CN101393332B - ACF pasting device and flat panel display device - Google Patents

Abstract

The invention provides an ACF pasting device, which applies equal pressure along the whole length of a substrate when pasting an ACF on the substrate. In the pasting mechanism (10), a pressure welding head (50) is arranged at the position between horizontal guide rollers (16), (17) for guiding the ACF tape (13), and the pressure welding head (50) is arranged at the upper part and the lower part by clamping the liquid crystal panel (1). A press-contact head (50) formed to have the same length is composed of a pressing blade (51) and a support blade (52). These pressing blades and supporting blades are attached to lifting blocks (53, 54) which can be displaced in the vertical direction along a guide rail (55). The support blade (52) is driven by a cylinder (56), and the pressing blade (51) is driven by a pressing mechanism (57), and the two blades can be driven to move up and down independently. When the hard paper tape (12) of the ACF tape (13) is pushed, ACF (8) corresponding to the length L of each electrode group (5) arranged on the liquid crystal panel (1) is pressed on the lower substrate (2).

Description

ACF sticking device and flat panel display device

technical field

The present invention relates to an ACF attaching device for attaching ACF (Anisotropic Conductive Film) to a substrate composed of a display panel or the like in order to mount a semiconductor circuit device such as a driver circuit on the substrate, and the ACF attaching device including A flat-panel display device of the ACF, and the display panel constitutes a flat-panel display device such as a liquid crystal display, a plasma display, an organic EL display, or the like.

Background technique

For example, a liquid crystal display is constructed by connecting a printed circuit board to a liquid crystal panel using a semiconductor circuit device. The liquid crystal panel is composed of two upper and lower transparent substrates that form a liquid crystal sealing space. Here, the semiconductor circuit device is a driving circuit, and the driving circuit has inner and outer electrodes, the inner electrodes are electrically connected to one substrate constituting the liquid crystal panel, and the outer electrodes are electrically connected to the printed circuit board. Typical installation methods of the drive circuit include COG (Chip on Glass) and TAB (Tape Automated Bonding). The COG method is to directly connect the chip-like IC component (ICパツケ—ジ) to the liquid crystal panel and the printed circuit board; the TAB method is to connect the TCP (Tape Carrier Package) with the drive circuit on the film-like substrate to the liquid crystal panel and the printed circuit board. circuit board connection.

In either case, wiring patterns are formed on at least two sides of the surface of one substrate constituting the liquid crystal panel, and the electrodes in the wiring patterns are electrically connected to the rear electrodes of the driving circuit. Therefore, wiring patterns are provided at minute intervals on the liquid crystal panel, and a predetermined number of electrode groups are formed for each mounted semiconductor circuit device. In addition, among the plurality of electrode groups, there is a blank area between adjacent electrode groups. In addition, since the drive circuit is also connected to the printed circuit board, a predetermined number of electrode groups are formed on the printed circuit board side as in the case of the liquid crystal panel. Here, the number of wires constituting the electrode group on the printed circuit board side is generally smaller than the number of wires constituting the electrode group on the liquid crystal panel side.

When connecting a drive circuit as a semiconductor circuit device, a liquid crystal panel, or a printed circuit board, it is necessary to reliably electrically connect a plurality of electrodes arranged at small intervals, and to fix the drive circuit. For this purpose, ACF is used. This ACF is formed by uniformly dispersing fine conductive particles in an adhesive binder resin. By thermocompression-bonding this ACF, the electrodes are electrically connected via conductive particles, and the adhesive resin is cured by heating to fix the driving circuit on the liquid crystal panel or the printed circuit board.

For example, ACF is pasted on a portion of one substrate of a liquid crystal panel where a wiring pattern is provided, and TCP, which is a driving circuit, is mounted on this substrate by a TAB method. ACF as an adhesive substance is laminated on a cardboard tape via a release layer, thereby constituting an ACF tape. The ACF tape is wound around a supply roll, sent out from the supply roll, and stuck to the substrate surface by a sticking mechanism. Therefore, on the pasting mechanism, there is provided a member that bridges the supply roller. In addition, in order to make the ACF tape supplied from the supply roller travel along a predetermined path, guide members including guide rollers and the like are disposed at appropriate locations.

There are two methods of pasting the ACF on the substrate, the whole pasting method and the split pasting method. The whole paste method is to paste continuously along the entire length of one side of the substrate; the split paste method is to paste each electrode group separately, and the ACF is not pasted in the blank area. In the all-pasting method, ACF is also pasted on unnecessary blank areas, so that waste of materials is caused, and, in the blank areas, the adhesive resin and conductive particles that constitute ACF are exposed, so in the drive circuit Problems may arise during handling and processing after installation. Therefore, it is best to use the split and paste method.

Patent Document 1 discloses a system in which ACF is divided and pasted for each electrode group on a substrate. In this patent document 1, in the rotation direction of the rotator, a plurality of holding parts of the ACF holding the sticking length are arranged, and the ACF tape bonded with the cardboard tape is cut into each sticking length, and the cardboard tape is adsorbed on Keep on top. The holding portion is in contact with or separated from the liquid crystal panel via a shaft provided on the rotating body so as to be retractable.

The substrate constituting the liquid crystal panel is moved, and each electrode group is positioned at predetermined intervals so as to face the rotating body in sequence. When the shaft connected to the holding portion is extended, the ACF, the cardboard tape, and the laminated tape adsorbed to the holding portion are pressed against the substrate. Then, the holding unit holds the cardboard tape in an adsorbed state, pulls the shaft to the side of the rotating body, and thus peels the ACF from the cardboard tape and sticks it on the substrate.

Patent Document 1: Japanese Patent Application Laid-Open No. 9-83114

In the aforementioned Patent Document 1, the substrate is supported by a stage portion so as to be movable in the X, Y, and θ directions, and a substrate backer is provided on the stage portion. On the sticking side of the ACF, a rotating body is mounted on the frame, and a plurality of holding parts for holding the divided ACF are provided on the outer peripheral surface of the rotating body. The rotating body can be raised and lowered and indexed and rotated. Therefore, the rotating body is rotated and lowered while moving the stage, and a pressing force is applied to the substrate stand, so that the ACF held on the holding part is attached to each part of the substrate where the electrode group is provided. . Since the substrate holder is provided on the table side, the substrate holder and the substrate are conveyed for a certain distance every time the rotary body attaches the ACF. Therefore, the substrate holder must have at least the entire length of the ACF attachment portion of the substrate.

In the case of a small board, the size of the board holder is also short, so even if there is some dimensional error or assembly error between the rotating body on the pressing side and the board holder, the ACF adhesion accuracy can be maintained at a high level. However, in the case of a large substrate, errors may accumulate between one end and the other end of the substrate stand. Then, the pressurizing force of the rotating body is not equal to the entire ACF, and pressurization deviation occurs, resulting in poor adhesion.

Contents of the invention

The present invention has been made in view of the above problems, and an object thereof is to apply a uniform pressure along the entire length of the substrate when ACF is pasted on the substrate.

In order to achieve the above objects, the ACF sticking device of the present invention sticks ACF to each electrode group on a substrate on which a plurality of electrode groups are formed, and the electrode group is a group of a plurality of electrodes, and is characterized in that it is supported by a substrate A table, a sticking mechanism including a half-cutting mechanism and a crimping head, and a conveying mechanism are composed; the above-mentioned substrate support table supports the above-mentioned substrate in a horizontal state; the above-mentioned sticking mechanism including a half-cutting mechanism and a crimping head is provided with a supply roller of the ACF tape, The above-mentioned half-cutting mechanism cuts the ACF tape sent out from the supply roller, keeping the hard paper tape continuous, and only cuts the ACF into the length to be pasted on each electrode group of the above-mentioned substrate; The ACF cut by the mechanism is crimped on the surface of the above-mentioned substrate; the above-mentioned conveying mechanism makes the above-mentioned pasting mechanism position and transport the above-mentioned crimping head to each ACF pasting position of the above-mentioned substrate, and the substrate is placed on the above-mentioned substrate supporting platform The above-mentioned crimping head is composed of a pressing blade and a supporting blade, and the above-mentioned supporting blade is arranged opposite to the above-mentioned substrate with the pressing blade, and supports the pressing force of the above-mentioned ACF applied to the above-mentioned substrate by the above-mentioned pressing blade, and these pressing blades and the supporting blade have at least the length of the sticking dimension of the ACF; the pressing blade and the supporting blade each have an elevating drive mechanism that independently drives toward and away from the substrate.

In this way, the ACF sticking apparatus is composed of a sticking mechanism and a transport mechanism that moves the sticking mechanism toward the arrangement direction of the electrode groups on the substrate and positions the sticking mechanism at each ACF sticking position. On the conveying mechanism, a lifting drive unit that lifts and drives the pasting mechanism can be provided. In addition, a half-cutting mechanism can be provided on the pasting mechanism, and the half-cutting mechanism can be displaced to an operating position and a retracted position. The elevating drive unit can elevate the sticking mechanism, so that when the half-cutting mechanism is arranged at the operating position, it can be set so as to avoid interference with the substrate. In addition, a forward and backward movement drive unit may be provided on the lift drive unit.

Therefore, in order to make the parts of the front and rear ACFs cut by the half-cutting mechanism the sticking object, the length dimension of the pressing blade and the supporting blade should be at least the sticking dimension of the ACF. However, the length dimensions of the pressing blade and the supporting blade are not limited to the length of the ACF to be pasted, and the pressing blade may be longer than the cut ACF tape. At this time, when the ACF is pasted, the excess length of the pressing blade and the supporting blade is arranged at the position where the pasting of the cardboard tape is completed. When the pressing blade is made longer than the bonding length of the ACF, it can be applied to several types of substrates having different electrode group lengths, or the same substrate, where the lengths of the electrode groups differ between the short side and the long side.

In the ACF tape, when the ACF constituting the adhesive layer is pasted on the substrate, it is necessary to align the position between the substrate and the pasting mechanism. In order to align the position, the substrate can be fixedly held, and the position of the pasting mechanism can be adjusted. A position adjustment mechanism may be provided on the side of the substrate support table that supports the substrate.

The pressing blade and supporting blade constituting the crimping head move up and down independently. The pressure blade exerts pressure on the ACF tape during crimping. The pressing blade and the supporting blade can be mounted on lifting blocks which are respectively driven by lifting. The two lifting blocks can be driven up and down by independent guide mechanisms respectively, or a common guide mechanism can be provided.

As mentioned above, the ACF sticking device is configured, and the ACF is used to mount semiconductor circuit elements on a substrate. The substrate on which the semiconductor circuit elements are mounted may be a printed circuit substrate, etc., but is more suitable for mounting a predetermined number of drive circuits on a substrate. Panels including flat panel displays such as liquid crystal displays, especially large panels.

Invention effect

As described above, when the ACF is pasted on the substrate, the ACF is pressed between the supporting blade and the pressing blade, and the ACF of the pasting length is pasted on the electrode group of the substrate. The pressure can effectively prevent poor adhesion.

Description of drawings

FIG. 1 is a plan view of essential parts showing a liquid crystal element as a substrate on which an ACF is pasted, and a driving circuit mounted on the substrate.

Fig. 2 is a front view showing a schematic structure of an ACF pasting machine.

FIG. 3 is a left side view of FIG. 2 .

FIG. 4 is a top view of FIG. 2 .

Fig. 5 is an explanatory view of the structure of the horizontal conveying rollers.

Fig. 6 is a side view showing the structure of the horizontal transport rollers.

Fig. 7 is an explanatory view of the structure of the cutting mechanism.

Fig. 8 is an enlarged front view of main parts of the ACF pasting machine showing the half-cut state of the ACF.

FIG. 9 is a left side view of FIG. 8 .

Fig. 10 is an enlarged front view of main parts of the ACF pasting machine showing a state where the pasting mechanism is lowered.

Fig. 11 is a left side view of Fig. 10 .

Fig. 12 is an enlarged front view of a main part of the ACF bonding machine showing a raised state of the supporting blade.

FIG. 13 is a left side view of FIG. 12 .

Fig. 14 is an enlarged front view of an essential part of an ACF bonding machine showing a state of crimping the ACF tape.

Fig. 15 is a left side view of Fig. 14 .

Fig. 16 is an explanatory view showing a state where the cardboard tape of the ACF tape is peeled off.

Fig. 17 is an enlarged front view of main parts of the ACF pasting machine, showing the dimensional relationship between the pressing blade and the ACF pasted by the pressing blade.

Detailed ways

Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 shows a liquid crystal panel and a driving circuit. The liquid crystal panel is an example of a substrate on which an ACF is pasted. The driving circuit is an example of a semiconductor circuit device mounted on the ACF. The driving circuit is composed of TCP mounted on the substrate by TAB. In addition, the substrate does not necessarily have to be a structure constituting a liquid crystal panel, and may be a substrate for other displays or other various printed circuit boards. In addition, what is mounted on the substrate is not limited to the drive circuit, and various semiconductor circuit devices electrically connected through the ACF can be used.

In FIG. 1, 1 is a liquid crystal panel, and the liquid crystal panel 1 is constituted by a lower substrate 2 and an upper substrate 3, both of which are formed of glass thin plates. Liquid crystal is sealed between the two substrates 2 and 3 . The lower substrate 2 protrudes from the upper substrate 3 by a predetermined width on at least two sides thereof, and a plurality of drive circuits 4 are mounted on the protruding portions 2a. The drive circuit 4 is formed by mounting an integrated circuit element 4b on a film substrate 4a.

On the protruding part 2a of the lower substrate 2, a predetermined number of electrodes are provided, and these electrodes are connected to the following wirings. . These electrodes, as indicated by reference numeral 5 in the figure, are formed in a group of a predetermined number of electrodes at each mounting portion of the drive circuit 4 . Alignment marks 6 a , 6 a are formed on both left and right sides of each electrode group 5 . Therefore, a blank area having a predetermined width, that is, a portion where no electrodes are provided, is formed between the adjacent electrode groups 5 , 5 . On the other hand, the drive circuit 4 is provided with a plurality of electrodes electrically connected to the electrodes constituting the electrode group 5 , and the electrode group connected to the electrode group 5 is denoted by reference numeral 7 . In addition, on the drive circuit 4, alignment marks 6b, 6b are also formed on the left and right sides of the electrode group 7. When the drive circuit 4 is mounted on the liquid crystal panel 1, these alignment marks are used as a reference to form the electrode group. Each electrode of 7 is aligned with each electrode constituting the electrode group 5 by adjusting the position.

The drive circuit 4 is mounted on the liquid crystal panel 1 via the ACF8. As is well known, the ACF 8 is formed by dispersing a plurality of fine conductive particles in an adhesive resin having an adhesive function, and the ACF 8 is heated and pressed between the drive circuit 4 and the liquid crystal panel 1 . In this way, the electrodes constituting the electrode group 5 and the electrodes constituting the electrode group 7 are electrically connected through the conductive particles, and the driving circuit 4 is fixed to the liquid crystal panel 1 by thermosetting the adhesive resin. Here, the ACF 8 having a length L is dividedly pasted at the position of each electrode group 5 provided on the protruding portion 2 a of the lower substrate 2 . In this way, the ACF 8 can be used without waste, and the pasted ACF 8 is almost completely covered by the drive circuit 4 .

2 to 4 show a schematic structure of a sticking mechanism for sticking the ACF 8 to the protruding portion 2 a of the lower substrate 2 . In these figures, 9 is a support base for maintaining the liquid crystal panel 1 in a horizontal state. The liquid crystal panel 1 is stably held on the support base 9 by, for example, a vacuum suction mechanism. Here, although the liquid crystal panel 1 is in contact with the support base 9 over a large area, the lower portion of the protruding portion 2a of the lower substrate 2 to which the ACF 8 is pasted is open. In order to align with the drive circuit 4 and the like, a position adjustment mechanism in the X, Y, and θ directions may be provided on the support base 9 .

Also, 10 is a sticking mechanism for sticking the ACF 8 to the liquid crystal panel 1. The sticking mechanism 10 has a mounting plate body provided in the vertical direction, and a supply roller 11 is detachably attached thereto. The ACF 8 is superimposed on the release layer of the cardboard tape 12 to constitute the ACF tape 13 , which is wound on the supply roll 11 . The ACF tape 13 is guided to run along a running path constituted by rollers 14 to 17 attached to the bonding mechanism 10 . 18 is a driving roller, which sandwiches the cardboard tape 12 pasted with the ACF 8 on the liquid crystal panel 1 and sends it to the discharge unit 19 .

The rollers 14 and 15 are guide rollers for feeding the ACF tape 13 , and the guide roller 15 is attached to the swing arm 20 . The swing arm 20 swings around the rotation shaft 21 . A driving mechanism (not shown) such as a motor is connected to the rotating shaft 21. When the swing arm 20 is swung in the arrow F direction, the sticking length is sent out from the supply drum 11 at least once, that is, the length L shown in FIG. 1 is sent out. ACF belt 13 is supplied between rollers 14,15. As a result, the reaction force acting when the ACF tape 13 is conveyed is always kept constant, and the resistance to the conveying force does not fluctuate due to the difference in the winding amount of the supply roller 11 .

As shown in Fig. 5 and Fig. 6, the rollers 16 and 17 are horizontal guide rollers, which guide the ACF tape 13 in the horizontal direction in its running path, and stipulate the length of ACF 8 pasted on the liquid crystal panel 1 at one time. The horizontal guide roller 17 specifies the sticking start position of the ACF8, and the horizontal guide roller 16 specifies the sticking end position of the ACF8, so that the sticking area of the ACF8 is set. As shown in FIG. 6, the horizontal guide rollers 16, 17 are formed with flange portions 16b, 17b on both sides of the cylindrical portions 16a, 17a, and collar portions 16b, 17b protrude from the cylindrical portions 16a, 17a. The height is about the same as or slightly larger than the thickness of the cardboard tape 12 in the ACF tape 13.

Therefore, between the horizontal guide rollers 16 and 17, the ACF8 is pasted on the liquid crystal panel 1, and then separated from the hard paper tape 12, and the hard paper tape 12 after the ACF8 has been peeled off is removed from the horizontal guide roller 17 downstream side. Recycle. A driving roller 18 is provided at a downstream side of the bonding area of the ACF 8 defined by the horizontal guide rollers 16 and 17 . The driving roller 18 has a driving roller 18a and a pinch roller 18b, and the cardboard tape 12 is nipped between the driving roller 18a and the pinching roller 18b. By driving and rotating the drive roller 18a, the ACF tape 12 of the length L can be fed out piece by piece.

As shown in Figure 3, sticking mechanism 10 is installed on the lifting driving part 22, and this lifting driving part 22 is installed on the forward and backward moving driving part 23, and the forward and backward moving driving part 23 is installed on the parallel moving driving part 24, and described parallel moving drive The portion 24 constitutes a transport mechanism. By means of these mechanisms, the sticking area of ACF8 specified between the horizontal guide rollers 16-17 (see Fig. 2) in the ACF belt 13 walking path can be adjusted in the up-down direction, that is, the Z-axis direction and the X-axis direction in the horizontal plane. (the direction perpendicular to the arrangement direction of the electrode group 5 ) and the Y-axis direction (the arrangement direction of the electrode group 5 ) are moved and positionally adjusted. On the other hand, the liquid crystal panel 1 is fixedly held on the support base 9 by vacuum suction.

Here, it is necessary to adjust the relative position of the ACF tape 13 between the horizontal guide rollers 16-17 and the electrode group 5 in the lower substrate 2, and the forward and backward movement driving part 23 moves the sticking area towards and away from the liquid crystal panel 1, and the parallel motion The driving unit 24 moves the sticking area toward the direction parallel to the arrangement direction of the electrode groups 5 in the liquid crystal panel 1, that is, the Y-axis direction, so that position adjustment can be performed on the sticking mechanism 10 side, but as described above, if If a position adjustment mechanism in the X, Y, and θ directions is provided on the support base 9, alignment with respect to the ACF belt 13 can also be performed on the support base 9 side.

The lift drive unit 22 has a tilt block 30 and an air cylinder 31 (or a motor) that moves the tilt block 30 in the front-rear direction. In addition, a slide member 32 that engages with an inclined surface of an inclined block 30 is connected to the sticking mechanism 10 . The slide member 32 has an inclined surface that coincides with the inclined block 30, and cannot be displaced except in the vertical direction by the regulating rod 33. Therefore, when the air cylinder 31 is driven, the sticking mechanism 10 is displaced in the vertical direction.

Next, the front-back drive unit 23 moves the base 34 on which the tilting block 30 is attached back and forth. The reciprocating movement of the pedestal 34 is performed by a drive mechanism 35 composed of an air cylinder, a motor, and the like. The parallel motion drive unit 24 has a transport table 36 on which a base 34 and its drive mechanism 35 are mounted. When the ball screw 37 constituting the ball screw transport mechanism is driven by the motor 38 to rotate, the transport table 36 can move the sticking mechanism 10 parallel to the arrangement direction of the electrode groups 5 in the liquid crystal panel 1 .

In the running path of the ACF tape 13 installed on the sticking mechanism 10, as shown in FIG. It is installed on the surface of the pasting mechanism 10 so as to reciprocate in a direction. As shown in Figure 1, the half-cutting mechanism 40 has a cutter 41 and a cutter support 42, and the cutter 41, as shown by the arrow in the figure, can approach and leave the cutter support 42 with the axis 43 as the center. turn. The state of leaving the cutter support 42 is maintained by the elastic force of the spring 44 constantly acting on the cutter 41 . When the pushing roller 46 arranged on the air cylinder 45 pushes the cutter 41 toward the direction against the spring 44 , the cutter 41 swings and displaces toward the direction of approaching the cutter support member 42 . At the position where the cutter 41 is closest to the cutter support 42, a small space is formed therebetween which is the same as or slightly smaller than the thickness of the cardboard strip 12 of the ACF belt 13. In this way, only half-cutting of ACF8 can be performed.

In order to stick the ACF 8 to the protruding portion 2 a of the lower substrate 2 , the ACF tape 13 is pressed against the surface of the lower substrate 2 at a position between the horizontal guide rollers 16 and 17 with a predetermined pressure. For this reason, as shown in FIGS. 8 and 9 , a crimping head 50 is provided on the pasting mechanism 10 . Here, the liquid crystal panel 1 is placed on the support base 9, but the protruding portion 2a of the lower substrate 2 protrudes from the support base 9, and the crimping head 50 pinches the protruding portion from above and below.

The crimping head 50 is composed of a pressing blade 51 and a supporting blade 52 . These press blades 51 and support blades 52 are attached to lifting blocks 53 and 54, respectively. These elevating blocks 53 and 54 are displaceable in the vertical direction along a pair of guide rails 55 provided on the sticking mechanism 10 . These press blades 51 and support blades 52 are arranged vertically with the liquid crystal panel 1 in between, and are formed to have the same length. The press blade 51 is arranged at a position above the ACF belt 13 which is guided between the horizontal guide rollers 16 and 17 and runs in the horizontal direction.

The lifting block 54 to which the support blade 52 is mounted is raised and lowered with a predetermined stroke by means of an air cylinder 56 . That is, when the air cylinder 56 is brought into the contracted state, the support blade 52 descends and is disposed at a position below the liquid crystal panel 1 . When the air cylinder 56 is extended, the support blade 52 is in contact with the lower surface of the liquid crystal panel 1 . On the other hand, a pressing mechanism 57 is connected to the lifting block 53 on which the pressing blade 51 is attached. The illustrated pressurizing mechanism 57 has a conveyance screw 57a driven by a motor, and constitutes a so-called jack. The pressurizing mechanism 57 applies a predetermined pressurizing force to the liquid crystal panel 1 supported by the support blade 52 from above by moving the lift block 53 connected to the pressurizing blade 51 up and down along the guide rail 55 . The parallelism between the press blade 51 and the support blade 52 is accurately maintained. In addition, the air cylinder 56 supporting the support blade 52 is not disturbed by the pressing force of the pressing mechanism 57 at least at the ascending stroke end position, and a pressure capable of maintaining the extended state can be introduced.

In the pressure blade 51 constituting the pressure head 50, or in both the pressure blade 51 and the support blade 52, a heater not shown in the figure is built in, so that the pressure head 50 thermocompression-bonds the ACF tape 13 to the liquid crystal panel. 1 on. The degree of heating is relatively low, which is the degree to soften the adhesive resin of ACF8 so that it does not lose its adhesive force. In addition, the width dimension of the pressure blade 51 and the support blade 52 constituting the crimping head 50 can sufficiently cover the width of the ACF tape 13, and the dimension in the longitudinal direction has at least the sticking length L of the ACF8.

As described above, the supply roller 11 , the running path of the ACF tape 13 supplied from the supply roller 11 , the half-cutting mechanism 40 , and the crimping head 50 are attached to the bonding mechanism 10 . Using this ACF pasting device, the ACF 8 necessary for mounting the drive circuit 4 in a TAB manner is pasted onto a predetermined number of electrode groups 5 formed on the protruding portion 2a of the lower substrate 2 of the liquid crystal panel 1. superior.

The liquid crystal panel 1 to which the ACF 8 is pasted is sucked and held at a predetermined position on the support base 9 in a horizontal state. In this state, in the lower substrate 2 of the liquid crystal panel 1 , the extended portion 2 a shown in FIG. 4 protrudes from the support base 9 , and a predetermined number of drive circuits 4 are mounted on the extended portion 2 a. Therefore, the sticking mechanism 10 to which the sticking device is mounted via the ball screw 37 is conveyed step by step in the direction of the arrow at the interval P shown in FIG. 1 .

The ACF 8 having a length L is sequentially pasted on the liquid crystal panel 1 , and for this purpose, the transport table 36 constituting the parallel motion driving unit 24 is driven, and the pasting mechanism 10 is displaced to a predetermined pasting area. At this time, as shown by the arrows in FIGS. 8 and 9 , the lift drive unit 22 keeps the pasting mechanism 10 at the raised position. The pressing blade 51 constituting the crimping head 50 is held at the raised position, and the supporting blade 52 is held at the lowered position. In this way, these pressing blades 51 and supporting blades 52 maintain a non-contact state with the liquid crystal panel 1, and the pasting mechanism 10 can move flexibly without damaging the liquid crystal panel 1 or the like. In addition, since the ACF tape 13 is separated from the liquid crystal panel 1, even if the half-cutting mechanism 40 is protruded forward from the surface of the bonding mechanism 10, it does not interfere with the liquid crystal panel 1. Therefore, half cutting of the ACF tape 13 can be performed. After this half-cutting is performed, the half-cut position of the ACF tape 13 is the pasting end position, and the end portion pasted with the previous ACF 8 is the pasting start position. That is, the horizontal guide roller 17 is arranged in front of the sticking start position, and the horizontal guide roller 16 is arranged in a rear position of the sticking end position.

Then, after the half-cutting mechanism 40 is withdrawn, as shown by arrows in FIGS. It is arranged at a position close to the surface of the lower substrate 2 of the liquid crystal panel 1 . Then, the air cylinder 56 is operated to raise the lifting block 54, and as shown in FIGS. Here, the length of the support blade 52 does not reach the entire length of the liquid crystal panel 1, and is limited to a position corresponding to the region where the ACF 8 is pasted in one operation. Next, as shown by the arrows in FIGS. 14 and 15 , the pressing mechanism 57 is operated to lower the pressing blade 51 to push the cardboard tape 12 of the ACF tape 13 , so that the ACF 8 is crimped on the lower substrate 2 . At the time of this crimping, the corner portion of the pressing blade 51 on the proximal end side coincides with the sticking terminal position of the ACF cut by the half-cutting mechanism 40 .

The conveying screw 57a constituting the pressurizing mechanism 57 is driven to act a predetermined pressurizing force on the liquid crystal panel 1 . Here, the lower substrate 2 of the liquid crystal panel 1 is made of a thin glass plate, which allows a certain degree of deformation, and has the same length, and is sandwiched between the pressure blade 51 and the support blade 52 maintaining the correct parallelism. Therefore, during this clamping, the clamped portion of the liquid crystal panel 1 follows the shape of the crimping head 50 composed of the pressure blade 51 and the support blade 52 . Since the pressure blade 51 and the supporting blade 52 include the sticking starting end position to the end position of the ACF tape 13, uniform pressure is applied to the entire joint portion of the ACF tape 13 that is in contact with the pressure blade 51. pressure. In addition, since the position of the end of the pressing blade 51 coincides with the half-cut pasting terminal position, no pressing force acts on the base end side of the half-cut pasting terminal position where the ACF 8 exists. In addition, after the pasting of the ACF8 is completed last time, the ACF8 does not exist, and there is no problem even if the pressing blade 51 and the supporting blade 52 protrude on the front side of the sticking start end position of the cardboard tape 12.

When the ACF 8 is crimped to the lower substrate 2 , the pressure applied to the ACF tape 13 by the crimp head 50 is released. Next, the air cylinder 56 is driven to displace the support blade 52 to the lowered position. Then, the lifting driving part 22 is raised, and at this time, as shown by the arrow in FIG. Action, like this, hard paper band 12 is peeled off with the mode that is torn from ACF8.

Through the above operations, the attachment of the ACF 8 to one electrode group 5 on the protruding portion 2 a of the lower substrate 2 is completed. Keeping the pasting mechanism 10 at the raised position, the drive roller 18 is operated to draw the ACF tape 13 out from the supply drum 11 and send it out piece by piece. Then, the parallel motion drive unit 24 is operated to move the pasting mechanism 10 for a certain length, that is, the length indicated by the interval P in FIG. 1 . The substrate support table 9 holding the liquid crystal panel 1 does not move. In this state, the same operation as described above is repeated, and the ACF8 is attached to the electrode group 5 sequentially. That is, for each electrode group 5 arranged on the liquid crystal panel 1 , the length L is roughly limited, and the ACF 8 is press-bonded, and this operation is repeated sequentially.

Here, the crimping head 50 is composed of a pressing blade 51 and a supporting blade 52, and these pressing blades 51 and supporting blades 52 are driven up and down by elevating blocks 53 and 54, respectively. These lifting blocks 53, 54 move up and down along the guide rail 55 provided on the pasting mechanism 10, and clamp the lower substrate 2 from up and down under the state that the pressing blade 51 and the supporting blade 52 always maintain the correct parallelism. When the electrode group 5 is formed at n positions on the liquid crystal panel 1, the distance (n·p) from the first ACF8 sticking position to the last ACF8 sticking position is also separated, but all press the ACF8 under approximately the same conditions. . Therefore, not only a small-sized liquid crystal panel, but also a large liquid crystal panel 1, the ACF 8 can be bonded to all the electrode groups 5 with equal pressure, and no crimping failure will occur. In addition, although the two lifting blocks 53 , 54 are guided by the same guide rail 55 , it is not necessary to share one guide rail 55 .

Here, when the ACF8 is pasted on the protruding portion 2a of the lower substrate 2 of the liquid crystal panel 1, in the running path of the ACF tape 13, the position of the proximal side end of the pressing blade must be the same as that of the half-cut pasted portion. The terminal position is the same, but it is not necessary to make the pressure blade be at the initial position of pasting. That is, the pressing blade 151 and the supporting blade 152 shown in FIG. 17 may extend forward by a length α beyond the position of the sticking start end of the ACF 8 . Here, on the front side of the sticking start position, after the pasting of the ACF8 is completed, the ACF8 does not exist, and only the cardboard tape 12 remains. Therefore, there is no problem even if the portion is sandwiched between the pressing blade 151 and the supporting blade 152 . Since there is no ACF8 in this part, the uniformity of pressurization of the ACF8 on the sticking part will not be impaired.

On the liquid crystal panel 1 , the driving circuit 4 is mounted on the short side and the long side, and the electrode group on the short side and the electrode group on the long side may have different overall lengths. For this reason, the full length of the pressing blade 151 and the support blade 152 is made longer than the length of the short-side electrode group and the long-side electrode group, so that when the ACF8 is attached to the short side, and When gluing ACF8 to the long side, the same gluing mechanism can be used. In addition, it can also be applied when affixing ACF to liquid crystal panels with different screen sizes.

Claims (4)

1. A kind of ACF sticking device, to each electrode group on the substrate that is formed with a plurality of electrode groups sticks ACF respectively, and described electrode group is with a plurality of electrodes as a group, it is characterized in that, by substrate supporting platform, comprises half The cutting mechanism and the sticking mechanism and the conveying mechanism of the crimping head are composed; The above-mentioned substrate support table supports the above-mentioned substrate in a horizontal state; The above-mentioned pasting mechanism comprising a half-cutting mechanism and a crimping head is provided with a supply roller of the ACF tape, and the above-mentioned half-cutting mechanism keeps the ACF tape sent out from the supply roller, making the cardboard tape continuous, and only cuts the ACF into required parts. The length of each electrode group pasted on the above-mentioned substrate; the above-mentioned crimping head crimps the ACF cut off by the half-cutting mechanism on the surface of the above-mentioned substrate; The conveying mechanism enables the pasting mechanism to position and transport the crimping head to each ACF pasting position of the substrate, and the substrate is placed on the substrate supporting platform; The pressure head is composed of a pressure blade and a support blade. The support blade is disposed opposite to the pressure blade with the substrate sandwiched therebetween, and supports the pressure applied by the pressure blade to the substrate by the ACF. These pressure blades and a supporting edge having at least the length of the sticking dimension of the above-mentioned ACF; The pressing blade and the supporting blade each have a lift drive mechanism independently driven in a direction approaching or separating from the substrate. 2. The ACF sticking device according to claim 1, wherein a lifting drive unit for vertically moving the sticking mechanism is provided on the conveying mechanism. 3. The ACF pasting device according to claim 1, wherein the above-mentioned pressing blade and supporting blade are respectively mounted on lifting blocks, and the two lifting blocks can move up and down independently along a common guide rail. 4. The ACF pasting device according to claim 1, wherein the length of contact between the above-mentioned pressing blade and the above-mentioned ACF tape is from the half-cut position of the above-mentioned ACF to the front of the conveying direction, that is, the pasting has been completed and only The length of the part where the cardboard tape is left.

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