CN101403785B

CN101403785B - Probe apparatus and probing method

Info

Publication number: CN101403785B
Application number: CN2008101695407A
Authority: CN
Inventors: 山本保人; 小泽和博; 加贺美史
Original assignee: Tokyo Electron Ltd
Current assignee: Tokyo Electron Ltd
Priority date: 2007-09-28
Filing date: 2008-09-28
Publication date: 2012-01-11
Anticipated expiration: 2028-09-28
Also published as: TWI442494B; KR20090033036A; JP5120027B2; CN101403785A; JP2009099937A; TW200931556A; KR101020396B1

Abstract

The invention provides a detection device and a detection method which can make apparatus miniaturization and realize high productivity. Minisize cameras (71, 72) for wafer shooting with downward visual field which are used for shooting wafer surface can move along horizontal direction at a height position between a wafer chuck and a probe, optical axis of each camera arranged on a calibration bridge are separated mutually, therefore, movement of the wafer chuck can be reduced when shooting the wafer for obtaining position information of the wafer. So that, miniaturization of the apparatus can be realized, in addition, because time needed for obtaining the position information of the wafer can be reduced, high productivity can be realized. Moreover, the minisize cameras (71, 72) are arranged by a way capable of mutually being jointed and separated, a separation distance of the two cameras can be a mutual separation distance of two given points on the wafer by adjusting, so the wafer chuck can be stationary for shooting another given point so as to increase productivity furthermore.

Description

Sniffer and detection method

Technical field

The present invention relates to through making the electric technology that this seized electrical characteristic of having a medical check-up is detected that contacts of detector (probe) and seized electrode slice of having a medical check-up (pad).

Background technology

After semiconductor wafer (being designated hereinafter simply as " wafer ") is gone up formation IC chip, in order the electrical characteristic of IC chip to be investigated and under wafer state, to be utilized sniffer to carry out probing test.For this sniffer; Wafer carried put on the wafer chuck (wafer chuck) (wafer carries and puts platform) that can move freely along X, Y, Z direction and can rotate freely around the Z axle; And the position to wafer chuck is controlled, make the top be arranged on wafer chuck probe detector for example probe contact with the electrode slice of the IC chip of wafer.

For the electrode slice that makes the IC chip on the wafer correctly contacts with detector; Be necessary to be called in advance the operation of close adjustment (fine alignment); And the position of the wafer chuck when contacting with detector according to the electrode slice that this result correctly obtains the IC chip is for example by the coordinate position of the drive system of being managed with the pulse coder (pulse encoder) of the CD-ROM drive motor interlock that drives wafer chuck.Wherein, For the coordinate position of drive system; For example on the X platform that moves along directions X, the Y platform that moves along the Y direction and the Z platform that moves along the Z direction, lineal scale (linear scale) is set respectively, confirms the method for the coordinate of all directions through the counting that comes from the groove that is formed on these lineal scales as the pulse of optical information.

In order to carry out this close adjustment; It is favourable adopting following structure; That is,, and be provided for the camera (patent documentation 1) of camera detector in the side of wafer chuck on the moving body that moves horizontally between wafer chuck and the probe at the camera that downward wafer shooting usefulness in the visual field is set.This is because pass through the focus of these cameras of focusing, respectively wafer surface and detector is made a video recording, and utilizes a camera that both are made a video recording thus and obtains same result.In order to make the drawing of the chip on the wafer; Carry out following operation; Promptly; The camera that utilizes wafer shooting usefulness to the wafer periphery for example 4 make a video recording in the hope of the operation of center wafer position (coordinate position of the drive system of wafer chuck), and to the angle part of two the IC chips for example spaced apart from each other of the specified point on the wafer make a video recording in the hope of wafer towards operation.

Then, in conjunction with wafer towards after, further a plurality of specified points on the wafer are made a video recording the position of the wafer chuck the when electrode slice of trying to achieve the IC chip accurately according to this image pickup result contacts with detector (, so-called contact position).In order to carry out such close adjustment operation; Make above-mentioned moving body be still in predefined position; Wafer chuck is moved and utilize the camera of wafer shooting usefulness successively the each point on the wafer to be made a video recording; But because camera point is more, so the mobile needed total time of wafer chuck is elongated.In addition, because the moving range of wafer chuck is wider, so the sniffer main body also must be designed to be able to cover the size of this moving range, therefore causes device to maximize.Particularly, be contemplated to occur surmounting 12 inches wafer size from now on, therefore along with wafer size becomes greatly day by day; If the platform number that is provided with of sniffer increases; Then need bigger floor space, when the size of clean room was restricted, the platform number that is provided with of sniffer can not be too many.

Patent documentation 1: 2001-No. 156127 communiques of TOHKEMY

Summary of the invention

The present invention proposes in order to address the above problem, its purpose be to provide a kind of can implement device miniaturization and can access the sniffer of high productive capacity.

First aspect of the present invention provides a kind of sniffer; This sniffer has a plurality of wafers that are examined chip to carry to put alignment arrangements utilizing to carry to be put drive division that platform uses and can carry along the wafer that horizontal direction and vertical direction move freely and put on the platform; Make the said electrode slice that is examined chip contact with the detector of probe to being examined chip inspection; This sniffer is characterised in that, comprising:

Be arranged on said wafer and carry and put on the platform, the image unit of the detector shooting usefulness that is used for the visual field that said detector is made a video recording is made progress;

Carry the moving body that the height and position put between platform and the probe can be provided with along horizontal direction movably at said wafer;

Be arranged on this moving body, its optical axis separately is spaced from each other, first image unit and second image unit of the wafer shooting usefulness that the visual field that is used for wafer surface is made a video recording is downward; With

The control unit of execution in step group, wherein, said step groups comprises the steps:

Through wafer being carried put platform to move successively the position to the focus of the focus of the focus of the image unit of detector shooting usefulness and first image unit of wafer shooting usefulness and second image unit to cooperate, wafer of obtaining each moment carries the step of the position of putting platform;

Utilize first image unit of said wafer shooting usefulness and second image unit to make a video recording to carrying the wafer of putting on the platform successively through wafer being carried put platform to move, obtain the step that wafer when respectively making a video recording carries the position of putting platform;

Utilize the image unit of detector shooting usefulness that detector is made a video recording, the wafer when obtaining shooting carries the step of the position of putting platform; With

Carry the step that wafer that the position calculation of putting platform is used to wafer is contacted with detector carries the position of putting platform according to the wafer of in each step, obtaining.

In addition; Sniffer of the present invention is characterised in that; Comprise: be arranged on the said moving body; Its optical axis separately is spaced from each other, and the visual field that is used for wafer surface is made a video recording downwards and the multiplying power wafer lower than the multiplying power of first image unit and second image unit make a video recording first low range camera and the second low range camera of usefulness.First image unit and first low range form left-right symmetric with the group of each optical axis of camera and second image unit and second low range with the group of each optical axis of camera.

In addition; Sniffer of the present invention is characterised in that; The first low range camera and the second low range camera that said step groups comprises the steps: to utilize wafer shooting usefulness carries 2 of the periphery of putting the wafer on the platform to wafer successively makes a video recording; Then wafer is carried to put platform and move with respect to the mutual connecting line quadrature of each optical axis of the first low range camera and the second low range camera; Utilize the first low range camera and the second low range camera successively with peripheries said 2 opposite sides 2 on the wafer to be made a video recording, the wafer during according to these four somes shootings carries the step that the center of wafer is tried to achieve in the position of putting platform.In sniffer of the present invention; The first low range camera and the second low range camera that replace wafer shooting usefulness, 2 of the periphery that utilizes first image unit and second image unit of wafer shooting usefulness that wafer is carried to put the wafer on the platform make a video recording and 2 of the periphery of said opposite side are made a video recording.

In addition; Sniffer of the present invention is characterised in that: said step groups comprises first image unit and second image unit that utilizes wafer shooting usefulness; Two specified points to leaving each other on the wafer are made a video recording; Wafer when making a video recording carries the position of putting platform according to each so that wafer become predefined towards mode wafer is carried put the platform rotation.In addition, first image unit and second image unit of said wafer shooting usefulness, the mode that can freely combine each other to separate with the moving part that utilizes image unit to use is arranged on the said moving body.In addition; The information that said control part basis is corresponding with the kind of wafer; Leave the mode of leaving distance each other that distance becomes two specified points on the wafer each other, the control signal of the drive division that output is used image unit with the optical axis of first image unit and second image unit.

The present invention provides a kind of detection method; This detection method has a plurality of wafers that are examined chip to carry to put alignment arrangements utilizing to carry to be put drive division that platform uses and can carry along the wafer that horizontal direction and vertical direction move freely and put on the platform; Make the said electrode slice that is examined chip contact with the detector of probe to being examined chip inspection; It is characterized in that this detection method uses:

Be arranged on said wafer and carry and put on the platform, the image unit of the detector shooting usefulness that is used for the visual field that said detector is made a video recording is made progress; With

Be arranged at said wafer and carry on the moving body that the height and position put between platform and the probe can be provided with along horizontal direction movably; Its optical axis separately is spaced from each other; First image unit and second image unit of the wafer shooting usefulness that the visual field that is used for wafer surface is made a video recording is downward, this detection method comprises:

Through wafer being carried put platform to move successively the position to the focus of the focus of the focus of the image unit of detector shooting usefulness and first image unit of wafer shooting usefulness and second image unit to cooperate, wafer of obtaining each moment carries the operation of the position of putting platform;

Utilize first image unit of said wafer shooting usefulness and second image unit to make a video recording to carrying the wafer of putting on the platform successively through wafer being carried put platform to move, obtain the operation that wafer when respectively making a video recording carries the position of putting platform;

Utilize the image unit of detector shooting usefulness that detector is made a video recording, the wafer when obtaining shooting carries the operation of the position of putting platform; With

Carry the operation that wafer that the position calculation of putting platform is used to wafer is contacted with detector carries the position of putting platform according to the wafer of in each step, obtaining.

In addition; Detection method of the present invention is characterised in that: first image unit and second image unit that utilizes wafer shooting usefulness carries wafer successively to be put the operation that the wafer on the platform makes a video recording and comprises: make a video recording for 2 of the periphery that utilizes first image unit and second image unit of wafer shooting usefulness that wafer is carried to put the wafer on the platform; Then wafer is carried to put platform and move with respect to the mutual connecting line quadrature of each optical axis of first image unit and second image unit; Utilize first image unit and second image unit successively with peripheries said 2 opposite sides 2 on the wafer to be made a video recording, the wafer during according to these four somes shootings carries the operation that the center of wafer is tried to achieve in the position of putting platform.

In addition; Detection method of the present invention is characterised in that: utilize first image unit and second image unit of wafer shooting usefulness that wafer is carried the wafer of putting on the platform and make a video recording successively; Utilize first image unit and second image unit of wafer shooting usefulness that two specified points that leave each other on the wafer are made a video recording; Wafer when making a video recording carries the position of putting platform according to each so that wafer become predefined towards mode wafer is carried put the operation of platform rotation.In addition; According to the information corresponding with the kind of wafer; Leave the mode of leaving distance each other that distance becomes two specified points on the wafer, the operation that the drive division that utilizes image unit to use is adjusted the position of first image unit and second image unit each other with the optical axis of first image unit of wafer shooting usefulness and second image unit.

The present invention provides a kind of storage medium; It is characterized in that: this storage medium has been taken in employed computer program in the sniffer; Wherein said sniffer has alignment arrangements a plurality of wafers that are examined chip carry to put to be put drive division that platform uses and can carry along the wafer that horizontal direction and vertical direction move freely and put on the platform through carrying; Make the said electrode slice that is examined chip contact with the detector of probe to being examined chip inspection, said computer program is formed step groups with the mode of carrying out above-mentioned each detection method.

According to the present invention; Wafer carries the height and position put between platform and probe is provided with the downward wafer shooting usefulness in the visual field that is used for wafer surface is made a video recording as the calibration bridge of the moving body that can move along horizontal direction first image unit and second image unit; So the amount of movement that when for the positional information that obtains wafer wafer being made a video recording, wafer is carried to put platform reduces.Therefore, miniaturization that can implement device in addition, is also shortened because obtain the time that positional information spent of wafer, therefore can realize high production rate.And; Through first image unit and second image unit of wafer shooting usefulness are set with the mode of leaving mutually; Can adjust and make it leave the mutual distance of leaving that distance becomes two specified points on the wafer, so, move to the position that a specified point is made a video recording through wafer being carried put platform; Can another specified point be made a video recording in constant wafer being carried put platform to keep static, thereby can further boost productivity.

Description of drawings

Fig. 1 is the concise and to the point stereogram of integral body of an example of the sniffer of expression first execution mode of the present invention.

Fig. 2 is the schematic plan view of an example of the above-mentioned sniffer of expression.

Fig. 3 is the longitudinal section of an example of the above-mentioned sniffer of expression.

Fig. 4 is the stereogram of an example of the load port in the above-mentioned sniffer of expression.

Fig. 5 is the concise and to the point figure of an example of the wafer transfer mechanism in the above-mentioned sniffer of expression.

Fig. 6 is the stereogram of an example of the inspection portion in the above-mentioned sniffer of expression.

Fig. 7 is the concise and to the point figure of an example of the above-mentioned inspection of expression portion.

Fig. 8 is the plane graph of the position of the calibration bridge in the above-mentioned inspection of the expression portion.

Fig. 9 is the plane graph of the related calibration bridge of expression execution mode of the present invention.

Figure 10 is the concise and to the point figure of an example of the mobile stroke of the wafer chuck in the above-mentioned inspection of the expression portion.

Figure 11 is the pie graph of an example of the formation of employed control part in the above-mentioned execution mode of expression.

Figure 12 is the plane graph of an example of the effect of the above-mentioned sniffer of expression.

Figure 13 is the plane graph of an example of the effect of the above-mentioned sniffer of expression.

Figure 14 is the plane graph of an example of the effect of the above-mentioned sniffer of expression.

Figure 15 is the plane graph of an example of the effect of the above-mentioned sniffer of expression.

Figure 16 is the figure that is used to explain that the initial point of two cameras is surveyed.

Figure 17 is the key diagram of method for using of the miniature camera of expression calibration bridge.

Figure 18 is the key diagram of method for using of the miniature camera of expression calibration bridge.

Figure 19 is the key diagram of method for using of the miniature camera of expression calibration bridge.

Figure 20 is the key diagram of the configuration example of the IC chip on the expression wafer W.

Figure 21 be used to explain this execution mode wafer towards first figure that meets form.

Figure 22 be used to explain this execution mode wafer towards second figure that meets form.

Figure 23 be used to explain this execution mode wafer towards the 3rd figure that meets form.

Figure 24 is the key diagram of difference of the displacement of the wafer chuck when being used to explain the calibration bridge that uses this execution mode and existing example.

The key diagram of the amount of movement of the integral body of the wafer W of the directions X when Figure 25 is expression use calibration bridge.

Figure 26 is the key diagram that is illustrated in all amount of movements of the wafer of calibrating the directions X when on the bridge miniature camera being installed.

Figure 27 is the related calibration bridge of other execution mode of expression and the figure of control part.

Figure 28 is the figure apart from corrective action that is used to explain between the miniature camera.

Label declaration

1 loading part

2 sniffer main bodys

3 wafer transfer mechanisms

4A, 4B wafer chuck

5A, 5B calibrate bridge (alignment bridge)

6A, 6B probe (probe card)

10 carrying rooms

11 first load ports

12 second load ports

21A, 21B inspection portion

29 probes

30 arms

31 epimere arms

32 stage casing arms

33 hypomere arms

36 chuck segment

37,38 optical sensors

41 miniature cameras (micro camera)

45 miniature cameras

71 miniature cameras

72 miniature cameras

Embodiment

Like Fig. 1～shown in Figure 3, comprise as the sniffer of first execution mode of the present invention: be used for disposing the loading part 1 that a plurality of wafer W as substrate that are examined chip join; And the sniffer main body 2 that wafer W is surveyed.At first, the integral layout to loading part 1 and sniffer main body 2 carries out simple declaration.

Loading part 1 has: first load port 11 and second load port 12 that are used to make first support C 1 and second support C 2 as the conveyance container of taking in a plurality of wafer W to be moved into respectively, and be configured in these load ports 11, the carrying room between 12 10.On first load port 11 and second load port 12, to be provided with and to be used for carrying respectively first year of putting these support C 1, C2 and to put platform 13 and put platform 14 in second year apart from one another by opening the configuration and handing-over mouth (peristome of the front) mode relative to each other of first support C 1 and second support C 2 along the Y direction.In addition, in above-mentioned carrying room 10, be provided with through carry out the wafer transfer mechanism (substrate transferring mechanism) 3 of the conveyance of wafer W as the arm 30 of substrate holder.

Mode and this loading part 1 adjacency configuration of sniffer main body 2 to be listed in loading part 1 along directions X, and have the framework 22 of the externally mounted part branch that constitutes sniffer main body 2.This framework 22 is cut apart by two along the Y direction via partition wall 20, and a side partitioning portion and the opposing party's partitioning portion are equivalent to divide the exterior body that forms first 21A of inspection portion and second 21B of inspection portion respectively.First 21A of inspection portion comprises: as the wafer chuck 4A of substrate-placing platform; The upper area of this wafer chuck 4A along Y direction (direction that connects load port 11,12) mobile, have camera as calibration bridge 5A image unit, that become moving body; With the probe 6A on the top board that is arranged on the top that becomes framework 22 201.Second 21B of inspection portion has identical structure, comprising: wafer chuck 4B; Calibration bridge 5B; And probe 6B.

Then, loading part 1 is elaborated.For first load port 11 and second load port 12 because symmetrically and constitute identical, so in Fig. 4 with the structure of first load port 11 as the representative expression.Like Fig. 3 and shown in Figure 4, loading part 1 is cut apart with above-mentioned carrying room 10 through partition wall 20a mutually, and this partition wall 20a is provided with gate (shutter) S and is used for opening and closing integratedly the switching mechanism 20b of the handing-over mouth of first support C 1 with this gate S.In addition, put platform 13 in first year to constitute unshowned rotating mechanism through the figure that is arranged on the lower side of putting platform 13 in first year, can according to per respectively 90 degree of clockwise and counterclockwise mode be rotated.

That is, for putting platform 13 in this first year, for example from the face side (the directions X right side the figure) of sniffer; The peristome of front that makes the hermetic type support C 1 that is called as FOUP (front opening is unified box) is towards sniffer one side (directions X left side); Carry to put through the unshowned automatic conveyance car of the figure in the clean room (AGV) and put on the platform 13, afterwards, put platform 13 dextrorotations and turn 90 degrees in this first year at first year; Make peristome relative with above-mentioned gate S; In addition likewise, when putting platform 13 from first year and take out of first support C 1, make first support C 1 according to being rotated counterclockwise 90 degree.

Handing-over for the wafer W between first support C 1 and the wafer transfer mechanism 3; Be to make the peristome of first support C 1 relative with gate S one side; Make the handing-over mouth of the gate S and first support C 1 open integratedly through the switching mechanism 20b that has explained; Make in the carrying room 10 and first support C 1 to be communicated with, wafer transfer mechanism 3 is carried out with respect to first support C 1.

Wafer transfer mechanism 3 comprises conveyance base station 35, makes this conveyance base station 35 along the rotating shaft 3a of vertical axle rotation on every side and the elevating mechanism that this rotating shaft 3a is gone up and down; And on conveyance base station 35, can be provided with 3 arms 30, each arm 30 has the effect that mutual independent advance and retreat are come the conveyance wafer W with freely advancing and retreat.The pivot of rotating shaft 3a is set at the centre of first support C 1 and second support C 2, i.e. distance first support C 1 and second support C, 2 equidistant positions.In addition, for wafer transfer mechanism 3, can and first support C 1 or second support C 2 between be used to join wafer W on the position and and first 21A of inspection portion or second 21B of inspection portion between be used to join and go up and down between the upper/lower positions of wafer W.

In addition, wafer transfer mechanism 3 has the pre-calibration mechanism 39 of the pre-calibration that is used to carry out wafer W.This pre-calibration mechanism 39 comprises: connect the axial region 36a that goes up and down and can rotate freely in the conveyance base station 35; With the top that is arranged on this axial region, become conplane chuck (chuck) portion 36 with this surface as rotating platform thereby the recess on the surface of common and conveyance base station 35 is chimeric.This chuck segment 36 is set at and the corresponding position, center that is in the wafer W to the arm 30 of state midway of shrinking back, and constitutes to lift the wafer W on the arm 30 of each section a little and to make its rotation from this arm 30.

In addition, pre-calibration mechanism 39 has the

optical sensor

37,38 as test section that the periphery that utilizes chuck segment 36 rotating wafer W is detected, be made up of luminescence sensor and optical receiving sensor.This

optical sensor

37,38 is fixed on from the position of the moving area lateral run-out of arm 30 through conveyance base station 35; In this example; Because become the wafer W of the object of pre-calibration and be wafer W and the wafer W on the stage casing arm 32 on the hypomere arm 33, thus be set to each wafer W of lifting by chuck segment 36 periphery up and down and for when wafer W is conducted interviews not with the height level of wafer W interference.Wherein, Though illustrate in the drawings; But loading part 1 is provided with control part; It detects directional reference portion and the center of wafer W of the otch (notch), orientation mark (orientation flat) etc. of wafer W based on the detection signal that comes from

optical sensor

37,38, and according to this testing result so that otch etc. make chuck segment 36 rotations towards the mode of prescribed direction.

For the wafer W of carrying out through the pre-calibration mechanism 39 that constitutes by

optical sensor

37,38 and chuck segment 36 towards adjustment (pre-calibration) for, below, be that example is carried out simple declaration with the taking-up of the wafer W on the hypomere arm 33.At first, lift wafer W on the hypomere arm 33 a little through chuck segment 36 and make the wafer W rotation, and from the illuminating part of optical sensor 38 via the zone of the circumference that contains wafer W (end) to the light receiver irradiates light.Then, with wafer W towards on hypomere arm 33, become regulation towards mode chuck segment 36 is stopped, and chuck segment 36 is descended, wafer W is handover on the hypomere arm 33, adjust thus wafer W towards.Then, wafer W is carried when putting on the wafer chuck 4A of for example first 21A of inspection portion, the position of wafer transfer mechanism 3 is adjusted, revise with off-centre to wafer W.Come like this to wafer W towards and off-centre adjust.Wherein, in Fig. 3, omit the diagram of this

optical sensor

37,38.

Then, sniffer main body 2 is elaborated.In the framework 22 of this sniffer main body 2, on the sidewall of loading part 1 side, in order between first 21A of inspection portion and second 21B of inspection portion, wafer W to be joined and offer the conveyance mouth 22a of the band shape that transversely (Y direction) stretch out.Wherein, For these the first inspections 21A of portion and second 21B of inspection portion; With respect to the pivot through wafer transfer mechanism 3, with the horizontal line HL of the straight line quadrature that is connected first load port 11 and second load port 12, the position etc. of being provided with of camera position that the delivery position of its wafer W separately, wafer W are surperficial and probe 6A is left-right symmetric; And constitute same structure; Therefore, for fear of repeat specification, first 21A of inspection portion is described with reference to Fig. 3, Fig. 6 and Fig. 7.

The 21A of inspection portion has base station 23, on this base station 23, begins to be disposed with following order from downside: along the guide rail that extends in the Y direction, through the Y platform 24 of for example ball-screw (ballscrew) in the driving of Y direction; With along the guide rail that extends at directions X, the X platform 25 that drives at directions X through for example ball-screw (ball screw).On this X platform 25 and Y platform 24, be respectively arranged with the motor that makes up with decoder (encoder), but omit its explanation herein.

On X platform 25; Be provided with the Z moving part 26 that the motor through the unshowned decoder of constitutional diagram drives in the Z direction, this Z moving part 26 is provided with the wafer chuck 4A as substrate-placing platform that can around the Z axle, rotate freely (moving freely along the θ direction).Therefore, this wafer chuck 4A can move in X, Y, Z, θ direction.X platform 25, Y platform 24 and Z moving part 26 become drive division, constitute can with wafer transfer mechanism 3 between be used to join the delivery position of wafer W, like the back driving wafer chuck 4A between the camera position, the contact position (inspection position) that contacts with the probe 29 of probe 6A on described wafer W surface.

Above the moving area of wafer chuck 4A, probe 6A can be installed on the top board 201 with freely loading and unloading.Upper face side at probe 6A is formed with the electrode group; In this electrode group with scheme between the unshowned measuring head for can electrically conducting; Above probe 6A, be provided with the spring catch unit (pogo pin unit) 28 that is formed with a plurality of spring catch 28a as electrode part below with allocation position corresponding mode with the electrode group of probe 6A.Above the spring catch unit 28, there is the unshowned measuring head of figure the location usually at this, but in this example, measuring head and sniffer main body were opened and be configured in other position in 2 minutes, and spring catch unit 28 is connected through the unshowned cable of figure with measuring head.

In addition; Side below probe 6A; Be electrically connected with the electrode group of upper face side respectively, with respect to the detector Surface Vertical of the wafer W vertical needle (wire probe) of extending for example, corresponding with the alignment arrangements of the electrode slice of wafer W and be set at the for example whole surface of probe 6A.As detector, can be the probe that constitutes by metal wire 29 that extends to oblique below with respect to the surface of wafer W, be formed on metal bump (gold bump) electrode on the flexual film etc.Probe 6A constitutes in this example and can contact with the whole electrode slice that is examined chip (IC chip) on wafer W surface with summing up, therefore can be through once contacting the mensuration that finishes electrical characteristic.

The lateral location of partition wall 20 sides of the wafer chuck 4A in the Z moving part of having explained 26 is fixed with the visual field miniature camera 41 up as the image unit of probe shooting usefulness through fixed head 41a.This miniature camera 41 is made a video recording for the needle point of amplifying probe 29, the collimating marks of probe 6A, and constitutes as the high magnification camera that contains the CCD camera.This miniature camera 41 is positioned at the roughly intermediate point of the directions X of wafer chuck 4A.In addition; For miniature camera 41; For in alignment arrangements direction and position to punctual adjustment probe 29; For to specific probe 29 for example the probe 29 at the two ends of probe 29 and the Y direction at the two ends of directions X make a video recording, in addition in order to observe the state of each probe 29 termly, and have the function that can make a video recording to all probes 29 successively.

In addition, on fixed head 41a, be used for the macrophotograph machine 42 as the camera of low range of the alignment arrangements of probe 29 being made a video recording in abutting connection with being fixed with in broad regions with miniature camera 41.And; On fixed head 41a; Being provided with target (target) 44 with respect to the focal plane that closes of miniature camera 41 along the mode of the direction advance and retreat of intersecting with optical axis through driving and reversing mechanism 43; This target 44 constitute through miniature camera 41 and after the

miniature camera

71,72 stated can draw a portrait identification, vapor deposition has the metal film of writing the circle of body as the quilt of location usefulness on for example transparent glass plate, for example diameter is 140 microns a metal film.Fig. 7 (a) and (b) are respectively the plane graph and the side views of the position relation of schematic representation wafer chuck 4A and miniature camera 41 and macrophotograph machine 42.Wherein, in this Fig. 7, omit target 44, the driving and reversing mechanism 43 explained.

The both sides of the directions X of the internal face of the framework 22 in the zone between wafer chuck 4A and probe 6A (side (positive front side) and depth side (inboard) in front) are provided with guide rail 47 along the Y direction.As shown in Figure 8, as the calibration bridge 5A of image unit be set to can along this guide rail 47 after on the Y direction, freely move between the normal place stated and the camera position.

In following explanation, for convenience's sake directions X (with reference to Fig. 2) is called left and right directions.On calibration bridge 5A; As shown in Figure 9; Be provided with first miniature camera 71 and second miniature camera 72 symmetrically with respect to the center line that will calibrate two five equilibriums about bridge 5A 70; And in addition, be provided with the first macrophotograph machine (macro camera), the 81 and second macrophotograph machine 82 symmetrically with respect to above-mentioned line 70.First miniature camera 71 and second miniature camera 72 are equivalent to first image unit and second image unit respectively.The first macrophotograph machine 81 and the second macrophotograph machine 82 are equivalent to the first low range camera and the second low range camera respectively.

It is downward that in these cameras any is the visual field.Here; Miniature camera (perhaps macrophotograph machine) as after state shown in Figure 16; Optical system through containing camera body 71a (72a) and mirror 71b (72b) constitutes, but in the present invention, technical essential is the optical axis that extends from the following faces downwards of calibration bridge 5A; Therefore; The term that is called as miniature camera (perhaps macrophotograph machine), convenient for the purpose of in the item that should explain, have situation and the situation of the optical system that refers to contain camera body and mirror of window portion that finger-type is formed in the following shooting usefulness of calibration bridge 5A.In Fig. 9, the less circular portion that is called miniature camera (perhaps macrophotograph machine) represent the to make a video recording window portion of usefulness, same situation after also identical among the figure that states.

What is called is provided with miniature camera 71,72 (perhaps the macrophotograph machine 81,82), be meant two miniature cameras are set, photographed images separately through after the control part stated and by image

processing.Miniature camera

71,72, as shown in Figure 2, compare with

macrophotograph machine

81,82, be positioned at horizontal line HL side as the border of first 21A of inspection portion and second 21B of inspection portion.In addition, when wafer size (wafer diameter) was 300mm, the distance 1 of

miniature camera

71,72 and center line 70 for example was 73mm,

macrophotograph machine

81,82 and center line 70 be for example 45mm apart from r.Wherein, when expression relevant with camera with other position apart from the time, be that optical axis with camera is as measuring point.For example, the implication of the distance 1 of

miniature camera

71,72 and center line 70 is: each optical axis of

miniature camera

71,72 and the distance 1 of center line 70.

In addition;

Miniature camera

71,72 for surface shooting that can amplifying chip W, and constitutes as the powerful camera that contains the CCD camera;

Macrophotograph machine

81,82 constitutes as the low range camera in order to make a video recording to wafer W with broad horizon.

Normal place as the stop position of above-mentioned calibration bridge 5A; Be meant when between wafer chuck 4A and wafer transfer mechanism 3, carrying out the handing-over of wafer W, when wafer W contacts with probe 6A and through above-mentioned first image unit (miniature camera 41) when probe 29 is made a video recording, calibration bridge 5A does not interfere with wafer chuck 4A, wafer transfer mechanism 3 and the position of keeping out of the way.In addition, above-mentioned camera position is meant, the position when make a video recording in the

miniature camera

71,72 through calibration bridge 5A and the surface of 81,82 pairs of wafer W of macrophotograph machine.The shooting that utilizes the surface of this

miniature camera

71,72 and 81,82 pairs of wafer W of macrophotograph machine to carry out is to be fixed on camera position through calibrating bridge 5A, wafer chuck 4A is moved carry out.

This camera position shown in the downside of Figure 10, is compared the depth side (central side of sniffer main body 2) of deflection Y direction with the center of probe 6A.It the reasons are as follows: as stated; Miniature camera 41 is set at the side (the positive front side of Y direction) of wafer chuck 4A; When utilizing 41 pairs of probes 29 of this miniature camera to make a video recording; Shown in the stage casing of Figure 10, the mobile stroke D2 of the Y direction of wafer chuck 4A (moving range of the center O1 of wafer chuck 4A) squints to the depth side (inboard) of Y direction from the center O2 of probe 6A.On the other hand; Shown in the epimere of Figure 10; For the mobile stroke D1 of the wafer chuck 4A in when contact (when wafer W contacts with probe 29); Because be formed with a plurality of probes 29, therefore become very short distance for wafer W (is summed up) with following contact of probe 6A with probe 29 in the lump.

Therefore; If the camera position of calibration bridge 5A and the center O2 of probe 6A are matched, the mobile stroke D3 of the wafer chuck 4A when then making a video recording through the surface of 71,72 pairs of wafer W of miniature camera overflows (flying out) to the right side of above-mentioned mobile stroke D1.

Therefore; The camera position of calibration bridge 5A is squinted to the positive front side of Y direction (side in front); Make and move stroke D2, D3 coincidence; But dynamic stroke (mobile range) D4 in zone as the mobile stroke D1～D3 that contains wafer chuck 4A is shortened, promptly, the length of the Y direction of sniffer main body 2 is shortened.Wherein, mobile stroke D2, D3 are not identical scopes, and the camera position of calibration bridge 5A is compared the deflection Y direction with the center O2 of probe 6A depth side is also passable.

In addition, as shown in Figure 2, sniffer is provided with the control part 15 that for example is made up of computer, and this control part 15 has the data processing division of formations such as program, memory, CPU etc.This program is formed step groups, makes to after being moved into load port 11 (12) to support C, and wafer W is checked, wafer W turns back to support C and support C is controlled by the action of a series of each one till taking out of thereafter.This program (comprise with the input operation of processing parameter, show relevant program) for example is stored in the storage medium 16 of floppy disk, CD, MO (photomagneto disk), hard disk etc. and is installed in the control part 15.

What in Figure 11, represent is an example of the formation of control part 15 shown in Figure 2.Label 151 is CPU; Label 152 is the program of a series of actions of being used to carry out sniffer; Label 153 is a scheme storage part of taking in the scheme of the inspection of being undertaken by inspection portion 21A (21B); Label 154 operating portion for parameter, the operation mode of sniffer being set, perhaps being carried out each operation relevant with running, label 155 is a bus.Operating portion 154 for example is made up of the picture of touch panel etc.

Then, the effect to above-mentioned sniffer describes.At first, with sniffer main body 2 opposite sides support C is moved into this load port 11 from load port 11 (12) through the automatic conveyance car (AGV) in the clean room.This moment support C the handing-over mouth towards sniffer main body 2, carry through rotation and to put platform 13 (14) and make it relative with gate S.Then, put platform 13 and advance and push support C, to unload the lid and the gate S of support C to gate S side thereby carry.

Then; In support C, take out wafer W; And with its conveyance to the 21A of inspection portion (21B), for following Action Specification, checked by first 21A of inspection portion and second 21B of inspection portion respectively two wafer W 1, W2 are arranged; Under this state, take out follow-up wafer W 3, wafer W 4 from support C, the pattern of carrying out series of processes describes.

At first, shown in figure 12, stage casing arm 32 enters in second support C 2, and taking-up wafer W 3 is also retreated to the position of carrying out pre-calibration.Then, chuck segment 36 rises, and wafer W 3 is risen; Meanwhile be rotated and according to the testing result of optical sensor 37; Among the 21A of first, second inspection portion, 21B, with become the corresponding otch of the 21A of inspection portion (21B) moved into wafer W 3 towards mode, the adjustment wafer W towards; In addition off-centre is also checked, carried out pre-calibration.Then, same, hypomere arm 33 enters in second support C 2, and is shown in figure 13, takes out wafer W 4, with become the corresponding otch of inspection portion 21A (21B) that moved into wafer W 4 towards mode, carry out wafer W 4 towards adjustment and the detection of off-centre.Then, in order to carry out the exchange of wafer W 3, W4 and wafer W 1, W2, wafer transfer mechanism 3 is descended.

Then, carry out the exchange of the wafer W 3 in first 21A of inspection portion interior wafer W 1 and the wafer transfer mechanism 3.When the inspection of wafer W 1 finished, wafer chuck 4A was shown in figure 14, moves to the delivery position near partition wall 20.Then, the vacuum card of removing wafer chuck 4A ends, and the lifter pin in the wafer chuck 4A is risen, thereby wafer W 1 is risen.Then, empty epimere arm 31 gets on the wafer chuck 4A, through lifter pin being descended receive wafer W 1 and retreating.In addition; Wafer transfer mechanism 3 is risen; Stage casing arm 32 is got on the wafer chuck 4A, and when judging that through previous pre-calibration the center of wafer W 3 takes place to squint, with the mode that the off-centre of wafer W 3 is revised; Through scheming the synergy of unshowned above-mentioned lifter pin and stage casing arm 32, wafer W was put on wafer chuck 4A in 3 years.

Then; Shown in figure 15; Wafer W 3 is handover to first 21A of inspection portion goes up and make and become empty stage casing arm 32 and enter into second 21B of inspection portion, the wafer W 2 of likewise being checked from wafer chuck 4B is also retreated, afterwards; Hypomere arm 33 enters on the wafer shroud 4B, and the wafer W 4 before will checking from hypomere arm 33 is handover to wafer chuck 4B.

Then, wafer transfer mechanism 3 being risen, make wafer W 1 and wafer W 2 for example turn back to first support C 1, in addition, for back to back wafer W (wafer W 5, W6), equally also is that per two ground take out from support C, carries out identical processing.

On the other hand, in first 21A of inspection portion, after being handover to wafer W 3 on the wafer chuck 4A,, the probe 29 of probe 6A is made a video recording through being arranged on the miniature camera 41 on the wafer chuck 4A.That is, make the needle point of probe 29 be positioned at the center of cross mark for example, center in the visual field of miniature camera 41, obtain the coordinate position (coordinate of X, Y, Z direction) of drive system of the wafer chuck 4A of this moment.Particularly, for example, on the directions X mutually from the probe 29 at farthest two ends with on the Y direction, make a video recording from the probe 29 at farthest two ends mutually, grasp the center of probe 6A and the direction arranged side by side of probe.At this moment, through being arranged on the macrophotograph machine 42 on the wafer chuck 4A, near the zone the object observing position then, detects the tip position of the probe 29 of target through miniature camera 41.Wherein, the calibration bridge 5A of this moment keeps out of the way to normal place shown in Figure 8.

Then; Make calibration bridge 5A move to the camera position (with reference to Fig. 8) of wafer W 3; Meanwhile; Shown in Figure 16 (a); Make gate 44 project to the zone between first miniature camera 71 of miniature camera 41 and calibration bridge 5A side of wafer chuck 4A side,, carry out the initial point detection (find the home position (original point searching)) of so-called two

cameras

41,71 so that the focus of two

cameras

41,71 and the optical axis mode consistent with the gate mark of gate 44 adjusted the position of wafer chuck 4A.In addition, carrying out initial point too for second miniature camera 72 shown in Figure 16 (b) surveys.Finish in each of moment that the moment that the initial point of two

cameras

41,71 surveys and the initial point that finish two

cameras

41,72 survey coordinate position of managing by drive system (directions X coordinate position, Y direction coordinate position, Z direction coordinate position) among memory chip chuck 4A.Then, make after gate 44 keeps out of the way, make wafer chuck 4A be positioned at the lower side of calibration bridge 5A, as following, carry out close adjustment.

At first, use macrophotograph machine 81,82 to try to achieve the center of wafer W.Figure 17 representes is that 4 E1～E4 to the periphery on the wafer W make a video recording and try to achieve each coordinate position, the pattern of intersection point of trying to achieve the straight line of E1 and 2 of E3 in connecting at these 4 and being connected the straight line of E2 and E4 in these 4 at 2.At this moment, the position of wafer chuck 4A is adjusted, made the periphery of wafer W be positioned at the center of cross mark for example, center in each visual field of the first macrophotograph machine 81 and the second macrophotograph machine 82 simultaneously.Then, after E2, E3 being finished shooting, move along direction E1, E4 are made a video recording, so the intersection point of above-mentioned two straight lines becomes the coordinate of the center C of wafer W with the center that is connected above-mentioned each visual field straight line quadrature each other.As stated; First miniature camera 71 of calibration bridge 5A one side and the miniature camera 41 of second miniature camera 72 and wafer chuck 4A one side carry out initial point and survey; In addition; Learn in advance first miniature camera 71 and second miniature camera 72 each optical axis leave distance, in addition, obtain in advance the first macrophotograph machine 81 and the second macrophotograph machine 82 each optical axis leave distance; Therefore, learn the relative coordinate of the center C of wafer with respect to the optical axis of the miniature camera 41 of wafer chuck 4A side.

In addition, the length of the straight line of connection E1, E3 (E2, E4) is the diameter of wafer W.For example for the wafer W of 300mm, in fact because the diameter of wafer W has error slightly with respect to 300mm, so the drawing (coordinate of each electrode slice) in order correctly to make the chip on the wafer W is necessary to grasp the centre coordinate and the diameter of wafer W.In addition, the registered location of the electrode slice of each chip in the coordinate system on the wafer (so-called ideal coordinates system) is stored at the relative position of the centre coordinate that leaves wafer W, so be necessary to try to achieve the centre coordinate of wafer W.In this example, shown in Figure 18 (a) and (b), successively to making a video recording about the latter half among Figure 18 of wafer W, try to achieve E2, E3 position through macrophotograph machine 81,82.Then, wafer W is moved along the Y direction, shown in Figure 19 (a) and (b), successively to making a video recording about the first half among Figure 19 of wafer W, try to achieve the position of E1, E4 through

macrophotograph machine

81,82.

Then, the arrangement of the IC chip on the wafer W (being formed on the line of higher (higher level) of the substrate of chip chamber) with along the mode of X axle and Y axle and wafer W towards matching.Wafer W is carried out pre-calibration before placing wafer chuck 4A in advance carrying, and towards roughly adjusting, therefore, in this stage, a side of the configuration direction of the IC chip of wafer W is roughly parallel with the Y axle to it, even if having towards deviation, its angle for example be 1 spend about.What Figure 20 represented is the example of the configuration of the IC chip on the wafer W, and label 400 is the IC chip, and label 500 is line (dicing line).

At first, shown in Figure 21 (a), the angle of the 81 pairs of IC chips of macrophotograph machine through a side is taken, according to its image pickup result grasp wafer W roughly towards.Then, utilize

miniature camera

71,72 respectively the specified point P1, the P2 that arrange along the X axle among 4 specified point P1～P4 that are predetermined to be made a video recording.These specified points P1～P4 is equivalent to the angle of IC chip 400.If specified point P1, P2 are fully parallel with the X axle, and then consistent with the optical axis position of

miniature camera

71,72 according to specified point P1, the X of P2, the Y coordinate position of design load calculating, then specified point P1, P2 one are positioned the center in each visual field of miniature camera 71,72.But this case is very rare in practical application, wafer W towards only from the direction skew of regulation; Promptly; Because line in length and breadth 500 is tilted from X, Y axle respectively,, cause that sometimes specified point P1, P2 be not in each visual field of

miniature camera

71,72 so wafer W moves to design attitude.

Therefore, at first according to the result by macrophotograph machine 81 shooting calculate wafer W roughly towards, drive wafer chuck 4A according to its result of calculation and make specified point P1, P2 be positioned at the visual field of

miniature camera

71,72 successively.Then, utilize

miniature camera

71,72 successively to specified point P1, P2 make a video recording (center that specified point P1, P2 are positioned at the visual field).Figure 21 (b) and Figure 22 (a) represent this pattern.Because can through this image pickup result calculate wafer W towards skew, so can according to this result of calculation only make the amount of wafer chuck 4A rotational offset revise wafer W towards (Figure 22 (b)).Its result, the line in length and breadth 500 of wafer W is parallel with X, Y axle respectively.

Then, for confirm correctly to have revised wafer W towards, shown in Figure 23 (a) and Figure 23 (b), successively specified point P3, P4 are made a video recording through miniature camera 71,72.If wafer W be oriented predefined towards; Then calculate the coordinate position (contact position) of the X be used to make the wafer chuck 4A that wafer W contacts with probe 29, Y, Z axle; In addition, if wafer W towards be not predefined towards, then revise once more wafer W towards; Successively specified point P1, P2 are made a video recording once more through

miniature camera

71,72 afterwards, with confirm wafer W towards.

Like this; From the position of the wafer chuck 4A that finishes each shooting and the position of the wafer chuck 4A when finish the detection of above-mentioned initial point, in control part 15 sides, calculate the coordinate of the wafer chuck 4A that each electrode slice on the wafer W 3 contacts with each probe 29 of probe 6A.Then, the contact coordinate position of wafer chuck 4A after calculating moved, each electrode slice on the wafer W 3 is contacted with each probe 29 of probe 6A.Then, from scheming the electric signal of unshowned measuring head, thus the electrical characteristic of each IC chip is checked through the electrode slice transmission regulation of spring catch unit 28 and each IC chip of probe 6A on wafer W 3.Afterwards, identical with above-mentioned wafer W 1, wafer chuck 4B is moved to delivery position, utilize wafer transfer mechanism 3 wafer W 3 to be taken out of from wafer chuck 4B.Wherein, check similarly for the wafer W of moving among second 21B of inspection portion 4.

Wherein, in this execution mode, when the assembling of device, the pivot coordinate of wafer chuck 4A (X on the platform, Y coordinate) is obtained and is stored as machine parameter through following method.At first, the benchmark wafer is carried to be placed on the chuck, at least 3 the reference part and its position coordinates of storage periphery.Then, wafer chuck 4A is only rotated to an angle, confirm the reference pattern position, the memory location coordinate.Then, preceding and postrotational coordinate is made its vertical bisecting line with straight line connecting wafer chuck 4A rotation, and line separately intersects, and its intersection point that intersects is stored as pivot.Then, when calibration, can utilize following formula to try to achieve the center of wafer W and the postrotational coordinate of the target position of calibration usefulness.That is, with pivot as the coordinate (X1, Y1) of initial point the coordinate (X2, Y2) during according to clockwise anglec of rotation θ can try to achieve by formula " X2=X1 * cos θ+Y1 * sin θ, Y2=-X1 * sin θ+Y1 * cos θ ".

The advantage that calibration bridge 5A is provided with 71,72 and two

macrophotograph machines

81,82 of two miniature cameras here, describes.4 shooting of the periphery of the wafer W of carrying out for the center of trying to achieve wafer W is that each group of (E2, E3) and (E1, E4) is roughly carried out through the switching of

macrophotograph machine

81,82 simultaneously.Then, moving of wafer chuck 4A also can only be carried out once carrying out along moving of Y direction after the affirmation that finishes E1, E3.Relative therewith, if the macrophotograph machine is one, then need successively with chuck move to wafer W on 4 the corresponding position of each point.Therefore, through using two

macrophotograph machines

81,82, can be positioned at 4 shooting of the peripheral position of wafer W in the short time.

In addition, Figure 24 (a) is illustrated among the calibration bridge 5A only to be equipped with a miniature camera 71, and its optical axis is positioned under the situation of structure at center of calibration bridge 5A, to the P1 on the above-mentioned wafer W, pattern when P2 makes a video recording.In addition, Figure 24 (b) representes in the above-described embodiment, to the P1 on the wafer W, pattern when P2 makes a video recording.Can know that from this figure the displacement of wafer chuck 4A is to be L1 under one the situation at miniature camera, be to be L2 under two the situation when miniature camera, and its displacement L2 compares with L1 significantly and shortens.

And; As being used for one of operation that wafer W and probe 29 are positioned; The collimating marks that the right ends part of utilizing

miniature camera

71,72 to observe wafer W is arranged; Perhaps in the situation of finding the pin track on the wafer W after the inspection, therefore, make the right ends position of wafer W or be positioned near it

miniature camera

71,72 under.What Figure 25 represented is the Move Mode of the wafer chuck 4A when carrying out this operation.Now, at the lower position of calibration bridge 5A, the mode positions wafer W that overlaps with the center C of the center line 70 of calibration bridge 5A and wafer W.From here towards wafer, left field is made a video recording by miniature camera 71, then with towards wafer W, left end be positioned at miniature camera 71 under mode along directions X wafer chuck 4A is moved.The amount of movement of the wafer chuck 4A of this moment is M1.If the wafer W of 300mm here, then M1 is 77mm.

Therefore, shown in figure 25, being positioned under the state of center line 70 of calibration bridge 5A with the center C of wafer W is benchmark, from this state begin wafer W to the left the amount that moves of zone and right side area be respectively M1.In this example, because use the wafer W of 300mm, so M1 is 77mm, the amount of movement of the integral body of wafer W is 154mm.

Figure 26 is illustrated in the situation that a miniature camera 71 is installed on the calibration bridge 5A, in this case, at first make wafer W be centered close to miniature camera 71 under; Then, wafer chuck 4A is moved along directions X, make the right ends position of wafer W be positioned at miniature camera 71 under; Therefore; Shown in figure 26, the wafer W amount that moves of zone and right side area to the left is M2, is equivalent to the radius of this wafer W.In this example, because use the wafer W of 300mm, so M2 is 150mm, the amount of movement of the integral body of wafer W is 300mm.

Be appreciated that when on

calibration bridge

5A, 71,72 and two

macrophotograph machines

81,82 of two miniature cameras being set through above content, can reduce the amount of movement of wafer chuck 4A.

Under the situation of using two

macrophotograph machines

81,82, preferably be and be symmetrical set with respect to above-mentioned center line 70.Its reason does; When utilize

macrophotograph machine

81,82 share respectively wafer W about under the situation of shooting in zone; With respect to center line 70; The moving area of wafer chuck 4A is left-right symmetric, if the moving area when making a video recording through 71,72 pairs of wafer W of miniature camera overlaps, then as a result of to be that asymmetrical situation is compared stenosis narrow with the moving area of wafer chuck 4A.Wherein, the configuration of

macrophotograph machine

81,82 also can be asymmetric with respect to above-mentioned center line 70.

The close adjustment action of above device be that the center describes with the action of first 21A of the inspection portion side among Fig. 1, but second 21B of inspection portion is also carried out close adjustment with identical process.In addition, a series of actions that comprises the action of close adjustment is carried out through the program 152 in the control part 15.

Can access following effect according to above-mentioned execution mode.Height and position between wafer chuck 4A (4B) and probe 6A (6B) is provided with 71,72 and two

macrophotograph machines

81,82 of two miniature cameras of the downward wafer shooting usefulness in the visual field as the calibration bridge 5A (5B) of the moving body that can move along horizontal direction.Then, the optical axis of

miniature camera

71,72 leaves each other, and in addition, the optical axis of

macrophotograph machine

81,82 also leaves each other, therefore, the amount of movement of wafer chuck 4A (4B) is reduced.Therefore, miniaturization that can implement device because obtaining the time that positional information spent of wafer W also shortens, therefore can realize high production rate in addition.

Further, other execution mode of the present invention is described.Figure 27 is related calibration bridge 5A and the control part 15 of this execution mode of expression.Wherein, because have identical structure for calibration bridge 5B, so, describe as representative with a side calibration bridge 5A.

In the calibration bridge 5A of this execution mode, two

miniature cameras

71,72 constitute as the unit that can move, and

miniature camera

71,72 both sides are configured to freely to engage separation (connect and leave).In addition, in calibration bridge 5A, also be equipped with and be used to driving mechanism 100,200 that

miniature camera

71,72 is moved.This driving mechanism 100 has through the ball-screw 103 at support component 101,102 support both ends and guide shaft (leading axle) 105, and ball-screw 103 sets with respect to the moving direction of miniature camera 71 is parallel with guide shaft 105.And; Ball-screw 103 one distolateral; The back side that particularly is miniature camera 71 is connected with the CD-ROM drive motor 104 that is used to make the ball-screw rotation; Through this CD-ROM drive motor 104 ball-screw 103 is rotated, thus, miniature camera 71 becomes the form that under the state that is supported by guide shaft 105, can move.Wherein, for driving mechanism 200, because it has the structure identical with driving mechanism 100, so omit its explanation herein.

CD-ROM drive motor 104,204 is connected with control part 15, through control part 15 its drivings of control.On this control part 15, the CPU151 that is had except the control part 15 of first execution mode, program 152, scheme storage part 153, operating portion 154, the bus 155, also be provided with camera movement table 156 through bus 155.Camera movement table 156 be with corresponding to the information of the size of IC chip 400 and miniature camera leave the corresponding and table installed of distance, CD-ROM drive motor 104,204 drives according to each data of showing of this camera movement table 156.

In the execution mode of having explained; Because the fixed-site of two miniature cameras; Therefore the P1 that leaves each other along directions X, the distance of leaving distance and miniature camera inconsistent (corresponding to situation is considerably less) of P2 (P3, P4); So, to the mobile a little wafer chuck 4A that has to for P2 is made a video recording after the P1 shooting.Therefore, can freely engage separated structures through being provided with, can so that the distance of leaving of miniature camera adjust with leaving of P1, P2 (P3, P4) apart from consistent mode.Because P1, P2 (P3, P4) are the bight of IC chip 400, so the distance of leaving of P1, P2 (P3, P4) is determined by the size of IC chip 400.

Therefore; Be stored in the memory camera movement table 156 and the stage of carrying out the inspection of wafer through control part 15; Through importing the information corresponding with chip size from input part; And the distance of leaving of reading the miniature camera corresponding with the chip size of importing moves

miniature camera

71,72 to become this mode controlling and driving portion of leaving distance.Then, in the moment that the distance of 71,72 of miniature cameras becomes L0 CD-ROM drive motor 104 is stopped.Thus, shown in figure 28 in the calibration bridge 5A of this execution mode, two

miniature cameras

71,72 are moved, change two miniature cameras 71, the distance between 72 and be the match distance L 0 of defined of the size with the IC chip 400 of the wafer of shooting.

Can access following effect according to this execution mode.Engage one another through the

miniature camera

71,72 that makes wafer shooting usefulness and to leave setting; Can adjust it leaves distance and is two specified points on the wafer W for example P1, the distance that P2 (P3, P4) leaves mutually of Figure 20; Therefore; If make wafer chuck 4A (4B) move to the position that a specified point P1 (P3) is made a video recording, then can make wafer chuck 4A (4B) keep static another specified point P1 (P4) is made a video recording, can further boost productivity thus.

As the probe 5A that has explained; Not only under situation about contacting in the lump; For example probe 29 is set in configuration corresponding mode with the electrode pad set in the zone of cutting apart through the diameter two of wafer W; Carry out at twice under the situation about contacting of wafer W and probe 29, perhaps with to cut apart the configuration of electrode pad set in zone of wafer W along circumferential four corresponding and be provided with and talking 29, the situation that four zones of cutting apart of wafer W and this are contacted is inferior also passable.In this case, through making wafer chuck 4A rotation, carry out contacting of probe 29 and wafer W.In sniffer of the present invention, preferably be applicable to through 1 time～4 times contact and finish the formation of the inspection of wafer W.

In addition,

miniature camera

71,72 also can be provided with on the light path of optical system and become times mechanism, becomes times mechanism through control and can access the visual field (the middle visual field) that multiplying power when using as the high magnification camera is compared low a little multiplying power.Wherein, the multiplying power when using as the high magnification camera is the multiplying power of the degree that can confirm the pin vestige on the electrode slice, for example in the visual field only income the multiplying power of an electrode slice is arranged., operating personnel can not find the pin track when confirming the pin track on the electrode slice after the inspection at

macrophotograph machine

81,82; Only confirm one by one that electrode slice just need take a long time in this external

miniature camera

71,72; Therefore; A plurality of electrode slices are once confirmed in the visual field in can utilizing, and can confirm having or not of pin track effectively.Wherein, under the situation that the specified point of the location usefulness on the wafer W of having explained is made a video recording, also can utilize the visual field in this.

More than, the optical axis of the optical axis of first miniature camera 71 and second miniature camera 72 leave distance, in above-mentioned example, become the size of the radius (150mm) that approaches to wafer from 146mm.Thus, be set at value, and can platform (stage) amount of movement that the whole surface that be used to make wafer W enters into the camera view of

miniature camera

71,72 be become minimum, have this advantage near the radius of wafer through making the size between above-mentioned optical axis.

More than, as the substrate transferring arm, be not limited to have above-mentioned 3 arms having explained, also can only have an arm.In addition, pre-calibration mechanism is not limited to and the combination of substrate transferring arm, also can independently be arranged in the device with the substrate transferring arm.At this moment; Wafer is handover on the platform of pre-calibration mechanism from the substrate transferring arm; And adjust so that wafer towards become regulation towards, and meanwhile so that the mode at the regulation position that is centered close to the substrate transferring arm of wafer is carried out from above-mentioned the reception to the wafer of substrate transferring arm.And, as being applicable to sniffer of the present invention, apparatus main body only have 1 also passable, make commonization of load port also passable with respect to the apparatus main body more than 3.

Claims

1. sniffer; This sniffer has alignment arrangements a plurality of wafers that are examined chip carry to put to be put drive division that platform uses and can carry along the wafer that horizontal direction and vertical direction move freely and put on the platform through carrying; Make the said electrode slice that is examined chip contact with the detector of probe to being examined chip inspection; This sniffer is characterised in that, comprising:

Carry the height and position of putting between platform and the probe at said wafer and be set to the moving body that can move along horizontal direction;

The control unit of execution in step group, wherein, said step groups may further comprise the steps:

2. sniffer as claimed in claim 1 is characterized in that, comprising:

Be arranged on the said moving body; Its optical axis separately is spaced from each other, and the visual field that is used for wafer surface is made a video recording downwards and the multiplying power wafer lower than the multiplying power of first image unit and second image unit make a video recording first low range camera and the second low range camera of usefulness.

3. sniffer as claimed in claim 2 is characterized in that:

First image unit and first low range form left-right symmetric with the group of each optical axis of camera and second image unit and second low range with the group of each optical axis of camera.

4. sniffer as claimed in claim 2 is characterized in that:

Said step groups comprises the steps that this step is:

The first low range camera and the second low range camera that utilizes wafer shooting usefulness carries 2 of the periphery of putting the wafer on the platform to wafer successively makes a video recording; Then wafer is carried put platform and move with the mode of the connecting line quadrature mutual with respect to each optical axis of the first low range camera and the second low range camera; Utilize the first low range camera and the second low range camera successively with peripheries said 2 opposite sides 2 on the wafer to be made a video recording, the wafer during according to these four somes shootings carries the center that wafer is tried to achieve in the position of putting platform.

5. sniffer as claimed in claim 4 is characterized in that:

The first low range camera and the second low range camera that replace wafer shooting usefulness, 2 of the periphery that utilizes first image unit and second image unit of wafer shooting usefulness that wafer is carried to put the wafer on the platform make a video recording and 2 of the periphery of said opposite side are made a video recording.

6. according to claim 1 or claim 2 sniffer is characterized in that:

Said step groups comprises first image unit and second image unit that utilizes wafer shooting usefulness; Two specified points to leaving each other on the wafer are made a video recording; Wafer when making a video recording carries the position of putting platform according to each so that wafer become predefined towards mode wafer is carried put the step of platform rotation.

7. according to claim 1 or claim 2 sniffer is characterized in that:

First image unit and second image unit of said wafer shooting usefulness, the mode that can freely combine each other to separate with the moving part of using through image unit is arranged on the said moving body.

8. according to claim 1 or claim 2 sniffer is characterized in that:

The information that said control part basis is corresponding with the kind of wafer; Become the mode of the distance of leaving each other of two specified points on the wafer with the distance of leaving each other of the optical axis of first image unit and second image unit, the control signal of the drive division that output is used image unit.

9. detection method; This detection method has alignment arrangements a plurality of wafers that are examined chip carry to put to be put drive division that platform uses and can carry along the wafer that horizontal direction and vertical direction move freely and put on the platform through carrying; Make the said electrode slice that is examined chip contact with the detector of probe to being examined chip inspection; This detection method is characterised in that, uses following equipment, and said equipment is:

Be arranged at said wafer and carry on the moving body that the height and position of putting between platform and the probe is set to move along horizontal direction; Its optical axis separately is spaced from each other; First image unit and second image unit of the wafer shooting usefulness that the visual field that is used for wafer surface is made a video recording is downward, this detection method comprises:

First image unit through wafer being carried put platform to move to utilize said wafer shooting usefulness and second image unit carry the wafer of putting on the platform to wafer successively makes a video recording, and obtains the operation that wafer when respectively making a video recording carries the position of putting platform;

10. detection method as claimed in claim 9 is characterized in that:

First image unit and second image unit that utilizes said wafer shooting usefulness carries wafer successively to be put the operation that the wafer on the platform makes a video recording and comprises: make a video recording for 2 of the periphery that utilizes first image unit and second image unit of wafer shooting usefulness that wafer is carried to put the wafer on the platform; Then wafer is carried put platform and move with the mode of the connecting line quadrature mutual with respect to each optical axis of first image unit and second image unit; Utilize first image unit and second image unit successively with peripheries said 2 opposite sides 2 on the wafer to be made a video recording, the wafer during according to these four somes shootings carries the operation that the center of wafer is tried to achieve in the position of putting platform.

11. like claim 9 or 10 described detection methods, it is characterized in that, comprising:

Utilizing first image unit and second image unit of said wafer shooting usefulness that wafer is carried the wafer of putting on the platform makes a video recording successively; Utilize first image unit and second image unit of wafer shooting usefulness that two specified points that leave each other on the wafer are made a video recording; Wafer when making a video recording carries the position of putting platform according to each so that wafer become predefined towards mode wafer is carried put the operation of platform rotation.

12. like claim 9 or 10 described detection methods, it is characterized in that, comprising:

According to the information corresponding with the kind of wafer; Become the mode of the distance of leaving each other of two specified points on the wafer, the operation that the drive division that utilizes image unit to use is adjusted the position of first image unit and second image unit with the distance of leaving each other of the optical axis of first image unit of wafer shooting usefulness and second image unit.