CN101472442A - Temperature equalization board - Google Patents
Temperature equalization board Download PDFInfo
- Publication number
- CN101472442A CN101472442A CNA2007101861205A CN200710186120A CN101472442A CN 101472442 A CN101472442 A CN 101472442A CN A2007101861205 A CNA2007101861205 A CN A2007101861205A CN 200710186120 A CN200710186120 A CN 200710186120A CN 101472442 A CN101472442 A CN 101472442A
- Authority
- CN
- China
- Prior art keywords
- capillary structure
- working media
- temperature
- plate
- flowing space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A temperature-uniforming plate includes a bottom plate and a cover plate. A chamber is hermetically formed between the bottom plate and the cover plate, and filled with a working medium. A first capillary structure, a second capillary structure and a third capillary structure are arranged in the chamber respectively; the first capillary structure is arranged on the inner surface of the cover body; the third capillary structure is arranged on the inner surface of the bottom plate; the second capillary structure is connected between the first capillary structure and the third capillary structure; a first vapourous working medium flowing space around the periphery of the second capillary structure is formed in the temperature-uniforming plate; a second vapourous working medium flowing space is formed in the second capillary structure; and the first vapourous working medium flowing space and the second vapourous working medium flowing space are communicated. The temperature-uniforming plate can reduce the whole thickness of the temperature-uniforming plate on the premise that the performance of the temperature-uniforming plate is ensured.
Description
Technical field
The present invention relates to a kind of temperature-uniforming plate, particularly a kind of temperature-uniforming plate that is used to electronic component to dispel the heat.
Background technology
Such as computer cpu, north bridge chips, the contour power electronic element of light-emitting diode towards trend development more compact and multi-functional, quicker operation, its heat that unit are is produced when operation is also more and more many thereupon, if these heats can not be left timely and effectively, to directly cause temperature sharply to rise, and have a strong impact on the normal operation of heat-generating electronic elements.For this reason, need to use heat abstractor to come these electronic components are dispelled the heat.
Most typical heat abstractor is a kind of finned radiator of being furnished with fan, contacts the purpose of reaching heat radiation with heat-generating electronic elements by radiator.For adapting to higher heat flux (heat flux), between heat-generating electronic elements and radiator, install a temperature-uniforming plate (heat spreader) with good heat conductivity usually additional.The effect of this temperature-uniforming plate is that the heat that heat-generating electronic elements produces is evenly distributed earlier, and then passes on the radiator, to give full play to the usefulness of radiator.
The cavity body structure that existing temperature-uniforming plate is normally surrounded by a upper plate and a lower plate.The total inner surface of described upper plate and lower plate is equipped with capillary structure, and forms the cavity as the steam motion between described upper plate and lower plate.During use, lower plate absorbs the heat that heat-generating electronic elements sends and makes the working media in it flash to steam state, the working media of steam state contacts to upper plate and with upper plate along cavity flow and discharges heat and be cooled to liquid state, and liquid working media is back to lower plate under the effect of capillary structure.Wherein, cavity is the flow channel of gaseous working medium, if cavity is too small, the resistance of working media evaporation will become big; If make cavity have bigger size to reduce flow resistance, will cause the increase of temperature-uniforming plate thickness, the radiating requirements that how to adapt to lightening electronic product under the prerequisite of guaranteed performance becomes the realistic objective of product.
Summary of the invention
In view of this, at this real temperature-uniforming plate that is necessary to provide a kind of better performances and thinner thickness.
A kind of temperature-uniforming plate, comprise a base plate and a cover plate, airtight formation one chamber between described base plate and the cover plate, be filled with a working media in this chamber, be respectively arranged with first in this chamber, second, the 3rd capillary structure, this first capillary structure is arranged at the inner surface of cover plate, the 3rd capillary structure is arranged at the inner surface of base plate, this second capillary structure is connected between this first capillary structure and the 3rd capillary structure, periphery around this second capillary structure in this temperature-uniforming plate forms the first steam state working media flowing space, form the second steam state working media flowing space in this second capillary structure, this first steam state working media flowing space communicates with the second steam state working media flowing space.
A kind of temperature-uniforming plate, comprise a base plate and a cover plate, form a chamber between this base plate and the cover plate, be provided with a working media in this chamber, be equipped with first capillary structure on the total inner surface of this cover plate, be provided with second capillary structure that connects between the base plate and first capillary structure in this chamber, form the one first steam state working media flowing space around this second capillary structure in this chamber, this second capillary structure encloses and forms the one second steam state working media flowing space, and this first steam state working media flowing space and this second steam state working media flowing space are interconnected.
Compared with prior art, the present invention utilizes in this temperature-uniforming plate circulatory system, the steam overwhelming majority condenses on the colder cover plate, and then be back to the principle at heat-generating electronic elements place, first capillary structure only on the cover board is set, in chamber, be provided with second capillary structure that connects between the base plate and first capillary structure, can reduce the integral thickness of temperature-uniforming plate; In addition, in chamber, form the one first steam state working media flowing space around this second capillary structure, this second capillary structure encloses and forms the one second steam state working media flowing space, this first steam state working media flowing space and this second steam state working media flowing space are interconnected, can reduce the resistance of heat-generating electronic elements place steam raising, effectively promote heat transfer efficiency.
Description of drawings
Below with reference to accompanying drawing, in conjunction with the embodiments the present invention is further described.
Fig. 1 is the three-dimensional assembly diagram of temperature-uniforming plate first embodiment of the present invention.
Fig. 2 is the cut-away view of temperature-uniforming plate shown in Figure 1.
Fig. 3 is the enlarged diagram of Fig. 2 centre circle III part.
Fig. 4 is the three-dimensional exploded view of Fig. 1.
Fig. 5 is the schematic perspective view of another embodiment of first capillary structure.
Embodiment
As Fig. 1 and shown in Figure 4, be first embodiment of temperature-uniforming plate of the present invention.This temperature-uniforming plate comprises that one has the base plate 100 and a cover plate 200 of cavity 102, this cover plate 200 is located on this base plate 100 and with 102 airtight formation one chambers of the cavity on this base plate 100 (figure is mark), is pumped into low pressure in this chamber and the working media that can carry out phase change is housed such as water, ethanol, paraffin etc.This temperature-uniforming plate comprises that also one is arranged on first capillary structure 220, on these cover plate 200 inner surfaces 201 and is arranged on the second steam state working media flowing space 400 that second capillary structure 221, in the chamber is arranged on the 3rd capillary structure 110 on these base plate 100 inner surfaces 101, the first steam state working media flowing space 300 and that is provided with around the periphery of this second capillary structure 221 is formed at these second capillary structure, 221 inside, and this first steam state working media flowing space 300 is communicated with this second steam state working media flowing space 400.
This base plate 100 can be made by copper, aluminium or other material with high thermal conductivity coefficient with cover plate 200.The outer surface 103 of this base plate 100 contacts with an electronic component (figure does not show), and absorbs the heat that electronic component produced.Generally speaking, make the central area of this base plate 100 contact usually with this electronic component.
The 3rd capillary structure 110 parts are arranged on the inner surface 101 of this base plate 100, and promptly relative with electronic component part can guarantee that like this base plate 100 the hottest parts have liquid working media to exist always, avoid the temperature-uniforming plate dry combustion method.The 3rd capillary structure 110 roughly is square, and its area is less than the area of 102 bottoms of the cavity on the base plate 100.In other words, in the cavity 102 that this first steam state working media flowing space 300 is formed on this base plate 100, and around 110 settings of the 3rd capillary structure.Design like this, can reduce the integral thickness of temperature-uniforming plate, make this temperature-uniforming plate adapt to constantly lightening trend of electronic component.
This first capillary structure 220 is laid on the total inner surface 201 of this cover plate 200 and is relative with the 3rd capillary structure 110.This second capillary structure 221 extends to the top surface edge place that replaces at the 3rd capillary structure 110 straight down from the central area of this first capillary structure 220, and first capillary structure 220 is connected up and down with the 3rd capillary structure 110.This first capillary structure 220, second capillary structure 221 and the 3rd capillary structure 110 can be selected capillary structure forms such as woven wire, cellulose, sintered powder, carbon nano pipe array for use, and this first, the 3rd capillary structure 220,110 also can further select for use minute groove as capillary structure.
The inside of this second capillary structure 221 surrounds a cavity structure, is this second steam state working media flowing space 400.This second steam state working media flowing space 400 is over against the 3rd capillary structure 110 and be positioned at the top of the 3rd capillary structure 110 upper surfaces.
This second capillary structure 221 is provided with some passages 222, these passages 222 uniformly-spaced are provided with, this second steam state working media flowing space 400 is communicated with the first steam state working media flowing space 300, makes the working media of steam state between this first and second steam state working media flowing space 300,400, to flow.In the present embodiment, this second capillary structure 221 is cut apart by described some passages 222 and is formed several independently protuberances (figure is mark), each passage 222 is formed between the two adjacent protuberances, and working media the flowing between first, second steam state working media flowing space 300,400 that a plurality of passages 222 can be accelerated steam state is set.
Above-mentioned is the concrete structure of this temperature-uniforming plate, below makes brief description at the course of work of this temperature-uniforming plate.
During work, the heat that electronic component produces is absorbed by base plate 100 and the working media that adsorbs in the 3rd capillary structure 110 is heated, flashes to steam state.The working media of steam state overflows and flows into this second steam state working media flowing space 400 fast from the 3rd capillary structure 110, and promptly is diffused in the whole first steam state working media flowing space 300 by passage 222.When running into cover plate 200, the working media of steam state is cooled to liquid, this is cooled into liquid working media and is collected to second capillary structure, 221 places via first capillary structure 220 on the cover plate 200, and be back in the 3rd capillary structure 110 by this second capillary structure 221, circulate again next time.
As mentioned above, by this second steam state working media flowing space 400 is set above the 3rd capillary structure 110, can reduce the 3rd capillary structure 110 places owing to the formed big pressure of working media vaporization, thereby reduce the resistance that working media evaporates, overflows the 3rd capillary structure 110.So, the speed of working media evaporation and overflow speeding up of the 3rd capillary structure 110 promotes the performance of temperature-uniforming plate.
In addition, being condensed into the working media of liquid can be in this first capillary structure 220 and the 3rd capillary structure 110 be back to downwards rapidly in the 3rd capillary structure 110 under the common effect of fluid pressure differential and gravity, can avoid temperature-uniforming plate to produce the dry combustion method phenomenon, promote the reliability of temperature-uniforming plate.
Be illustrated in figure 5 as the first capillary structure 220a among another embodiment, the difference of first capillary structure 220 is among itself and first embodiment: this second capillary structure 221a is whole form circular, one passage 222a is arranged on the top of the second capillary structure 221a near the first capillary structure 220a, and the second steam state working media flowing space 400a is communicated with the first steam state working media flowing space 300.The number of passage 222a, shape are not subjected to the qualification of present embodiment, can be one, two or more, can be square other shapes that yet can be, and can be arranged on the bottom position of the second capillary structure 221a near the 3rd capillary structure 110 yet.
110 of the 3rd capillary structures in the various embodiments described above are located at the position of the inner surface 101 corresponding heat-generating electronic elements of base plate 100, also promptly be positioned at the middle position of chamber, reduced capillary structure occupation space in the temperature-uniforming plate, utilize this space as the space that working media flows, can reduce the integral thickness of temperature-uniforming plate; Simultaneously, allow first capillary structure 220,220a be connected with the 3rd capillary structure 110, and form the second steam state working media flowing space 400,400a between the two, and allow this second steam state working media flowing space 400,400a communicate with the first steam state working media flowing space 300 in the temperature-uniforming plate, can reduce the resistance of heat-generating electronic elements place steam raising.The resistance that temperature-uniforming plate of the present invention can not increase the working media evaporation has thin thickness again, and the integral thickness of this temperature-uniforming plate can be reduced to 2.5 millimeters.
The second steam state working media flowing space 400 among the present invention, the shape of 400a are not subjected to the restriction of above-mentioned two embodiment, second capillary structure 221 can be arranged on first capillary structure 220, the 220a, also can be located on the 3rd capillary structure 110, position, shape that is communicated with passage 222, the 222a of the second steam state working media flowing space 400,400a and the first steam state working media flowing space 300 etc. also makes corresponding changes as the case may be.
Claims (12)
1. temperature-uniforming plate, comprise a base plate and a cover plate, airtight formation one chamber between described base plate and the cover plate, be filled with a working media in this chamber, it is characterized in that: be respectively arranged with first in this chamber, second, the 3rd capillary structure, this first capillary structure is arranged at the inner surface of cover plate, the 3rd capillary structure is arranged at the inner surface of base plate, this second capillary structure is connected between this first capillary structure and the 3rd capillary structure, periphery around this second capillary structure in this temperature-uniforming plate forms the first steam state working media flowing space, form the second steam state working media flowing space in this second capillary structure, this first steam state working media flowing space communicates with the second steam state working media flowing space.
2. temperature-uniforming plate as claimed in claim 1 is characterized in that: this second capillary structure forms and replaces on the 3rd capillary structure from this first capillary structure.
3. temperature-uniforming plate as claimed in claim 1 is characterized in that: the passage that forms at least one connection first steam state working media flowing space and the second steam state working media flowing space on this second capillary structure.
4. temperature-uniforming plate as claimed in claim 3 is characterized in that: this second capillary structure is divided into a plurality of protuberances by passage, and described passage is formed between the two adjacent protuberances.
5. temperature-uniforming plate as claimed in claim 3 is characterized in that: this second capillary structure is a ring-type, and described passage is formed on the bottom or the tip position of second capillary structure.
6. as any one described temperature-uniforming plate of claim 3 to 5, it is characterized in that: described passage is several.
7. temperature-uniforming plate as claimed in claim 6 is characterized in that: described passage uniformly-spaced is provided with.
8. temperature-uniforming plate as claimed in claim 1 is characterized in that: described second, third capillary structure is positioned at the middle position of described chamber.
9. temperature-uniforming plate, comprise a base plate and a cover plate, form a chamber between this base plate and the cover plate, be provided with a working media in this chamber, it is characterized in that: be equipped with first capillary structure on the total inner surface of this cover plate, be provided with second capillary structure that connects between the base plate and first capillary structure in this chamber, form the one first steam state working media flowing space around this second capillary structure in this chamber, this second capillary structure encloses and forms the one second steam state working media flowing space, and this first steam state working media flowing space and this second steam state working media flowing space are interconnected.
10. temperature-uniforming plate as claimed in claim 9, it is characterized in that: the part is equipped with one the 3rd capillary structure on the inner surface of this base plate, the 3rd capillary structure is over against this second capillary structure setting, and this second capillary structure is between this first capillary structure and the 3rd capillary structure.
11. temperature-uniforming plate as claimed in claim 9 is characterized in that: on this second capillary structure at least one passage is set, so that this first steam state working media flowing space is communicated with this second steam state working media flowing space.
12. temperature-uniforming plate as claimed in claim 9 is characterized in that: described second, third capillary structure is positioned at the middle position of described chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101861205A CN101472442A (en) | 2007-12-27 | 2007-12-27 | Temperature equalization board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101861205A CN101472442A (en) | 2007-12-27 | 2007-12-27 | Temperature equalization board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101472442A true CN101472442A (en) | 2009-07-01 |
Family
ID=40829442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101861205A Pending CN101472442A (en) | 2007-12-27 | 2007-12-27 | Temperature equalization board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101472442A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103826412A (en) * | 2012-11-16 | 2014-05-28 | 奇鋐科技股份有限公司 | heat sink |
| CN107621184A (en) * | 2017-08-29 | 2018-01-23 | 苏州天脉导热科技有限公司 | Superconduction soaking plate |
| CN110260193A (en) * | 2019-06-28 | 2019-09-20 | 商洛市虎之翼科技有限公司 | Lighting device with heat sinking function |
| CN111121510A (en) * | 2019-12-27 | 2020-05-08 | 东莞赛诺高德蚀刻科技有限公司 | Temperature-uniforming plate and preparation method thereof |
| CN112996339A (en) * | 2019-12-12 | 2021-06-18 | 王训忠 | Temperature equalizing plate device |
-
2007
- 2007-12-27 CN CNA2007101861205A patent/CN101472442A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103826412A (en) * | 2012-11-16 | 2014-05-28 | 奇鋐科技股份有限公司 | heat sink |
| CN107621184A (en) * | 2017-08-29 | 2018-01-23 | 苏州天脉导热科技有限公司 | Superconduction soaking plate |
| CN110260193A (en) * | 2019-06-28 | 2019-09-20 | 商洛市虎之翼科技有限公司 | Lighting device with heat sinking function |
| CN112996339A (en) * | 2019-12-12 | 2021-06-18 | 王训忠 | Temperature equalizing plate device |
| CN112996339B (en) * | 2019-12-12 | 2023-09-26 | 王训忠 | Uniform temperature plate device |
| CN111121510A (en) * | 2019-12-27 | 2020-05-08 | 东莞赛诺高德蚀刻科技有限公司 | Temperature-uniforming plate and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101754656B (en) | Uniform temperature plate | |
| US7637633B2 (en) | Heat dissipation devices for an LED lamp set | |
| CN101221023B (en) | Heat transfer device | |
| CN203563290U (en) | Integrated phase change cooling device with built-in multi-channel heat pipes in fins | |
| CN203672209U (en) | Miniature capillary pump ring with capillary wick structure of gradient pore structure | |
| US20100065255A1 (en) | Vapor Chamber | |
| CN107949238A (en) | A kind of soaking plate heat dissipating device with support column arrangement and preparation method thereof | |
| CN101765352B (en) | Flat type heat conducting pipe and heat radiating module using same | |
| TW201240587A (en) | Vapor chamber | |
| CN106061199B (en) | A kind of small type heat exchanger of flow boiling | |
| US20220022339A1 (en) | Heat dissipation device | |
| JPH0727999B2 (en) | Integrated heat pipe module | |
| CN101472442A (en) | Temperature equalization board | |
| CN101363696B (en) | Flat hot pipe for cooling electron device and processing technology thereof | |
| CN209766407U (en) | Air cooled high power high heat flow heat sink | |
| CN116483178A (en) | Computing equipment and cold plate thereof | |
| CN100557367C (en) | A kind of large power plate integral type phase change heat-radiation method and radiator | |
| CN101676672B (en) | vapor chamber | |
| CN100334931C (en) | Plane capillary core evaporimeter with fin for CPL | |
| CN109890177A (en) | An electronic device thermal management microstructure | |
| CN207881290U (en) | Flat heat pipe expansion type condensing device | |
| CN102345992A (en) | A pressure gradient driven low-pressure loop thermosiphon device | |
| RU2546676C2 (en) | Intensified evaporative cooling system for light-emitting-diode module | |
| CN2829090Y (en) | Slotted cylindrical heat pipe | |
| TWM639337U (en) | Vapor chamber structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20090701 |