CN109890177A - An electronic device thermal management microstructure - Google Patents
An electronic device thermal management microstructure Download PDFInfo
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- CN109890177A CN109890177A CN201910171105.6A CN201910171105A CN109890177A CN 109890177 A CN109890177 A CN 109890177A CN 201910171105 A CN201910171105 A CN 201910171105A CN 109890177 A CN109890177 A CN 109890177A
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- Prior art keywords
- pcb
- chamber
- cooling chamber
- micro
- flow channel
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Links
- 238000001816 cooling Methods 0.000 claims abstract description 99
- 239000007788 liquid Substances 0.000 claims abstract description 59
- 238000001704 evaporation Methods 0.000 claims abstract description 29
- 230000008020 evaporation Effects 0.000 claims abstract description 27
- 239000002184 metal Substances 0.000 claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 20
- 239000002826 coolant Substances 0.000 claims abstract description 17
- 230000005540 biological transmission Effects 0.000 claims abstract description 11
- 238000003491 array Methods 0.000 claims abstract 3
- 230000000149 penetrating effect Effects 0.000 claims abstract 2
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 7
- 239000002904 solvent Substances 0.000 claims description 3
- 150000002500 ions Chemical class 0.000 claims 1
- 230000003204 osmotic effect Effects 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 8
- 238000005516 engineering process Methods 0.000 abstract description 5
- 238000009834 vaporization Methods 0.000 description 38
- 230000008016 vaporization Effects 0.000 description 37
- 239000003507 refrigerant Substances 0.000 description 10
- 239000012528 membrane Substances 0.000 description 7
- MINPZZUPSSVGJN-UHFFFAOYSA-N 1,1,1,4,4,4-hexachlorobutane Chemical compound ClC(Cl)(Cl)CCC(Cl)(Cl)Cl MINPZZUPSSVGJN-UHFFFAOYSA-N 0.000 description 6
- 101150049492 DVR gene Proteins 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- AGCPZMJBXSCWQY-UHFFFAOYSA-N 1,1,2,3,4-pentachlorobutane Chemical compound ClCC(Cl)C(Cl)C(Cl)Cl AGCPZMJBXSCWQY-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- ZGHQUYZPMWMLBM-UHFFFAOYSA-N 1,2-dichloro-4-phenylbenzene Chemical compound C1=C(Cl)C(Cl)=CC=C1C1=CC=CC=C1 ZGHQUYZPMWMLBM-UHFFFAOYSA-N 0.000 description 1
- WEJZHZJJXPXXMU-UHFFFAOYSA-N 2,4-dichloro-1-phenylbenzene Chemical compound ClC1=CC(Cl)=CC=C1C1=CC=CC=C1 WEJZHZJJXPXXMU-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000007363 ring formation reaction Methods 0.000 description 1
- 229960002668 sodium chloride Drugs 0.000 description 1
- 235000002639 sodium chloride Nutrition 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
Abstract
本发明公开了一种电子设备热管理微结构，包括上层PCB和下层PCB，上层PCB与下层PCB叠放键合；上层PCB布设有蒸发室、冷却室以及用于气态冷却工质传输的微型流道Ⅰ，微型流道Ⅰ连通上层PCB蒸发室与冷却室；下层PCB布设蒸发室、冷却室、用于液态冷却工质传输的微型流道II以及为液态冷却工质提供驱动力的微型泵，微型流道II连通下层PCB蒸发室与冷却室，微型流道II的入口和出口分别与微型泵连接；上层PCB蒸发室与下层PCB蒸发室之间通过纳米多孔蒸发薄膜隔开，上层PCB冷却室与下层PCB冷却室之间通过半透薄膜隔开；上层PCB冷却室和下层PCB蒸发室均布设有贯通PCB的金属柱体阵列。本发明解决了现有电子设备散热技术中遇到的问题，改善了电子设备的性能和稳定性。
The invention discloses a thermal management microstructure of electronic equipment, comprising an upper PCB and a lower PCB, the upper PCB and the lower PCB are stacked and bonded; Channel I, micro channel I connects the upper PCB evaporation chamber and cooling chamber; the lower PCB is arranged with an evaporation chamber, a cooling chamber, a micro channel II for the transmission of the liquid cooling medium, and a micro pump that provides driving force for the liquid cooling medium. The micro-channel II connects the lower PCB evaporation chamber and the cooling chamber, and the inlet and outlet of the micro-channel II are respectively connected with the micro pump; the upper PCB evaporation chamber and the lower PCB evaporation chamber are separated by a nanoporous evaporation film, and the upper PCB cooling chamber It is separated from the lower PCB cooling chamber by a semi-permeable film; the upper PCB cooling chamber and the lower PCB evaporation chamber are both provided with metal column arrays penetrating the PCB. The invention solves the problems encountered in the heat dissipation technology of the existing electronic equipment, and improves the performance and stability of the electronic equipment.
Description
Technical field
The invention belongs to electronic equipment dissipating heat technical fields, in particular to a kind of electronic equipment heat management micro-structure.
Background technique
In recent years, data and network transmission are fast-developing, and network information capacity jump increasingly increases to meet network communication
Demand, high-speed electronic device need speed, in terms of make a breakthrough.As photoelectric device power is continuously increased, ruler
Very little continuous reduction, the thermal design problem in electronic equipment highlight.Traditional cooling technology and heat dissipation integrating device without
Method meet demand, it is necessary to use suitable radiating mode and radiator to ensure high-speed electronic device and all kinds of high-speed light electric appliances
Part works normally.
It is existing to improve the technical patent of heat dissipation such as using microstructure: Chinese patent publication (publication number
CN108682660A) " a kind of miniature cooling unit and its integrated approach and device " proposes that a kind of miniature cooling unit is intended to improve
Integrated power chip is grounded in radiation processes and the problem of coolant liquid watertightness；Chinese patent publication (publication number
CN107403775A) " a kind of microchannel heat sink and the electronic equipment patent No. " improves external heat radiation using microchannel structure and fills
The heat dissipation performance set；" printed circuit board embeds the heat exchange of runner liquid cooling to Chinese patent publication (publication number CN105188260A)
Device " it proposes and embeds liquid cooling runner in printed circuit board to improve the heat dissipation problem of high power device.
From the above existing heat dissipation technology can be seen that technical research emphasis be gradually transferred to by discrete radiator it is embedded
The integrated heat radiating device of circuit board or chip, so that poor reliability in current integrated electronics heat dissipation technology is solved, cooling effect
The problems such as rate is low, and thermal resistance is big, integrated level is low.And in existing electronic equipment dissipating heat technology there are still the problem of have:
1, the thermal management scheme coefficient of heat transfer is lower；
2, it needs external liquid pump to provide driving force for coolant liquid, limits integration level of electronic equipment；
3, higher to the size and performance requirement of external liquid pump.
Summary of the invention
In order to solve the technical issues of above-mentioned background technique proposes, the invention proposes the micro- knots of a kind of electronic equipment heat management
Structure.
In order to achieve the above technical purposes, the technical solution of the present invention is as follows:
A kind of electronic equipment heat management micro-structure, including upper layer PCB and lower layer PCB, upper layer PCB and lower layer PCB stack key
It closes；Upper layer PCB is laid with vaporization chamber, cooling chamber and the micro flow channel I for the cooling working medium transmission of gaseous state, micro flow channel I and connects
Logical upper layer PCB vaporization chamber and cooling chamber；Lower layer PCB lays vaporization chamber, cooling chamber, for the miniature stream of liquid cooled working medium transmission
Road II and the micropump of driving force is provided for liquid cooled working medium, micro flow channel II is connected to lower layer PCB vaporization chamber and cooling chamber,
The entrance and exit of micro flow channel II is connect with micropump respectively；By receiving between upper layer PCB vaporization chamber and lower layer's PCB vaporization chamber
Rice porous evaporation film separates, and is separated between upper layer PCB cooling chamber and lower layer's PCB cooling chamber by semipermeable membrane；Heating device
It is positioned close at the position of lower layer's PCB vaporization chamber, cooling fin is positioned close at the position of upper layer PCB cooling chamber；Upper layer PCB
Cooling chamber and lower layer's PCB vaporization chamber are laid with the metal cartridge array of perforation PCB.
Further, the generally linear or S-shaped of micro flow channel I and micro flow channel II.
Further, the section of micro flow channel I is triangle.
Further, the section of micro flow channel II is circle.
Further, in upper layer PCB, micro flow channel I is tilted down along cooling chamber direction.
Further, the vaporization chamber on the PCB of upper layer and cooling chamber are cylinder shape groove structure；Vaporization chamber on lower layer PCB
It is nearly cylinder shape groove structure, the rounded structure in the junction of bottom surface and side with cooling chamber.
Further, the metal cartridge array that upper layer PCB cooling chamber and lower layer's PCB vaporization chamber is arranged in is annular array.
Further, when work, liquid cooled working medium enters lower layer PCB from the entrance of micro flow channel II by micropump,
Lower layer PCB vaporization chamber is flowed into along micro flow channel II, in lower layer's PCB vaporization chamber, the heat that heating device generates passes through metal column
Volume array and lower layer PCB and liquid cooled working medium exchange heat, and partial solvent passes through nanoporous after liquid cooled working medium absorbs heat
Evaporating film evaporative phase-change is the cooling working medium of gaseous state, and is transferred to upper layer PCB vaporization chamber, remaining liquid through nanoporous evaporating film
Cooling working medium flows into lower layer PCB cooling chamber by micro flow channel II, and is exchanged heat by metal cartridge array and lower layer PCB,
Liquid cooled working medium after cooling flows back to micropump from the outlet of micro flow channel II；Upper layer PCB is transferred to by evaporative phase-change to steam
The cooling working medium of gaseous state for sending out room flows into upper layer PCB cooling chamber through micro flow channel I, and is exchanged heat by metal cartridge and cooling fin, from
And mutually becoming liquid cooled working medium, the concentration of the liquid cooled working medium in lower layer's PCB cooling chamber is much higher than in upper layer PCB cooling chamber
Liquid cooled working medium, the liquid cooled working medium in the PCB cooling chamber of upper layer flows back to lower layer PCB by the osmosis of semipermeable membrane
Cooling chamber, and then flow back to micropump.
By adopting the above technical scheme bring the utility model has the advantages that
(1) gas-liquid two-phase refrigerating function may be implemented in electronic equipment heat management micro-structure proposed by the present invention, with other electricity
Sub- equipment thermal management scheme, which is compared, has the bigger coefficient of heat transfer, improves the performance and heat of photoelectric device and high-speed electronic device
Stability；
(2) electronic equipment heat management micro-structure proposed by the present invention is cold using the heat progress gas-liquid two-phase of heating device
But, while micropump is shared to the driving force of coolant liquid, reduce coolant liquid and the performance requirement of liquid pump is collected so as to utilize
The limitation for device integration is relieved at micropump.
Detailed description of the invention
Fig. 1 is the schematic perspective view of a kind of electronic equipment heat management micro-structure provided in an embodiment of the present invention；
Fig. 2 is the schematic perspective view of lower layer of embodiment of the present invention PCB；
Fig. 3 is the schematic perspective view of upper layer of embodiment of the present invention PCB；
Fig. 4 is lower layer of embodiment of the present invention PCB vaporization chamber sectional view；
Fig. 5 is upper layer of embodiment of the present invention PCB cooling chamber sectional view.
Label declaration:
1-upper layer PCB；2-lower layer PCB；3-micropumps；4-cooling fins；5-heating devices；6-vaporization chambers；7-is cold
But room；The micro flow channel of 8-transmission liquid cooled working medium；9-metal cartridges；The outlet of 10-liquid refrigerants；11-liquid refrigerants
Entrance；12-nanoporous thin evaporated films；The micro flow channel of the 13-cooling working medium of transmission gaseous state；14-semipermeable membranes.
Specific embodiment
Below with reference to attached drawing, technical solution of the present invention is described in detail.
It include upper layer PCB and lower layer PCB the invention proposes a kind of electronic equipment heat management micro-structure, upper layer PCB is under
Layer PCB stacks bonding；Upper layer PCB is laid with vaporization chamber, cooling chamber and the micro flow channel I for the cooling working medium transmission of gaseous state,
Micro flow channel I is connected to upper layer PCB vaporization chamber and cooling chamber；Lower layer PCB lays vaporization chamber, cooling chamber, is used for liquid cooled working medium
The micro flow channel II of transmission and the micropump of driving force is provided for liquid cooled working medium, micro flow channel II is connected to lower layer PCB and steams
Hair room and cooling chamber, the entrance and exit of micro flow channel II are connect with micropump respectively；Upper layer PCB vaporization chamber and lower layer PCB steam
Hair is separated between room by nanoporous thin evaporated film, passes through semipermeable membrane between upper layer PCB cooling chamber and lower layer's PCB cooling chamber
It separates；Heating device is positioned close at the position of lower layer's PCB vaporization chamber, and cooling fin is positioned close to upper layer PCB cooling chamber
At position；Vaporization chamber in the cooling chamber and lower layer PCB of upper layer PCB is laid with the metal cartridge array of perforation PCB.
Specific embodiments of the present invention are provided below, it is any disclosed in Examples below in addition to above-mentioned technical characteristic
Feature can be equivalent by other or has the alternative features of similar purpose to be replaced unless specifically stated.That is, except non-specifically chatting
It states, each feature is an example in a series of equivalent or similar characteristics.
As shown in Fig. 1 to 5, which includes upper layer PCB1 and lower layer PCB2.Upper and lower level PCB is folded
Put bonding.Upper layer and lower layer PCB is respectively equipped with vaporization chamber 6 and cooling chamber 7, is distributed in the both ends PCB, vaporization chamber 6 and cooling chamber 7
Size can be according to the size adjusting of heating device 5, and vaporization chamber 6 and 7 diameter of section of cooling chamber are 8mm in the present embodiment.Upper and lower level
PCB is respectively provided with the micro flow channel 13 of the cooling working medium of transmission gaseous state and is used for transmission the micro flow channel 8 of liquid cooled working medium,
Micro flow channel 8 is connected to the vaporization chamber 6 and cooling chamber 7 of upper layer PCB, and micro flow channel 13 is connected to the vaporization chamber 6 and cooling chamber of lower layer PCB
7.The metal cartridge 9 that perforation PCB layer section circular diameter is 1mm, 9 cyclization of metal cartridge are laid in vaporization chamber 6 and cooling chamber 7
Shape array arrangement, radial spacing 2mm.There is nanoporous thin evaporated film respectively between the vaporization chamber 6 and cooling chamber 7 of upper and lower level PCB
12 and semipermeable membrane 14 separate, and by 9 support film of metal cartridge array, film thickness 200nm, nanoporous evaporation is thin
12 aperture of film is 100nm.Lower layer PCB2 be equipped with liquid cooled working medium outlet 10 and entrance 11, for be laid in lower layer PCB2
On micropump 3 connect.5 upside-down mounting of heating device is in 6 lower section of lower layer's PCB vaporization chamber, and cooling fin 4 is loaded in upper layer PCB cooling chamber 7
Side.
In the present embodiment, the sodium-chloride water solution that concentration is 23% is selected but be not limited to liquid cooled working medium.Liquid is cold
But it is molten to can be any mixing for being evaporated process and process of osmosis by nanometer thin evaporated film 12 and semipermeable membrane 14 for working medium
Liquid.9 material of metal cartridge in the embodiment of the present invention is copper.
In the present embodiment, the vaporization chamber on the PCB1 of upper layer and cooling chamber are cylinder shape groove structure.On lower layer PCB2
Vaporization chamber and cooling chamber are nearly cylinder shape groove structure, the rounded structure in the junction of bottom surface and side.Transmit liquid cooled
The section of the micro flow channel 8 of working medium is circle, this is in order to avoid liquid refrigerant is at work due to uneven concentration or room
Interior flow velocity difference leads to that liquid refrigerant solute accumulated plugging runner 8 and lower layer's PCB vaporization chamber 6 and cooling chamber occurs in edge
7, influence radiator cooling effect and service life.The section for transmitting the micro flow channel 13 of gaseous working medium is triangle, this
It is since gaseous working medium may liquefy along runner transmission process, liquefied working medium can lead to along runner edge-corner
It crosses capillarity and flows into upper layer PCB cooling chamber.It, can also be by runner 13 further to improve the problem of liquefaction working medium flows into cooling chamber
It is suitably tilted downwards along 7 direction of cooling chamber, it is avoided to flow back to vaporization chamber 6.
In practical applications, the electronic equipment heat management micro-structure by after the shell of electronic equipment or encapsulation with cooling fin
4 contacts.Subtracted by filling the materials such as thermally conductive ester between cooling fin 4 and electronic equipment casing and electronic equipment casing and micro-structure
Few thermal resistance, this has further improvement result to heat dissipation effect of the invention.
At work, liquid cooled working medium is pumped into lower layer PCB2 from micropump 3 to the present embodiment, along liquid refrigerant runner
8 flow into lower layer PCB vaporization chamber.In lower layer's PCB vaporization chamber, the heat that heating device 5 generates passes through lower layer PCB2 and metal column
Body 9 and liquid cooled working medium exchange heat.Liquid cooled working medium absorbs heat partial solvent (water) and passes through nanoporous thin evaporated film 12
Evaporative phase-change is that gaseous state is transferred to upper layer PCB vaporization chamber.Liquid cooled working medium is flowed into after absorbing heat by liquid refrigerant runner 8
Lower layer's PCB cooling chamber, and pass through the metal cartridge 9 of cooling chamber and PCB heat exchange.Again through cooling chamber liquid cooled working medium after cooling
Micropump 3 is flowed back to through liquid refrigerant runner 8.The cooling working medium of the gaseous state for being transferred to upper layer PCB vaporization chamber by evaporative phase-change is through gas
State working fluid channel 13 flows into upper layer PCB cooling chamber, then by exchanging heat with cooling chamber metal cartridge 9 and cooling fin 4, Xiang Bianwei liquid
(water).Since for liquid refrigerant concentration much higher than liquid refrigerant in upper layer PCB cooling chamber, upper layer PCB is cooling in lower layer's PCB cooling chamber
Indoor liquid refrigerant flows back to lower layer's PCB cooling chamber by the osmosis of semipermeable membrane 14, and then flows back to micropump 3.
Embodiment is merely illustrative of the invention's technical idea, and this does not limit the scope of protection of the present invention, it is all according to
Technical idea proposed by the present invention, any changes made on the basis of the technical scheme are fallen within the scope of the present invention.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910171105.6A CN109890177B (en) | 2019-03-07 | 2019-03-07 | An electronic device thermal management microstructure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910171105.6A CN109890177B (en) | 2019-03-07 | 2019-03-07 | An electronic device thermal management microstructure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109890177A true CN109890177A (en) | 2019-06-14 |
| CN109890177B CN109890177B (en) | 2020-04-21 |
Family
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111599776A (en) * | 2020-06-04 | 2020-08-28 | 北京工业大学 | A multi-layer composite nanoporous evaporator |
| CN112888264A (en) * | 2021-02-02 | 2021-06-01 | 西安交通大学 | Double-deck microchannel heat abstractor based on gas-liquid separation |
| CN113099706A (en) * | 2021-05-21 | 2021-07-09 | 山东大学深圳研究院 | Loop heat pipe suitable for heat dissipation of flexible device, working method and heat dissipation device |
| TWI834401B (en) * | 2022-11-23 | 2024-03-01 | 大陸商慶鼎精密電子（淮安）有限公司 | Method of forming thermal conducting rod and method of forming circuit board |
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| CN112888264A (en) * | 2021-02-02 | 2021-06-01 | 西安交通大学 | Double-deck microchannel heat abstractor based on gas-liquid separation |
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| CN113099706A (en) * | 2021-05-21 | 2021-07-09 | 山东大学深圳研究院 | Loop heat pipe suitable for heat dissipation of flexible device, working method and heat dissipation device |
| CN113099706B (en) * | 2021-05-21 | 2022-07-22 | 山东大学深圳研究院 | Loop heat pipe suitable for heat dissipation of flexible device, working method and heat dissipation device |
| TWI834401B (en) * | 2022-11-23 | 2024-03-01 | 大陸商慶鼎精密電子（淮安）有限公司 | Method of forming thermal conducting rod and method of forming circuit board |
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|---|---|
| CN109890177B (en) | 2020-04-21 |
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