CN101651237A - Assembling method of lithium battery protection circuit board with chip directly placed on - Google Patents
Assembling method of lithium battery protection circuit board with chip directly placed on Download PDFInfo
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- CN101651237A CN101651237A CN200910042195A CN200910042195A CN101651237A CN 101651237 A CN101651237 A CN 101651237A CN 200910042195 A CN200910042195 A CN 200910042195A CN 200910042195 A CN200910042195 A CN 200910042195A CN 101651237 A CN101651237 A CN 101651237A
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- printed circuit
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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Abstract
The invention provides an assembling method of lithium battery protection circuit board with a chip directly placed on. An MOSDET chip and an IC chip are directly placed on the circuit board and are bonded and fixed by binding material, and then a metal wire or a metal strip is used to connect the pads of the two with the pads on the circuit board, and finally cladding agent is used to cover the whole body for protection, so as to complete assembling. The concrete application technologies can be classified to: a first one, preparing a circuit board-placing a chip-solidifying-welding a metal wire or metal strip-dropping cladding agent and encapsulating-placing a resistor-capacitor unit-completing assembling; and a second one, preparing a circuit board-placing a resistor-capacitor unit-placing a chip-solidifying-welding a metal wire or metal strip-dropping cladding agent and encapsulating-completing assembling. The invention can cause the circuit board to turn to be narrower and thinner,is applicable to hand-held electronic products sensitive to shape and size, dispenses with the chip encapsulation testing link, avoids on resistance and signal delay caused by encapsulation and alsosaves material cost.
Description
Technical field
The present invention relates to a kind of assemble method of chargeable lithium battery charge-discharge protection circuit plate, more specifically relate to a kind of assembling that is suitable for the protective circuit plate of single-unit that various portable type electronic products use or multisection lithium battery.
Background technology
Lithium battery is acknowledged as the desirable energy of 21 century development because operating voltage height, energy density height, memory-less effect, pollution-free, light weight, self discharge are little, quick charge, not containing metal lithium, many distinct advantages such as have extended cycle life.In mobile communication such as portable electronics such as mobile phone, MP4, laptop computer, video camera, GPS, be widely used at present.Along with succeeding in developing of novel battery material, the high power capacity lithium battery will progressively play an important role at high-power energy fields such as electric automobile, artificial satellite, Aero-Space and energy storage.
Because the chemical characteristic of lithium battery, in normal use, electric energy is being carried out in its inside and chemical energy transforms mutually, and unsuitable charge and discharge might be shortened serious problems such as battery life or initiation chemical side reactions generation battery explosion.So each lithium ion battery all contains a protective circuit, put to avoid overcharging, to cross, phenomenons such as overcurrent, short circuit and excess temperature, well use safely guaranteeing.
Protective circuit and battery are fitted together and constitute complete lithium battery.The lithium battery protection circuit of main flow is formed by discharging and recharging control IC, switching transistor MOSFET and passive Resistor-Capacitor Unit at present; the charge and discharge protecting IC of switching transistor also appearred integrated recently; the outside only needs a spot of resistance or electric capacity, improves widely and has simplified circuit.Miniaturization day by day along with the profile of hand-held electronic product; lithium battery is also more and more thinner little; and then require lithium battery protection circuit littler and thinner, because resistance and electric capacity profile can be very little, in fact the profile of IC and MOSFET has just determined the profile size of bearer circuit plate.And, requiring the conducting resistance of MOSFET littler along with the decline of overcurrent monitoring threshold voltage, the control signal transmission is more accurate.Its protective circuit plate all is to adopt traditional surface mounting technology assembling at present, promptly packaged chip and the welding of passive Resistor-Capacitor Unit is assemblied on the circuit board.Yet area of chip and thickness through encapsulation are all big than what do not encapsulate, further dwindle so the area size of whole bearer circuit plate and thickness are very difficult, and encapsulation also can significantly increase the conducting resistance of chip and the delay of acceleration transmission signals.
Summary of the invention
Technological deficiency at the prior art existence; the present invention discloses a kind of assemble method of chip directly placed lithium battery protection circuit plate on circuit board; it is to replace traditional SMT technology with MOSFET chip and IC are chip directly placed on circuit board; because MOSFET chip and the IC chip un-encapsulated used; so can realize thinner little circuit board overall dimension, also reduce defectives such as the excessive and IC transmission signals delay of MOSFET conducting resistance that package parasitics brings.
For achieving the above object; technical scheme of the present invention is as follows: the present invention is without encapsulation in advance with MOSFET chip and IC chip; directly be mounted on the printed circuit board; be that MOSFET chip and IC chip are adhesively fixed on the printed circuit board by binding material; with metal wire or metal tape pad on MOSFET chip and the IC chip and the pad on the printed circuit board are welded to connect again, are protected to finish the assembling of protective circuit plate with all join domains of chip covering covering chip and chip and board pads at last.Adopt the concrete main technique flow process of implementing of the inventive method that two kinds of differences are arranged again: first kind: a circuit board preparation-pasting chip-curing-weldering metal wire or a weldering metal tape-covering are sealed-are mounted Resistor-Capacitor Unit-assembling and finish; Second kind: Resistor-Capacitor Unit-pasting chip-curing-weldering metal wire prepared-mount by circuit board or a weldering metal tape-covering is sealed-assembled and finishes.
The present invention compared with prior art, have following obvious improvement and outstanding characteristics: adopt chip directly placed method, circuit board can be realized narrower and frivolous profile, be more suitable for hand-held electronic product to the profile magnitude, directly save the packaging and testing link of chip, conducting resistance and the signal delay of having avoided encapsulation to introduce have finally also been saved Material Cost, reduced the production cycle and have been improved packaging efficiency.The present invention is suitable for the assembling of the protective circuit plate of single-unit that various portable type electronic products use or multisection lithium battery, is particularly suitable for the assembly of the protective circuit plate of single-unit lithium battery.
Description of drawings
The invention will be further described below in conjunction with drawings and Examples.
Fig. 1 is the front schematic view of printed circuit board of the present invention;
Fig. 2 is the schematic rear view of printed circuit board of the present invention;
Fig. 3 is resistance, electric capacity and the chip attachment schematic diagram on printed circuit board;
Fig. 4 is the schematic diagram that drips the covering protection;
Fig. 5 is the circuit catenation principle figure that the present invention assembles the lithium battery protection circuit plate after finishing.
Among the figure: 1, printed circuit board, 2, charging is anodal, 3, target, 4, the charging negative pole, 5, via hole, 6, metal wire, 7, covering, 8, the pad on the printed circuit board, 9, mount the MOSFET bonding pads, 10, mount the pad of resistance, capacity cell, 11, the electrode pad on MOSFET chip and the IC chip.
Embodiment
The present invention is with the assemble method of chip directly placed lithium battery protection circuit plate on circuit board; concrete manufacturing process steps is as follows: referring to shown in Figure 1; be ready to the two-sided single layer printed circuit plate 1 of suitable wiring, with the long 20mm of being designed and sized to of circuit board 1 * wide 3mm * thick 1mm, according to the needs of assembling; the length range of circuit board is 10mm～35mm; be preferably 20mm, width range is designed to 2～5mm, is preferably 3mm; thickness range is designed to 0.5～3mm, is preferably 1mm.The front of circuit board 1 distributes and mounts the pad of electronic devices and components, and the circuit board front mounts electronic devices and components, and the two ends in circuit board front are respectively " Battery+ " positive terminal pad and " Battery-" negative terminal pad that connects lithium battery core material positive and negative electrode.The material of pad is a metal, and bulk material is a copper, surface coverage nickel/gold plate.
Referring to shown in Figure 2, reverse side one side of circuit board 1 three the connection electrode pads that distribute successively are respectively the pad of charging anodal 2, the pad of target 3 and the pad of charging negative pole 4.Wherein " Battery+ " positive terminal pad in the pad of charging anodal 2 and circuit board front back-to-back, by three via hole 5 direct interconnection.The aperture of via hole is 0.3mm, and the disk track of via hole is 0.6mm.Generally as required, aperture design is 0.2mm～1mm, and disk track is designed to 0.4～1.5mm.The material of pad and via hole is a metal, and bulk material is a copper, surface coverage nickel/gold plate.
Referring to Fig. 3 and shown in Figure 4, the front of circuit board 1 is distributed with: by the pad 8 on metal wire and the printed circuit board that aluminum pad electrode on the chip is connected, and mount MOSFET bonding pads 9, and mount the pad 10 of resistance, capacity cell, the material of pad is a metal, bulk material is a copper, surface coverage nickel/gold plate.At first with filter resistance R1, filter capacitor C1, current detecting end current-limiting resistance R2 and these resistance of target biasing resistor R3 and capacity cell are mounted on the printed circuit board by SMT technology, again will be without the MOSFET chip and the IC chip of encapsulation in advance, directly be mounted on the printed circuit board 1, promptly respectively MOSFET chip and IC chip are adhesively fixed on printed circuit board and mount on the MOSFET bonding pads 9 by binding material, binding material adopts conducting resinl or non-conductive glue or metal soldering paste or brazing metal, settable cementitious then material, with metal wire 6 pad 8 on electrode pad on MOSFET chip and the IC chip 11 and the printed circuit board is welded to connect again, metal wire 6 also can be a metal tape, and the material of metal wire or metal tape adopts gold in the present embodiment, silver, copper or aluminium.At last, with chip covering 7 the interconnect area covering of MOSFET chip, IC chip and MOSFET chip, IC chip and printed circuit board is protected.Lithium battery protection circuit plate after assembling is finished; its from " Battery+ " positive terminal pad to ' ' Battery-" negative terminal pad, the centre is distribution filtering resistance R 1, filter capacitor C1, charge and discharge protecting IC chip, MOSFET chip, current detecting end current-limiting resistance R2 and target biasing resistor R3 successively.
In the foregoing description; certainly; also can adopt the said encapsulation of claim to mount in proper order; promptly at first will be without the MOSFET chip and the IC chip of encapsulation in advance; directly be mounted on the printed circuit board 1; promptly respectively MOSFET chip and IC chip are adhesively fixed on printed circuit board and mount on the MOSFET bonding pads 9 by binding material; settable cementitious then material; with metal wire 6 pad 8 on electrode pad on MOSFET chip and the IC chip 11 and the printed circuit board is coupled together again; use chip covering 7 with the MOSFET chip again; IC chip and MOSFET chip; the interconnect area of IC chip and printed circuit board covers and is protected, at last with filter resistance R1; filter capacitor C1; current detecting end current-limiting resistance R2 and these resistance of target biasing resistor R3 and capacity cell are mounted on the printed circuit board by SMT technology.
Referring to Fig. 3 and shown in Figure 5, wherein 11 designs of the electrode pad on the IC chip are at the periphery of chip, described electrode pad 11 is respectively power supply power anodal VCC, earth polar VSS, discharge control output end OD, current detecting end CSI and charging control output end OC five electrodes, accurate position, quantity and the sizes etc. of the electrode pad on the chip are as the criterion with the product data handbook of chip, and the Facing material of electrode pad generally is a metallic aluminium.The regional periphery that mounts the IC chip is distributed with the finger-shaped electrode pad 8 of 5 round rectangles (being the pad on the printed circuit board), respectively with chip on electrode pad corresponding one by one.The Design of length of finger-shaped electrode pad is 0.6～0.8mm, is preferably 0.7mm, and width is designed to 0.050～0.150mm, is preferably 0.1mm, and the interval between each finger-shaped electrode pad is not less than 0.125mm.IC chip edge after mounting is not less than 0.325mm apart from the distance of 5 finger-shaped electrode pads of periphery, and the outermost border of IC chip edge and circuit board distance is not less than 0.325mm.
Referring to shown in Figure 3, there are two electrode pads 11 in the front of MOSFET chip, this electrode pad 11 is respectively the G utmost point and the S utmost point, the S pole-face is long-pending long-pending greater than the G pole-face, accurate position, quantity and the size of the electrode pad on the chip is as the criterion with the product data handbook of chip, and the Facing material of electrode pad generally is a metallic aluminium.The back side of MOSFE-F chip generally covers the thin gold layer of one deck or thin silver layer as the D utmost point.Two MOSFET can by two chips that separate separately form or one without two chips scratching separation.The peripheral left and right sides, zone that mounts the MOSFET chip is symmetrically distributed with the finger-shaped electrode pad 8 (being the pad on the printed circuit board) of 4 round rectangles, and the G utmost point and the S utmost point with two MOSFET chips is corresponding one by one respectively.With the Design of length of the extremely corresponding finger-shaped electrode pad 8 of G is 0.6～0.8mm, preferred 0.7mm, and width is designed to 0108～0.2mm, preferred 0.1mm; With the Design of length of the extremely corresponding finger-shaped electrode pad 8 of S is 0.6～0.8mm, preferred 0.7mm, and width is designed to 0.5～1.2mm, preferred 0.8mm.
Above-mentioned resistance R 1, R2, R3 and capacitor C 1 all adopt 0603 profile, and as required, resistance R 1, R2, R3 and capacitor C 1 also can be designed to 0402,0403 or 0805 profile.The size of resistance R 1, R2, R3 and C1 is chosen according to the recommendation and the side circuit application experience of the product performance databook of IC.General 100 Ω≤R1≤1000 Ω, 1000 Ω≤R2≤2000 Ω, 2000 Ω≤R3≤10000 Ω, 0.01 μ F≤C1≤100 μ F.
Above content is in conjunction with further describing that concrete main execution mode is done, and can not assert that concrete enforcement of the present invention is confined to these explanations.Those skilled in the art without departing from the inventive concept of the premise, some other technology of done accurately, the deduction or replace that beautify, all should belong to protection scope of the present invention.
Claims (2)
1, a kind of assemble method of chip directly placed lithium battery protection circuit plate on circuit board is characterized in that, MOSFET chip and IC is chip directly placed on circuit board, and its technology manufacturing process comprises the following steps:
A, circuit board are prepared: the two-sided single layer printed circuit plate that is ready to suitable wiring, the front of printed circuit board distributes and mounts the pad of electronic devices and components, the front of printed circuit board mounts electronic devices and components, and the two ends in circuit board front are respectively " Battery+ " positive terminal pad and " Battery-" negative terminal pad that connects lithium battery core material positive and negative electrode; Reverse side one side of circuit board three the connection electrode pads that distribute successively, be respectively charging positive terminal pad, target pad and charging negative terminal pad, " Battery+ " positive terminal pad in described charging positive terminal pad and circuit board front back-to-back, by the via hole direct interconnection;
B, pasting chip: without encapsulation in advance, directly be mounted on the printed circuit board MOSFET chip and IC chip by binding material;
C, curing: settable cementitious material is fixedly connected on MOSFET chip and IC chip on the printed circuit board;
D, weldering metal wire or weldering metal tape: electrode pad on MOSFET chip and the IC chip and the pad on the printed circuit board are welded to connect with metal wire or metal tape;
E, a covering are sealed: cover the interconnect area of MOSFET chip, IC chip and MOSFET chip, IC chip and printed circuit board at last with the chip covering, protected;
F, mount Resistor-Capacitor Unit: the resistance and the capacity cell that will comprise filter resistance R1, filter capacitor C1, current detecting end current-limiting resistance R2 and target biasing resistor R3 are mounted on the printed circuit board;
G, assembling are finished: the lithium battery protection circuit plate after assembling is finished; to " Battery-" negative terminal pad, the centre is distribution filtering resistance R 1, filter capacitor C1, charge and discharge protecting IC chip, MOSFET chip, current detecting end current-limiting resistance R2 and target biasing resistor R3 successively from " Battery+ " positive terminal pad for it.
2, a kind of assemble method of chip directly placed lithium battery protection circuit plate on circuit board is characterized in that, MOSFET chip and IC is chip directly placed on circuit board, and its technology manufacturing process comprises the following steps:
A, circuit board are prepared: the two-sided single layer printed circuit plate that is ready to suitable wiring, the front of printed circuit board distributes and mounts the pad of electronic devices and components, the front of printed circuit board mounts electronic devices and components, and the two ends in circuit board front are respectively " Battery+ " positive terminal pad and " Battery-" negative terminal pad that connects lithium battery core material positive and negative electrode; Reverse side one side of circuit board three the connection electrode pads that distribute successively, be respectively charging positive terminal pad, target pad and charging negative terminal pad, " Battery+ " positive terminal pad in described charging positive terminal pad and circuit board front back-to-back, by the via hole direct interconnection;
B, mount Resistor-Capacitor Unit: the resistance and the capacity cell that will comprise filter resistance R1, filter capacitor C1, current detecting end current-limiting resistance R2 and target biasing resistor R3 are mounted on the printed circuit board;
C, pasting chip: without encapsulation in advance, directly be mounted on the printed circuit board MOSFET chip and IC chip by binding material;
D, curing: settable cementitious material is fixedly connected on MOSFET chip and IC chip on the printed circuit board;
E, weldering metal wire or weldering metal tape: electrode pad on the chip and the pad on the printed circuit board are welded to connect with metal wire or metal tape;
F, a covering are sealed: cover the interconnect area of MOSFET chip, IC chip and MOSFET chip, IC chip and printed circuit board at last with the chip covering, protected;
G, assembling are finished: the lithium battery protection circuit plate after assembling is finished; to " Battery-" negative terminal pad, the centre is distribution filtering resistance R 1, filter capacitor C1, charge and discharge protecting IC chip, MOSFET chip, current detecting end current-limiting resistance R2 and target biasing resistor R3 successively from " Battery+ " positive terminal pad for it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910042195A CN101651237A (en) | 2009-08-27 | 2009-08-27 | Assembling method of lithium battery protection circuit board with chip directly placed on |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910042195A CN101651237A (en) | 2009-08-27 | 2009-08-27 | Assembling method of lithium battery protection circuit board with chip directly placed on |
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| CN101651237A true CN101651237A (en) | 2010-02-17 |
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| CN200910042195A Pending CN101651237A (en) | 2009-08-27 | 2009-08-27 | Assembling method of lithium battery protection circuit board with chip directly placed on |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102833939A (en) * | 2011-06-13 | 2012-12-19 | 鸿富锦精密工业（深圳）有限公司 | Capacitor performance optimization method and circuit board designed by applying same |
| CN103547075A (en) * | 2013-10-12 | 2014-01-29 | 中国科学院深圳先进技术研究院 | PCB board automatic detection and assembly production equipment |
| CN105611750A (en) * | 2015-12-21 | 2016-05-25 | 台州市日昌晶灯饰有限公司 | Fabrication technology of color light control circuit board |
| CN106410887A (en) * | 2015-07-30 | 2017-02-15 | 三美电机株式会社 | Multichip, battery protection apparatus, and battery pack |
| CN106998620A (en) * | 2016-01-25 | 2017-08-01 | 本田技研工业株式会社 | Electronic-circuit device |
| CN109076706A (en) * | 2016-02-29 | 2018-12-21 | 薄膜电子有限公司 | Use the electronic device and its manufacturing method of anisotropy conductiving glue useful in surface mounting technique and this method |
| CN111954392A (en) * | 2019-05-15 | 2020-11-17 | 株式会社小糸制作所 | Electronic component mounting substrate and method for manufacturing same |
-
2009
- 2009-08-27 CN CN200910042195A patent/CN101651237A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102833939A (en) * | 2011-06-13 | 2012-12-19 | 鸿富锦精密工业（深圳）有限公司 | Capacitor performance optimization method and circuit board designed by applying same |
| CN103547075A (en) * | 2013-10-12 | 2014-01-29 | 中国科学院深圳先进技术研究院 | PCB board automatic detection and assembly production equipment |
| CN103547075B (en) * | 2013-10-12 | 2016-08-31 | 中国科学院深圳先进技术研究院 | Pcb board automatically detects and assembles production equipment |
| CN106410887A (en) * | 2015-07-30 | 2017-02-15 | 三美电机株式会社 | Multichip, battery protection apparatus, and battery pack |
| CN106410887B (en) * | 2015-07-30 | 2019-12-24 | 三美电机株式会社 | Multi-chip, battery protection device and battery pack |
| CN105611750A (en) * | 2015-12-21 | 2016-05-25 | 台州市日昌晶灯饰有限公司 | Fabrication technology of color light control circuit board |
| CN106998620A (en) * | 2016-01-25 | 2017-08-01 | 本田技研工业株式会社 | Electronic-circuit device |
| US10547292B2 (en) | 2016-01-25 | 2020-01-28 | Honda Motor Co., Ltd. | Electric circuit device |
| CN106998620B (en) * | 2016-01-25 | 2020-03-20 | 本田技研工业株式会社 | Electronic circuit device |
| CN109076706A (en) * | 2016-02-29 | 2018-12-21 | 薄膜电子有限公司 | Use the electronic device and its manufacturing method of anisotropy conductiving glue useful in surface mounting technique and this method |
| CN111954392A (en) * | 2019-05-15 | 2020-11-17 | 株式会社小糸制作所 | Electronic component mounting substrate and method for manufacturing same |
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Open date: 20100217 |