CN101426336A - Resistance-embedded printed wiring board and method of manufacturing the same - Google Patents
Resistance-embedded printed wiring board and method of manufacturing the same Download PDFInfo
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- CN101426336A CN101426336A CNA2008101778984A CN200810177898A CN101426336A CN 101426336 A CN101426336 A CN 101426336A CN A2008101778984 A CNA2008101778984 A CN A2008101778984A CN 200810177898 A CN200810177898 A CN 200810177898A CN 101426336 A CN101426336 A CN 101426336A
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- resistive element
- metallic film
- wiring board
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- printed wiring
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Abstract
The present invention provides a method for manufacturing a resistor-embedded type printed distributing board stably with low cost. The resistor-embedded type printed distributing board can simultaneously realize the thickness reduction of resistor and superfine wiring pattern with high aspect ratio. The method for manufacturing a printed distributing board which is obtained through laminating an organic resin insulating layer (1) and a metal wiring layer (5) and is formed with resistor is characterized in that the surface of organic resin insulating layer (1) is formed with a metal film (3) which covers the organic resin insulating layer and is formed with the surface of resistor through printing and forming a film-shaped resistor (2). The metal wiring layer is formed through electrolyzing and plating while the metal film is taken as an electricity supplying layer.
Description
Technical field
The manufacture method of the printed wiring board that the present invention relates to resistive element built-in.
Background technology
In the last few years, require to improve the packing density of electronic unit, the signal frequency of raising electronic unit, requirement to the miniaturization that is loaded in the printed wiring board in the electronic equipment, multifunction is more and more higher, more and more need be in the internal layer of the printed wiring board built-in built-in printed wiring board of so-called parts of passive component.
Fig. 3 A, Fig. 3 B are the section process charts (with reference to patent documentation 1) of the manufacture method of the built-in printed wiring board of expression resistive element in the past.At first, shown in Fig. 3 A (1), prepare on the single face of insulated substrates such as polyimides 51, to have the single face copper-coated laminated board 53 of copper foil layer 52.For the thickness of herein copper foil layer 52, for the thickness deviation of the print film during printing carbon paste (carbon paste) after can making diminishes, can form fine circuitous pattern, preferably copper is thick thinner, so use the thickness of 5 μ m.
By the etching of utilizing the light processing method to carry out, single face copper-coated laminated board 53 is formed the electrode 52a and the wiring figure 52b of resistance.
Next, optionally the precious metal electroplating by non-electrolytic silver plating etc. forms surface-treated layer 54 on the electrode part 52a of resistance, and does not form on wiring 52b.Thus, the electrode part of resistance can be guaranteed the carbon paste of later formation and the patience of the high temperature and humidity test between the electrode.
Next, on electrode 52a, utilize silk screen printing to print the carbon paste TU-50-8 that sheet resistance (sheet resistance) value is Korean and Japanese chemistry institute (ア サ ヒ chemistry institute (the strain)) manufacturing of 50 Ω, as the carbon paste that becomes resistance, form resistive element 55 thereby carry out thermmohardening.Form the photoresistance welding flux layer afterwards as required, implement surface treatment, carry out sharp processing, thereby obtain having the printed wiring board 56 of resistive element.
The schematic diagram that the thickness of the resistance when Fig. 3 B (2) and (3) are the above-mentioned printing of expression changes according to the configuration of print direction and electrode.And Fig. 3 B (2) expression electrode is configured in the example on the direction identical with print direction, shown in A-A ' section, and the thickness attenuation of the resistance paste between this situation bottom electrode.
On the other hand, Fig. 3 B (3) expression electrode is configured in respect to print direction and has rotated example on the directions of 90 degree, and shown in B-B ' section, the thickness of the resistance paste between this situation bottom electrode is thickening relatively.Therefore, the thickness deviation in order to reduce to print needs to suppress the thickness of electrode.
The print process of the resistance paste of the use low-temperature sintering type of putting down in writing in this patent documentation 1 grade has following feature: the range of choice broad of the sheet resistance value of resistance paste, wider range of the resistance value that can form.
Under the situation of the resistance paste that uses low-temperature sintering type, form resistive element by silk screen print method, but, because the form variations of the element that be printed this moment, the resistive element that forms high-precision resistance value is difficult, under the lower situation of the precision that does not satisfy desired resistive element, resistance value, by having used the finishing of laser etc., the adjustment that improves resistance value.
As the factor of the form variations of the resistive element in this silk screen printing, the configuration direction and the print direction of the electrode at known and the position that forms resistive element are relevant.Though also depend on the shape of electrode,, form resistive element the position electrode thickness, be that the thickness of wiring figure is thicker, thus, make the thickness deviation of described resistive element further become big.
As the method that this is solved, enumerate the method for the thickness attenuation of the wiring figure of sening as an envoy to.By making the thickness attenuation of wiring figure, thus, also has the finer effect of spacing that can make the wiring figure that can form.
On the other hand, when making the thickness attenuation of wiring figure, produce the such problem of resistance value rising of wiring figure.When conductor resistance value rose owing to the filming of wiring figure, the caloric value when not only flowing through electric current increased, and, thereby since the thin thermal diffusivity of wiring figure worsen.In addition, also there is following situation: thus in resistive element, flow through the electric current heating, still, resistance value is owing to this heat changes, and perhaps circuit is whole owing to heat becomes and can not normally work.
Therefore, in the preferred cloth line graph, particularly the conductor of electrode part has the thickness that can guarantee thermal diffusivity.Therefore, need to improve the electrical current value in design or radiator structure etc. is installed energetically, thereby whole cost is uprised.
On the other hand, for high frequency requirement in the last few years, it is built-in to make resistive element, thereby can shorten the distance of IC and resistance, also has the advantage of the influence that can reduce stray reactance (reactance) etc.But when the wiring figure attenuation, when conductor resistance value rises, the loss when transmitting high-frequency signal increases.
Usually,, think that dielectric losses is overriding for transmitting loss, still, owing to can not ignore in conductor losses in the zone of number GHz, so in the resistive element built-in substrate, the thickness of wiring figure is thicker to be very important.
Therefore, as patent documentation 2 grades are put down in writing, by wiring figure is transferred on the insulating resin, thereby in the thickness that reduces the wiring figure that from insulating resin, exposes, can also guarantee the thickness of the wiring figure of essence.
But adopt the method for such transfer printing to have following shortcoming: wiring figure is with the aspect ratio fine more transfer printing on insulating resin that is difficult to more that becomes.In addition, generate heat when in resistive element, flowing through electric current, still, with the bad conductive paste of material use heat conduction of the resistive element electrodes in contact of generating heat, so, the danger that exists thermal diffusivity to worsen.
And put down in writing following method in patent documentation 3 grades: printed resistor cream on insulating substrate in advance at its two ends printing conductive cream, thereby forms electrode part.By adopting this method, thus, the thickness of resistance paste can form thinly and even, still, owing to form electrode part with conductive paste, and so existence is the unstable such shortcoming of interelectrode distance to the important parameters of the resistance value of decision resistive element.
As a result, in the manufacture method of the printed wiring board of built-in resistive element in the past, realize that simultaneously the filming of the resistive element that formed by resistance paste and high aspect ratio and fine wiring figure are difficult.Therefore, expect at a low price and stably make the method for resistive element built-in printing wiring board, this resistive element built-in printing wiring board can be realized thickness reduction and the high aspect ratio and the fine wiring figure of resistive element simultaneously.
But, in the manufacture method of the printed wiring board of built-in resistive element in the past, be difficult to realize simultaneously filming and the high aspect ratio and the fine wiring figure of the resistive element that forms by resistance paste.
Summary of the invention
The present invention has considered that the problems referred to above finish, its objective is the method that a kind of low price is provided and stably makes the resistive element built-in printing wiring board, this resistive element built-in printing wiring board can be realized thickness reduction and the high aspect ratio and the fine wiring figure of resistive element simultaneously.
To achieve these goals, the invention provides a kind of in the printed wiring board that organic resin insulating layer and metal wiring layer are laminated the manufacture method of the printed wiring board of built-in resistive element, it is characterized in that,
On the surface of described organic resin insulating layer, utilize printing to form membranaceous resistive element,
Form metallic film, this metallic film cover described organic resin insulating layer formation the face of described resistive element,
Described metallic film is carried out metallide as power supply layer, form described metal wiring layer.
According to these features, the present invention plays following effect.
According to the present invention, in the manufacture method of printed wiring board with resistive element, electrode part etc. do not have that printing forms resistive element on the concavo-convex substrate insulating material, so, element can be formed thinly and evenly.Then, after the metallic film of oxide protective layer and power supply layer is had both in formation, form electrode and wiring figure, so, the high-density circuit that conductor resistance value is low, the thermal diffusivity of resistive element adstante febre is also excellent can be formed.Particularly, if semi-additive process then can form high aspect ratio and fine wiring figure.
Therefore, a kind of low price can be provided and stably make the method for resistive element built-in printing wiring board, this resistive element built-in printing wiring board can be realized reduction and the high aspect ratio and the fine wiring figure of resistive element thickness simultaneously.
Description of drawings
Fig. 1 is the constructed profile of the operation of the expression embodiment of the invention 1.
Fig. 2 is the constructed profile of the operation of the expression embodiment of the invention 2.
Fig. 3 A is the vertical view and the profile of expression method in the past.
Fig. 3 B is the vertical view and the profile of expression method in the past.
Embodiment
Below, with reference to accompanying drawing embodiments of the present invention are described.
Fig. 1 is the section process chart of expression embodiments of the invention 1, at first, shown in Fig. 1 (1), not being exposed on the outside one side of the insulated substrate 1 of polyimides etc., utilize silk screen print method, the printing sheet resistance value is the carbon paste TU-50-8 that the Korean and Japanese chemistry institute (ア サ ヒ chemistry institute (strain)) of 50 Ω is made, as the carbon paste that becomes resistive element 2.
As silk screen version specification, use that grid number is 400, emulsion thickness is the silk screen version specification of 10 μ m.Under this state, there is not electrode part, becomes printing,, exist hardly by the configuration of electrode and the influence that print direction brought so the thickness deviation of printed carbon paste is less to smooth place.
After printing is used to form the carbon paste of this resistive element 2, substrate is fixed on the thick aluminium sheet of 2mm (not shown), utilize the far infrared reflow ovens, heating 60 seconds more than 100 ℃ and below 200 ℃, in heter temperature is that 250 ℃, retention time are to make its thermmohardening under 10 seconds the condition, forms resistive element 2.When utilizing the far infrared reflow ovens to carry out the sintering of resistive element 2, thermmohardening, during maximum temperature in applying a series of manufacturing processes that comprise later lamination procedure in advance, it is good that the thermal endurance of resistive element 2 becomes.
And, after printing, in the hot-blast stove of box, carry out 170 ℃, 60 minutes thermmohardening, thereby also can form resistive element 2.For the size of resistive element 2, making the distance between the electrode 2b is 0.5mm, and printing width is 1.0mm.
In addition, afterwards, the resistive element 2 that forms is carried out contraposition in this operation, form electrode, so, actually outside the position of working as resistive element 2, for example, on the precalculated position, end of substrate, can also form mark that contraposition uses etc. simultaneously by carbon paste.
Before forming this resistive element 2, with the tight contact that stably improves insulated substrate 1 (being polyimide film) and resistive element 2 (being carbon paste) here here is purpose, and that preferably carries out plasma treatment or corona treatment etc. can not cause Treatment injury to insulated substrate 1.
Next, shown in Fig. 1 (2), on the face that comprises the face that has formed resistive element 2, form metallic film 3.For metallic film 3; need play and the effect of the oxide protective layer at the interface of the electrode part of formation later on; and play the effect of the power supply usefulness screen in the metallide when utilizing semi-additive process to form wiring figure; so the material of metallic film 3 must carry out and the selective etching that becomes the metal of wiring.
Herein, suppose with copper to form wiring figure, select nickel as metal with selective etching function.Except nickel, can also use chromium simple substance or these multilayer.As the thickness of metallic film 3, the minimum thickness as can zero defect ground forming is preferably about 1 μ m.As the formation method, and electroplate, when implementing the plating of 1 μ m about thick, can not be created in the pin hole that becomes problem on the function with sputter and (electrolysis or non-electrolysis).
Before forming this metallic film, with the tight contact that stably improves insulated substrate 1 (being polyimide film), resistive element 2 (being carbon paste) and metallic film 3 here here is purpose, and that preferably carries out normal-temperature plasma processing etc. can not cause Treatment injury to insulated substrate 1, resistive element 2.
Next, shown in Fig. 1 (3), utilize the light processing method to form platedresist 4, use it to utilize cathode copper to electroplate and form wiring figure 5, platedresist 4 is used to carry out so-called half adding method.The thickness of platedresist 4 for this moment uses the thick dry film photoresist of 20 μ m, and it is thick that wiring figure 5 forms 15 μ m.
Then, shown in Fig. 1 (4), peel off platedresist 4 (not shown), utilize the method for the selective etching of nickel and copper to remove metallic film (not shown).As this etching liquid, can use corrosivity at the material of resistive element 2 and copper lower and optionally nickel is carried out the etching liquid of etching, for example contains the etching liquid of hydrogen peroxide or nitric acid.In addition,, propylene, epoxy resin, phenol (phenol) etc. are arranged as the resin of resistive element 2, owing to all have patience at above-mentioned soup, so, can use resistive element 2 as etching mask.
In the operation before so far, wiring figure 5 separated and electric independences.Because thickness is 15 μ m, so conductor resistance value is lower, the thermal diffusivity of resistive element 2 adstante febres is also high.Certainly, can change the thickness of resist or the thickness of copper coating, thus, can control conductor resistance value or thermal diffusivity according to purposes.When being used to obtain the laser reconditioning of high-precision resistance value, for this embodiment 1, the thickness of resistive element 2 is thin and even, so, can stably carry out.
Afterwards, implement formation, the surface treatment of solder resist (solder resist) layer as required, carry out sharp processing, thereby obtain having the printed wiring board 6 of resistive element.
Fig. 2 is the profile of the operation of expression embodiments of the invention 2.Shown in Fig. 2 (1), in this embodiment 2, after in Fig. 1 (2), having formed metallic film 3, on whole on the metallic film 3, form panel electrodeposited coating 7, afterwards, shown in Fig. 2 (2), utilize general method, form the wiring figure that comprises electrode part by the lithographic method that is undertaken by (Subtractive) method that deducts.Utilize the THICKNESS CONTROL of panel electrodeposited coating 7 to change the thickness of wiring figure, so, can form wiring figure with desirable thickness.
And, only constituting under the situation of metallic film by nickel, when the etching of wiring figure, metallic film also is removed, so, seek the simplification of operation.And, though not shown,,, also can be built in the multilayer printed-wiring board by this two kinds of methods and general method.
Description of reference numerals: the 1st, insulated substrate, the 2nd, resistive element, the 3rd, metallic film, the 4th, electroplate anti-The erosion agent, the 5th, wiring pattern, the 6th, have the printed wiring board of resistive element, the 7th, the panel electrodeposited coating, the 51st, Insulated substrate, the 52nd, Copper Foil, 52a are the electrodes of resistance, 52b is wiring pattern, the 53rd, it is folded that single face covers copper Laminate, the 54th, surface-treated layer, the 55th, resistive element, the 56th, have a resistance unit with what in the past method formed The printed wiring board of part.
Claims (4)
1. the manufacture method of the printed wiring board of built-in resistive element in the printed wiring board that stacked organic resin insulating layer and metal wiring layer form is characterized in that,
On the surface of described organic resin insulating layer, utilize printing to form membranaceous resistive element,
Form metallic film, this metallic film cover described organic resin insulating layer formation the face of described resistive element,
Described metallic film is carried out metallide as power supply layer, form described metal wiring layer.
2. the manufacture method of printed wiring board as claimed in claim 1 is characterized in that,
On described metallic film, form platedresist,
Use described platedresist, described metallic film carried out metallide as power supply layer, on described metal wiring layer, form figure,
Peel off described platedresist, remove the described metallic film of the part of exposing of described metal line interlayer, form the pair of electrodes and the wiring figure that are connected to described resistive element.
3. the manufacture method of printed wiring board as claimed in claim 1 is characterized in that,
Described metallic film is carried out metallide as power supply layer, on whole, forms described metal wiring layer,
On described metal wiring layer, form the etching resist,
Described metal wiring layer and described metallic film are carried out etching, form described pair of electrodes and wiring figure.
4. the manufacture method of printed wiring board as claimed in claim 1 is characterized in that,
Described metallic film is made of nickel.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-277795 | 2007-10-25 | ||
| JP2007277795 | 2007-10-25 | ||
| JP2007277795A JP4943293B2 (en) | 2007-10-25 | 2007-10-25 | Method for manufacturing printed wiring board incorporating resistance element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101426336A true CN101426336A (en) | 2009-05-06 |
| CN101426336B CN101426336B (en) | 2011-07-27 |
Family
ID=40616603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101778984A Expired - Fee Related CN101426336B (en) | 2007-10-25 | 2008-10-27 | Method of manufacturing resistance-embedded printed wiring board |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4943293B2 (en) |
| CN (1) | CN101426336B (en) |
| TW (1) | TWI429349B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102573301A (en) * | 2010-12-23 | 2012-07-11 | 北大方正集团有限公司 | Method for making grooves on circuit board and circuit board |
| CN107466157A (en) * | 2017-06-20 | 2017-12-12 | 深圳崇达多层线路板有限公司 | A kind of method buried baffle-wall and baffle-wall making printed wiring board is buried using this |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6079798A (en) * | 1983-10-06 | 1985-05-07 | 三洋電機株式会社 | Resin circuit board |
| JPS61185995A (en) * | 1985-02-13 | 1986-08-19 | 三菱電機株式会社 | Making of circuit board with resistor |
| JPH0680880B2 (en) * | 1988-03-15 | 1994-10-12 | 松下電工株式会社 | Manufacturing method of ceramic circuit board with resistor |
| JPH0682908B2 (en) * | 1988-06-27 | 1994-10-19 | 松下電工株式会社 | Method for manufacturing ceramic circuit board with resistor |
| JPH0682909B2 (en) * | 1988-06-27 | 1994-10-19 | 松下電工株式会社 | Method for manufacturing ceramic circuit board with resistor |
| JP4069787B2 (en) * | 2003-04-04 | 2008-04-02 | 株式会社デンソー | Multilayer substrate and manufacturing method thereof |
| CN101048036B (en) * | 2006-03-30 | 2010-05-12 | 财团法人工业技术研究院 | Embedded thin film resistor, manufacturing method thereof and multilayer substrate |
-
2007
- 2007-10-25 JP JP2007277795A patent/JP4943293B2/en active Active
-
2008
- 2008-10-08 TW TW97138728A patent/TWI429349B/en active
- 2008-10-27 CN CN2008101778984A patent/CN101426336B/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102573301A (en) * | 2010-12-23 | 2012-07-11 | 北大方正集团有限公司 | Method for making grooves on circuit board and circuit board |
| CN102573301B (en) * | 2010-12-23 | 2014-08-27 | 北大方正集团有限公司 | Method for making grooves on circuit board and circuit board |
| CN107466157A (en) * | 2017-06-20 | 2017-12-12 | 深圳崇达多层线路板有限公司 | A kind of method buried baffle-wall and baffle-wall making printed wiring board is buried using this |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200938019A (en) | 2009-09-01 |
| TWI429349B (en) | 2014-03-01 |
| CN101426336B (en) | 2011-07-27 |
| JP4943293B2 (en) | 2012-05-30 |
| JP2009105323A (en) | 2009-05-14 |
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Granted publication date: 20110727 Termination date: 20191027 |