CN101699939B - Method for rolling PCB - Google Patents
Method for rolling PCB Download PDFInfo
- Publication number
- CN101699939B CN101699939B CN2009103092907A CN200910309290A CN101699939B CN 101699939 B CN101699939 B CN 101699939B CN 2009103092907 A CN2009103092907 A CN 2009103092907A CN 200910309290 A CN200910309290 A CN 200910309290A CN 101699939 B CN101699939 B CN 101699939B
- Authority
- CN
- China
- Prior art keywords
- mixed pressure
- pcb board
- lamination
- forming method
- barrier film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 45
- 238000005096 rolling process Methods 0.000 title abstract 5
- 239000011347 resin Substances 0.000 claims abstract description 34
- 229920005989 resin Polymers 0.000 claims abstract description 34
- 238000012545 processing Methods 0.000 claims abstract description 16
- 239000011248 coating agent Substances 0.000 claims abstract description 13
- 238000000576 coating method Methods 0.000 claims abstract description 13
- 230000004888 barrier function Effects 0.000 claims description 40
- 238000003475 lamination Methods 0.000 claims description 37
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 25
- 239000011889 copper foil Substances 0.000 claims description 21
- 239000003292 glue Substances 0.000 claims description 13
- 238000012958 reprocessing Methods 0.000 claims description 13
- 239000004809 Teflon Substances 0.000 claims description 10
- 229920006362 Teflon® Polymers 0.000 claims description 10
- 239000011162 core material Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical group COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 claims description 3
- 239000000443 aerosol Substances 0.000 claims description 3
- 230000003628 erosive effect Effects 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 229920002545 silicone oil Polymers 0.000 claims description 3
- 238000003825 pressing Methods 0.000 abstract description 15
- 238000001035 drying Methods 0.000 abstract description 6
- 238000004140 cleaning Methods 0.000 abstract description 3
- 238000010030 laminating Methods 0.000 abstract description 3
- 230000001680 brushing effect Effects 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000012528 membrane Substances 0.000 abstract 4
- 239000003795 chemical substances by application Substances 0.000 abstract 3
- 239000010410 layer Substances 0.000 description 45
- 239000000463 material Substances 0.000 description 15
- 238000005516 engineering process Methods 0.000 description 14
- 239000002184 metal Substances 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000000758 substrate Substances 0.000 description 12
- 238000000465 moulding Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The invention relates to a method for rolling a PCB, which comprises the following steps: providing laminae of the PCB and providing a rolling element; coating a parting agent at the notching part of the outmost lamina and around the surface of rolling element, and drying the parting agent to form an isolating membrane; laminating the laminae; brushing and cleaning away recessed resin and the insulating membrane; and performing post-treatment processing to manufacture the PCB. In the method, the parting agent is coated on the outer layer of the circuit board and the surface of the rolling element to form the thin isolating membrane and during pressing, the overflowing recessed resin gathers on the insolating membrane to be separated from the circuit board and completely removed from the circuit board easily. The method can completely solve the resin recession problem and reduce the cost of the removal of the recessed resin from the circuit board at the same time.
Description
Technical field
The present invention relates to the pcb board forming field, refer in particular to pcb board mixed pressure forming method.
Background technology
Pcb board is via multilayer central layer and semi-solid preparation lamination synthesis type.In wiring board is made, when central layer material difference, perhaps need the pressing platelet, or when needing the pressing Metal Substrate, often carry out local mixed pressure, mix lamination, bury Metal Substrate technology.So-called local mixed pressure is meant that wiring board uses two or more different sheet material, and special sheet material (as the sheet material of low-loss such as PTFE and low-k) part is pressed into other sheet materials (as FR4, i.e. glass-epoxy).What is called is mixed lamination, is meant the plank of the different numbers of plies of sheet material of the same race, and high number of plies plank part is pressed into low number of plies plank, to reduce the cost of the high number of plies design of whole employings.What is called is buried Metal Substrate, is meant before pressing, and the metal basigamy is put into the central layer/prepreg/Copper Foil of wiring board, presses together with it then.
Yet, in the pressing process, there is the resin gummosis to be spilled over to the pcb board surface between each layer, need removing, otherwise will influence the following process and the serviceability of plate.At present, the solution of wiring board resin gummosis is: burn gummosis with laser, or Leveling machine grinds off gummosis excessively.
It is very high that laser burns the gummosis cost, and because gummosis irregular and wayward.Cross Leveling machine and grind off gummosis,, can not remove gummosis fully because wiring board has warpage.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of pcb board mixed pressure forming method, the problem that the resin gummosis is difficult to handle in the existing mixed pressure moulding process of solution.
For solving the problems of the technologies described above, the present invention adopts following technical scheme pcb board mixed pressure forming method, may further comprise the steps:
(1) provides each lamination and the mixed pressure element of pcb board, bond with prepreg between each lamination;
(2) around the surface of outermost layer lamination and mixed pressure element, apply mould release, the dry barrier film that forms;
(3) lamination;
(4) remove excessive glue of resin and barrier film;
(5) reprocessing processing.
In described (1) step, slot in corresponding lamination in the shape of corresponding mixed pressure element and the position that is pressed into; (2) step is to apply mould release around the surface of the fluting place of outermost layer lamination and mixed pressure element.
Described lamination comprises outermost layer Copper Foil and core material.
The mixed pressure element comprises hardware, functional module, mixing flaggy or platelet.
The coating width of mould release is in 10mm in described (2) step, and coating thickness is as the criterion to cover outer layer laminate and mixed pressure element surface.
Described mould release is Teflon solution or silicone oil.
Add the mould release that dimethyl ether forms aerosol type in the described Teflon solution.
After described mould release applies and finishes, 100 degrees centigrade with interior temperature under the dry barrier film that forms.
Described (4) step is to scrub overflow when removing described (3) step lamination to accumulate in this barrier film that forms in resin on the barrier film and (2) step in brush plate machine.
Described (5) step reprocessing processing comprises boring, heavy copper, plating, outer figure or outer erosion.
Beneficial effect of the present invention is as follows: pcb board mixed pressure forming method of the present invention utilizes mould release to be coated in the wiring board skin and the mixed pressure element surface is gone up the very thin one deck barrier film of formation all around, the resin gummosis that overflows during pressing accumulates on this layer barrier film, the resin gummosis is separated with wiring board by barrier film, therefore, the resin gummosis that overflows just cleans up from wiring board easily.This method can solve the resin gummosis problem of wiring board fully, can reduce the cost that wiring board is removed the resin gummosis simultaneously.
Description of drawings
Fig. 1 is a pcb board structural representation in one embodiment of the invention pcb board mixed pressure forming method process.
Fig. 2 is a pcb board structural representation in further embodiment of this invention pcb board mixed pressure forming method process.
Embodiment
Mixed pressure forming method of the present invention mixes lamination at relating to local mixed pressure in the pcb board moulding, buries Metal Substrate technology etc.Wherein, local mixed pressure generally has two kinds of laminated, i.e. FOIL-LAM (Copper Foil is stacked) and CORE-LAM (central layer is stacked).Central layer is stacked to be meant the stacked of the no copper foil layer in surface.This mixed pressure forming method of the present invention may further comprise the steps:
(1) provides each lamination and the mixed pressure element of pcb board, bond with prepreg between each lamination;
(2) around the surface of outermost layer lamination and mixed pressure element, apply mould release, the dry barrier film that forms;
(3) lamination;
(4) remove excessive glue of resin and barrier film;
(5) reprocessing processing.
During local mixed pressure, functional module or platelet embed in the pcb board as the mixed pressure element; Perhaps high number of plies plank part is pressed into when hanging down number of plies plank, and the mixed pressure element is high number of plies plank; Perhaps bury in the Metal Substrate technology Metal Substrate as the mixed pressure element; Under these situations or similar situation, in (1) step, slot on corresponding lamination in the shape of corresponding mixed pressure element and the position that is pressed into; In (2) step, apply mould release all around at the fluting place of outermost layer lamination and the surface of mixed pressure element, but can not be coated on the side of groove inboard or mixed pressure element, otherwise influence bonding effect.
When carrying out lamination for the central layer of unlike material, the flaggies different with other central layer material are called the mixing flaggy, this mixing flaggy is the mixed pressure element, and mix flaggy as outermost layer with this during lamination, only need mix the flaggy surrounded surface at this in (2) step this moment and apply mould release, core material is looked situation can not apply mould release.
When the central layer of identical material carried out lamination, as special case, the mixed pressure element was the central layer identical with each lamination, and during lamination as outermost layer, at this moment, only need on outermost layer central layer surrounded surface, apply mould release in (2) step, and core material does not apply mould release.
The coating width of mould release generally is to close in the boundary line 10mm at tripping, and coating thickness is as the criterion with the overlay surface.The pressing boundary line is meant the boundary line of the intersection or the mixed pressure element of mixed pressure element and pcb board.
Example one
This routine laminated is FOIL-LAM (Copper Foil is stacked).With reference to Fig. 1, mixed pressure moulding pcb board mainly may further comprise the steps simultaneously:
(1) provides Copper Foil 1, prepreg 2, central layer 3 and platelet 4;
(2) apply mould release around the surface at the fluting place 5 of Copper Foil 1 and outer central layer 30 and around the surface of platelet 4, and the dry barrier film that forms;
(3) laminated into type;
(4) scrub;
(5) reprocessing processing.
With reference to Fig. 1 (a), in (1) step of mixed pressure forming method of the present invention, at first the method by prior art prepares Copper Foil 1, prepreg 2, central layer 3 and platelet 4.Prepreg 2 is a resin bed, and central layer 3 is the FR4 plate, and platelet 4 is made by high frequency sheet material.According to the shape of platelet 4, the position of corresponding its pre-pressing is in the position of Copper Foil 1 and central layer 3 correspondences fluting 5.When stacked, prepreg 2 is positioned at Copper Foil 1 and outer central layer 30, and between each layer central layer 3, and is with Copper Foil 1 and outer central layer 30, and bonding mutually between each core material 3 when being beneficial to pressing.Be appreciated that according to different needs, the function plate that platelet 4 also can be made by the material of other prior art that is different from central layer 3 materials, its effect is for some specific function that realizes pcb board or needs be embedded in the pcb board.
In (2) step, mould release is coated in (comprising release liquid) around the surface at fluting place 5 of Copper Foil 1 and outer central layer 30 and around the surface of special sheet material PTFE platelet 4, generally in 10mm, coating thickness is as the criterion with the overlay surface coating width.Mould release is not coated to the inwall of fluting 5 and the sidewall of platelet 4 during coating.
The used mould release of the present invention is selected the reagent of prior art for use, and for example silicone oil and Teflon solution are preferably Teflon solution.In the present embodiment, use Teflon solution, can dip in and get mold release agent solution, it is applied superincumbent assigned address with small brushes (width should be no more than 10mm, or little writing brush) or tailormadepiston brush.
In addition, also can in mould release, add the mould release that dimethyl ether forms aerosol type, be sprayed on assigned address with answering low angle during coating.
The preferred mould release that adopts solution, the convenient coating controlled, and saves the mould release consumption.
After coating is finished, 100 degrees centigrade with interior temperature under dry about 10 minutes, the dry barrier film (not shown) that forms of coated Teflon solution.This Teflon barrier film has fabulous thermal stability, chemical stability, non-viscosity, sliding (promptly extremely low coefficient of friction).The drying means of prior art and equipment are suitable for.
With reference to Fig. 1 (b), after the mould release drying, just can carry out the laminated into type of (3) step simultaneously.Technology laminated into type is identical with the technology of prior art, and Copper Foil 1 and 3 pressings of each layer central layer are bonding with prepreg 2 between each layer, and platelet 4 is pressed in the fluting 5, thereby forms pcb board 10.The resin melten gel 6 of overflow in the lamination process accumulates on the barrier film of panel area surface-coated of platelet 4 and embedded location thereof, and the resin gummosis is separated with wiring board by barrier film.
Carry out the treatment process of above-mentioned (4) step after the lamination: cross brush plate machine and brush away the barrier film that forms after excessive glue of resin and the mould release drying.Pcb board 10 after the cleaning is seen Fig. 1 (c), and resin gummosis and barrier film are removed fully.
The reprocessing processing of (5) step according to the element difference of mixed pressure, is carried out corresponding reprocessing processing on demand.In the present embodiment, reprocessing processing comprises the boring of being undertaken by the technology of prior art, heavy copper, plating, outer figure and outer erosion etc. to make pcb board, and it has outer figure and circuit.
Above-mentioned (4) step is scrubbed the step of removing barrier film and resin gummosis and was preferably carried out before the desmearing operation of heavy copper process.
Be appreciated that local mixed pressure technology, because of there not being copper foil layer 1 for CORE-LAM, has only core layer 3, therefore only need apply mould release at the fluting 5 of outer central layer 30 and the circumferential surface of platelet 4, other technology is identical with the mixed pressure moulding process of above-mentioned FOIL-LAM, does not give unnecessary details at this.
Example two
At present embodiment, with the mixed pressure of carrying out of in pcb board, burying Metal Substrate mixed pressure forming method of the present invention is described, please be simultaneously with reference to Fig. 2, this mixed pressure method may further comprise the steps:
(1) step: preparation Copper Foil 1, prepreg 2, central layer 3 and Metal Substrate 4 '.The shape of Copper Foil 1, central layer 3 corresponding Metal Substrate 4 ' and the position of imbedding fluting 5 are with reference to Fig. 2 (a).
(2) step: apply mould release around the surface at fluting 5 places of Copper Foil 1 and outer central layer 30 and around the surface of Metal Substrate 4 ', and the dry barrier film that forms.Present embodiment uses Teflon solution equally, and brushing is at this assigned address.Drying can adopt the drying equipment of prior art or technology to carry out dried in 100 degree celsius temperature scopes.
(3) step, laminated into type; With Copper Foil 1 and 3 pressings of each layer central layer, bonding with prepreg 2 between each layer, Metal Substrate 4 ' is pressed in the fluting 5, thereby forms pcb board 10 (with reference to Fig. 2 (b)).The resin melten gel 6 of overflow in the lamination process accumulates on the coated barrier film of circumferential surface of plate of Metal Substrate 4 ' and embedded location thereof, and the resin gummosis is separated with wiring board by barrier film.
(4) step is scrubbed: cross brush plate machine and brush away excessive glue of resin and barrier film.Pcb board 10 after the cleaning is seen Fig. 2 (c), and resin gummosis and barrier film are removed fully.
(5) step, reprocessing processing is carried out other processing or processing by the technology of prior art, the final pcb board with outer figure and circuit that forms.
Be appreciated that, for mixed laminating technology, the mixed pressure of the plank of the different numbers of plies of sheet material of the same race, high number of plies plank part is pressed into low number of plies plank, in its mixed pressure forming process, applies mould release around high number of plies plank and outer low number of plies plank surface, the dry barrier film that forms, carry out pressing then, scrub afterwards and remove overflow glue and barrier film, carry out reprocessing processing by the method for prior art again.
In addition, when covering Copper Foil, also can adopt method of the present invention, at Copper Foil and the outer mould release that applies of pcb board on the pcb board surface, the dry barrier film that forms, carry out pressing then, scrub afterwards and remove overflow glue and barrier film, carry out reprocessing processing by the method for prior art again.
For common pcb board moulding, when multilayer laminated plate carries out lamination, for preventing that resin from overflowing glue at pcb board outer surface easy-clear not, apply mould release to form barrier film at outermost laminate surrounded surface before the lamination, carry out lamination again, thereby make the resin glue that overflows accumulate on the barrier film and separate, clean again and remove overflow glue and barrier film with pcb board.Thereby solve the excessive glue problem of resin in the PCB manufacture process effectively.
In other laminating technology, when relating to resin and overflowing glue, all can adopt technical method of the present invention, apply mould release at superficies, the dry barrier film that forms carries out pressing then, scrub afterwards and remove overflow glue and barrier film, carry out reprocessing processing by the method for prior art again.
The present invention utilizes special material (for example mould release) to apply and forms very thin one deck barrier film in the circuit board, the resin gummosis that overflows during pressing accumulates on this layer barrier film, the resin gummosis is separated with wiring board by barrier film, therefore, the resin gummosis that overflows is just removed clean easily from wiring board.
Claims (10)
1. pcb board mixed pressure forming method may further comprise the steps:
1) provides each lamination and the mixed pressure element of pcb board, bond with prepreg between each lamination;
2) around the surface of outermost layer lamination and mixed pressure element, apply mould release, the dry barrier film that forms;
3) lamination;
4) remove excessive glue of resin and barrier film;
5) reprocessing processing.
2. pcb board mixed pressure forming method as claimed in claim 1 is characterized in that: in described the 1st step, slot in corresponding lamination in the shape of corresponding mixed pressure element and the position that is pressed into; The 2nd step is to apply mould release around the surface of the fluting place of outermost layer lamination and mixed pressure element.
3. pcb board mixed pressure forming method as claimed in claim 1, it is characterized in that: described lamination comprises outermost layer Copper Foil and core material.
4. pcb board mixed pressure forming method as claimed in claim 1 is characterized in that: the mixed pressure element comprises hardware, functional module, mixing flaggy or platelet.
5. pcb board mixed pressure forming method as claimed in claim 1 is characterized in that: the coating width of mould release is in 10mm in described the 2nd step, and coating thickness is as the criterion to cover outer layer laminate and mixed pressure element surface.
6. pcb board mixed pressure forming method as claimed in claim 1 is characterized in that: described mould release is Teflon solution or silicone oil.
7. pcb board mixed pressure forming method as claimed in claim 6 is characterized in that: add the mould release that dimethyl ether forms aerosol type in the described Teflon solution.
8. pcb board mixed pressure forming method as claimed in claim 6 is characterized in that: after described mould release applies and finishes, 100 degrees centigrade with interior temperature under the dry barrier film that forms.
9. pcb board mixed pressure forming method as claimed in claim 1, described the 4th step are to scrub overflow when removing described the 3rd step lamination to accumulate in this barrier film that forms in resin on the barrier film and the 2nd step in brush plate machine.
10. as each described pcb board mixed pressure forming method among the claim 1-9, described the 5th step reprocessing processing comprises boring, heavy copper, plating, outer figure or outer erosion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009103092907A CN101699939B (en) | 2009-11-05 | 2009-11-05 | Method for rolling PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009103092907A CN101699939B (en) | 2009-11-05 | 2009-11-05 | Method for rolling PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101699939A CN101699939A (en) | 2010-04-28 |
| CN101699939B true CN101699939B (en) | 2011-04-06 |
Family
ID=42148376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009103092907A Active CN101699939B (en) | 2009-11-05 | 2009-11-05 | Method for rolling PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101699939B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI511627B (en) * | 2014-04-18 | 2015-12-01 | Boardtek Electronics Corp | Circuit board having interior space by embedding space frame |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101909409B (en) * | 2010-07-16 | 2012-06-06 | 统赢软性电路(珠海)有限公司 | Manufacturing process for high-frequency multilayer mixed compression signal plate |
| CN102045965B (en) * | 2010-11-17 | 2013-01-23 | 深圳统信电路电子有限公司 | Lamination manufacturing method for imbedded inductance magnet ring |
| CN102244982B (en) * | 2011-04-06 | 2013-03-20 | 深南电路有限公司 | Method for controlling warp of local high-frequency mixedly-pressed circuit board |
| CN102858091B (en) * | 2011-06-28 | 2015-08-19 | 北大方正集团有限公司 | A kind of method removing mixed pressure shaping pcb board resin gummosis |
| CN102490435B (en) * | 2011-12-21 | 2014-08-27 | 博罗县精汇电子科技有限公司 | Method for manufacturing asymmetric factor multi-layer hardboard in soft and hard combination board by adopting separation lamination method |
| CN103857187B (en) * | 2012-12-07 | 2017-03-08 | 深南电路有限公司 | A kind of circuit board and the remaining glue processing method of circuit board |
| CN103079360B (en) * | 2012-12-28 | 2015-09-30 | 广州杰赛科技股份有限公司 | The processing method of embedded lines plate |
| CN103347365B (en) * | 2013-06-07 | 2015-09-30 | 东莞生益电子有限公司 | Remove the method for pcb board surface layer baric flow glue |
| CN104853522B (en) * | 2014-02-13 | 2018-02-23 | 深南电路有限公司 | Circuit board manufacturing method and the circuit board for being embedded with Metal Substrate |
| CN105101609B (en) * | 2014-05-08 | 2018-01-30 | 先丰通讯股份有限公司 | Inner space erecting type circuit board |
| CN106163135A (en) * | 2015-04-21 | 2016-11-23 | 深南电路股份有限公司 | A kind of partial hybrid board structure of circuit and processing method thereof |
| CN105072824B (en) * | 2015-07-27 | 2017-12-01 | 广州杰赛科技股份有限公司 | A kind of preparation method of embedded lines plate |
| CN114121597A (en) * | 2020-08-31 | 2022-03-01 | 矽磐微电子(重庆)有限公司 | Wafer film pasting method and semiconductor device |
| CN114585152B (en) * | 2022-03-30 | 2024-11-19 | 生益电子股份有限公司 | Printed circuit board and method for preparing the same |
| CN117098329B (en) * | 2023-08-31 | 2025-01-07 | 乐健科技（珠海）有限公司 | Preparation method of buried magnetic core circuit board |
| CN118434025B (en) * | 2024-05-10 | 2024-10-15 | 浙江上豪电子科技有限公司 | Circuit board mixed-pressing process |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200522806A (en) * | 2003-10-30 | 2005-07-01 | Fuji Photo Film Co Ltd | Method for producing printed wiring board |
| CN101374388A (en) * | 2008-03-28 | 2009-02-25 | 苏陟 | Method for preparing fine line flexible circuit board with high peeling strength |
| CN201270626Y (en) * | 2008-11-04 | 2009-07-08 | 美锐电路(惠州)有限公司 | Improved construction for PCB pre-pressing |
-
2009
- 2009-11-05 CN CN2009103092907A patent/CN101699939B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200522806A (en) * | 2003-10-30 | 2005-07-01 | Fuji Photo Film Co Ltd | Method for producing printed wiring board |
| CN101374388A (en) * | 2008-03-28 | 2009-02-25 | 苏陟 | Method for preparing fine line flexible circuit board with high peeling strength |
| CN201270626Y (en) * | 2008-11-04 | 2009-07-08 | 美锐电路(惠州)有限公司 | Improved construction for PCB pre-pressing |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI511627B (en) * | 2014-04-18 | 2015-12-01 | Boardtek Electronics Corp | Circuit board having interior space by embedding space frame |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101699939A (en) | 2010-04-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101699939B (en) | Method for rolling PCB | |
| CN103430642B (en) | The manufacture method of multilayer printed circuit board | |
| US8685196B2 (en) | Method for producing a multilayer printed circuit board, adhesion prevention material and multilayer printed circuit board and use of such a method | |
| CN105722302B (en) | It is embedded in the circuit board and its processing method of boss Metal Substrate | |
| CN105208796B (en) | The production method and super thick copper circuit board of super thick copper circuit board | |
| CN105451428B (en) | A kind of processing method and stacked wiring board of stacked wiring board | |
| CN103430640B (en) | The manufacture method of multilayer printed circuit board | |
| US20140124124A1 (en) | Printed circuit board manufacturing method | |
| TWI492675B (en) | Peelable copper foil-clad substrate, and method for manufacturing circuit board | |
| CN104349613A (en) | PCB (Printed Circuit Board) and manufacturing method thereof | |
| KR20160100352A (en) | Copper-clad laminate for forming integrated capacitor layer, multilayer printed wiring board, and production method for multilayer printed wiring board | |
| TW201501582A (en) | Build-up material for use in printed-circuit board and applications thereof, printed-circuit board having inner buried elements | |
| CN104717840B (en) | Circuit board manufacturing method and circuit board | |
| CN102573336B (en) | The preparation method of multilayer circuit board and for the pressing structure of layers of multilayer circuit board | |
| JP2015026654A5 (en) | Copper foil with carrier, method for producing copper-clad laminate and method for producing printed wiring board | |
| CN102781170A (en) | A kind of preparation method of mirror surface aluminum substrate | |
| JP2015024515A5 (en) | Copper foil with carrier, method for producing copper-clad laminate and method for producing printed wiring board | |
| CN105451472A (en) | Laminated circuit board processing method and laminated circuit board | |
| CN103118507A (en) | Production method of multilayer printed circuit board | |
| CN107801325A (en) | Cover the method for preparation method and pressing with big spacious area's core plate of resin copper foil | |
| CN104159406A (en) | Slotting multilayer circuit board manufacturing method and slotting multilayer circuit board | |
| CN104010444A (en) | Manufacturing method of ladder circuit, circuit board containing ladder circuit and manufacturing method thereof | |
| CN104582273B (en) | A kind of stairing circuit board manufacturing method | |
| CN104754871B (en) | A kind of circuit board manufacturing method | |
| CN205291774U (en) | High thermal conductive metal substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SHENNAN CIRCUIT CO., LTD. Free format text: FORMER NAME: SHENZHEN SHENNAN CIRCUITS CO., LTD. |
|
| CP03 | Change of name, title or address |
Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000, Guangdong, Shenzhen, Nanshan District overseas Chinese City South Shahe Industrial Zone Patentee before: Shenzhen Shennan Circuits Co., Ltd. |