CN101576576B - Probe card assembly and intermediary device used for probe card assembly - Google Patents

Abstract

The invention discloses a probe card assembly and an intermediary device used for the probe card assembly, which are used for testing a wafer to be tested and mainly comprise a mother board and a daughter board. The daughter board is provided with a plurality of test probes near the center for contacting the wafer to be tested. The daughter board is provided with a plurality of first electrical contacts in an annular array towards the motherboard, and a plurality of second electrical contacts in an annular array are arranged outside the opening of the central part of the motherboard corresponding to the first electrical contacts. The probe card assembly further comprises at least one spacer and a plurality of intermediary devices, wherein the spacer has a preset thickness and is arranged between the mother board and the daughter board, and a plurality of slots are formed in the spacer so as to accommodate the intermediary devices.

Description

Probe card assembly and intermediary device used for probe card assembly

technical field

The present invention relates to a probe card assembly and an intermediary device used in the probe card assembly, in particular to the probe card assembly used for wafer testing.

Background technique

In the past, in the semiconductor wafer process, in order to test the good and bad of the die on the wafer before the wafer is diced, it is necessary to use a high-performance probe card (probe card) to perform wafer testing, as in the previous technology. As disclosed in US Publication Nos. US6292005, US6184698, US6398570, US6478596, etc., the probe card has a precise contact mechanism, which is used to make contact with the wafer to be tested, conduct the circuit, and perform electrical testing. However, the structure of the probe card is quite complicated, and it must be processed with semiconductor-level technology, so the cost is very expensive. And when the IC design and layout in the die are different, the probe card must also be replaced and remade; often in order to test a new IC design and spend a very expensive price to make the probe card, if the test is unsuccessful, then The entire set of probe cards is scrapped, and the cost burden is extremely high, which has caused many companies in the industry to hesitate. Therefore, if a probe card assembly can be provided with replaceable components, when the IC design is different, only part of the components need to be replaced, and the rest of the probe card can still be used, so that the probe card can be reused, And it reduces the manufacturing cost of the probe card, which is really a great boon for the industry.

Contents of the invention

In order to solve the unsatisfactory problems of the above-mentioned prior art, the present invention proposes a probe card assembly and an intermediary device used in the probe card assembly for wafer testing. It mainly includes a mother board and a replaceable daughter board. The daughter board is provided with a plurality of test probes near the center for contacting a wafer to be tested. The daughter board is provided with a plurality of first electrical contacts in an annular array toward the motherboard, and the outer side of the opening in the central part of the motherboard is corresponding to the first electrical contacts, and a plurality of second electrical contacts are arranged in an annular array. contact. The probe card assembly further includes at least one spacer and a plurality of intermediary devices, wherein the spacer has a predetermined thickness and is disposed between the motherboard and the daughter board, and is provided with a plurality of slots so that The intermediary device is accommodated therein. The upper and lower sides of the intermediary device respectively have a plurality of third electrical contacts and fourth electrical contacts, and the intermediary device can be elastically deformed after being compressed, so that the third electrical contacts are used to contact the first electrical contacts, The fourth electrical contact is used to contact the second electrical contact, so that the electrical signal is conducted from the first electrical contact to the second electrical contact through the intermediary device, that is, the electrical signal is conducted from the daughter board to the motherboard. Because the sub-board is replaceable, when the IC design is different and the probe card needs to be changed, just remove the sub-board and replace it with another sub-board made according to the new IC design, and then connect the new sub-board to the mother board. The board is combined, and at the same time, the parallelism and electrical transmission between the daughter board and the mother board are adjusted through the spacer and the intermediary device, so that the probe card can be reused and the manufacturing cost of the probe card can be reduced.

Therefore, the main purpose of the present invention is to provide a probe card assembly, which mainly includes a mother board and a daughter board, wherein the circuit design on the daughter board can be designed according to different requirements, and then replaced, so that the process, testing and labor can be saved. Manufacturing overhead.

The secondary purpose of the present invention is to provide a kind of intermediary device used in the probe card assembly, which has elasticity and conductive effect, and is arranged between the motherboard and the daughter board of the probe card assembly, in order to firmly transmit the motherboard and the daughter board. Electrical signals between daughter boards.

Description of drawings

FIG. 1 is a schematic diagram of a probe card assembly according to the first preferred embodiment of the present invention.

Fig. 2 is a top view, which is an intermediary device according to the first or second preferred embodiment of the present invention.

Fig. 3 is a side view, which is an intermediary device according to the first or second preferred embodiment of the present invention.

FIG. 4 is a partially enlarged view of part A in FIG. 3 .

Description of main component symbols:

Probe Card Components 20

Motherboard 1

Opening 11

The second electrical contact 12

Daughter Board 2

Test Probes 21

The first electrical contact 22

Spacer 3

Grooving 31

Hollow Ring Structure 32

Intermediary device 4

Body 41

First frame 411

Second frame 412

Elastic conductive pin 42

The third electrical contact 421

The fourth electrical contact 422

Locating pin 43

Detailed ways

Since the present invention discloses a probe card assembly and an intermediary device used in the probe card assembly for testing a wafer to be tested, the principle of use and basic functions of the probe card assembly have already been known in the related technical field Usually knowledgeable people can understand it, so the description below will not give a complete description. At the same time, the diagrams compared below are structural representations related to the features of the present invention, and are not and need not be completely drawn according to the actual size, so please describe first.

Please refer to FIG. 1 to FIG. 4 , which are the first preferred embodiment of the present invention, which is a probe card assembly 20 for testing a wafer to be tested. The probe card assembly 20 mainly includes a motherboard 1 and a daughter board 2 , and the daughter board 2 is provided with a plurality of test probes 21 near the center for contacting the wafer to be tested. A plurality of first electrical contacts 22 arranged in a circular array are arranged on the side of the daughter board 2 facing the direction of the mother board 1, and an opening 11 is provided in the central part of the mother board, and the outer side of the opening 11 corresponds to the first electrical contacts 22. Where the contacts 22 are located, there are also a plurality of second electrical contacts 12 arranged in a circular array. Further, the probe card assembly 20 includes at least one spacer 3 and a plurality of intermediary devices 4 for transmitting electrical signals, wherein the spacer 3 has a preset thickness and is disposed between the motherboard 1 and the daughter board 2 There are a number of slots 31 on it, so that the intermediary device 4 can be accommodated therein, and it also has the meaning of protecting the intermediary device 4. When the motherboard 1 and the sub-board 2 are combined and locked, due to The supporting force provided by the spacer 3 in the thickness direction prevents the motherboard 1 and the sub-board 2 from crushing the intermediary device 4 . The upper and lower sides of the intermediary device 4 respectively have a plurality of third electrical contacts 421 and fourth electrical contacts 422, wherein the third electrical contacts 421 can be used to contact the first electrical contacts 22 of the sub-board 2 and the second electrical contacts 421. The four electrical contacts 422 can be used to contact the second electrical contacts 12 of the motherboard 1, and the intermediary device 4 can be elastically deformed after being compressed. When the probe card assembly 20 is assembled into a finished product, the intermediary device 4 is slightly compressed. In this way, the contact between the first electrical contact 22, the second electrical contact 12, the third electrical contact 421 and the fourth electrical contact 422 can be made closer, so that the electrical signal can be stably transmitted from the first An electrical contact 22 is connected to the second electrical contact 12 through the intermediary device 4 . It should be noted that since the mother board 1 and the daughter board 2 are independent entities, the daughter board 2 can be designed and replaced according to different requirements, thus saving manufacturing costs in process, testing and production, and improving the process, Manufacturing efficiency in testing and production, and due to the use of the spacer 3 and the elastic intermediary device 4, the error caused by the difference in parallelism between the motherboard 1 and the daughter board 2 can be eliminated, and the electrical signal can be transmitted stably .

In order to make the electrical signals of the motherboard 1 and the daughter board 2 have a good conduction, the intermediary device 4 further includes a plurality of elastic conductive pins 42, one end of which is a third electrical contact 421, and the other end is a fourth electrical contact 422. The elastic conductive pin 42 contains conductive metal particles and appropriate polymer materials, wherein the material of the conductive metal particles is gold, the gold is to provide good electrical conduction characteristics, and the polymer material is to provide appropriate elasticity to allow compression after compression. deformation. The intermediary device 4 further includes a body 41, the body 41 includes a first frame 411, and a second frame 412 covering the outside of the first frame 411, wherein the elastic coefficient of the second frame 412 is smaller than that of the first frame 411 , that is, the rigidity of the first frame 411 is better to maintain the necessary configuration, and the second frame is softer to provide elastic deformation. Furthermore, the intermediary device 4 is further protruded with a pair of positioning pins 43 for inserting into positioning holes provided on the motherboard 1 or daughter board 2 , so that the positioning of the intermediary device 4 in the probe card assembly 20 is more precise and stable.

The above-mentioned spacer 3 is a hollow ring structure 32, and the spacer 3 can be composed of a single planar member to form the hollow ring structure 32 and the slots 31, or can be composed of a plurality of planar members to form a hollow ring. The structure 32 and the slots 31 are preferably composed of a single planar member to form the hollow ring structure 32 and the slots 31 .

In the above-mentioned probe card assembly 20, the test probe 21 used therein can be a cantilever probe as shown in FIG. 1, or a pogo pin (not shown) can also be used.

The present invention further provides a second preferred embodiment, which is an intermediary device 4 used in the probe card assembly 20 . The intermediary device 4 includes a body 41 and a plurality of elastic conductive pins 42, the features of which are as disclosed in the aforementioned first preferred embodiment.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the scope of rights of the present invention; at the same time, the above descriptions should be clear and implementable for those who are familiar with the technical field, so others do not depart from the disclosure of the present invention. Equivalent changes or modifications made under the spirit of the invention should be included in the scope of the claims.

Claims (6)

1. a probe card assembly is used for the test of a wafer to be measured, mainly comprises a motherboard and daughter board, is provided with a plurality of test probes near the said daughter board adjacent central, in order to the contact measured wafer, it is characterized in that:

Said daughter board is provided with a plurality of first electrical contacts towards said motherboard with the annular array shape, and said motherboard central part is provided with an opening, and said open outer side is provided with a plurality of second electrical contacts corresponding to said a plurality of first electrical contact places with the annular array shape; Said probe card assembly further includes at least one distance piece and a plurality of intermediaries device; Wherein said distance piece has a predefined thickness; And be arranged between said motherboard and the daughter board, which is provided with a plurality of flutings, so that said a plurality of intermediaries device is wherein ccontaining; Said a plurality of intermediaries device includes a plurality of elastic conduction pins; Said a plurality of elastic conduction pin one of which end is the 3rd electrical contact, and the other end is the 4th electrical contact, and said a plurality of elastic conduction pin includes conducting metal particles and suitable macromolecular material; And said a plurality of intermediaries device is the back elastically deformable by compression; So that said a plurality of the 3rd electrical contact is in order to contacting said a plurality of first electrical contact, said a plurality of the 4th electrical contacts are in order to contacting said a plurality of second electrical contact so that electric signal from said a plurality of first electrical contacts via said a plurality of intermediaries device conducting to said a plurality of second electrical contacts.

2. according to the described probe card assembly of claim 1; It is characterized in that; The thickness of said a plurality of intermediaries device is slightly larger than the predefined thickness of said distance piece, and the thickness of said a plurality of intermediaries device after being out of shape by compression is not less than the predefined thickness of said distance piece.

3. according to the described probe card assembly of claim 2; It is characterized in that; Said a plurality of intermediaries device further includes a body; Said body further includes one first framework, and is coated on the second outside framework of said first framework, and the elasticity coefficient of wherein said second framework is less than the elasticity coefficient of said first framework.

4. according to the described probe card assembly of claim 2, it is characterized in that the two ends of said a plurality of intermediaries device further convex with paired register pin, in order to insert the pilot hole that the location is arranged at said motherboard or said daughter board.

5. according to the described probe card assembly of claim 1, it is characterized in that said a plurality of test probes are cantalever type probe or spring probe.

6. according to the described probe card assembly of claim 1, it is characterized in that ring texture and said distance piece that said distance piece is hollow are ring texture and the said a plurality of flutings of forming hollow with single plane member or a plurality of plane member.

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