make an integrated package high-power LED lighting source 12, each light source power Greater than 30 watts. At present, the power of the light source can be made from 30 watts to 120 watts.

The LED illuminating lamp made according to the above-mentioned method for manufacturing the integrated package high-power LED illuminating light source is characterized in that the LED illuminating lamp comprises the following parts: ①In the illuminating lamp shell 13, an integrated encapsulating high-power LED illuminating light source 12 and The control circuit 14 connected to it; the power of the LED lighting source is greater than 30 watts; 2. The LED lighting source includes: the metal lampshade 11 is fixed with an integral package chip 8 attached to the substrate 9 made of metal material; the substrate is installed on the radiator 10; ③Integrated packaging chip includes: light source chip 5, substrate 2 and the overall packaging layer formed by a mixture of epoxy resin glue, scattering agent and phosphor powder; the overall packaging chip is a square or rectangle with a side length of less than 40mm; ④Light source The chip is formed by connecting more than one light-emitting chip 4 in series or/and in parallel according to the required power; The conductive colloid silver colloid 3 bonds and fixes several chips into an integral block; the power of a single white LED chip is 0.01-3 watts.

The beneficial effects of the present invention are:

1) Compared with traditional light sources, the LED lighting lamp of the present invention has the following advantages: 1. energy saving; energy consumption is 1/10 of incandescent lamps, 1/6 of high-pressure sodium lamps, and 1/4 of energy-saving lamps. ② Long life of 100,000 hours. ③ It can work under frequent startup and shutdown, and the voltage fluctuation range is large. ④Environmental protection and safety: no radiation, no need to consider heat dissipation, no greenhouse effect. ⑤ Solid package; not fragile, not afraid of vibration, easy to transport and install, suitable for use in high wind and sand areas.

2) According to the LED light source of the present invention (also can be referred to as a single-point type or a high-power LED light source within 3 points), compared with the existing multi-spot LED light source sample test results, it is obtained: ① The composition of the present invention makes the color rendering of the light source Extremely high; and because the total amount of packaging materials is reduced, the amount of scattering agent and fluorescent powder is also small, and the light is obviously soft, which is closer to natural light and sunlight (see Figure 4). ② Uniform light emission, no glare and light pollution, has a positive effect on preventing visual fatigue. ③ The decay is slow, and the decay will not exceed 5% within three years. 4. The total amount of chemical materials such as epoxy resin glue, scattering agent and fluorescent powder required by the structure of the present invention is below 1/10 of the amount of existing multi-spot light sources, so the light has no chemical radiation, which is more conducive to eyes and eyes. the health of the body. 3) The high-power LED lighting source of the present invention solves the problem that the existing multi-point LED light source cannot be used for relatively high-power outdoor lighting. With the deepening of research and development, the power can reach more than 120 watts, making LED semiconductor lighting a real large Power green lighting.

(4) Description of drawings

Fig. 1 is a schematic diagram of the light source chip 6 of the present invention, that is, an illustration of step 1) and 2) of the manufacturing method of the LED lighting source;

Fig. 2 is a schematic diagram of the overall packaged chip 8 of the present invention, that is, a schematic diagram of step 3) of the LED lighting source manufacturing method;

Fig. 3 is a schematic diagram of the integrated packaging high-power LED lighting source 12 of the present invention; that is, a schematic diagram of step 3) of the manufacturing method of the LED lighting source;

Fig. 4 chip encapsulation effect drawing of the present invention;

Fig. 5 is a schematic diagram of the principle structure of the lighting street lamp product according to Embodiment 1 of the present invention.

(5) Specific implementation methods

Embodiment: see Fig. 1-Fig. 5,

This embodiment integrates a manufacturing method of encapsulating a high-power LED lighting source, and the LED lighting source is used for a high-power street lamp. The preparation method comprises the following steps:

1) As shown in Figure 1, select six single white LED chips 1 belonging to semiconductor elements, place them on a substrate 2 made of organic materials at a certain distance, and bond the six single white LED chips with conductive colloidal silver glue 3 Be fixed as light-emitting chip 4; The power of single white light LED chip 1 is 0.01-3 watt (can be purchased in the company that makes semiconductor-LED chip specially in the world). 2) As shown in Figure 1 (for example), six light-emitting chips 4 are connected in series (two in series) and parallel (three in parallel) to achieve a light source chip 5 with a required power of 90 watts. 3) As shown in Figure 2, the light source Chip 5 and substrate 2 are integrally packaged with a mixture of epoxy resin glue 6 , scattering agent and fluorescent powder 7 to form a square integrally packaged chip 8 ; the length of each side of the square is B8 = 30-40mm. The epoxy resin glue 6 can be processed by solid epoxy resin. The total amount of epoxy resin, scattering agent and phosphor is less than 1/10 of the existing multi-point light source made of independent packaging of single small lamp beads with the same power; the uniform amount of scattering agent and phosphor packaging is less than the amount of epoxy resin 5%. 4) As shown in FIG. 3, the above-mentioned overall packaged chip 8 is pasted on the substrate 9. The substrate plays a role of heat conduction and support, and is generally made of an aluminum plate. The overall packaged chip with the substrate is installed on the radiator 10: finally the whole is packed into the metal lampshade 11, and the metal lampshade adopts die-cast aluminum to make an integrated package high-power LED lighting source 12, and the power of the lighting source is 90 watts.

The LED lighting street lamp manufactured by the above method includes the following parts: ① See FIG. 5 , in the lighting lamp housing 13 , an integrated and packaged high-power LED lighting source 12 and a control circuit 14 connected to it are fixed. The control circuit is composed as follows: street lamp alternating current (AC) 220V is connected to the manual control switch, and the transformer rectification circuit rectifies the alternating current 220V to direct current DC24V; and then connects the two poles 8a and 8b of the lighting source 12 through the constant current drive control circuit, and the power of the light source is 90 watt. The lamp housing 13 of the street lamp is provided with a lamp pole and a support 15 . Adjust the position of the light source in the lamp housing 13 according to the needs of use. ② As shown in Fig. 3, the LED lighting source 12 is composed as follows: a die-cast aluminum lampshade 11 is fixed with an integral package chip 8 attached to a substrate 9 made of an aluminum plate; the substrate is mounted on a radiator 10. Radiator 10 can adopt the radiator 10.1 that pottery and aluminum alloy material are made; Radiator 10 also can be made into the shape that matches with lampshade inner surface shape or be attached to the radiator 10.2 that lampshade inner surface fuses into one. As shown in Fig. 4, a reflector 11.1 is installed between the overall packaged chip 8 and the lampshade 11. Convex mirrors are installed at positions that match the light source. ③ As shown in FIG. 2 , the integrated packaging chip 8 includes: the integrated packaging layer formed by the light source chip 5 , the substrate 2 and the mixture of epoxy resin glue, scattering agent and phosphor powder on the periphery. The whole packaged chip is a square with side length B8 of 30mm-40mm. ④ As shown in Fig. 1, the light source chip 5 is composed of six light-emitting chips 4 with two in series and three in parallel according to the required power of 90 watts. ⑤ As shown in Figure 1, the light-emitting chip 4 contains: six single white LED chips 1 with a certain distance placed on the substrate 2 made of organic materials, and a conductive gel-like silver glue 3 to bond and fix the six chips as a whole Lumpy body. The power of a single white LED chip 1 is 2.5 watts.

Claims (5)

1. A method for manufacturing an integrated and packaged high-power LED lighting source, which is characterized by the following steps: 1) According to the power required by the lighting lamp, select a number of individual white light LED chips (1), place them on the substrate (2) made of non-metallic materials at a certain distance, and use conductive colloidal silver glue (3) to place several individual chips. The white LED chip is bonded and fixed to form a light-emitting chip (4), and the power of each chip is 0.01-3 watts; 2) Connect more than one light-emitting chip (4) in series or/and in parallel to achieve the required power; become a light source chip (5); 3) The light source chip (5) and the substrate are integrally packaged with a mixture of epoxy resin glue 6, scattering agent and phosphor 7 to form a square or rectangular integrally packaged chip (8) with a side length less than 40 mm; 4) Paste the above overall package chip on the substrate (9) made of metal material; then install it on the radiator (10) together with the substrate; finally put it into the metal lampshade (11) as a whole, and then make an integrated package high-power LED As for the lighting source (12), the power of each LED lighting source is greater than 30 watts. 2. The manufacturing method of LED lighting source according to claim 1, characterized in that the total amount of epoxy resin glue, scattering agent and fluorescent powder is less than that of the multi-point light source made by independent encapsulation of a single small lamp bead with the same power. 1/10; the amount of scattering agent and fluorescent powder is less than 5% of the amount of epoxy resin glue. 3. The LED lighting lamp made by the LED lighting light source manufacturing method according to claim 1, characterized in that the LED lighting lamp comprises the following parts: ①In the lamp housing (13) of the lighting lamp, an integrated and packaged high-power LED lighting source (12) and a control circuit (14) connected to it are fixed; the power of each LED lighting source (12) is greater than 30 watts; ②The LED lighting source (12) includes: the metal lampshade (11) is fixed with an integral package chip (8) attached to the substrate (9) made of metal material; the substrate is installed on the radiator (10); ③Integrated packaging chip (8) contains: light source chip (5), substrate (2) and the overall packaging layer formed by the mixture of epoxy resin glue, scattering agent and phosphor powder on the periphery; the side length of the overall packaging chip is less than 40mm square or rectangular; ④ The light source chip (5) is formed by connecting more than one light-emitting chip (4) in series or/and in parallel according to the required power; ⑤The light-emitting chip (4) contains: a number of single white LED chips (1) with a certain distance are placed on the substrate (2) made of non-metallic materials, and there are conductive colloidal silver glue (3) to bond the chips Fixed as an integral block; the power of a single white LED chip is 0.01-3 watts. 4. The LED lighting lamp according to claim 3, characterized in that the power of the light source is 30 watts-120 watts; the overall packaged chip is a square with a side length of 30mm-40mm. 5. The LED lighting lamp according to claims 3 and 4, characterized in that the shape of the heat sink (10) matches the shape of the inner surface of the lampshade or is attached to the inner surface of the lampshade and integrated into one.

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