CN101562964B - Heat-conducting medium protecting cover and heating abstractor with the protecting cover - Google Patents
Heat-conducting medium protecting cover and heating abstractor with the protecting cover Download PDFInfo
- Publication number
- CN101562964B CN101562964B CN2008103011286A CN200810301128A CN101562964B CN 101562964 B CN101562964 B CN 101562964B CN 2008103011286 A CN2008103011286 A CN 2008103011286A CN 200810301128 A CN200810301128 A CN 200810301128A CN 101562964 B CN101562964 B CN 101562964B
- Authority
- CN
- China
- Prior art keywords
- heat
- conducting medium
- covering plate
- abstractor
- ribs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010438 heat treatment Methods 0.000 title 1
- 230000001681 protective effect Effects 0.000 description 20
- 230000000694 effects Effects 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 241000278713 Theora Species 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
- F28F2265/02—Safety or protection arrangements; Arrangements for preventing malfunction in the form of screens or covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a heat-conducting medium protecting cover which is used for covering a heat abstractor so as to protect the heat-conducting medium smeared on the heating abstractor; the heat-conducting medium protecting cover comprises a cover plate used for covering the heating-conducting medium; the cover plate is provided with a plurality of reinforcing ribs in a convex way; the reinforcing ribs are against the heating abstractor to lead that the cover plate does not contact the heat-conducting medium. The invention also comprises the heating abstractor provided with the heat-conducting medium protecting cover. The protecting cover and the heating abstractor can be applied in the assembly of various electronic devices needing heat dissipation.
Description
Technical field
The present invention is relevant with heat radiation, refers to especially a kind of heat conducting medium protective cover and the heat abstractor with this over cap.
Background technology
Development along with electronic industry, electronic component (particularly central processing unit) running frequency and speed improve constantly, the heat that electronic component produces also increases thereupon, temperature constantly raises, have a strong impact on the normal operation of electronic component, in order to guarantee the normal operation of electronic component, usually at electronical elements surface one radiator is installed, in time get rid of with the heat that electronic component is produced, if but radiator is directly installed on the surface of electronic component, there is the gap between radiator and the electronical elements surface, air in the gap has increased hot biography impedance, make the radiating effect of radiator not good, reduce interface heat for the surperficial close contact that makes radiator and electronic component and pass impedance, industry is coating one deck heat-conducting medium between radiator and electronic component usually, it can fill the gap between radiator and the electronical elements surface on the one hand, make the Surface Contact of radiator and electronic component more abundant and tight, on the other hand, heat-conducting medium has higher pyroconductivity, has strengthened the thermal conduction effect between radiator and the heat-generating electronic elements.
Usually when the assembling computer; first heat-conducting medium is applied in the radiator bottom surface; then radiator is installed on the electronic component; but because heat-conducting medium is the easy contaminative chemical substance of a kind of paste; during the assembling computer; heat-conducting medium is easy on pickup other elements in the computer; therefore it is very inconvenient to implement this operation in the process of assembling computer; for reducing the trouble of assembling process; the dealer is coated with heat-conducting medium usually in advance on the radiator finished product; then an over cap is installed on the radiator with the protection heat-conducting medium; when the needs installation of heat radiator; remove over cap, radiator can be fixed to and treat on the radiating electronic element, prevent that the heat-conducting medium pickup is to other place.A kind of heat conducting medium protective cover that Chinese patent discloses for No. 99235745.4 is installed on the heat abstractor surface that is coated with heat-conducting medium, comprises that lid, guard space reach fixedly ora terminalis.Wherein, this lid is positioned at the central part of this heat conducting medium protective cover and is a concave inward structure; comprise roof and sidewall; this guard space is formed space, lid indent position; be used for hiding the heat-conducting medium of smearing on the heat abstractor; should be fixedly ora terminalis be positioned on the periphery of lid, this fixed part is arranged on fixedly on the ora terminalis, is used for installing this heat conducting medium protective cover on heat abstractor.But because over cap is made of plastics usually; very easily produce the bending distortion, the concave inward structure of above-mentioned over cap often bends distortion owing to being subject to external force, thereby contacts with heat-conducting medium; heat-conducting medium is scratched, be installed to the radiating effect of the radiator on the electronic component after the impact.
Summary of the invention
In view of above content, be necessary to provide a kind of heat conducting medium protective cover that can effectively protect heat-conducting medium.
A kind of heat conducting medium protective cover; be used for covering and spreading upon heat-conducting medium on the heat abstractor with protection on the heat abstractor; described heat conducting medium protective cover comprises that one is used for hiding the covering plate of described heat-conducting medium; be convexly equipped with some ribs on the described covering plate, described ribs is against on the described heat abstractor and described covering plate is not contacted with described heat-conducting medium.
The present invention also provides a kind of heat abstractor that is equiped with above-mentioned heat conducting medium protective cover; it comprises a radiator; described radiator is provided with a base; one side of described base is coated with heat-conducting medium; described heat abstractor comprises that also one covers the heat conducting medium protective cover that is used for protecting described heat-conducting medium at described base; described heat conducting medium protective cover comprises that one is used for hiding the covering plate of described heat-conducting medium; convex with some ribs on the described covering plate, described ribs offsets with described base and described covering plate and described heat-conducting medium is not contacted.
Compared to prior art, the ribs on the covering plate of the present invention can effectively avoid covering plate to touch heat-conducting medium, better protects heat-conducting medium.
Description of drawings
Fig. 1 is the stereogram that heat conducting medium protective cover of the present invention and can be installed the radiator of this heat conducting medium protective cover.
Fig. 2 is that the heat conducting medium protective cover among Fig. 1 is fixed to the three-dimensional assembly diagram on the radiator.
Fig. 3 is the cutaway view along III-III among Fig. 2.
Embodiment
See also Fig. 1, Figure 1 shows that heat conducting medium protective cover 30 of the present invention and can install the radiator 10 of this heat conducting medium protective cover 30.
This radiator 10 comprises a base 11, one side of base 11 is provided with one and is used for treating the contacted contact-making surface 113 of heat dissipation element with one, the middle part of contact-making surface 113 is coated with a heat-conducting medium layer 15, do not smear heat-conducting medium for four jiaos of contact-making surface 113, radiator 10 is equiped with some radiating fins 14 and two heat pipes 13 at the opposite side of base 11, one end of two heat pipes 13 is located in these radiating fins 14, and the other end is fixed between base 11 and these radiating fins 14.
This heat conducting medium protective cover 30 comprises that one is used for hiding the covering plate 31 of this heat-conducting medium layer 15, and covering plate 31 is all identical with shape, the size of contact-making surface 113.The vertical side plate 32 that extends and form around covering plate 31 of the periphery of covering plate 31, side plate 32 is made by the material of elastically deformable, such as plastics etc.Covering plate 31 and side plate 32 surround one jointly can accommodate base 11 in accommodation space 37 wherein, covering plate 31 has been convexly equipped with some ribs 33 respectively at the Qi Sijiao place in accommodation space 37, these ribs 33 are connected to side plate 32, thereby strengthen the intensity of covering plate 31, prevent that covering plate 31 from larger flexural deformation occuring.The thickness of these ribs 33 is greater than the thickness of this heat-conducting medium layer 15.Corresponding two heat pipes 13 in the relative both sides of side plate 32 are provided with the breach 321 that passes for two heat pipes 13, and the width of breach 321 is slightly less than the width of two heat pipes 13.
See also Fig. 1 to Fig. 3; during assembling; heat conducting medium protective cover 30 is covered on base 11; covering plate 31 hides on contact-making surface 113; ribs 33 on the covering plate 31 is against on the contact-making surface 113, does not contact between the heat-conducting medium layer 15 at contact-making surface 113 middle parts and the covering plate 31, avoids heat-conducting medium layer 15 to be scratched; and ribs 33 has been strengthened the intensity of covering plate 31, thereby prevents that covering plate 31 from contacting with heat-conducting medium layer 15 because external force produces larger flexural deformation.Simultaneously, the side plate 32 of heat conducting medium protective cover 30 is fitted in the periphery of base 11, and heat pipe 13 embeds in the breach 321 of side plate 32, and heat conducting medium protective cover 30 is fixed on the radiator 10.
Claims (6)
1. heat conducting medium protective cover; be used for covering and spreading upon heat-conducting medium on the heat abstractor with protection on the heat abstractor; described heat conducting medium protective cover comprises that one is used for hiding the covering plate of described heat-conducting medium; it is characterized in that: be convexly equipped with some ribs on the described covering plate; the periphery of described covering plate extends to form side plate; described side plate comprises extended some sidewalls around covering plate; described covering plate and some sidewalls surround jointly only has the untight accommodation space of one side; described accommodation space can accommodating described heat abstractor; described ribs extend in the accommodation space and directly and at least two sides in some sidewalls link to each other, described ribs is against on the described heat abstractor and described covering plate is not contacted with described heat-conducting medium.
2. heat conducting medium protective cover as claimed in claim 1, it is characterized in that: described ribs is positioned at the Si Jiaochu of described covering plate.
3. heat abstractor; comprise a radiator; described radiator is provided with a base; one side of described base is coated with heat-conducting medium; described heat abstractor comprises that also one covers the heat conducting medium protective cover that is used for protecting described heat-conducting medium at described base; described heat conducting medium protective cover comprises that one is used for hiding the covering plate of described heat-conducting medium; it is characterized in that: convex with some ribs on the described covering plate; the periphery of described covering plate extends to form side plate; described side plate comprises extended some sidewalls around covering plate; described covering plate and some sidewalls surround jointly only has the untight accommodation space of one side; described accommodation space can accommodating described radiator base; described ribs extend in the accommodation space and directly and at least two sides in some sidewalls link to each other, described ribs offsets with described base and described covering plate and described heat-conducting medium is not contacted.
4. heat abstractor as claimed in claim 3; it is characterized in that: the opposite side of described base is equiped with heat pipe; the corresponding described heat pipe of described sidewall offers breach; the width of described breach is slightly less than the width of described heat pipe, and described heat pipe embeds in the described breach and described heat conducting medium protective cover is fixed on the described radiator.
5. heat abstractor as claimed in claim 3, it is characterized in that: shape, the size of described covering plate and described base are all identical, and described ribs is arranged on the Si Jiaochu of described covering plate, and described heat-conducting medium spreads upon the middle part of described base.
6. heat abstractor as claimed in claim 3, it is characterized in that: the thickness of described ribs is greater than the thickness of described heat-conducting medium.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008103011286A CN101562964B (en) | 2008-04-14 | 2008-04-14 | Heat-conducting medium protecting cover and heating abstractor with the protecting cover |
| US12/206,966 US20090255659A1 (en) | 2008-04-14 | 2008-09-09 | Protective cap for thermal grease of heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008103011286A CN101562964B (en) | 2008-04-14 | 2008-04-14 | Heat-conducting medium protecting cover and heating abstractor with the protecting cover |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101562964A CN101562964A (en) | 2009-10-21 |
| CN101562964B true CN101562964B (en) | 2013-01-09 |
Family
ID=41163022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008103011286A Expired - Fee Related CN101562964B (en) | 2008-04-14 | 2008-04-14 | Heat-conducting medium protecting cover and heating abstractor with the protecting cover |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20090255659A1 (en) |
| CN (1) | CN101562964B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM311243U (en) * | 2006-11-22 | 2007-05-01 | Cooler Master Co Ltd | Cover to protect the heat-conduction medium |
| TWM337725U (en) * | 2008-03-11 | 2008-08-01 | Tai Sol Electronics Co Ltd | Radiation paste lid |
| CN101616570B (en) * | 2008-06-25 | 2012-07-04 | 富准精密工业(深圳)有限公司 | Protective cover |
| JP6105549B2 (en) * | 2011-03-25 | 2017-03-29 | フィリップス ライティング ホールディング ビー ヴィ | Thermally conductive pad material including a perforated liner |
| CN114071966A (en) * | 2017-05-18 | 2022-02-18 | 北京嘉楠捷思信息技术有限公司 | Circuit board, radiator, working assembly and electronic equipment |
| CN111263552B (en) * | 2020-02-05 | 2020-12-29 | 环胜电子(深圳)有限公司 | Adapter card module with protective cover |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2678129Y (en) * | 2004-02-04 | 2005-02-09 | 珍通科技股份有限公司 | Heat transfer medium protection device for radiator |
| CN2800705Y (en) * | 2005-05-29 | 2006-07-26 | 富准精密工业(深圳)有限公司 | Protective cover and heat radiator with same |
| CN2884533Y (en) * | 2005-12-16 | 2007-03-28 | 英业达股份有限公司 | Thermally conductive medium protection cover with reinforced structure |
| CN200990753Y (en) * | 2006-10-26 | 2007-12-12 | 讯凯国际股份有限公司 | Thermal medium protection cover |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE218655T1 (en) * | 1993-09-24 | 2002-06-15 | Csr Ltd | IMPROVEMENTS TO THE FRAME OF A MANHOLE COVER |
| JPH11511909A (en) * | 1996-06-21 | 1999-10-12 | サーマロイ，インコーポレイテッド | Pre-apply grease to heat sink with protective coating |
| TW358565U (en) * | 1997-12-01 | 1999-05-11 | Hon Hai Prec Ind Co Ltd | Protection back lid for heat transfer dielectric plate |
| TW359383U (en) * | 1997-12-19 | 1999-05-21 | Hon Hai Prec Ind Co Ltd | Protection cover for heat transfer dielectrics |
| US7166912B2 (en) * | 2001-04-05 | 2007-01-23 | Advanced Energy Technology Inc. | Isolated thermal interface |
| US7051790B2 (en) * | 2003-12-19 | 2006-05-30 | Asia Vital Component Co., Ltd. | Protect cover for a radiator |
| US7068514B2 (en) * | 2004-02-18 | 2006-06-27 | Cpumate Inc. | Protection structure for thermal conducting medium of heat dissipation device |
| US6935420B1 (en) * | 2004-06-16 | 2005-08-30 | Hon Hai Precision Ind. Co., Ltd. | Heat dissipation assembly |
| CN2727961Y (en) * | 2004-08-25 | 2005-09-21 | 鸿富锦精密工业（深圳）有限公司 | Radiator |
| US20060124643A1 (en) * | 2004-12-15 | 2006-06-15 | Markert Brooks R | Dispensing cover with tear strip and living hinge |
| US7441593B2 (en) * | 2005-04-15 | 2008-10-28 | Chaun-Choung Technology Corp. | Protective cover for heat-conductive material of heat sink |
| CN2800718Y (en) * | 2005-05-24 | 2006-07-26 | 富准精密工业(深圳)有限公司 | Heat transfer medium protection device |
| CN100455175C (en) * | 2005-07-08 | 2009-01-21 | 富准精密工业(深圳)有限公司 | Loop-type radiating module group |
| TWM283223U (en) * | 2005-07-15 | 2005-12-11 | Foxconn Tech Co Ltd | Protective cap |
| CN100534280C (en) * | 2006-03-16 | 2009-08-26 | 富准精密工业(深圳)有限公司 | Heat transfer medium protection device |
| US7319592B2 (en) * | 2006-04-11 | 2008-01-15 | Inventec Corporation | Recyclable protective cover for a heat-conductive medium |
| US7589969B2 (en) * | 2006-04-12 | 2009-09-15 | Inventec Corporation | Folding protective cover for heat-conductive medium |
| TWI301937B (en) * | 2006-07-31 | 2008-10-11 | Compal Electronics Inc | Thermal conducting medium protector |
| US7610950B2 (en) * | 2006-11-08 | 2009-11-03 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with heat pipes |
| US7394656B1 (en) * | 2006-12-09 | 2008-07-01 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipation device |
| US7918267B2 (en) * | 2007-05-23 | 2011-04-05 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device having cap for protecting thermal interface material thereon |
| US7980297B2 (en) * | 2007-09-06 | 2011-07-19 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink having protective device for thermal interface material spread thereon |
| CN101573020A (en) * | 2008-04-28 | 2009-11-04 | 富准精密工业(深圳)有限公司 | Protection cover |
-
2008
- 2008-04-14 CN CN2008103011286A patent/CN101562964B/en not_active Expired - Fee Related
- 2008-09-09 US US12/206,966 patent/US20090255659A1/en not_active Abandoned
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2678129Y (en) * | 2004-02-04 | 2005-02-09 | 珍通科技股份有限公司 | Heat transfer medium protection device for radiator |
| CN2800705Y (en) * | 2005-05-29 | 2006-07-26 | 富准精密工业(深圳)有限公司 | Protective cover and heat radiator with same |
| CN2884533Y (en) * | 2005-12-16 | 2007-03-28 | 英业达股份有限公司 | Thermally conductive medium protection cover with reinforced structure |
| CN200990753Y (en) * | 2006-10-26 | 2007-12-12 | 讯凯国际股份有限公司 | Thermal medium protection cover |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101562964A (en) | 2009-10-21 |
| US20090255659A1 (en) | 2009-10-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101562964B (en) | Heat-conducting medium protecting cover and heating abstractor with the protecting cover | |
| CN104663010B (en) | Electronic-controlled installation | |
| US20170367175A1 (en) | Electronic apparatus and heat dissipation and emi shielding structure thereof | |
| CN107114003B (en) | Shielding part, electronic device, the method for installing shielding part | |
| CN100358134C (en) | Heat dissipation assembly and protective cover for heat conducting media | |
| US20090207578A1 (en) | Apparatus for reducing electromagnetic interference and spreading heat | |
| US7487825B2 (en) | Heat dissipation device | |
| WO2017164873A1 (en) | Electrical devices and methods for forming electrical devices | |
| CN101573020A (en) | Protection cover | |
| CN206314170U (en) | Shield assemblies and electronic equipment | |
| CN102647863A (en) | Electronic device | |
| EP4081006B1 (en) | Heat dissipation device, circuit board assembly, and electronic apparatus | |
| CN102412215A (en) | Heat radiation module and electronic device using the same | |
| CN201894030U (en) | Structure to improve heat dissipation effect of heat conduction components | |
| CN103974600A (en) | Method and device to provide uniform cooling in rugged environment | |
| US20130301222A1 (en) | Stacked heat dissipating module of an electronic device | |
| CN209691398U (en) | Heat radiating type mobile hard disk | |
| CN101616570B (en) | Protective cover | |
| CN201252711Y (en) | Shell structure capable of being combined with radiator | |
| CN108633213B (en) | Electronic device | |
| CN210607565U (en) | Coaxial resistance load with good heat dissipation effect | |
| CN205946467U (en) | Heat abstractor and electronic product of fin, PCB subassembly | |
| CN211200164U (en) | Barrier gate radar | |
| CN101365315B (en) | Protection cover and heat radiating device using the cover | |
| US20170280551A1 (en) | Heat radiation shielding device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130109 Termination date: 20130414 |