CN101686021B - Wire structure used in miniature piezoelectric pumps - Google Patents

Abstract

The present invention is an electrical connection structure for a micro piezoelectric pump, comprising: a driving circuit board and a wire structure composed of multiple single layers. From top to bottom, they are a driving circuit board, a wire structure, and a piezoelectric sheet. The driving circuit board is provided with a driving circuit for driving the piezoelectric sheet, and at least one electrical contact is provided on the driving circuit board, wherein the electrical contacts are electrically connected to the driving circuit. The piezoelectric sheet is provided with a first electrode contact area and a second electrode contact area which are electrically isolated from each other on the same surface. The wire structure is used to transmit the signals of the electrical contacts to the first electrode contact area and the second electrode contact area.

Description

Wire structure used in miniature piezoelectric pumps

technical field

The invention relates to a piezoelectric (Piezoelectric) miniature piezoelectric pump, and in particular to a miniature piezoelectric pump with an internal wire structure. the

Background technique

As shown in FIG. 1 , the electrical connection means between the driving circuit board 1 and the piezoelectric sheet 2 of the known miniature piezoelectric pump is to use two electric wires 1a to connect. Two ends of the wires 1 a are welded to the driving circuit board 1 and the piezoelectric film 2 respectively. When the known miniature piezoelectric pump is further designed to be miniaturized, the electric wires 1a will hinder the design of the miniaturized pump. the

In view of the fact that the above-mentioned known miniature piezoelectric pump still has room for improvement, the inventor of the present invention desperately wants to invent a wire structure between the driving circuit board and the piezoelectric sheet to replace the above two wires, so that the more miniaturized pump can easy to accomplish. the

Contents of the invention

The first object of the present invention is to provide a wire structure for driving the circuit board and the piezoelectric sheet, which can replace the traditional connection method of two wires, and further enable the realization of a more miniaturized pump. the

The second object of the present invention is to provide a miniature piezoelectric pump, which makes the assembly of the miniature piezoelectric pump easier, especially eliminating the need for wire welding to the piezoelectric sheet. the

In order to achieve the above-mentioned purpose, the present invention provides a kind of electrical connection structure that is used for miniature piezoelectric pump, comprising: a drive circuit board, it is provided with a drive circuit and it is used for driving a piezoelectric sheet, and on this drive circuit board More than one electrical contact is provided, wherein these electrical contacts are electrically connected to the drive circuit; a first interfacing ring is a substrate made of a non-conductive material, and there are more than one first interfacing rings arranged on the surface of the first interfacing ring. An upper gasket, and a first lower gasket corresponding to the first upper gasket and arranged on the bottom surface of the first interface ring, wherein the paired first upper gasket and the first lower gasket are electrically Sexual connection, wherein the first interface ring is attached to the bottom surface of the driving circuit board, and the first upper pads are in contact with the electrical contacts on the bottom surface of the driving circuit board, wherein the first upper pads and The material of the first lower pads is conductive; a first metal ring has a plurality of corresponding inner recesses around it, and has more than one inwardly extending cantilever and more than one contact, wherein the contact disposed at the end of the cantilever, wherein the first metal ring is attached to the bottom surface of the first connecting ring, whereby the first metal ring contacts the first lower gasket of a part of the first connecting ring, and The other part of the first lower gasket respectively passes through the inner recesses; a second interface ring is a substrate of a non-conductive material, and has more than one second upper gasket arranged on the surface of the second interface ring , and a second lower gasket corresponding to the second upper gasket and disposed on the bottom surface of the second interface ring, wherein the paired second upper gasket and the second lower gasket are electrically connected, wherein The second connecting ring is attached to the bottom surface of the first metal ring, wherein the second upper gaskets respectively contact the first lower gaskets passing through the inner recesses, wherein the second upper gaskets The material of the second lower gaskets is electrically conductive; a second metal ring is attached to the bottom surface of the second connecting ring and is in contact with the second lower gaskets of the second connecting ring; wherein The piezoelectric sheet is provided with a first electrode contact area and a second electrode contact area electrically isolated from each other on the same surface, and is attached to the bottom surface of the second metal ring, wherein the first electrode contact area is a contact the contact of the first metal ring, wherein the second electrode contact area is in contact with the second metal ring; and

The electrical connection structure for the micro piezoelectric pump is respectively a driving circuit board and a wire structure composed of multiple single layers from top to bottom; wherein the driving circuit board is provided with a driving circuit for to drive a piezoelectric sheet, and set at least one electrical contact on the drive circuit board, wherein the electrical contacts are electrically connected to the drive circuit; wherein the piezoelectric sheet is electrically isolated from each other on the same surface The first electrode contact area and a second electrode contact area; wherein the wire structure is used to transmit the signals of these electrical contacts to the first electrode contact area and the second electrode contact area. the

Furthermore, the present invention also provides a miniature piezoelectric pump, which includes: a body, the top surface and the bottom surface are respectively provided with a concave portion, wherein the concave portion of the bottom surface of the body is provided with two concave holes, and the two concave holes are embedded with Two one-way valves, and two through holes are arranged between the two recessed holes and the recess on the top surface of the body; a drive circuit board is provided with a drive circuit for driving a piezoelectric sheet, and the drive circuit board At least one electrical contact is provided, wherein the electrical contacts are electrically connected to the drive circuit and placed in the recess on the top surface of the body; a wire structure is sandwiched between the drive circuit board and the piezoelectric sheet, And including: a first connecting ring, which is a substrate of non-conductive material, and has at least one first upper gasket arranged on the surface of the first connecting ring, and corresponding to the first upper gasket and The first lower gasket arranged on the bottom surface of the first interface ring, wherein the pair of the first upper gasket is electrically connected to the first lower gasket, wherein the first interface ring is bonded to the drive circuit The bottom surface of the board, and the electrical contacts where the first upper gaskets contact the bottom surface of the driving circuit board, wherein the materials of the first upper gaskets and the first lower gaskets are conductive; a first metal ring , which has a plurality of inner recesses corresponding to each other around it, and has a cantilever extending toward the center and a joint, wherein the joint is arranged at the end of the cantilever, wherein the first metal ring is attached to the first interface ring The bottom surface, whereby the first metal ring contacts the first lower gaskets of a part of the first interface ring, and the other part of the first lower gaskets respectively pass through the inner recesses; a second interface The ring is a substrate made of a non-conductive material, and has at least one second upper gasket arranged on the surface of the second interface ring, and is corresponding to the second upper gasket and arranged on the bottom surface of the second interface ring The second lower gasket, wherein the paired second upper gasket is electrically connected to the second lower gasket, wherein the second interface ring is attached to the bottom surface of the first metal ring, and the second The upper pads are respectively in contact with the first lower pads passing through the inner recesses, wherein the materials of the second upper pads and the second lower pads are electrically conductive; a second metal ring is attached to the The bottom surface of the second connecting ring, and the second lower gaskets in contact with the second connecting ring; the piezoelectric sheet is provided with a first electrode contact area electrically isolated from each other and a first electrode contact area electrically isolated from each other on the same surface. A second electrode contact area, and a contact point attached to the bottom surface of the second metal ring, wherein the first electrode contact area contacts the first metal ring, wherein the second electrode contact area contacts the second metal ring; a cover plate , is to cover the concave portion on the top surface of the body; a bottom plate is provided with two pipe bodies corresponding to the two concave holes of the body, and the bottom plate is closed to the concave portion on the bottom surface of the body. the

Description of drawings

FIG. 1 is a three-dimensional schematic view showing the connection between the drive circuit board and the piezoelectric film of a known miniature piezoelectric pump by two wires. the

FIG. 2 is an exploded perspective view showing the electrical connection structure of the present invention for a micro piezoelectric pump. the

Fig. 3 is a three-dimensional assembled view showing the electrical connection structure of the present invention. the

FIG. 4 is a schematic diagram showing the bottom surface of the driving circuit board of the present invention. the

FIG. 5 is a three-dimensional perspective view showing the first interface ring of the present invention. the

FIG. 6 is a perspective view showing a second interface ring of the present invention. the

FIG. 7 is an exploded perspective view showing a micro piezoelectric pump using the electrical connection structure of the present invention. the

FIG. 8 is an exploded perspective view showing another perspective of the micro piezoelectric pump applied with the electrical connection structure of the present invention. the

FIG. 9 is a perspective view showing a micro piezoelectric pump applying the electrical connection structure of the present invention. the

Symbol Description

1 Driver circuit board 1a Wires

2 Piezoelectric film 3 Electrical connection structure

10 Drive circuit board 11 Drive circuit

12 Lugs 20 Lead wire structure

21 First interface ring 212 Lug

213a First upper gasket 213b First lower gasket

214 through hole 22 first metal ring

222 Contact 223 Cantilever

224 Lug 225 Inner recess

23 Second interface ring 232 Lug

233a Second upper gasket 233b Second lower gasket

234 Through hole 24 Second metal ring

30 Piezoelectric film 31 Contact area of the first electrode

32 second electrode contact area 40 miniature piezoelectric pump

41 Cover plate 411 Screw hole

412 Ring part 413 Lugs

42 Body 421 Screw hole

422 Recess 423 Lug groove

424 Recessed part 425 Recessed hole

426 Check valve 427 Through hole

43 Bottom plate 431 Tube body

Detailed ways

FIG. 2 is an exploded perspective view showing the electrical connection structure of the present invention for a micro piezoelectric pump, and FIG. 3 is a perspective assembled view showing the electrical connection structure of the present invention. The electrical connection structure 3 of the present invention includes a driving circuit board 10 and a wire structure 20 , and these components will be described in detail below. the

The drive circuit board 10 is provided with a drive circuit 11 , and at least four lugs 12 are provided around the drive circuit board 10 . Referring to FIG. 4 , a plurality of electrical contacts 13 are disposed on the bottom surface of the driving circuit board 10 , and the positions of the electrical contacts 13 correspond to the positions of the first upper pads 213 a of the first connecting ring 21 . The electrical contacts 13 are electrically connected to the driving circuit 11 . The material of the driving circuit board 10 can be a printed circuit board (PCB), and the thickness ranges from 10um to 5mm. the

The wire structure 20 composed of multiple single layers includes from top to bottom: a first connecting ring 21 , a first metal ring 22 , a second connecting ring 23 and a second metal ring 24 . The wire structure 20 composed of multiple single layers can be implemented to be closely connected together to form a single piece (One piece) structure. the

Furthermore, the wire structure 20 composed of a plurality of single layers can be closely connected with the board body of the driving circuit board 10 to form a one piece structure. the

The first connecting ring 21 adopts a ring structure, so the central area is hollowed out. Four lugs 212 are disposed on the outer edge of the first connecting ring 21 , and the positions of the lugs 212 are corresponding to the lugs 12 of the driving circuit board 10 . Referring to FIG. 2 and FIG. 5 , at least eight first upper gaskets 213 a and first lower gaskets 213 b are respectively disposed on the surface and the bottom surface of the first interface ring 21 . These pads 213a, 213b are made of conductive material, such as metal. A plurality of pairs of first upper gaskets 213a and first lower gaskets 213b respectively penetrate through a conductive through hole 214, so the pairs of first upper gaskets 213a and first lower gaskets 213b are electrically conductive. connect. The number of the first upper gasket 213a and the first lower gasket 213b is not limited, and the quantity can be adjusted according to the design. The substrate of the first connecting ring 21 may be a printed circuit board substrate, such as an FR4 substrate, and the thickness of the substrate may be within a range of 10 um-5 mm. the

The first metal ring 22 adopts a ring structure, so the inner area surrounded by the first metal ring 22 is hollow. The first metal ring 22 is provided with a cantilever 223 and a contact point 222 , and the cantilever 223 extends inward, for example, extends toward the center, and the contact point 222 is disposed at the end of the cantilever 223 . The outer edge of the first metal ring 22 is provided with four lugs 224 , and the outer edge of the first metal ring 22 is also provided with four inner recesses 225 . The lugs 224 correspond to the lugs 212 of the first interface ring 21 . The inner recesses 225 respectively allow the four first lower gaskets 213b of the first interface ring 21 to pass through. The material of the first metal ring 22 can be selected from one of nickel, nickel-cobalt alloy, stainless steel, titanium, copper, brass, aluminum, and cobalt, and the thickness can range from 0.1 um to 500 um. the

The second connecting ring 23 adopts a ring structure, so the central area is hollowed out. Four lugs 232 are disposed on the outer edge of the second connecting ring 231 , and the lugs 232 correspond to the lugs 224 of the first metal ring 22 . Referring to FIG. 2 and FIG. 6 , at least four second upper gaskets 233 a and second lower gaskets 233 b are respectively disposed on the surface and the bottom surface of the second interface ring 23 . The pads 233a, 233b are made of conductive material, such as metal. A plurality of pairs of second upper gaskets 233a and second lower gaskets 233b respectively penetrate through a conductive through hole 234, so the paired second upper gaskets 233a and second lower gaskets 233b are electrically conductive. connect. The number of the second upper pads 233a and the second lower pads 233b is not limited, and can be adjusted according to the number of the first upper pads 213a and the first lower pads 213b. The substrate of the second connecting ring 23 may be a printed circuit board substrate, such as an FR4 substrate, and the thickness of the substrate may be within a range of 10 um-5 mm. the

The height of the second upper spacer 233a can be implemented to be the same as the thickness of the first metal ring 22, after that, when the first metal ring 22 is closely attached to the surface of the second interface ring 23, the second upper spacers 233a Will be at the same level as the first metal ring 22.

The second metal ring 24 adopts a ring structure, so the inner area surrounded by the second metal ring 24 is hollowed out. The material of the second metal ring 24 can be selected from one of nickel, nickel-cobalt alloy, stainless steel, titanium, copper, brass, aluminum, and cobalt, and the thickness can range from 0.1 um to 500 um. the

The piezoelectric sheet 30 is provided with a first electrode contact area 31 and a second electrode contact area 32 electrically isolated from each other on the same surface. The piezoelectric material of the piezoelectric sheet 30 can be a piezoelectric material of a conventional piezoelectric sheet, and the thickness of the piezoelectric sheet 30 can be within a range of 0.1 um to 5 mm. the

In the present invention, when assembling the electrical connection structure 3, the first intervening ring 21 is arranged and contacted on the bottom surface of the driving circuit board 10, and then the first metal ring 22 is arranged and contacted on the bottom surface of the first intervening ring 21, and then the The second connecting ring 23 is disposed on and contacts the bottom surface of the first metal ring 22 . The first upper pads 213 a on the surface of the first connecting ring 212 respectively contact the corresponding electrical contacts 13 . The four first lower gaskets 213b on the bottom surface of the first connecting ring 21 will respectively pass through the four inner recesses 225 on the outer edge of the first metal ring 22, and respectively contact the corresponding four bottom gaskets 213b on the surface of the second connecting ring 22. The second upper spacer 233a. Next, the second metal ring 24 is disposed and contacted on the bottom surface of the second connecting ring 23 , and finally, the piezoelectric sheet 30 is disposed and contacted on the bottom surface of the second metal ring 24 . The first electrode contact area 31 of the piezoelectric sheet 30 is in contact with the contact point 222 of the first metal ring 22 , and at the same time, the second electrode contact area 32 of the piezoelectric sheet 30 is in contact with the second metal ring 24 . the

The driving signal generated by the driving circuit 11 of the driving circuit board 10 will pass through the electrical contacts 13, the pads 213a, 213b of the first connecting ring 21, the first metal ring 22 and the contact 222, and the second connecting ring 23 The pads 233 a , 233 b and the second metal ring 24 are transferred to the first electrode contact area 31 and the second electrode contact area 32 of the piezoelectric sheet 30 . When the piezoelectric sheet 30 receives the driving signal from the driving circuit 11 , the piezoelectric sheet 30 will be activated. the

Fig. 7 is a three-dimensional exploded view showing a micro piezoelectric pump applying the electrical connection structure of the present invention, and Fig. 8 is a three-dimensional exploded view showing another perspective of the micro piezoelectric pump applying the electric connection structure of the present invention, and Fig. 9 is a perspective view showing a micro piezoelectric pump applied with the electrical connection structure of the present invention. The micro piezoelectric pump 40 of FIG. 7 applies the electrical connection structure 3 of the present invention. The micro piezoelectric pump 40 includes a cover plate 41 , an electrical connection structure 3 , a piezoelectric sheet 30 , a body 42 , and a bottom plate 43 . the

The periphery of the cover plate 41 is provided with four screw holes 411, and the bottom surface of the cover plate 41 protrudes downwards with an annular portion 412, and the periphery of the annular portion 412 is provided with four lugs 413, these lugs 413 is corresponding to the lugs 12 of the driver circuit board 10 , the lugs 212 of the first interface ring 21 , the lugs 224 of the first metal ring 22 , and those of the second interface ring 23 Lug 232. the

Four screw holes 421 are disposed around the body 42 , and the screw holes 421 correspond to the screw holes 411 of the cover plate 41 . A recess 422 is disposed on the top surface of the body 42 , and four lug grooves 423 are disposed around the recess 422 , and the lug grooves 423 are used for placing the lugs 413 , 12 , 212 , 224 , 232 . The bottom surface of the body 42 is provided with a concave portion 424 , and two concave holes 425 are disposed in the concave portion 424 , and a one-way valve 426 is buried in each of the two concave holes 425 . Two through holes 427 are formed between the two concave holes 425 and the concave portion 422 of the body 42 . the

The bottom plate 43 is provided with two tube bodies 431 corresponding to the two concave holes 425 in the concave portion 424 of the main body 42 . the

When assembling the miniature piezoelectric pump 40, first complete the assembly of the above-mentioned electrical connection structure 3, then, align the lugs of the electrical connection structure 3 with the corresponding lug grooves 423, and then align the electrical connection structure. 3 and the piezoelectric sheet 30 are placed in the recess 422 on the top surface of the body 42, and then, the cover plate 41 is covered on the recess 422 on the top surface of the body 42, and the screw holes 411 of the cover plate 41 are respectively aligned with the recesses 422 of the body 42. These screw holes 421, meanwhile, the ring portion 412 on the bottom surface of the cover plate 41 will be against the driving circuit board 10. Next, place the two one-way valves 426 into the concave holes 425 respectively, and then cover the bottom plate 43 on the concave portion 424 on the bottom surface of the main body 42 . Finally, the screws 50 are respectively locked to the screw holes 411 , 421 , thus completing the assembly of the micro piezoelectric pump 40 . the

In the present invention, a wire structure 20 is arranged between the drive circuit board 10 and the piezoelectric sheet 30 to replace the known two wires, which can indeed achieve the effect of reducing the internal structure volume of the micro piezoelectric pump. This is the advantage and beneficial effect of the present invention. where. the

However, the above-mentioned content is only a preferred embodiment of the present invention, and should not be used to limit the applicable scope of the present invention. All changes and modifications that are obvious to those skilled in the art, the protection scope of the present application should be based on the right The content defined by the requirements shall prevail.

Claims (20)

1. a connecting structure for electrical equipment that is used for micro piezoelectric group Pu is characterized in that, comprising:

The one drive circuit plate, one drive circuit is set, and it is used for driving a piezoelectric patches, and at this drive circuit board more than one electric contact is set, and wherein those electric contacts are to be electrically connected in this drive circuit;

One first Jie's T-Ring, it is the substrate of a non-conductive material, and has first Upper gasket more than that is arranged at this first Jie T-Ring surface, and it is corresponding at this first Upper gasket and be arranged at first lower gasket of this first Jie T-Ring bottom surface, this wherein paired first Upper gasket is that electric property is connected with this first lower gasket, wherein this first Jie T-Ring is to fit in this drive circuit board bottom surface, and those first Upper gaskets be the contact this drive circuit board bottom surface those electric contacts, wherein the material of those first Upper gaskets and those first lower gaskets has conductivity;

One first becket, have a plurality of inner fovea parts that correspond to each other around it, and have more than one cantilever that extends internally and a more than one contact, wherein this contact is arranged on the end of this cantilever, wherein this first becket is to fit in this first Jie T-Ring bottom surface, this first becket contacts this first lower gasket of the part of this first Jie T-Ring by this, and this first lower gasket of another part is respectively by those inner fovea parts;

One second Jie's T-Ring, it is the substrate of a non-conductive material, and has second Upper gasket more than that is arranged at this second Jie T-Ring surface, and it is corresponding at this second Upper gasket and be arranged at second lower gasket of this second Jie T-Ring bottom surface, this wherein paired second Upper gasket is that electric property is connected with this second lower gasket, wherein this second Jie T-Ring is to fit in this first becket bottom surface, wherein those second Upper gaskets are those first lower gaskets that contact respectively by those inner fovea parts, and wherein the material of those second Upper gaskets and those second lower gaskets has conductivity;

One second becket fits in this second Jie T-Ring bottom surface, and those second lower gaskets that are contacted with this second Jie T-Ring;

This piezoelectric patches wherein, on same surface the first electrode contact area and the one second electrode contact area that electric sexual isolation each other is set, and fit in this second becket bottom surface, wherein this first electrode contact area is the contact of this first becket of contact, and wherein this second electrode contact area is this second becket of contact.

2. the connecting structure for electrical equipment that is used for micro piezoelectric group Pu as claimed in claim 1, it is characterized in that, around this drive circuit board, this first Jie T-Ring, this first becket and this second Jie T-Ring, be that lug corresponding more than four further respectively is set respectively.

3. the connecting structure for electrical equipment that is used for micro piezoelectric group Pu as claimed in claim 1 is characterized in that the thickness range of this drive circuit board, this first Jie T-Ring or this second Jie T-Ring is between 10um～5mm.

4. the connecting structure for electrical equipment that is used for micro piezoelectric group Pu as claimed in claim 1 is characterized in that the thickness range of this first becket, this second becket or this piezoelectric patches is between 0.1um～5mm.

5. the connecting structure for electrical equipment that is used for micro piezoelectric group Pu as claimed in claim 1 is characterized in that this piezoelectric patches is by the made thin slice of a kind of piezoelectric.

6. the connecting structure for electrical equipment that is used for micro piezoelectric group Pu as claimed in claim 1 is characterized in that the substrate of the substrate of this drive circuit board, this first Jie T-Ring or the substrate of this second Jie T-Ring are printed circuit board base boards.

7. the connecting structure for electrical equipment that is used for micro piezoelectric group Pu as claimed in claim 1, it is characterized in that, the material of this first becket or this second becket is that selection is wherein a kind of from nickel, nickel cobalt (alloy), stainless steel, titanium, copper, brass, aluminium and cobalt.

8. the connecting structure for electrical equipment that is used for micro piezoelectric group Pu as claimed in claim 1 is characterized in that the material of the pad of this first Jie T-Ring or this second Jie T-Ring is a metal.

9. the connecting structure for electrical equipment that is used for micro piezoelectric group Pu as claimed in claim 1 is characterized in that those first Upper gaskets of this first Jie T-Ring and those first lower gasket quantity respectively are 8.

10. the connecting structure for electrical equipment that is used for micro piezoelectric group Pu as claimed in claim 1 is characterized in that those second Upper gaskets of this second Jie T-Ring and those second lower gasket quantity respectively are 4.

11. the connecting structure for electrical equipment that is used for micro piezoelectric group Pu as claimed in claim 1, it is characterized in that, paired first Upper gasket and this first lower gasket, be that through hole that a tool conductivity is set is used for wearing and passes through in this first Upper gasket and this first lower gasket, and this first Upper gasket of electric property connection and this first lower gasket.

12. the connecting structure for electrical equipment that is used for micro piezoelectric group Pu as claimed in claim 1, it is characterized in that, paired second Upper gasket and this second lower gasket, be that through hole that a tool conductivity is set is used for wearing and passes through in this second Upper gasket and this second lower gasket, and this second Upper gasket of electric property connection and this second lower gasket.

13. the connecting structure for electrical equipment that is used for micro piezoelectric group Pu as claimed in claim 1 is characterized in that this first Jie T-Ring, this first becket, this second Jie T-Ring, this second becket are to connect airtight to be an individual construction together.

14. the connecting structure for electrical equipment that is used for micro piezoelectric group Pu as claimed in claim 1 is characterized in that this drive circuit board, this first Jie T-Ring, this first becket, this second Jie T-Ring, this second becket are to connect airtight to be an individual construction together.

15. a micro piezoelectric group Pu is characterized in that, comprising:

One body, end face and bottom surface respectively are provided with a recess, and wherein the recess of this body bottom surface is provided with two shrinkage pools, and this two shrinkage pool is to be embedded with two unidirectional valves, and is provided with two through holes between the recess of this two shrinkage pool and this body end face;

The one drive circuit plate, one drive circuit is set, and it is used for driving a piezoelectric patches, and at this drive circuit board more than one electric contact is set, and wherein those electric contacts are to be electrically connected in this drive circuit, and the recess that is placed in this body end face;

One conductor structure, interlayer and comprise between this drive circuit board and this piezoelectric patches:

One first Jie's T-Ring, it is the substrate of a non-conductive material, and has first Upper gasket more than that is arranged at this first Jie T-Ring surface, and to should and being arranged at first lower gasket of this first Jie T-Ring bottom surface at this first Upper gasket, this wherein paired first Upper gasket is connected with the electric property of this first lower gasket, wherein this first Jie T-Ring fits in this drive circuit board bottom surface, and those first Upper gaskets contact those electric contacts of this drive circuit board bottom surface, and wherein the material of those first Upper gaskets and those first lower gaskets has conductivity;

One first becket, have a plurality of inner fovea parts that correspond to each other around it, and have a cantilever and a contact that extends to the center, wherein this contact is arranged on the end of this cantilever, wherein this first becket fits in this first Jie T-Ring bottom surface, this first becket contacts this first lower gasket of the part of this first Jie T-Ring by this, and this first lower gasket of another part is respectively by those inner fovea parts;

One second Jie's T-Ring, it is the substrate of a non-conductive material, and has second Upper gasket more than that is arranged at this second Jie T-Ring surface, and it is corresponding at this second Upper gasket and be arranged at second lower gasket of this second Jie T-Ring bottom surface, this wherein paired second Upper gasket is connected with the electric property of this second lower gasket, wherein this second Jie T-Ring fits in this first becket bottom surface, wherein those second Upper gaskets contact those first lower gaskets by those inner fovea parts respectively, and wherein the material of those second Upper gaskets and those second lower gaskets has conductivity;

One second becket fits in this second Jie T-Ring bottom surface, and those second lower gaskets that are contacted with this second Jie T-Ring;

This piezoelectric patches, be that the first electrode contact area and the one second electrode contact area of electric sexual isolation each other are set on same surface, and fit in this second becket bottom surface, wherein this first electrode contact area contacts the contact of this first becket, and wherein this second electrode contact area contacts this second becket;

One cover plate is the recess that is covered on this body end face;

One base plate is provided with two bodys, and corresponding to two shrinkage pools of this body, and this base plate is covered on the recess of this body bottom surface.

16. micro piezoelectric as claimed in claim 15 is helped the Pu, it is characterized in that, this cover plate bottom surface convexes with an annulus portion, wherein be provided with at least four lugs around this annulus portion, and this first Jie T-Ring, first becket and second Jie's T-Ring around respectively be provided with at least four lug respectively, and be provided with at least four lug grooves around this body end face recess.

17. micro piezoelectric as claimed in claim 15 is helped the Pu, it is characterized in that, paired first Upper gasket and this first lower gasket, the through hole that a tool conductivity is set is used for wearing and passes through in this first Upper gasket and this first lower gasket, and this first Upper gasket of electric property connection and this first lower gasket.

18. micro piezoelectric as claimed in claim 15 is helped the Pu, it is characterized in that, paired second Upper gasket and this second lower gasket, the through hole that a tool conductivity is set is used for wearing and passes through in this second Upper gasket and this second lower gasket, and this second Upper gasket of electric property connection and this second lower gasket.

19. micro piezoelectric as claimed in claim 15 group Pu is characterized in that this first Jie T-Ring, this first becket, this second Jie T-Ring, this second becket are to connect airtight to be an individual construction together.

20. micro piezoelectric as claimed in claim 15 group Pu is characterized in that this drive circuit board, this first Jie T-Ring, this first becket, this second Jie T-Ring, this second becket connect airtight and be an individual construction together.

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