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CN101510383A - Flat display panel - Google Patents

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CN101510383A
CN101510383A CNA2009101297480A CN200910129748A CN101510383A CN 101510383 A CN101510383 A CN 101510383A CN A2009101297480 A CNA2009101297480 A CN A2009101297480A CN 200910129748 A CN200910129748 A CN 200910129748A CN 101510383 A CN101510383 A CN 101510383A
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pins
chip
display panel
distributions
driving
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CN101510383B (en
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傅建豪
江明峰
李敏勤
张峻桓
徐百宏
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AUO Corp
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AU Optronics Corp
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Abstract

The invention provides a flat display panel, which comprises a substrate, a driving chip, a plurality of control circuit lines and wirings. The display area and the peripheral circuit area are defined on the substrate, the driving chip is arranged on the peripheral circuit area and comprises a plurality of pins, the space between the adjacent pins is not equal, and the space between the pins at the central part of the driving chip is smaller than the space between the pins at the outer side of the driving chip. The control circuit line is arranged in the display area, and the wiring is arranged in the peripheral circuit area and is electrically connected with the control circuit line and the pins.

Description

平面显示面板 flat display panel

技术领域 technical field

本发明是有关于一种平面显示面板,尤指一种具有不等间距接脚的驱动芯片的平面显示面板。The invention relates to a flat display panel, in particular to a flat display panel with driver chips with unequal pitch pins.

背景技术 Background technique

相较于传统如阴极射线管显示器等非平面显示器,平面显示器具有重量轻与厚度薄等特性,已逐渐成为显示器市场上的主流产品,例如应用在家用电视、个人电脑显示器以及如手机、数码相机与便携式音乐播放装置等便携式电子产品。依据显示技术的不同,平面显示器的种类包括等离子体显示器、液晶显示器以及有机发光显示器。一般而言,上述种类的平面显示器皆是将电子元件或发光元件设置于薄型基板上。以薄膜晶体管液晶显示器为例,其通常包括上、下二玻璃基板,其中下玻璃基板表面设置了薄膜晶体管、扫描线、信号线、像素电极,而上玻璃基板表面则设置彩色滤光片与黑色矩阵层等元件,通过框胶固定上、下玻璃基板的位置,并于两者间填充液晶分子,即构成了薄膜晶体管液晶显示面板。此外,薄膜晶体管液晶显示器通常另包括多个芯片,通过与扫描线与信号线电连接以控制显示器各画素的开关。Compared with traditional non-flat displays such as cathode ray tube displays, flat-panel displays have the characteristics of light weight and thin thickness, and have gradually become mainstream products in the display market. For example, they are used in home TVs, personal computer monitors, mobile phones, and digital cameras. Portable electronic products such as portable music players. According to different display technologies, types of flat panel displays include plasma displays, liquid crystal displays, and organic light emitting displays. Generally speaking, the above-mentioned types of flat-panel displays are provided with electronic components or light-emitting components on thin substrates. Taking thin-film transistor liquid crystal display as an example, it usually includes two glass substrates, upper and lower, wherein thin-film transistors, scanning lines, signal lines, and pixel electrodes are arranged on the surface of the lower glass substrate, and color filters and black color filters are arranged on the surface of the upper glass substrate. For components such as the matrix layer, the position of the upper and lower glass substrates is fixed by the frame glue, and liquid crystal molecules are filled between the two, which constitutes a thin film transistor liquid crystal display panel. In addition, the thin film transistor liquid crystal display usually further includes a plurality of chips, which are electrically connected to the scanning lines and the signal lines to control the switching of each pixel of the display.

由于平面显示器的发展不断趋向高解析度的设计,使得扫描线与信号线的分布越来越密集,因此芯片的接脚间的间距也越来越小,进而产生许多因缩小工艺尺寸而引起的技术问题。举例而言,若芯片的接脚间距太小,则芯片与导线的接合工艺可能会因热涨冷缩等问题,导致导电材料向外膨胀偏移而发生接脚短路问题。此外,为配合信号线与扫描线的走线设计,与芯片相接的导线通常具有不同的拉线长度,会造成各导线阻抗不均,进而影响信号线与扫描线的信号传导速度与品质。As the development of flat-panel displays tends to high-resolution design, the distribution of scanning lines and signal lines is becoming more and more dense, so the spacing between the pins of the chip is getting smaller and smaller, which in turn produces many problems caused by shrinking the process size. technical problem. For example, if the pitch of the pins of the chip is too small, the bonding process between the chip and the wire may be caused by heat expansion and contraction, etc., causing the conductive material to expand and deviate outwards, resulting in short circuit of the pins. In addition, in order to match the wiring design of signal lines and scanning lines, the wires connected to the chip usually have different lengths, which will cause uneven impedance of each wire, thereby affecting the signal transmission speed and quality of signal lines and scanning lines.

发明内容 Contents of the invention

本发明的目的之一在于提供一种平面显示面板,其包括至少一设于基板上的驱动芯片,且驱动芯片的接脚具有不完全相同的间距,以改善前述已知技术中因接脚间距太小而产生的接脚短路以及导线阻抗不均等问题。One of the objects of the present invention is to provide a flat display panel, which includes at least one driver chip disposed on a substrate, and the pins of the driver chip have different pitches, so as to improve the gap between pins in the prior art. If it is too small, there will be problems such as pin short circuit and uneven wire impedance.

本发明提供一种平面显示面板,其包括一基板、至少一驱动芯片、多条控制电路线以及多条配线。其中,基板上定义有显示区与周边电路区,设于显示区的至少一侧,驱动芯片是设于周边电路区,包括多个接脚,且相邻接脚之间的间距不完全相等。此外,控制电路线是设置于显示区内,配线是设置于周边电路区并且与控制电路线和接脚电连接。上述多条配线至少包含第一配线以及相邻的第二配线和第三配线,第一配线所连接的接脚和第二配线与第三配线所连接的接脚之间分别具有第一间距与第二间距,其中第一间距大于第二间距,第二配线的线宽大于第一配线的线宽,且第一配线的线宽大于第三配线的线宽。The invention provides a flat display panel, which includes a substrate, at least one driving chip, a plurality of control circuit lines and a plurality of wirings. Wherein, a display area and a peripheral circuit area are defined on the substrate, and are arranged on at least one side of the display area. The driving chip is arranged in the peripheral circuit area, and includes a plurality of pins, and the distances between adjacent pins are not completely equal. In addition, the control circuit lines are arranged in the display area, and the wires are arranged in the peripheral circuit area and electrically connected with the control circuit lines and pins. The plurality of wirings include at least the first wiring and the adjacent second wiring and the third wiring, the pin connected to the first wiring and the pin connected to the second wiring and the third wiring There are first spacing and second spacing between them, wherein the first spacing is greater than the second spacing, the line width of the second wiring is greater than the line width of the first wiring, and the line width of the first wiring is greater than that of the third wiring line width.

根据本发明的权利要求范围,另揭露一种平面显示面板,其包括一基板、至少一驱动芯片、多条控制电路线以及多条配线。基板上定义有显示区与周边电路区,设于显示区的至少一侧。驱动芯片是设于周边电路区,其包括多个接脚,相邻的接脚间的间距不完全相等,且驱动芯片的中央部分的接脚间的间距是小于驱动芯片外侧的接脚间的间距。控制电路线是设置于显示区,而配线是设置于周边电路区,并与控制电路线和接脚相电连接,且配线具有弯曲配置区。According to the claims of the present invention, a flat display panel is further disclosed, which includes a substrate, at least one driving chip, a plurality of control circuit lines and a plurality of wirings. A display area and a peripheral circuit area are defined on the substrate, which are arranged on at least one side of the display area. The driver chip is located in the peripheral circuit area, which includes multiple pins, and the distance between adjacent pins is not completely equal, and the distance between the pins in the central part of the driver chip is smaller than that between the pins on the outer side of the driver chip. spacing. The control circuit line is arranged in the display area, and the wiring is arranged in the peripheral circuit area, and is electrically connected with the control circuit line and the pins, and the wiring has a bending configuration area.

由于本发明平面显示面板的驱动芯片具有不等间距的接脚,可以有效避免因间距太近而造成的接脚短路问题。同时,与间距较大的接脚所连接的外侧配线可具有较大的线宽,能大幅降低配线阻抗,因此位于中央部分的配线不需大量的绕工线或绕曲折线设计,便能均匀化各配线的阻抗,能节省材料成本与配线空间。Since the driver chip of the flat display panel of the present invention has pins with unequal pitches, it can effectively avoid the problem of short circuit of the pins caused by too close pitches. At the same time, the outer wiring connected to the pins with larger spacing can have a larger line width, which can greatly reduce the wiring impedance. Therefore, the wiring located in the central part does not need a large number of winding lines or zigzagging lines. The impedance of each wiring can be uniformed, and the material cost and wiring space can be saved.

附图说明 Description of drawings

图1为本发明平面显示面板的俯视示意图。FIG. 1 is a schematic top view of a flat display panel of the present invention.

图2为图1所示驱动芯片与配线的局部放大示意图。FIG. 2 is a partially enlarged schematic diagram of the driver chip and wiring shown in FIG. 1 .

图3为本发明平面显示面板的驱动芯片与配线设计的第二实施例的示意图。FIG. 3 is a schematic diagram of a second embodiment of the driver chip and wiring design of the flat display panel of the present invention.

图4为本发明平面显示面板的驱动芯片与配线设计的第三实施例的示意图。FIG. 4 is a schematic diagram of a third embodiment of the driver chip and wiring design of the flat display panel of the present invention.

图5为图4所示配线26n的部分放大示意图。FIG. 5 is a partially enlarged schematic view of the wiring 26n shown in FIG. 4 .

图6为本发明平面显示面板的驱动芯片与配线设计的第四实施例的示意图。FIG. 6 is a schematic diagram of a fourth embodiment of the driver chip and wiring design of the flat display panel of the present invention.

图7为本发明平面显示面板的驱动芯片与配线设计的第五实施例的示意图。FIG. 7 is a schematic diagram of a fifth embodiment of the driver chip and wiring design of the flat display panel of the present invention.

附图标号Reference number

10        平面显示面板                  12                 基板10 Flat Display Panel 12 Substrate

14        显示区                        14a                显示区边界14 Display Area 14a Display Area Boundary

16        周边电路区                    18、20             驱动芯片16 Peripheral circuit area 18, 20 Driver chip

22、24    控制电路线                    26、28、26g~26p   配线22, 24 Control circuit wires 26, 28, 26g~26p wiring

26a       第三配线                      26b                第一配线26a The third wiring 26b The first wiring

26c       第二配线                      26d                第六配线26c Second Wiring 26d Sixth Wiring

26e       第四配线                      26f                第五配线26e 4th wiring 26f 5th wiring

30、30a~30f   接脚                     32                 弯曲配置区30. 30a~30f Pins 32 Bending configuration area

A1、A2、A3、A4 振幅                     B1、B2             配线夹角A1, A2, A3, A4 Amplitude B1, B2 Wiring Angle

C1        中心线                        d                  配线间距C1 Center Line D Wiring Spacing

E1、E2    波浪形状走线的波峰E1, E2 The crest of the wave-shaped trace

M1、M2    波峰与波谷的终点M1, M2 The end of the peak and trough

T1        波浪形状走线的波谷            w                  线宽T1 trough of wavy trace w w line width

P1、P2、P3、P4  接脚间距P1, P2, P3, P4 pin spacing

具体实施方式 Detailed ways

请参考图1与图2,图1与图2为本发明平面显示面板的第一实施例的示意图,其中图1为平面显示面板的俯视示意图,而图2为图1的部分元件放大示意图。如图1所示,本发明平面显示面板10包含基板12,其定义有显示区14与周边电路区16,其中周边电路区16是设于显示区14的至少一侧,在本实施例中,周边电路区16是设于显示区14的外围。平面显示面板10另包含多个驱动芯片18、20设于周边电路区16、多条控制电路线22、24设于显示区14、以及多条配线26、28设置于周边电路区16,其中配线26、28是分别电连接于至少一条控制电路线22、24。控制电路线22与控制电路线24可分别为信号线与扫描线,而驱动芯片18与驱动芯片20则可分别包括信号线驱动电路与扫描线驱动电路。在显示区14内,信号线与扫描线是分别彼此互相平行。此外,驱动芯片18、20较佳包括晶粒软膜接合(chip on film,COF)型芯片,其是直接贴合于具可绕性的软膜(图未示)表面,再以软膜贴附于周边电路区16。Please refer to FIG. 1 and FIG. 2 . FIG. 1 and FIG. 2 are schematic diagrams of a first embodiment of a flat display panel of the present invention, wherein FIG. 1 is a schematic top view of a flat display panel, and FIG. 2 is an enlarged schematic diagram of some components of FIG. 1 . As shown in FIG. 1, the flat display panel 10 of the present invention includes a substrate 12, which defines a display area 14 and a peripheral circuit area 16, wherein the peripheral circuit area 16 is arranged on at least one side of the display area 14. In this embodiment, The peripheral circuit area 16 is disposed on the periphery of the display area 14 . The flat display panel 10 further includes a plurality of driver chips 18, 20 disposed in the peripheral circuit area 16, a plurality of control circuit lines 22, 24 disposed in the display area 14, and a plurality of wires 26, 28 disposed in the peripheral circuit area 16, wherein The wires 26, 28 are electrically connected to at least one control circuit wire 22, 24, respectively. The control circuit lines 22 and the control circuit lines 24 can be signal lines and scan lines respectively, and the driving chip 18 and the driving chip 20 can respectively include a signal line driving circuit and a scanning line driving circuit. In the display area 14, the signal lines and the scan lines are respectively parallel to each other. In addition, the driving chips 18, 20 preferably include chip on film (chip on film, COF) type chips, which are directly attached to the surface of a flexible soft film (not shown), and then pasted with a soft film. Attached to peripheral circuit area 16.

请参考图2,图2为图1所示驱动芯片18与配线26的局部放大示意图。驱动芯片18包括多个接脚(pin)30并排设置,且相邻接脚30之间的间距(pitch)不完全相等。举例而言,接脚30a与接脚30b的间距为P1;接脚30b与接脚30c的间距为P2;接脚30d与接脚30e的间距为P3;而接脚30e与接脚30f的间距为P4,且间距P1、P2、P3、P4不完全相等。在本实施例中,越接近驱动芯片18的外侧的接脚30间的间距越大。如图2所示,驱动芯片18定义有一中心线C1,其将驱动芯片18平分成左、右两侧,接脚30a、30b、30c、30d、30e、30f皆设于中心线C1的左侧,且依序由中心线C1向驱动芯片18的外侧排列,因此,间距P1是小于间距P2,间距P2小于间距P3,而间距P3小于间距P4(同理,设于接脚30c、30d之间的接脚30彼此之间所具有的间距必大于间距P2而小于间距P3)。在较佳实施例中,相邻接脚30的最小间距,例如间距P1为约20微米,而最大间距(例如间距P4)为约50微米。此外,位于中心线C1两侧的接脚30是以中心线C1为对称轴而左右对称排列,因此在中心线C1右侧的接脚30,若设置位置越远离中心线C1,则其彼此之间的间距亦越大。再者,配线26的数目是对应于驱动芯片18的接脚30的数目,且各配线26分别与一接脚30相连接。为便于说明,图2所示的配线26是以数字符号26a~26f来区分。在中心线C1左侧依序设有第三配线26a、第一配线26b、第二配线26c、第六配线26d、第四配线26e以及第五配线26f,其中第三配线26a与第二配线26c是与第一配线26b相邻,第六配线26d与第五配线26f是相邻于第四配线26e,第二配线26c与第六配线26d之间的配线26是省略未绘示于图2中。第三配线26a、第一配线26b、第二配线26c、第六配线26d、第四配线26e以及第五配线26f分别连接于接脚30a、接脚30b、接脚30c、接脚30d、接脚30e及接脚30f。因此,第一配线26b所连接的接脚30b和第三配线26a所连接的接脚30a之间的间距P1是小于第一配线26b所连接的接脚30b与第二配线26c所连接的接脚30c之间的间距P2。同样的,第六配线26d与第五配线26f是与第四配线26e相邻而设于其两侧,第四配线26e所连接的接脚30e和第六配线26d所连接的接脚30d之间具有间距P3,而第四配线26e所连接的接脚30e和第五配线26f所连接的接脚30f之间具有间距P4,且间距P4是大于间距P3。Please refer to FIG. 2 , which is a partially enlarged schematic diagram of the driving chip 18 and the wiring 26 shown in FIG. 1 . The driver chip 18 includes a plurality of pins 30 arranged side by side, and the pitches between adjacent pins 30 are not completely equal. For example, the distance between pin 30a and pin 30b is P1; the distance between pin 30b and pin 30c is P2; the distance between pin 30d and pin 30e is P3; and the distance between pin 30e and pin 30f is P4, and the pitches P1, P2, P3, and P4 are not exactly equal. In this embodiment, the closer to the outside of the driver chip 18 , the larger the distance between the pins 30 is. As shown in FIG. 2 , the driver chip 18 defines a centerline C1, which divides the driver chip 18 into left and right sides, and the pins 30a, 30b, 30c, 30d, 30e, and 30f are all located on the left side of the centerline C1. , and are arranged in sequence from the center line C1 to the outside of the driver chip 18, therefore, the pitch P1 is smaller than the pitch P2, the pitch P2 is smaller than the pitch P3, and the pitch P3 is smaller than the pitch P4 (similarly, it is arranged between the pins 30c, 30d The distance between the pins 30 must be greater than the distance P2 and smaller than the distance P3). In a preferred embodiment, the minimum pitch between adjacent pins 30, such as the pitch P1, is about 20 microns, and the maximum pitch, such as the pitch P4, is about 50 microns. In addition, the pins 30 on both sides of the central line C1 are symmetrically arranged with the central line C1 as the axis of symmetry. Therefore, if the pins 30 on the right side of the central line C1 are located farther away from the central line C1, the distance between them will increase. The distance between is also larger. Furthermore, the number of wires 26 corresponds to the number of pins 30 of the driver chip 18 , and each wire 26 is connected to a pin 30 respectively. For convenience of description, the wires 26 shown in FIG. 2 are identified by numerals 26a to 26f. The third wiring 26a, the first wiring 26b, the second wiring 26c, the sixth wiring 26d, the fourth wiring 26e and the fifth wiring 26f are sequentially arranged on the left side of the central line C1, wherein the third wiring Line 26a and second wiring 26c are adjacent to first wiring 26b, sixth wiring 26d and fifth wiring 26f are adjacent to fourth wiring 26e, second wiring 26c and sixth wiring 26d The wiring 26 between them is omitted and not shown in FIG. 2 . The third wiring 26a, the first wiring 26b, the second wiring 26c, the sixth wiring 26d, the fourth wiring 26e and the fifth wiring 26f are respectively connected to the pins 30a, 30b, 30c, Pin 30d, pin 30e and pin 30f. Therefore, the pitch P1 between the pin 30b connected to the first wiring 26b and the pin 30a connected to the third wiring 26a is smaller than the distance between the pin 30b connected to the first wiring 26b and the second wiring 26c. The pitch P2 between the connected pins 30c. Similarly, the sixth wiring 26d and the fifth wiring 26f are adjacent to the fourth wiring 26e and located on both sides thereof, and the pin 30e connected to the fourth wiring 26e is connected to the pin 30e connected to the sixth wiring 26d. There is a pitch P3 between the pins 30d, and there is a pitch P4 between the pins 30e connected to the fourth wiring 26e and the pins 30f connected to the fifth wiring 26f, and the pitch P4 is greater than the pitch P3.

值得注意的是,由于相邻接脚30之间的间距不完全相等,因此部分相邻接脚30之间的间距亦可为相同。举例而言,若由中心线C1左侧至驱动芯片18的外侧依序包括接脚间距P1、P2、P5、P6、P3、P4(其中P5与P6未示于图中),则上述接脚间距彼此之间的大小关系可为P1<P2<P5=P6<P3<P4。It should be noted that, since the distances between adjacent pins 30 are not completely equal, the distances between some adjacent pins 30 may also be the same. For example, if the pin pitches P1, P2, P5, P6, P3, and P4 are sequentially included from the left side of the central line C1 to the outside of the driver chip 18 (wherein P5 and P6 are not shown in the figure), the above pins The size relationship between the pitches can be P1<P2<P5=P6<P3<P4.

另一方面,各配线26可具有不完全相同的线宽。在本实施例中,位于中心线C1两侧的配线26是以中心线C1为对称轴而左右对称排列,且连接于驱动芯片18外侧部分的接脚30的配线26线宽是较大于连接于驱动芯片18中央部分的接脚30的配线26,且越靠近驱动芯片18外侧,配线26的线宽越大,例如第五配线26f的线宽大于第四配线26e的线宽,而第四配线26e的线宽大于第六配线26d的线宽。因此,在中心线C1任一侧的配线26的线宽皆不相同。在较佳实施例中,各配线26的线宽w最小为约6至8微米。On the other hand, the wires 26 may not have completely the same line width. In this embodiment, the wires 26 located on both sides of the center line C1 are symmetrically arranged with the center line C1 as the axis of symmetry, and the width of the wires 26 connected to the pins 30 on the outer part of the driver chip 18 is larger than The wiring 26 connected to the pin 30 of the central part of the driving chip 18, and the closer to the outside of the driving chip 18, the larger the line width of the wiring 26, for example, the line width of the fifth wiring 26f is greater than that of the fourth wiring 26e. width, and the line width of the fourth wiring 26e is larger than that of the sixth wiring 26d. Therefore, the line widths of the wirings 26 on either side of the central line C1 are different. In a preferred embodiment, the line width w of each wire 26 is a minimum of about 6 to 8 microns.

由于连接于单一驱动芯片18的配线26是用扇出形(fan-out)拉线方式设于周边电路区16,因此接近驱动芯片18外侧的配线26(例如第六配线26d、第四配线26e及第五配线26f)的长度是大于接近驱动芯片18中央部分的配线26(例如第三配线26a、第一配线26b及第二配线26c)。为了避免因外侧配线26走线较长而有较高的阻抗,根据本发明的精神,外侧配线26具有较大的线宽,以使所有配线26的阻抗均匀化。此外,配合驱动芯片18的接脚30之间具有不同的间距,且越外侧的接脚30的间距越大,因此相邻配线26之间亦有较大的距离和空间,可以通过增加其线宽来有效改善因拉线较长而导致的阻抗不均问题。Since the wires 26 connected to a single driver chip 18 are arranged in the peripheral circuit area 16 in a fan-out (fan-out) drawing mode, the wires 26 (such as the sixth wire 26d, the fourth wire 26d, etc. The wiring 26e and the fifth wiring 26f) are longer than the wiring 26 near the center of the driver chip 18 (such as the third wiring 26a, the first wiring 26b and the second wiring 26c). In order to avoid higher impedance due to the longer wiring of the outer wiring 26, according to the spirit of the present invention, the outer wiring 26 has a larger line width to make the impedance of all the wiring 26 uniform. In addition, there are different pitches between the pins 30 of the driving chip 18, and the pitches of the outer pins 30 are larger, so there is also a larger distance and space between adjacent wirings 26, which can be increased by increasing The line width can effectively improve the uneven impedance caused by the long cable.

请参考图3,图3为本发明平面显示面板的驱动芯片与配线设计的第二实施例的示意图。为便于说明,与前一实施例相同的元件是以同样的元件符号表示,且位于中心线C1左侧的配线26分别以26g、26h、26i、26j来区分。在第二实施例中,各配线26分别具有一弯曲配置区32,在弯曲配置区32内,配线26具有连续重复的多个锯齿或波浪形状,其中锯齿状图案是如图3所示。各配线26的锯齿或波浪状图案分别具有一振幅,例如配线26g、26h、26i、26j的振幅分别以A1、A2、A3及A4表示,代表锯齿状图案的锯齿齿槽宽度。在较佳实施例中,驱动芯片18外侧的配线26的振幅(例如振幅A4、A3)是大于驱动芯片18中央部分的配线26的振幅(例如振幅A1),或者越靠近驱动芯片18外侧的配线26的振幅是稍大于其内侧配线26的振幅。在此设计下,于各配线26的弯曲配置区32内,具有较小振幅的配线26的走线因需要绕走较多的锯齿数目,因此其长度是大于振幅较大的配线26的走线长度。此外,类似于图2,本实施例中外侧配线26的宽度大于接近驱动芯片18中央部分的配线26的宽度,例如配线26j的宽度是大于配线26i的宽度,而配线26h的宽度大于配线26g的宽度。值得注意的是,为配合目前微影、蚀科等工艺技术的限制,相邻配线26之间的距离最小距离为约6至8微米,例如配线26j与配线26i在弯曲配置区32的锯齿状图案间的最小间距d最小为约6微米。再者,驱动芯片18上的接脚30是以中心线C1为对称轴而左右对称,中心轴C1两侧的配线26宽度与走线图案亦对称于中心轴C1。然而,在其他实施例中,中心轴C1两侧的接脚30与配线26的配置位置或走线设计不需完全相同或互相对称。Please refer to FIG. 3 . FIG. 3 is a schematic diagram of a second embodiment of the driver chip and wiring design of the flat display panel of the present invention. For ease of description, the same components as those in the previous embodiment are denoted by the same component symbols, and the wires 26 on the left side of the central line C1 are respectively distinguished by 26g, 26h, 26i, and 26j. In the second embodiment, each wiring 26 has a curved configuration area 32 respectively. In the curved configuration area 32, the wiring 26 has a plurality of zigzag or wave shapes that are repeated continuously, wherein the zigzag pattern is as shown in FIG. 3 . The zigzag or wavy pattern of each wiring 26 has an amplitude respectively. For example, the amplitudes of the wirings 26g, 26h, 26i, and 26j are denoted by A1, A2, A3, and A4 respectively, which represent the width of the zigzag groove of the zigzag pattern. In a preferred embodiment, the amplitude (such as amplitude A4, A3) of the wiring 26 on the outside of the driving chip 18 is greater than the amplitude (such as amplitude A1) of the wiring 26 in the central part of the driving chip 18, or the closer to the outside of the driving chip 18 The amplitude of the wiring 26 is slightly larger than the amplitude of the wiring 26 inside it. Under this design, in the bending arrangement area 32 of each wiring 26, the wiring 26 with a smaller amplitude needs to go around more sawtooth numbers, so its length is longer than that of the wiring 26 with a larger amplitude. the trace length. In addition, similar to FIG. 2, the width of the outer wiring 26 in this embodiment is greater than the width of the wiring 26 close to the central part of the driver chip 18, for example, the width of the wiring 26j is greater than the width of the wiring 26i, and the width of the wiring 26h The width is larger than that of the wiring 26g. It is worth noting that, in order to meet the limitations of current lithography, etching and other process technologies, the minimum distance between adjacent wirings 26 is about 6 to 8 microns, for example, wiring 26j and wiring 26i are in the bending configuration area 32 The minimum spacing dmin between the zigzag patterns is about 6 microns. Furthermore, the pins 30 on the driving chip 18 are symmetrical about the central axis C1 as the axis of symmetry, and the widths and routing patterns of the wires 26 on both sides of the central axis C1 are also symmetrical about the central axis C1. However, in other embodiments, the pins 30 on both sides of the central axis C1 and the wires 26 do not need to be exactly the same or symmetrical to each other.

请参考图4,图4为本发明平面显示面板的驱动芯片与配线设计的第三实施例的示意图,部分元件是沿用图2、图3的附图标号。在本实施例中,部分配线26具有弯曲配置区32,以波浪形状的图案绕曲折线而设置于周边电路区16。在弯曲配置区32中,配线26的振幅A1、A2代表波浪形状的长度,亦即一相邻波峰波谷的中点与其邻近相邻波峰波谷的中点的距离。为清楚说明振幅A1、A2的定义方式,图5绘示出配线26n的部分放大示意图。如图5所示,相邻的波峰E1与波谷T1之间具有中点M1,而相邻的波峰E2与波谷T1之间具有中点M2,此二相邻的中点M1、M2的距离即定义为配线26n的振幅A2。与前一实施例相类似,靠近中心线C1的配线26,例如配线26k、261、26m的振幅较小,而靠近驱动芯片18外侧的配线26,例如配线26n、26o的振幅较大,因此走线较短。此外,最外侧的配线26p不具有弯曲配置区,然而在其他实施例中,外侧的多条配线26(例如配线26n、26o、26p)可以都不具有弯曲配置区。再者,如同前一实施例,越接近驱动芯片18外侧的配线26具有较大的线宽,例如配线26p的线宽大于配线26o的线宽,而配线26m的线宽大于配线261的线宽。Please refer to FIG. 4 . FIG. 4 is a schematic diagram of a third embodiment of the driver chip and wiring design of the flat display panel of the present invention. In this embodiment, part of the wires 26 has a curved arrangement area 32 , and is arranged in the peripheral circuit area 16 in a wave-shaped pattern around the meander line. In the curved configuration area 32 , the amplitudes A1 and A2 of the wires 26 represent the length of the wave shape, that is, the distance between the midpoint of an adjacent crest and trough and the midpoint of an adjacent adjacent crest and trough. To clearly illustrate how the amplitudes A1 and A2 are defined, FIG. 5 shows a partially enlarged schematic diagram of the wiring 26n. As shown in Figure 5, there is a midpoint M1 between the adjacent peak E1 and the trough T1, and there is a midpoint M2 between the adjacent peak E2 and the trough T1, and the distance between the two adjacent midpoints M1 and M2 is It is defined as the amplitude A2 of the wiring 26n. Similar to the previous embodiment, the wiring 26 near the central line C1, such as the wiring 26k, 261, 26m, has a smaller amplitude, and the wiring 26 near the outside of the driver chip 18, such as the wiring 26n, 26o, has a smaller amplitude. Larger, so the traces are shorter. In addition, the outermost wire 26p does not have a bending configuration area, but in other embodiments, none of the outer wires 26 (such as wires 26n, 26o, 26p) may have a bending configuration area. Furthermore, as in the previous embodiment, the wiring 26 closer to the outside of the driver chip 18 has a larger line width, for example, the line width of the wiring 26p is greater than that of the wiring 26o, and the line width of the wiring 26m is greater than that of the wiring 26m. The line width of line 261.

请参考图6,图6为本发明平面显示面板的驱动芯片与配线设计的第四实施例的示意图。如同前一实施例,驱动芯片18的接脚30间的间距不完全相同,例如位于驱动芯片18外侧的接脚30之间的间距较大,而位于驱动芯片18中央部分的接脚30间的间距较小。在本实施例中,每条配线26是对应于一接脚30,并具有相同的线宽。此外,各配线26皆具有弯曲配置区32,包括锯齿状图案的绕工线设计。然而,接近中心线C1的配线30的振幅较小(例如振幅A1),而对应于驱动芯片18外侧的接脚30的配线26具有较大的振幅。Please refer to FIG. 6 . FIG. 6 is a schematic diagram of a fourth embodiment of the driver chip and wiring design of the flat display panel of the present invention. As in the previous embodiment, the spacing between the pins 30 of the driving chip 18 is not exactly the same, for example, the spacing between the pins 30 located on the outside of the driving chip 18 is relatively large, while the spacing between the pins 30 located in the central part of the driving chip 18 The spacing is small. In this embodiment, each wire 26 corresponds to a pin 30 and has the same wire width. In addition, each wiring 26 has a curved configuration area 32 , including a winding wire design in a zigzag pattern. However, the wiring 30 close to the central line C1 has a smaller amplitude (for example, the amplitude A1 ), while the wiring 26 corresponding to the pin 30 outside the driving chip 18 has a larger amplitude.

图7为本发明平面显示面板的驱动芯片与配线设计的第五实施例的示意图。如图所示,驱动芯片18包括多个接脚30,且接脚30间的间距不完全相同。值得注意的是,位于中心线C1左、右侧的接脚30的设置位置并没有成镜像对称,例如在驱动芯片18最左侧的二接脚30a、30b之间的间距为P1,而在驱动芯片18最右侧的二接脚30c、30d之间的间距为P2,而间距P1是大于间距P2。配线26是分别对应连接于一接脚30,其中接近驱动芯片18中央部分的配线26的线宽是小于接近驱动芯片18外侧的配线26,例如配线26a的线宽小于配线26c,配线26d的线宽大于配线26c,而配线26f的线宽大于配线26d与配线26e的线宽,位于中心线C1右侧的配线26亦具有类似的线宽变化设计。值得注意的是,位于中心线C1两侧的配线26的走线图案并未完全对称,举例而言,中心线C1右侧的配线26i具有弯曲配置区32,而配线26k、26j则不具有弯曲配置区,然而,中心线C1左侧的配线26d、26e、26f皆不具有弯曲配置区32。此外,配线26k与显示区边界14a的夹角B1不等于配线26f与显示区边界14a的夹角B2,在本实施例中,夹角B2是大于夹角B1。FIG. 7 is a schematic diagram of a fifth embodiment of the driver chip and wiring design of the flat display panel of the present invention. As shown in the figure, the driver chip 18 includes a plurality of pins 30 , and the spacing between the pins 30 is not exactly the same. It should be noted that the arrangement positions of the pins 30 on the left and right sides of the centerline C1 are not mirror-symmetrical, for example, the distance between the two leftmost pins 30a and 30b of the driver chip 18 is P1, while in The distance between the two rightmost pins 30c and 30d of the driving chip 18 is P2, and the distance P1 is greater than the distance P2. The wires 26 are respectively correspondingly connected to a pin 30, wherein the wire width of the wire 26 close to the central part of the driver chip 18 is smaller than the wire 26 near the outside of the driver chip 18, for example, the wire width of the wire 26a is smaller than that of the wire 26c , the line width of the wiring 26d is larger than that of the wiring 26c, and the line width of the wiring 26f is larger than that of the wiring 26d and the wiring 26e. The wiring 26 on the right side of the central line C1 also has a similar line width variation design. It should be noted that the routing pattern of the wiring 26 on both sides of the central line C1 is not completely symmetrical. For example, the wiring 26i on the right side of the central line C1 has a bending configuration area 32, while the wiring 26k and 26j are There is no bent arrangement area, however, none of the wirings 26 d , 26 e , and 26 f on the left side of the central line C1 has the bent arrangement area 32 . In addition, the angle B1 between the wiring 26k and the boundary 14a of the display area is not equal to the angle B2 between the wiring 26f and the boundary 14a of the display area. In this embodiment, the angle B2 is greater than the angle B1.

本发明平面显示面板可应用于离子显示器、液晶显示器以及有机发光显示器或需要芯片与导线接合的任何显示面板。此外,前述实施例是以信号线与信号线驱动芯片的走线设计为例来说明本发明的精神,类似的设计亦可应用于扫描线与扫描线驱动芯片或他与芯片接脚相接的导线设计中。The flat display panel of the present invention can be applied to ion display, liquid crystal display and organic light-emitting display or any display panel that requires bonding of chips and wires. In addition, the aforementioned embodiments illustrate the spirit of the present invention by taking the routing design of the signal line and the signal line driver chip as an example. Similar designs can also be applied to the scanning line and the scanning line driver chip or the connection between the scanning line and the chip pins. wire design.

相较于已知技术,由于本发明平面显示面板的驱动芯片的接脚具有不等间距的设计,因此可以避免已知工艺中因接脚间距太近而引起的配线短路问题。在较佳实施例中,靠近驱动芯片外侧的接脚之间距较大,因此连接于外侧接脚的配线具有较大的走线空间,本发明亦利用此点特性设计使外侧配线具有较大的线宽,以有效降低外侧配线的阻抗,使得接近驱动芯片中央部分的配线不需像已知技术的设计而必须具有非常细密的绕工线或绕曲折线设计,导致大幅增加其拉线长度。简而言之,本发明利用驱动芯片上不等间距的接脚与调整配线线宽的设计,并配合弯曲配置区振幅的变化,能使配线阻抗均匀化,并有效提高配线工艺良品率,进一步改善平面显示面板的显示品质。Compared with the prior art, since the pins of the driving chip of the flat display panel of the present invention have unequal pitches, it is possible to avoid the wiring short circuit problem caused by too close pitch of the pins in the known technology. In a preferred embodiment, the distance between the pins near the outside of the driver chip is larger, so the wiring connected to the outer pins has a larger routing space. The present invention also utilizes this characteristic design to make the outer wiring have a larger Large line width to effectively reduce the impedance of the outer wiring, so that the wiring close to the central part of the driver chip does not need to have a very fine winding line or winding line design like the design of the known technology, resulting in a significant increase in its Cable length. In short, the present invention uses the unequal spacing pins on the driver chip and the design of adjusting the width of the wiring, and cooperates with the change of the amplitude of the bending configuration area, which can make the wiring impedance uniform and effectively improve the quality of the wiring process. rate, further improving the display quality of the flat display panel.

以上所述仅为本发明的较佳实施例,凡依本发明权利要求范围所做的均等变化与修饰,皆应属本发明的涵盖范围。The above descriptions are only preferred embodiments of the present invention, and all equivalent changes and modifications made according to the claims of the present invention shall fall within the scope of the present invention.

Claims (23)

1. a two-d display panel is characterized in that, described panel comprises:
One substrate, definition has a viewing area and a periphery circuit region, is located at least one side of described viewing area;
At least one chip for driving is located at described periphery circuit region, and described chip for driving comprises a plurality of pins, and the spacing between adjacent described these pins is not exclusively equal;
Many control circuit lines are arranged at described viewing area; And
Many distributions, be arranged at described periphery circuit region and be electrically connected with described these control circuit lines and described these pins, described these distributions comprise one first distribution and adjacent one second distribution and one the 3rd distribution at least, have one first spacing and one second spacing respectively between described pin that described first distribution is connected and described second distribution and described these pins that described the 3rd distribution is connected, wherein said first spacing is greater than described second spacing, and the live width of described second distribution is greater than the live width of described first distribution, and the live width of described first distribution is greater than the live width of described the 3rd distribution.
2. two-d display panel as claimed in claim 1 is characterized in that, described these control circuit lines are parallel each other in described viewing area.
3. two-d display panel as claimed in claim 1, it is characterized in that the live width of described these distributions that is connected in described these pins in the described chip for driving outside is greater than the live width of described these distributions of described these pins that are connected in described chip for driving middle body.
4. two-d display panel as claimed in claim 1, it is characterized in that, described chip for driving has a center line, and the spacing between described these pins of approaching more described center line is more little, and big more away from the spacing between described these pins of described center line more.
5. two-d display panel as claimed in claim 4 is characterized in that, described these pins that are positioned at the described center line both sides of described chip for driving are to be that axis of symmetry and left-right symmetric are arranged with described center line.
6. two-d display panel as claimed in claim 5 is characterized in that, described these distributions that are positioned at the described center line both sides of described chip for driving are that axis of symmetry and left-right symmetric are arranged with described center line.
7. two-d display panel as claimed in claim 4 is characterized in that, described these distributions that are positioned at the described center line both sides of described chip for driving are asymmetric setting.
8. two-d display panel as claimed in claim 1 is characterized in that, described these distributions have a curved configuration district.
9. two-d display panel as claimed in claim 8 is characterized in that, described these distributions in the described curved configuration district have a plurality of sawtooth or the wave-like of continuous repetition, and described these sawtooth or the wave-like of each described distribution have an amplitude.
10. two-d display panel as claimed in claim 9 is characterized in that, the amplitude of described these distributions in the described chip for driving outside is the amplitude greater than described these distributions of described chip for driving middle body.
11. two-d display panel as claimed in claim 9 is characterized in that, in described curved configuration district, the minor increment of adjacent described these distributions is about 6 to 8 microns.
12. two-d display panel as claimed in claim 1 is characterized in that, the minimum spacing of adjacent described these pins is about 20 microns, and maximum spacing is about 50 microns.
13. two-d display panel as claimed in claim 1 is characterized in that, described these distributions of the middle body of described chip for driving have a curved configuration district, and described these distributions in the outside of described chip for driving do not have described curved configuration district.
14. two-d display panel as claimed in claim 1 is characterized in that, described these chip for driving comprise crystal grain mantle joint chip.
15. a two-d display panel is characterized in that, described panel comprises:
One substrate, definition has a viewing area and a periphery circuit region, is located at least one side of described viewing area;
At least one chip for driving, be located at described periphery circuit region, described chip for driving comprises that the spacing between a plurality of pins and adjacent described these pins is not exclusively equal, between described these pins of the middle body of wherein said chip for driving between apart from being less than distance between between described these pins in the described chip for driving outside;
Many control circuit lines are arranged at described viewing area; And
Many distributions are arranged at described periphery circuit region and are electrically connected with described these control circuit lines and described these pins, and wherein said these distributions have a curved configuration district.
16. two-d display panel as claimed in claim 15, it is characterized in that the live width of described these distributions that is connected in described these pins in the described chip for driving outside is the live widths greater than described these distributions of described these pins of the middle body that is connected in described chip for driving.
17. two-d display panel as claimed in claim 15 is characterized in that, the live width of described these distributions is identical.
18. two-d display panel as claimed in claim 15 is characterized in that, described these distributions in the described curved configuration district have a plurality of sawtooth or the wave-like of continuous repetition, and described these sawtooth or the wave-like of each described distribution have an amplitude.
19. two-d display panel as claimed in claim 18 is characterized in that, the amplitude of described these distributions in the described chip for driving outside is the amplitude greater than described these distributions of the middle body of described chip for driving.
20. two-d display panel as claimed in claim 18 is characterized in that, in described curved configuration district, the minor increment of adjacent described these distributions is about 6 to 8 microns.
21. two-d display panel as claimed in claim 15 is characterized in that, the minimum spacing of described adjacent described these pins is about 20 microns, and maximum spacing is about 50 microns.
22. two-d display panel as claimed in claim 15 is characterized in that, described these distributions of the middle body of described chip for driving have a curved configuration district, and described these distributions in the described chip for driving outside do not have described curved configuration district.
23. two-d display panel as claimed in claim 15 is characterized in that, described these chip for driving comprise crystal grain mantle joint chip.
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