CN101533319B

CN101533319B - Touch panel and manufacturing method thereof

Info

Publication number: CN101533319B
Application number: CN2008100837720A
Authority: CN
Inventors: 张绍雄; 张起豪; 陈央嶙
Original assignee: Delta Electronics Inc
Current assignee: Delta Electronics Inc
Priority date: 2008-03-12
Filing date: 2008-03-12
Publication date: 2012-05-30
Anticipated expiration: 2028-03-12
Also published as: CN101533319A

Abstract

The invention relates to a touch panel and a manufacturing method thereof. The touch panel comprises a substrate, a resistance layer, a plurality of signal terminals, a conductive circuit layer, an insulating layer and a plurality of signal lines. The substrate is provided with a touch area and a peripheral area, the signal end is arranged in the peripheral area and electrically connected with the resistance layer, and the conduction circuit layer is arranged in the peripheral area and electrically connected with the resistance layer. The insulating layer is arranged on the signal terminals and the conductive circuit layer, and the signal lines are arranged on the insulating layer and are respectively and electrically connected with the signal terminals correspondingly. According to the invention, the signal line can be effectively isolated from the conductive circuit layer and the resistance layer through the insulating layer, and the size of the touch panel is reduced by stacking in the vertical direction, so that the purpose of miniaturization is achieved. In addition, the invention does not need a cutting step and cutting equipment, thereby reducing the cost.

Description

Contact panel and preparation method thereof

Technical field

The present invention is about a kind of contact panel and preparation method thereof.

Background technology

In recent years; Contact panel has been widely used on the general consumer electronics commodity gradually; For example device for mobile communication, digital camera, digital music player (MP3), personal digital aid (PDA) (PDA), satellite navigator (GPS), palmtop computer (hand-held PC); Even brand-new super removable computer (Ultra Mobile PC, UMPC) etc.And along with the trend of product miniaturization, the area that how to dwindle contact panel also becomes crucial problem.

A kind of known contact panel 1 is as shown in Figure 1, and its part sectioned view is as shown in Figure 2.Contact panel 1 comprises substrate 11, resistive layer 12, order wire circuit layer 13, a plurality of signal end 14, protective seam 15 and many signal line 17.Substrate 11 has Touch Zone T1 and surrounding zone P1, and surrounding zone P1 is located on Touch Zone T1.Resistive layer 12 is arranged at the Touch Zone T1 and the surrounding zone P1 of substrate 11.Order wire circuit layer 13 is arranged at surrounding zone P1 with signal end 14, and links with resistive layer 12, and signal end 14 is positioned at the corner of resistive layer 12.Protective seam 15 coats order wire circuit layer 13 and signal end 14, to reach the effect of protection.One end of signal wire 17 and signal end 14 electrically connect, and the other end of signal wire 17 and winding displacement 18 electrically connect.

The start principle of contact panel 1 is following: when 13 charging of order wire circuit layer, whole resistive layer 12 can produce and be the electric field that equipotential line distributes.When the user presses a wherein position of resistive layer 12; The electric field of resistive layer 12 can change; And the signal end 14 that is positioned at four corners is according to changing and produce signal, and is sent to the rear end through signal wire 17 and winding displacement 18 and carries out signal Processing, to learn user's pressing position.

Because signal wire 17 is in order to transmit signal, so it must be isolated with order wire circuit layer 13 and resistive layer 12.The mode of known isolated employing has two kinds: first kind is that signal wire 17 is made in outside the scope of resistive layer 12, but this can make whole size become big; Second kind is through the cut mode signal wire 17 and order wire circuit layer 13 and resistive layer 12 to be separated, but this can increase the complexity of technology and the cost of cutter sweep.

Summary of the invention

Because above-mentioned problem, the object of the invention be provide a kind of can minification and need not use extra processing step and equipment, reach miniaturization and the contact panel that reduces cost and preparation method thereof.

For reaching above-mentioned purpose, comprise a substrate, a resistive layer, a plurality of signal end, an order wire circuit layer, an insulation course and many signal line according to a kind of contact panel of the present invention.Substrate has a Touch Zone and a surrounding zone, and signal end is arranged at the surrounding zone and electrically connects with resistive layer, and the order wire circuit layer is arranged at the surrounding zone and electrically connects with resistive layer.Insulation course is arranged on signal end and the order wire circuit layer, and signal wire is arranged on the insulation course, and corresponding with each signal end respectively electric connection.

For reaching above-mentioned purpose, the method for making of complying with a kind of contact panel of the present invention comprises following steps: form a resistive layer on a substrate, substrate has a Touch Zone and a surrounding zone; Form an order wire circuit layer in the surrounding zone, and electrically connect with resistive layer; Form a plurality of signal ends in this surrounding zone, and electrically connect with resistive layer; Form an insulation course on order wire circuit layer and these signal ends; And form many signal line on insulation course, and corresponding with each signal end respectively electric connection.

Hold the above; According to contact panel of the present invention and preparation method thereof insulation course is formed on signal end and the order wire circuit layer; Again signal wire is formed on the insulation course; So signal wire can completely cut off through insulation course and with order wire circuit layer and resistive layer effectively, and piling up of vertical direction and the size of dwindling contact panel thus, reach the purpose of miniaturization.In addition, the present invention need not carry out cutting step and also need not cutting equipment, so can reduce cost.

Description of drawings

Fig. 1 is a kind of synoptic diagram of known contact panel;

Fig. 2 is the part sectioned view of the contact panel of Fig. 1;

Fig. 3 A to Fig. 3 C is the different aspect synoptic diagram according to the contact panel of first embodiment of the invention;

Fig. 4 A and Fig. 4 B are the different aspect synoptic diagram according to the contact panel of second embodiment of the invention; And

Fig. 5 A and Fig. 5 B are the different aspect synoptic diagram according to the contact panel of third embodiment of the invention.

Description of reference numerals

1～4,2A, 2B, 3A, 4A: contact panel

11,21,31,41: substrate

12,22,22A, 22B, 32,42: resistive layer

13,23,33,43: the order wire circuit layer

14,24,34,44: signal end

35,35A, 45,45A: dielectric layer

16,26,36,46: protective seam

17,27,27A, 27B, 37,47: signal wire

18,28: winding displacement

29,29A, 29B, 39,49: insulation course

H: perforation

P1, P2, P3, P4: surrounding zone

T1, T2, T3, T4: Touch Zone

Embodiment

Below will contact panel according to the preferred embodiment of the present invention and preparation method thereof be described with reference to relevant indicators.Wherein components identical will be with identical symbolic representation.

First embodiment

Fig. 3 A shows the contact panel 2 of first embodiment of the invention.Contact panel 2 comprises a substrate 21, a resistive layer 22, an order wire circuit layer 23, a plurality of signal end 24, an insulation course 29, many signal line 27.

Substrate 21 has a Touch Zone T2 and a surrounding zone P2, and surrounding zone P2 is located on Touch Zone T2.Substrate 21 is such as but not limited to glass substrate or plastic base.The Touch Zone T2 and the surrounding zone P2 of resistive layer 22 formation and covered substrate 21; The material of resistive layer 22 can comprise the metal oxide of conduction, and the metal oxide of conduction for example is indium tin oxide (ITO), indium-zinc oxide (IZO), aluminium zinc oxide (AZO), gallium zinc oxide (GZO) or zinc paste (ZnO).

Order wire circuit layer 23 all is formed at surrounding zone P2 with signal end 24, and electrically connects with resistive layer 22, and order wire circuit layer 23 is a noncontinuous electrode.Signal end 24 is corner electrode (corner electrode), and contact panel 2 is applied voltage and received current, and forms simultaneously with order wire circuit layer 23.In the present embodiment, resistive layer 22 covers order wire circuit layer 23 and signal end 24.Order wire circuit layer 23 and signal end 24 can be formed at substrate 21 through coating, printing, applying or plated film mode.The material of order wire circuit layer 23 and signal end 24 can for example be copper or elargol.

Insulation course 29 is formed on the signal end 24 and order wire circuit layer 23 of surrounding zone P2, and also is formed on the resistive layer 22.Signal wire 27 is formed on the insulation course 29 through the screen painting mode, and respectively with each signal end 24 corresponding electric connection.In the present embodiment, signal end 24 exposes to insulation course 29, makes signal wire 27 and signal end 24 electrically connect.

In addition, contact panel 2 also comprises a protective seam 26 and a winding displacement 28.Protective seam 26 is formed on signal wire 27 and the insulation course 29, and can be a composite bed at this.The material of protective seam 26 can for example be epoxy resin (epoxy) or silica gel (silicon).Protective seam 26 can be protected order wire circuit layer 23 and signal end 24.Signal wire 27 electrically connects with winding displacement 28, carries out signal Processing to transmit signals to the rear end.

Fig. 3 B shows a kind of variation aspect of contact panel 2.It is one stepped that the insulation course 29A of contact panel 2A becomes, and makes signal wire 27 and signal end 24 electrically connect.

Fig. 3 C shows that the another kind of contact panel 2 changes aspect.The signal wire 27B of contact panel 2B electrically connects via a perforation H and the signal end 24 of insulation course 29B.Its middle punch H can form through etching mode.

Second embodiment

Please with reference to shown in Fig. 4 A, the contact panel 3 of second embodiment of the invention comprises a substrate 31, a resistive layer 32, an order wire circuit layer 33, a plurality of signal end 34 (only showing among the figure), a dielectric layer 35, an insulation course 39, many signal line 37 (only showing among the figure) and a protective seam 36.What need explanation is that dielectric layer 35 is formed on the resistive layer 32.Dielectric layer 35 can comprise at least one hardened layer and/or at least one anti-reflecting layer, and can form hardened layer earlier and form anti-reflecting layer again; Or the formation anti-reflecting layer forms hardened layer more earlier.Wherein the material of this anti-reflecting layer for example is monox (SiO), silicon nitride (SiN) or silicon oxynitride (SiON).In addition, signal wire 37 can be chatted bright mode and signal end 34 electric connections through the foregoing description.

Fig. 4 B shows a kind of variation aspect of contact panel 3.The dielectric layer 35A of contact panel 3A mainly is formed on the resistive layer 32 that is positioned at Touch Zone T3.

The 3rd embodiment

Please with reference to shown in Fig. 5 A, the contact panel 4 of third embodiment of the invention comprises a substrate 41, a resistive layer 42, an order wire circuit layer 43, a plurality of signal end 44 (only showing among the figure), a dielectric layer 45, an insulation course 49, many signal line 47 (only showing among the figure) and a protective seam 46.What need explanation is that resistive layer 42 is formed on the substrate 41.Order wire circuit layer 43 and signal end 44 are formed on the resistive layer 42.Dielectric layer 45 be formed at order wire circuit layer 43, signal end 44 and the resistive layer 42 that exposes to the open air on.Insulation course 49 is formed on the dielectric layer 45, and signal wire 47 is formed on the insulation course 49, and protective seam 46 covers signal wire 47.In addition, signal wire 47 can be chatted bright mode and signal end 44 electric connections through first embodiment.

Fig. 5 B shows a kind of variation aspect of contact panel 4.The dielectric layer 45A of contact panel 4A mainly is formed on the resistive layer 42 that is positioned at Touch Zone T4.

In sum; Contact panel of the present invention and preparation method thereof is formed at insulation course on signal end and the order wire circuit layer; Again signal wire is formed on the insulation course; So signal wire can completely cut off through insulation course and with order wire circuit layer and resistive layer effectively, and piling up of vertical direction and the size of dwindling contact panel thus, reach the purpose of miniaturization.In addition, the present invention need not carry out cutting step and also need not cutting equipment, so can reduce cost.

The above is merely illustrative, but not is restricted person.Anyly do not break away from spirit of the present invention and category, and, all should be contained in the appended claim its equivalent modifications of carrying out or change.

Claims

1. A touch panel, comprising:

A substrate with a touch area and a peripheral area;

a resistance layer formed on the touch area and the peripheral area;

a conductive circuit layer, disposed on the peripheral area, and electrically connected to the resistance layer;

A plurality of signal terminals are arranged in the peripheral area and electrically connected with the resistance layer;

an insulating layer disposed on the signal terminals and the conductive circuit layer; and

A plurality of signal lines are arranged on the insulating layer, and are respectively electrically connected to each signal terminal;

a dielectric layer disposed on the resistance layer, or disposed on the resistance layer of the touch area, or disposed on the signal terminals, the conductive circuit layer and the exposed resistance layer;

Wherein the resistance layer covers the signal terminals and the conductive circuit layer, and the insulating layer is formed on the resistance layer, the dielectric layer includes at least one hardening layer and at least one anti-reflection layer, and the material of the anti-reflection layer includes oxidation Silicon, silicon nitride or silicon oxynitride.

2. The touch panel according to claim 1, wherein the substrate is a glass substrate or a plastic substrate, and the material of the resistance layer includes indium tin oxide, indium zinc oxide, aluminum zinc oxide, gallium zinc oxide, oxide Zinc or conductive metal oxides.

3. The touch panel as claimed in claim 1, wherein materials of the signal terminals and the conductive circuit layer include silver glue or copper.

4. The touch panel as claimed in claim 1, wherein the conductive circuit layer is a discontinuous electrode, the signal terminals are corner electrodes, and the conductive circuit layer and the signal terminals are formed simultaneously.

5 . The touch panel as claimed in claim 1 , wherein the signal line is electrically connected to the signal terminal through a hole in the insulating layer, and the hole is formed by etching.

6 . The touch panel as claimed in claim 5 , wherein the signal terminals are exposed on the insulating layer, and the insulating layer is in a stepped shape, so that the signal lines are electrically connected to the signal terminals.

7. The touch panel according to claim 1 or 6, wherein the signal lines are formed on the insulating layer by screen printing, and are respectively electrically connected to the signal terminals.

8 . The touch panel as claimed in claim 1 , further comprising a protective layer disposed on the signal terminals and the conductive circuit layer or the signal lines, and a material of the protective layer includes epoxy resin or silicone.

9. The touch panel as claimed in claim 1, wherein the signal lines are electrically connected to a row of lines.

10. A method for manufacturing a touch panel, comprising the following steps:

forming a resistance layer on a substrate, the substrate has a touch area and a peripheral area;

forming a conductive circuit layer in the peripheral area and electrically connecting with the resistance layer;

forming a plurality of signal terminals in the peripheral area and electrically connecting with the resistance layer;

forming an insulating layer over the conductive circuit layer and the signal terminals; and

forming a plurality of signal lines on the insulating layer, and correspondingly electrically connecting with each signal terminal;

forming a dielectric layer on the resistive layer, or on the resistive layer in the touch area, or on the signal terminals, the conductive circuit layer and the exposed resistive layer;

The resistance layer covers the signal terminals and the conductive circuit layer, and the insulating layer is formed on the resistance layer, the dielectric layer includes at least one hardening layer and at least one anti-reflection layer, and the material of the anti-reflection layer includes silicon oxide , silicon nitride or silicon oxynitride.

11. The manufacturing method according to claim 10, wherein the signal terminals and the conductive circuit layer are formed on the peripheral area of the substrate by coating, printing, laminating or coating.

12. The manufacturing method according to claim 10, wherein the conductive circuit layer is a discontinuous electrode, the signal terminals are corner electrodes, and the conductive circuit layer and the signal terminals are formed simultaneously.

13. The manufacturing method according to claim 10, wherein the signal terminals are exposed on the insulating layer, and the insulating layer is in a stepped shape, so that the signal lines are electrically connected to the signal terminals.

14. The manufacturing method according to claim 10 or 13, wherein the signal lines are electrically connected to the signal terminals by screen printing.

15. The manufacturing method as claimed in claim 10, further comprising forming a protection layer on the signal terminals, the material of the protection layer comprising epoxy resin or silicone.

16. The manufacturing method as claimed in claim 10, further comprising electrically connecting the signal lines with a row of lines.