CN101681958A

CN101681958A - Opto-electronic semiconductor body and method for the production thereof

Info

Publication number: CN101681958A
Application number: CN200880013521A
Authority: CN
Inventors: K·英格尔; P·罗德; L·霍佩尔; M·萨巴蒂尔
Original assignee: Osram Opto Semiconductors GmbH
Current assignee: Ams Osram International GmbH
Priority date: 2007-04-26
Filing date: 2008-04-24
Publication date: 2010-03-24
Anticipated expiration: 2028-04-24
Also published as: CN102176502B; EP2149159B1; JP5362704B2; WO2008131735A1; DE102007022947A1; JP2014003326A; CN102176502A; US20100171135A1; KR20120081238A; TWI381548B; US20130221392A1; KR101260375B1; CN101681958B; EP2149159A1; KR101419413B1; JP5801359B2; US8653540B2; TW200903863A; DE102007022947B4; KR20100017365A

Abstract

An optoelectronic semiconductor body is described, which has a semiconductor layer sequence (2) with an active layer (23) suitable for generating electromagnetic radiation; and a first and a second electrical connection layer (4 , 6), wherein the semiconductor body is provided for emitting electromagnetic radiation from the front side, the first and second electrical connection layers are arranged on the back side opposite the front side and are electrically insulated from each other by means of the separation layer (5), the first The electrical connection layer (4), the second electrical connection layer (6) and the separation layer (5) overlap laterally, and a part of the second electrical connection layer (6) passes through the penetration portion of the active layer (23) from the back ( 3) Extend toward the direction of the front. Furthermore, a method for producing such an optoelectronic semiconductor body is specified.

Description

Opto-electronic semiconductor body and manufacture method thereof

Present patent application requires the priority of German patent application 102007019773.1 and 102007022947.1, and their disclosure is incorporated herein by reference.

The present invention relates to a kind of opto-electronic semiconductor body and a kind of method that is used to make opto-electronic semiconductor body.

Task of the present invention is that a kind of opto-electronic semiconductor body with improved efficient and/or improved electrical characteristics is described.

These tasks by according to the opto-electronic semiconductor body of independent claims and the method that is used to make opto-electronic semiconductor body solve.

Expansion scheme of the present invention and improvement project be explanation in the dependent claims respectively, and their disclosure is incorporated in the specification hereby clearly.

Opto-electronic semiconductor body according to the present invention has the semiconductor layer sequence, and this semiconductor layer sequence comprises the active layer that is suitable for producing electromagnetic radiation.

Active layer has pn knot, double-heterostructure, single quantum well (SQW, single quantumwell) or multi-quantum pit structure (MQW) and is used to produce radiation.The title quantum well structure is not illustrated implication aspect the quantized dimension at this.Thus, it especially comprises the combination in any of quantum groove, quantum wire and quantum dot and these structures.The MQW example of structure is at publication WO 01/39282, US5, and 831,277, US6,172,382B1 and US5 are described in 684,309, and their disclosure is incorporated herein by reference thus.

Semiconductor body is set for from positive surface launching electromagnetic radiation.With the opposed back side, front on be furnished with first and second electric connection layers.First and second electric connection layers are electrically insulated from each other by separating layer.

At this, and " with the opposed back side, front on arrange " at least a portion of first or second electric connection layer of expression semiconductor layer sequence from the front direction to the back side follow.Yet do not need whole first or second electric connection layer is arranged on the back side.But the direction extension of the breakthrough part of active layer towards the front passed in the subregion of second electric connection layer from the back side.To make them particularly go up overleaf laterally overlapping yet first electric connection layer, second electric connection layer and separating layer are built as.

In an expansion scheme of semiconductor body, the part of the electromagnetic radiation of the direction emission that first and/or second electric connection layer will be from active area towards the back side is to the direction reflection in front.

Advantageously, the radiative front of semiconductor layer sequence do not have electrical contacts, as bond pad.Reduce the risk of blocking and/or absorb the part of the electromagnetic radiation of launching at work owing to electrical contacts by this way by active area.For example can advantageously save the bothersome method step related with on the front of semiconductor layer sequence, making this contact site, for example with the surface finish of the face side of semiconductor layer sequence, and/or make and to have big thickness but the metal contact pin with little horizontal expansion is used for extend current, and/or can advantageously save restriction or prevent that electric current from injecting the measure in the zone of the semiconductor layer sequence under the electrical contacts, for example under contact site, make up electric insulation layer, Schottky barrier and/or ion implanted region territory.

In another expansion scheme, semiconductor body is a thin-film light emitting diode chip.Especially, it has support substrate on its back side.In an expansion scheme, first and second articulamentums are disposed between semiconductor layer sequence and the support substrate at least in part.

Thin-film light emitting diode chip is characterised in that at least one in the following characteristic feature:

-on the interarea of supporting member, particularly support substrate, apply or be built with the reflector in the semiconductor layer sequence that produces radiation, in this semiconductor layer sequence of at least a portion reflected back of the electromagnetic radiation that this reflector will produce in the semiconductor layer sequence, the semiconductor layer sequence that wherein produces radiation particularly produces the epitaxial loayer sequence of radiation;

-thin-film light emitting diode chip has supporting member, this supporting member be not on it epitaxial growth the growth substrates of semiconductor layer sequence, but supporting member independently, this supporting member is fixed on semiconductor layer sequence afterwards and lists;

-semiconductor layer sequence has the thickness in 20 μ m or littler scope, especially the thickness in 10 μ m or littler scope;

-semiconductor layer sequence does not have growth substrates.At this, the growth substrates used for growth in case of necessity of " not having growth substrates " expression is removed from the semiconductor layer sequence or at least by thinning greatly.Especially, this growth substrates by thinning be make itself or only with the epitaxial loayer sequence together be not from the supporting.The quilt residual fraction of the growth substrates of thinning greatly is not suitable as this substrate that is used for the growth substrates function especially; And

-semiconductor layer sequence comprises at least one semiconductor layer with at least one following face: this mask has the mixing structure, this structure causes the approximate ergodic distribution of light in the semiconductor layer sequence in the ideal case, that is to say that it has ergodic as far as possible scattering properties at random.

The basic principle of thin-film light emitting diode chip for example is described in the 2174-2176 page or leaf of Appl.Phys.Lett.63 (16) on October 18th, 1993 people such as I.Schnitzer, and its disclosure thus is incorporated herein by reference.Described the example of thin-film light emitting diode chip in publication EP 0905797A2 and WO 02/13281A1, their disclosures thus are incorporated herein by reference equally.

Thin-film light emitting diode chip is similar to youth's uncle's surface radiator well and therefore for example is suitable for being applied in headlight well, such as in the front headlight of motor vehicle.

In another expansion scheme, semiconductor body has the specular layer (Spiegelschicht) of semiconductive or electric insulation at least in part between the semiconductor layer sequence and first and/or second electric connection layer.The refractive index of specular layer for example with the semiconductor layer sequence as the refractive index deviation 1 of lower floor or more: this layer followed after specular layer on the direction in front, and particularly with this specular layer adjacency.In an expansion scheme, specular layer comprises dielectric, as SiO ₂In another expansion scheme, separating layer is built as the specular layer of electric insulation at least in part.

In an improvement project, specular layer semiconductive or electric insulation comprises distributed Bragg reflector (DBR, Distributed Bragg Reflector), and it is right that it comprises the layer that alternately has high index of refraction and low-refraction.

In an expansion scheme, the specular layer of semiconductive or electric insulation cover stacked semiconductor layer back side interarea 50% or more.In another expansion scheme, specular layer has a plurality of openings, and extend to the semiconductor layer sequence by these openings the subregion of first and/or second electric connection layer.

The specular layer of semiconductive or electric insulation is for example owing to change of refractive has extra high reflection coefficient, makes that it especially effectively will be by the direction reflection of active area towards the electromagnetic radiation of the direction emission at the back side towards the front.By following specular layer operating current is injected in the semiconductor layer sequence especially equably: this specular layer has a plurality of openings, and the subregion of first and/or second electric connection layer extends through these openings.

In another expansion scheme, the semiconductor layer sequence has the current extending adjacent with the back side.Current extending for example comprises transparent conductive oxide (TCO, transparent conductingoxide).By current extending, further improve the uniformity that electric current injects.

In another expansion scheme, first and/or second electric connection layer has sandwich construction.For example, first and/or second electric connection layer has and increases attached layer, reflector and/or current distribution layer.

Increase attached laminated destination towards the semiconductor layer sequence.Preferably, increase attached layer and have 1nm or littler thickness, particularly 0.5nm or littler thickness.Increasing attached layer for example can be the individual layer of atom and/or molecule and/or the layer that does not seal.The reflector particularly is disposed in after the side that deviates from the semiconductor layer sequence that increases attached layer, and particularly is adjacent.

Increase attached layer and improve reflector adhering on the layer (the particularly semiconductor layer of semiconductor layer sequence such as current extending or separating layer) before first or second electric connection layer.According to the characteristic in reflector, also can save and increase attached layer.

Increase attached layer and for example have platinum and/or titanium.The reflector has reflection coefficient high electric conducting material, particularly metal, and for example silver perhaps is made of it.

Additionally, in an improvement project, first and/or second electric connection layer has current distribution layer, and it particularly comprises the material with good especially conductive capability, for example gold.

In another expansion scheme of opto-electronic semiconductor body, first electric connection layer has and electrically contacts district's (such as bond pad), and it is suitable for electrically contacting semiconductor body from the front of semiconductor body.Additionally or alternatively, it can have the following district that electrically contacts: this electrically contacts the district and is suitable for electrically contacting semiconductor body from the back side of semiconductor body.Similarly, second electric connection layer can have and is suitable for the district that electrically contacts that electrically contacts the contact zone of semiconductor body from the front of semiconductor body and/or be suitable for electrically contacting at the back side of semiconductor body semiconductor body.

The district that electrically contacts that is suitable for electrically contacting from the front of semiconductor body semiconductor body conforms with the side that the destination is disposed in the semiconductor layer sequence.These electrically contact the district can advantageously implement in large area, because they do not influence the emission from the electromagnetic radiation of semiconductor body.Therefore, semiconductor body is suitable for having the application of big operating current particularly well.In other words, it advantageously has high current capacity.

The layout of contact zone advantageously can freely be selected.Semiconductor body can be set for and come p side contacts and n side contacts semiconductor layer sequence from its front, be used for coming p side contacts and n side contacts semiconductor layer sequence from its back side, be used for coming the p side contacts and come n side contacts semiconductor layer sequence from its back side from its front, be used for coming the n side contacts and come p side contacts semiconductor layer sequence from its back side, and be used for coming n and/or p side contacts semiconductor layer sequence from front and back from its front.At this, the p side contacts is set up by first electric connection layer and the n side contacts is set up by second electric connection layer, and is perhaps opposite.

In another expansion scheme, the semiconductor layer sequence has and positive adjacent resilient coating, and it particularly has low conductive capability.For example, resilient coating is not doped or is mixed by weak ground n.In an improvement project, resilient coating is that (ESD: static discharge), it reduces the danger of damaging semiconductor body owing to static discharge to the esd protection layer.

At this, the resilient coating with low conductive capability is understood that following resilient coating: it is unsuitable for operating current is guided to active area, and its conductive capability for example is less than or equal to 20 (Ω cm) ^-1In an improvement project, the conductive capability that is also referred to as conductivity is less than or equal to 1 (Ω cm) ^-1At this, weak n mixes and is understood that 2 * 10 ¹⁷Atom/cm ³Perhaps littler n mixes.

The method that is used to make opto-electronic semiconductor body according to the present invention has following steps:

-epitaxial growth semiconductor layer sequence on growth substrates, this semiconductor layer sequence has the active layer that is suitable for producing electromagnetic radiation, and is set for from positive surface launching electromagnetic radiation;

-first electric connection layer is applied to the semiconductor layer sequence with the opposed back side, front on;

-structure runs through portion (Durchbruch) in active layer;

-on the back side of semiconductor layer sequence, make up separating layer; And

-on the back side of semiconductor layer sequence, apply second electric connection layer,

Wherein first electric connection layer, second electric connection layer and separating layer lateral overlap ground make up, and the subregion of second electric connection layer is structured in the portion of running through, and second electric connection layer is isolated by the separating layer and first electric connection layer.

In an expansion scheme of this method, first and/or second electric connection layer reflectivity ground is implemented.

In another expansion scheme of this method, after the growing semiconductor sequence of layer, at least a portion of growth substrates is removed.The removal of growth substrates can be carried out before or after applying first or second articulamentum.For example, the part of growth substrates is for example by laser-stripping method and come off (abgesprengt).

In another expansion scheme, on the back side of semiconductor body, arrange or make up support substrate.Support substrate can be a supporting member independently, and it for example is connected with the semiconductor layer sequence by weld layer or adhesive phase by welding or adhesion step.Alternatively, first and/or second electric connection layer can be a support substrate.For this reason, first and/or second electric connection layer for example is enhanced in the mode of electroplating.

In an expansion scheme of this method, divide ground to make up the specular layer of semiconductive or electric insulation in the upper rear portion of semiconductor layer sequence.In an improvement project of this expansion scheme, in the specular layer of semiconductive or electric insulation, make up opening.This for example can carry out when applying specular layer by mask.Alternatively, opening for example can produce in this specular layer after applying specular layer by photoetching process.First and/or second electric connection layer conforms with the destination and is applied in, and makes to win and/or the subregion of second electric connection layer extends through the opening of specular layer.

In another expansion scheme of this method, on the back side of semiconductor layer sequence, apply current extending, it particularly comprises transparent conductive oxide.

In another expansion scheme, the semiconductor layer sequence comprises the growth of resilient coating to the epitaxial growth on the growth substrates.Resilient coating particularly is disposed between active area and the growth substrates.It for example has low conductive capability, and preferably is not doped or is mixed by weak ground n.In an improvement project of this method, resilient coating is exposed when removing growth substrates.

Other advantage and favourable expansion scheme are by drawing among the embodiment that describes below in conjunction with Fig. 1 to 8.

Figure 1A to 1G illustrates the schematic cross-section of opto-electronic semiconductor body in the different phase of the method for making opto-electronic semiconductor body according to first embodiment;

Fig. 2 illustrates the schematic cross-section according to the opto-electronic semiconductor body of second embodiment;

Fig. 3 illustrates the schematic cross-section according to the opto-electronic semiconductor body of the 3rd embodiment;

Fig. 4 illustrates the schematic cross-section according to the opto-electronic semiconductor body of the 4th embodiment;

Fig. 5 A, 5B and 6 illustrate the schematic plan of the different expansion scheme of electric connection layer; And

Fig. 7 and 8 illustrates the schematic cross-section according to the subregion of the opto-electronic semiconductor body of the 3rd embodiment.

In embodiment and accompanying drawing, identical or act on identical part and be equipped with identical Reference numeral.The magnitude relationship of accompanying drawing and element illustrated in the accompanying drawings can not be considered as by correct proportions in principle.Or rather, each element, for example layer can illustrate in order better to understand and/or to be crossed greatly or cross heavy back for better presenting property.

Figure 1A to 1G goes out the method that is used to make opto-electronic semiconductor body according to first embodiment with the schematic cross sectional representation in the different phase of method.

At first, make semiconductor layer sequence 2 epitaxial growths on growth substrates 1 (referring to Figure 1A).Semiconductor layer sequence 2 is for example based on the III/V compound semiconductor materials or based on the II/VI compound semiconductor materials.Semiconductor layer sequence 2 has 5 μ m to the thickness between the 7 μ m at this.

The III/V compound semiconductor materials has the element from the 3rd main group at least, for example Al, Ga, In, and from the element of the 5th main group, for example B, N, P, As.Especially, term " III/V compound semiconductor materials " comprises the family of binary, ternary or quaternary compound, these compounds comprise from least a element of the 3rd main group with from least a element, particularly nitride compound semiconductor and the phosphide compound semiconductor of the 5th main group.This binary, ternary or quaternary compound for example can have one or more dopants and additional part in addition.What belong to the III/V compound semiconductor materials for example has III-th family nitride compound semiconductor materials and III-th family phosphide compound semiconductor materials such as GaN, GaAs and an InGaAlP.

Correspondingly, the II/VI compound semiconductor materials has the element from second main group at least, for example Be, Mg, Ca, Sr, and from the element of the 6th main group, for example O, S, Se.Especially, the II/VI compound semiconductor materials comprises binary, ternary or quaternary compound, and these compounds comprise from least a element of second main group with from least a element of the 6th main group.This binary, ternary or quaternary compound for example can have one or more dopants and additional part in addition.What belong to the II/VI compound semiconductor materials for example has ZnO, ZnMgO, CdS, CnCdS, a MgBeO.

Semiconductor layer sequence 2 has n doped layer 21 (it is adjacent with growth substrates 1 at this) and p doped layer 22.P doped layer 22 is disposed on the side that deviates from growth substrates 1 of semiconductor layer sequence 2 at this.Between n doped layer 21 and p doped layer 22, be furnished with active area 23.

In an expansion scheme, semiconductor layer sequence 2 is built as the npn sequence of layer, wherein is built with another n doped layer on a side that deviates from n doped layer 21 of p doped layer 22.In another expansion scheme, p doped layer 22 is adjacent with growth substrates 1, and n doped layer 21 deviates from growth substrates 1.

In a flexible program of this method, before growing semiconductor sequence of layer 2, applying (particularly epitaxial growth) resilient coating (not shown in FIG.) on the growth substrates 1.Resilient coating for example causes in growth substrates 1 and grows into the coupling of the lattice constant between the layer of semiconductor layer sequence 2 on the resilient coating subsequently.In an expansion scheme that conforms with purpose, resilient coating is not doped or is mixed by weak ground n.For example, the concentration of one or more n dopants of resilient coating is 2 * 10 ¹⁷Atom/cm ³Perhaps littler.

Resilient coating that be not doped or that mixed by weak ground n is not suitable for being flow through by the operating current of semiconductor body.Yet this can't work unfriendly, is not provided operating current because semiconductor body is not set for by growth substrates 1 or from the side towards growth substrates 1 of stacked semiconductor layer 2.Or rather, resilient coating reduces the danger that this semiconductor body is damaged or damages owing to static discharge under the situation of the semiconductor body of finishing.

Subsequently, in active area 23, make up at least one and run through portion (referring to Figure 1B).For this reason, for example semiconductor layer sequence 2, produce recess 3 from the second interarea 202s of semiconductor layer sequence 2 by the etching of passing mask.Preferably, make up a plurality of portions 3 of independently running through, realize advantageously that thus transverse current distributes especially uniformly.

Recess 3 extending from second interarea 202 towards semiconductor layer sequence 2 with second interarea, 202 opposed first interareas 201.Recess 3 for example has the shape of cylinder or cylindroid, cuboid, taper or truncated cone, pyramid or truncated pyramid.Alternatively, recess 3 also can be built as groove.Preferably, groove has flat bottom surface basically.In an expansion scheme, the cross section of groove enlarges from the bottom surface towards second interarea 202.

Before making up recess 3 or afterwards, on second interarea 202, apply first contact layer 4, for example evaporation first contact layer 4.First contact layer 4 preferably has reflection coefficient high material, particularly metal, for example silver.First contact layer 4 can have first and second subregions, and their layer thickness differs from one another.For example, the first zone has the layer thickness littler than second portion zone.

Subsequently, separating layer 5 is structured on the part on surface of recess 3 and on the part on the surface of electric connection layer 4 (referring to Fig. 1 C).For example, however separating layer 5 preferably fully cover at least in part recess 3 around sidewall.Conform with the destination, separating layer 5 is extended up to active area 23 and preferably up to the bottom surface of recess 3 at least from second interarea 202 in recess 3.

Separating layer 5 conforms with in addition that the destination covers first electric connection layer 4 adjacent with recess 3 and particularly with the side 403 of recess 3 adjacency.In addition, separating layer 5 interarea 402 that deviates from semiconductor layer sequence 2 that partly covers first electric connection layer 4 at this.For example, separating layer 5 covers the interarea thin first zone of first electric connection layer 4, that deviate from semiconductor layer sequence 2.Separating layer is built as electric insulation, and for example has dielectric, for example SiO ₂, SiN _xPerhaps SiON perhaps is made of this dielectric.

Subsequently, as shown in Fig. 1 D, make second electric contacting layer 6.The subregion of second electric contacting layer 6 is disposed in the recess 3, and preferably fills up this recess fully.Because with the sidewall of separating layer 5 covering recesses 3, so can not have the short circuit in source region 23 owing to the subregion that is disposed in second electric contacting layer 6 in the recess 3.

Second electric connection layer 6 partly covers first electric contacting layer 4 in the vertical view of second interarea 202 of semiconductor layer sequence 2.For example, second electric contacting layer extends to the fringe region of semiconductor layer sequence 2 on the first zone of first electric connection layer 4 in a lateral direction from the recess 3s.Between first and second electric connection layers 4,6, be furnished with separating layer 5, make between first and second electric connection layers 4,6, electrical short not occur at this.

As shown in Fig. 1 E, support substrate 7 is being fixed on first and second electric connection layers 4,6 by weld layer or adhesive phase 8 on the back side that deviates from growth substrates 1 of semiconductor layer sequence 2 subsequently.At this, adhesive phase 8 has low conductive capability, and especially, it is an electric insulation.Support substrate for example has aluminium nitride or is made of aluminium nitride.Other the particularly support substrate 7 such as the glass support substrate of insulation also can be imagined.

What also can imagine is, substitutes to utilize adhesive phase and connect by the weld layer of conduction.Conform with the destination, in this flexible program, separating layer 5 also be structured in first and/or second

electric connection layer

4,6 on the face of support substrate 7.

In method step subsequently (referring to Fig. 1 F), with growth substrates thinning or removal fully.This for example can be undertaken by known in principle to those skilled in the art laser-stripping method.For this reason, growth substrates 1 or semiconductor layer sequence 2 preferably have sacrifice layer, and it is decomposed when utilizing the laser emission irradiation, makes growth substrates 1 come off.Utilizing the irradiation of laser emission for example to pass growth substrates 1 carries out.

At last, semiconductor layer sequence 2 is partly removed, so that the

electrical contacts

41,61 of first or second

electric connection layer

4,6 is exposed.This removal is for example undertaken by etch process, and wherein dry etching process and wet chemical etching technique all are suitable.

In an improvement project of this method, yet the side of the side of the side of semiconductor layer sequence 2, first electric connection layer 4 and/or second electric contacting layer 6 preferably fully covers (referring to Fig. 1 G) at least in part with electric insulation layer 5 equally.

Be set at the opto-electronic semiconductor body shown in Fig. 1 G and make the electromagnetic radiation that produced at work by active area 23 deviate from the positive surface launching of support substrate 7 towards it by first interarea 201 of semiconductor layer sequence 2 according to first embodiment.Reflected back by first electric connection layer 4, second electric connection layer 6 and/or separating layer 5 direction towards the direction at the back side, i.e. electromagnetic radiation towards the emission of the direction of second interarea 202 by active area 23 towards the front.

Be used for making the operating current of opto-electronic semiconductor body work to be injected into the semiconductor layer sequence from the front by first electrical contacts 41 and second electrical contacts 61.

Electrical contacts

41,61 is disposed in semiconductor layer sequence 2 sides at this.

Advantageously,

electrical contacts

41,61 is not arranged in towards the light path of the electromagnetic radiation of the direction in front emission.Simultaneously, realize and the good especially thermal coupling of support substrate 7, make the loss heat that in the work of semiconductor body, is produced be led diffusing from the semiconductor layer sequence especially effectively by

electric connection layer

4,6.

By first electrical contacts 41 and first electric connection layer 4, semiconductor layer sequence 2 is touched in the p side at this.The n side contacts is undertaken by second electrical contacts 61 and second electric connection layer 6 at this.But the n side of semiconductor layer sequence 2 and p side, promptly particularly n doped layer 21 and p doped layer 22 also can be exchanged.

Fig. 5 A and 5B illustrate the different flexible programs of the shape of the portion of running through 3 by active area 23 with the schematic plan according to the front of the opto-electronic semiconductor body of Fig. 1 G.Semiconductor layer sequence 2 is omitted for the diagram of simplifying at this.

In the flexible program shown in Fig. 5 A, recess 3 has the shape of groove, wherein only shows in these grooves in Fig. 1 G for the diagram of simplifying.The portion of running through 3 of passing active layer 23 of second the electric connection layer 6 and subregion of extending is banded in this flexible program.First contact layer 4 is set up the comprehensive engagement with semiconductor layer sequence 2 under the situation of not considering the portion of running through 3.

In the flexible program shown in Fig. 5 B, running through portion 3 is not the groove shape, but has the shape of cylinder or truncated cone.Therewith correspondingly, the subregion of second electric connection layer 6 that extends of the portion of running through by active layer 23 3 has circular cross section.

In the embodiment of Fig. 5 A and in the embodiment of Fig. 5 B,

electrical contacts

41,61 is implemented all bandedly, and extends on the whole side length of semiconductor body basically.

Be that at second embodiment of the opto-electronic semiconductor body shown in Fig. 2 and the difference of first embodiment semiconductor layer sequence 2 has alligatoring or structuring on its front.For example, first interarea 201 for example comes structuring by the projection and/or the recess of pyramid-type, circular cone type, the truncated pyramid formula and/or truncated cone formula.This alligatoring or structuring are worked preferably as the diffuser at the electromagnetic radiation of being launched by active area 23.This alligatoring also is suitable for wherein not illustrating other embodiment of alligatoring.

Be that with another difference of first embodiment semiconductor layer sequence 2 has current distribution layer 9 at this on its back side.Current extending 9 preferably has transparent conductive oxide, for example indium tin oxide (ITO, Indium-Tin-Oxide) or indium-zinc oxide (IZO, Indium-Zinn-Oxide).For example, current extending by evaporation to epitaxially grown semiconductor layer.

Advantageously, further improve the uniformity that is injected into the operating current in the semiconductor layer sequence 2 by first electric connection layer 4 at work by the current extending 9 that also is suitable for other embodiment again.This for example can not conform with purpose when p doped layer 22 has enough transverse conductance abilities.Usually, the transverse conductance ability of the transverse conductance of n doped layer 21 energy force rate p doped layer 22 is higher.Therefore, in this second embodiment, saved current extending with second electric connection layer, 6 adjacency.

In addition, different with first embodiment, in second embodiment according to Fig. 2, second electric connection layer 6 partly extends in the inside of first electric connection layer 4.In other words, on the direction at the back side, one after the other at first be the first zone of first electric connection layer 4 in front from opto-electronic semiconductor body, be the subregion of second electric connection layer 6 subsequently, and be another part zone of first electric connection layer 4 at last.

In order to make, for example at first the first zone of first electric connection layer 4 to be applied to semiconductor layer sequence and to list, and be equipped with separating layer 5.Make up second electric connection layer subsequently.This particularly is similar to first embodiment and carries out (referring to Fig. 1 C and 1D).Subsequently, following by structure before subregion after second electric connection layer 6 finishes first electric connection layer 4, also separating layer 5 is applied on second electric connection layer 6.

In this expansion scheme, advantageously also will be by the electromagnetic radiation of separating layer 5 towards the direction at the back side from 2 outgoing of semiconductor layer sequence at least in part the reflected back semiconductor layer sequence 2 (and reflecting back towards the direction in front thus).By this way, further improved the efficient of semiconductor body.

At last, in the embodiment of Fig. 2, first electrical connection section 41 is not set for the front contact semiconductor body from semiconductor body.Or rather, have the support substrate 7 of conduction according to the opto-electronic semiconductor body of second embodiment, its weld layer 8 that has the weld metal as AuZn in this utilization mechanically and conductively is fixed on first electric connection layer 4.Electrically-conducting adhesive, also be suitable for material as fixed bed 8 as the epobond epoxyn of filling with silver.By support substrate, semiconductor body can (at this in the p side) by first electric connection layer 4 from its back side contact.Second electrical contacts 61 contacts as being set for from the front among first embodiment.

In the 3rd embodiment shown in Fig. 3, substitute first electric contacting layer, second electric contacting layer 6 is connected with support substrate 7 conductions.First electric contacting layer 4 is by separating layer 5 and conductance supporting substrate 7 electric insulations.

According to the 3rd embodiment, first and second electric contacting

layers

4,6 have:

reflector

410 or 610, and this reflector and semiconductor layer sequence 2 are adjacent and comprise the high metal of reflection coefficient, for example silver; And

circuit transmission layer

420 or 620, this circuit transmission layer for example has gold.

Realize the especially effectively reflection of electromagnetic radiation by reflector 410,610.Utilize current distribution layer 420,620 to realize the particularly low-loss guiding of operating current to semiconductor layer sequence 2.

The reflector preferably has at 50nm to the thickness between the 200nm, particularly preferably has at 100nm to the thickness between the 140nm, wherein comprises boundary value respectively.First and/or second

electric connection layer

4,6 can additionally have and increases attached layer (not shown in FIG.).Increase attached layer and for example have platinum or titanium, and for example have the thickness of 0.1nm.What conform with purpose is, from the front on the direction at the back side, reflector 410,420 and current delivery layer 420,620 are followed after increasing attached layer.

In this embodiment, independently support substrate 7 by the conduction weld layer or adhesive phase 8 be fixed to separating layer 5 the subregion on and be fixed on second electric connection layer 6.Yet, alternatively, also second electric connection layer 6 can be configured to support substrate 7.Can save fixed bed 8.For example, second electric connection layer 6 strengthens by electroplating deposition, make its be mechanically stable and particularly from the support substrate 7 of supporting.In this expansion scheme, opto-electronic semiconductor body does not preferably have other support substrate 7.Similarly, in one of this embodiment or additional embodiments, also 4 enhancings of first electric connection layer can be used to form support substrate 7.

In a flexible program of the semiconductor body of first and/or second

electric connection layer

4,6 that has enhancing, two articulamentums do not exceed the semiconductor layer sequence in the side, so that positive joint face is provided.So conforming with the destination, semiconductor body on its back side, has first and second contact sites 41,61.Semiconductor body can substitute in this expansion scheme or also have support substrate 7 except strengthening first and/or second electric connection layer on its back side, and this support substrate has first and second

electrical contacts

41,61 overleaf.

Be that according to the opto-electronic semiconductor body of the 3rd embodiment with according to another difference between the semiconductor body of preceding two embodiment semiconductor layer sequence 2 has the specular layer 10 of semiconductive or electric insulation on its back side.Specular layer 10 particularly with second interarea 202 in abutting connection with or adjacent with second interarea 202 at least.

Specular layer can comprise dielectric, as SiO ₂The refractive index of specular layer and particularly differ 1 or bigger with the refractive index of the layer of second interarea, 202 adjacency or adjacent with second interarea 202 at least semiconductor layer sequence.At this, specular layer 10 comprises distributed Bragg reflector (DBR, Distributed Bragg-Reflector).It is right that distributed Bragg reflector has at least one alternately high and low layer of refractive index.The Bragg reflector that is made of dielectric layer is known to those skilled in the art in principle, and does not therefore set forth in more detail at this.It is right to substitute the layer that is made of dielectric layer, and it is right that Bragg reflector also can have the layer that constitutes by transparent conductive oxide, as ITO.Comprising the specular layer 10 with layer right Bragg reflector that is made of transparent conductive oxide can be semiconductive or or even conduction.Realize extra high reflectivity by specular layer 10.

For example, first electric connection layer 4, second electric connection layer 6 and in case of necessity specular layer 10 will reflect back 80% or more by the direction of active layer 23 towards the electromagnetic radiation of the direction emission at the back side towards the front, preferably 90% or more, and particularly preferably 95% or more.

Specular layer 10 preferably cover semiconductor layer sequence 2 second interarea 202 50% or more.It has one or more opening 110, the first electric connection layers 4 and extends by these openings.In the zone of opening 110, first electric connection layer 4 is connected with semiconductor layer sequence 2 conductions.Preferably, specular layer 10 has a plurality of openings 110, and they can be irregularly or regularly, for example be arranged on the grid point of contemplated grid.The gravel size decision ground of opening is relatively little, so they are the so-called connection contacts (Knuepfelkontakte) that electrically contact by first electric connection layer 4.

Vertical view with the front of semiconductor body in Fig. 6 shows this expansion scheme, has wherein saved the semiconductor layer sequence 2 that has current distribution layer 9.Be different from Fig. 3, second among Fig. 6 electrically contacts the district and 61 is not disposed in the back side of semiconductor body, is set for front contact semiconductor body from semiconductor body but be similar to first embodiment.Electrically contacting

district

41,61 extends on the whole side length at semiconductor body basically at this.

Specular layer 10 has a plurality of openings 110, and they have circular cross section at this.Opening 110 is disposed on the grid point of contemplated rectangle or square grid.In first opening 110, be furnished with the part of first electric connection layer 4.The subregion of second electric connection layer 6 extends through second opening 110.First and second openings 110 are arranged by arow respectively at this.Other layout can be provided with equally.

In the improvement project that also is suitable for other execution modes of this embodiment, separating layer 5 is built as the specular layer of electric insulation at least in part, and it particularly has distributed Bragg reflector (DBR).For example, at least one of separating layer 5 be disposed in the recess 3 and/or so made up with the part of recess 3 adjacency.

Schematically shown the part of the opto-electronic semiconductor body of Fig. 3 in Fig. 7 and 8, wherein current extending 9 and specular layer 10 are removed for simplicity of illustration.

Fig. 7 illustrates the fringe region of the semiconductor body that has first electrical contacts 41.This sectional view is rotated 180 degree with respect to Fig. 3, makes the contact site 41 of winning be disposed in the right side of Fig. 7.First electrical contacts 41 is built as bond pad.When making semiconductor body, for example after the fringe region of removing the semiconductor layer sequence, in separating layer 5, produce opening for this reason, and subsequently bond pad 41 is deposited in this opening.

Fig. 8 illustrates the schematic cross-section of the recess 3 of flute profile, and the separated layer 5 of the sidewall of this recess covers.

Fig. 4 illustrates the 4th embodiment of opto-electronic semiconductor body.Different with the embodiment of front, in this embodiment, the portion of running through 3 of passing active area 23 implements as the portion of running through of extending on the whole thickness of semiconductor layer sequence 2.So running through portion 3 extends up to second interarea 202 from first interarea 201 at this.The portion of running through is hole or the slot in the semiconductor layer sequence 2 thus.

This by first interarea 201 of alligatoring on, except the current extending on the back side that is arranged in semiconductor layer sequence 29, also be furnished with another current extending 9 ' at this.This another current extending 9 ' for example has transparent conductive oxide equally, as ITO.Utilize this another current extending 9 ', realize operating current being flowed to active area 23 especially equably by second electric connection layer 6.

As among the 3rd embodiment, also has specular layer 10 according to the semiconductor body of the 4th embodiment.At this, substitute or except separating layer 5, specular layer 10 is disposed between second interarea 202 and second electric connection layer 6 of semiconductor layer sequence 2.

Second electric connection layer 6 extends in the subregion of passing through first electric connection layer 4 from the back side on the direction in front at least in first three embodiment, and situation is really not so in the 4th embodiment.In the 4th embodiment, first articulamentum 4 covers second articulamentum 6 at least in part in the vertical view at the back side of semiconductor body.

The present invention is owing to the description by embodiment is confined to these embodiment, but comprise the new arbitrarily feature and the combination in any of feature, this particularly comprises the combination in any of the feature in the claim, even this feature or should combination itself be illustrated in claim or embodiment clearly.

Claims

1. An optoelectronic semiconductor body having: a semiconductor layer sequence having an active layer suitable for generating electromagnetic radiation; and a first and a second electrical connection layer, wherein

- the semiconductor body is arranged to emit electromagnetic radiation from the front side,

- the first and the second electrical connection layer are arranged on the rear side opposite the front side and are electrically insulated from each other by means of the separating layer,

- the first electrical connection layer, the second electrical connection layer and the separation layer overlap laterally, and

- A partial area of the second electrical connection layer extends from the back side through the penetrating portion of the active layer toward the front side.

2. The optoelectronic semiconductor body as claimed in claim 1, wherein the first and/or the second electrical connection layer reflects part of the electromagnetic radiation emitted by the active region in the direction of the rear in the direction of the front.

3. The optoelectronic semiconductor body as claimed in claim 1, wherein the semiconductor layer sequence has no growth substrate.

4. The optoelectronic semiconductor body as claimed in claim 1, which has a carrier substrate on its rear side.

5. The optoelectronic semiconductor body as claimed in claim 1, wherein a semiconducting or electrically insulating mirror layer is at least partially arranged between the semiconductor layer sequence and the first and/or second electrical connection layer, the mirror layer The layer has a plurality of openings, and the first and/or the second electrical connection layer extends through the openings towards the semiconductor layer sequence.

6 . The optoelectronic semiconductor body as claimed in claim 1 , wherein the semiconductor layer sequence has a current spreading layer adjacent to the rear side, which current spreading layer contains a transparent conductive oxide.

7. The optoelectronic semiconductor body as claimed in claim 1, wherein the first and/or the second electrical connection layer has a multilayer structure with an adhesion-promoting layer, a reflection layer and/or a current distribution layer.

8. The optoelectronic semiconductor body as claimed in claim 1, wherein the first electrical connection layer has electrical contact regions which are suitable for electrically contacting the semiconductor body from its front side.

9. The optoelectronic semiconductor body as claimed in claim 1, wherein the second electrical connection layer has electrical contact regions which are suitable for electrically contacting the semiconductor body from its front side.

10. The optoelectronic semiconductor body as claimed in claim 1, wherein the first and/or the second electrical connection layer has electrical contact regions which are suitable for electrically contacting the semiconductor body from its rear side.

11. The optoelectronic semiconductor body as claimed in claim 1, wherein the semiconductor layer sequence has a buffer layer arranged on the front side, which buffer layer has a low electrical conductivity and is undoped or slightly n-doped.

12. A method for manufacturing an optoelectronic semiconductor body, comprising the steps of:

- epitaxially growing a semiconductor layer sequence on a growth substrate, which semiconductor layer sequence has an active layer suitable for generating electromagnetic radiation and is arranged to emit electromagnetic radiation from the front side;

- applying a first electrical connection layer on the back side of the semiconductor layer sequence;

- construction of penetrations in the active layer;

- building up a separation layer on the back side of the semiconductor layer sequence; and

- applying a second electrical connection layer on the back side of the semiconductor layer sequence,

in

- the first electrical connection layer, the separation layer and the second electrical connection layer are constructed laterally one above the other,

- a partial region of the second electrical connection layer is formed in the penetration, and

- The second electrical connection layer is electrically insulated from the first electrical connection layer by means of the separating layer.

13. The method of claim 12, wherein at least a portion of the growth substrate is removed and a support substrate is arranged or built on the backside.

14. The method according to any one of claims 12 to 13, wherein

- partially forming a semiconducting or electrically insulating mirror layer on the rear side of the semiconductor layer sequence,

- constructing a plurality of openings in the semiconducting or electrically insulating mirror layer, and

- applying the first and/or second electrical connection layer such that they extend through the opening.

15. The method according to one of claims 12 to 14, wherein epitaxially growing the semiconductor layer sequence comprises growing a buffer layer with low electrical conductivity, removing at least a part of the growth substrate, and exposing the buffer layer when removing the growth substrate .