CN101292368A - Light-emitting device mounting substrate, light-emitting device mounting component, and planar light source device - Google Patents

Abstract

A luminous device mounting substrate, a luminous device mounting component and a planar light source. In the luminous device mounting substrate, plural kinds of luminous devices with different luminance colors are mounted, is characterized by comprising a plurality of luminous device mounting portions each of which is for enclosing a luminous device corresponding to a luminance color, wherein the luminous device mounting portion has a configuration in which a plurality of luminous devices can be mounted on each luminous device mounting portion.

Description

Light-emitting device mounting substrate, light-emitting device mounting component, and planar light source device

Cross References to Related Applications

This application is an application filed under 35 U.S.C. §111(a) filed on October 31, 2005 pursuant to 35 U.S.C. §111(b) as required by 35 U.S.C. §119(e)(1) Interest on the filing date of provisional application 60/731,494.

technical field

The present invention relates to a light-emitting device mounting substrate, a light-emitting device mounting assembly, and a planar light source device using them to mount a light-emitting device for lighting and lighting for liquid crystal backlights body.

More particularly, the present invention relates to a light emitting device mounting substrate for mounting light emitting devices with a plurality of different light emitting colors, a light emitting device mounting assembly, and a planar light source device using them. device, the light emitting device can be used as a white light emitter.

Background technique

In recent years, the luminous efficiency of light-emitting devices has been greatly improved, and the application of light-emitting devices to lighting is being studied.

Especially in the case of using a light-emitting diode (hereinafter also referred to as LED), which is one of solid-state light-emitting devices, as a backlight illuminant (surface light source) for a liquid crystal display, very good color reproducibility and high-speed response can be achieved, and thus it is expected to obtain High quality display.

Traditionally, the mainstream of this backlight illuminant for LCD is the so-called edge-light type, in which the cold cathode tube as the illuminant is located on the edge face of the chassis to reduce the thickness and power consumption of the device.

However, in recent years, liquid crystal displays are required to be larger in size, and the edge-emitting type has limitations in improving luminance and uniformity of luminance.

Therefore, the use of direct emission type light should be studied for large-size liquid crystal displays.

Furthermore, due to the increasing demand for improved display quality, very good color reproducibility cannot be achieved when using white light emitting diodes with light emission from blue light emitting diodes and light emission from yellow light emitting phosphors as complementary colors.

Against this background, recently, a so-called three-in-one LED lamp has been developed, in which light-emitting diode (LED) chips of the three primary colors of red, green and blue are placed in one module, and the three colors are mixed to produce white light (For example, see Non-Patent Document 1 (web site of STANLEY ELECTRIC CO., LTD.)).

As shown in FIG. 9 , the three-in-one component 100 has an outer shape of about several square millimeters, and has a configuration in which red-emitting LED chips 102 and green-emitting LED chips of about 0.35 square millimeters each 104. The blue light-emitting LED chips 106 are respectively placed in the center of the assembly at positions corresponding to the vertices of an equilateral triangle.

The advantage of the three-in-one LED lamp (luminous body) is that white light is easily mixed from three colors. Therefore, the three-in-one assembly 100 described above is used.

Non-Patent Document 1: Website of STANLEY ELECTRIC CO., LTD., [Online], Internet <http://www.stanley-components.com>

Contents of the invention

Problem to be solved by the present invention

However, in order to obtain good white color by mixing colors, the three LED chips 102, 104 and 106 must be placed adjacent to each other, which has the disadvantage of not being easy to dissipate heat.

This problem is particularly acute when using so-called high-power LEDs with an LED chip size of 1 square millimeter or more.

Therefore, each three-in-one assembly 100 having different distances between LED chips must be prepared according to the size of the LED chips used.

In the case of using a three-in-one component as a backlight emitter for an LCD display, if the screen size becomes larger, the mixing of the three colors is easier than in the case of a small-sized screen, even if the distance between the LED chips of the three colors In the case of an increase, white light emitters can also be obtained on the backlit surface.

Therefore, in order to effectively utilize this condition, it is necessary to separately manufacture the three-in-one assembly 100 with a large distance between LED chips.

In addition, in the conventional 3-in-1 LED lamp, the LED devices of the three colors are very close to each other in a 3-in-1 assembly 100, so the power is low and the brightness is low. In order to make the brightness look high, it is necessary to arrange a plurality of three-in-one modules 100 in an array type.

An object of the present invention is to provide a light-emitting device installation assembly, which includes a light-emitting body with different distances between light-emitting devices in one assembly. Another object of the present invention is to provide a light emitting device mounting substrate, a light emitting device mounting assembly and a planar light source using them which can reduce the production and mounting costs of a light emitting device mounting assembly.

way of solving the problem

In order to solve the above-mentioned problems, the present inventors found a light-emitting device mounting substrate, a light-emitting device mounting assembly, and a planar light source using them.

More specifically, the present invention relates to, for example, the following Examples (1) to (16).

(1) a light emitting device mounting substrate in which a plurality of light emitting devices with different light emitting colors are mounted, comprising a plurality of light emitting device mounting portions each for housing a light emitting device corresponding to one light emitting color, Wherein, the light emitting device mounting portion has a configuration, in which a plurality of light emitting devices can be mounted on each light emitting device mounting portion.

(2) The light emitting device mounting substrate according to the above embodiment (1), wherein the number of light emitting device mounting portions arranged is equal to or greater than the number of different light emitting colors of the light emitting devices to be mounted.

(3) The light-emitting-device mounting substrate according to the above-mentioned embodiment (1) or (2), wherein the light-emitting-device mounting portions are provided on the light-emitting-device mounting substrate at a constant pitch.

(4) The light-emitting device mounting substrate according to the above-mentioned embodiment (2), wherein a plurality of light-emitting-device mounting portions extend from a fixed point on the light-emitting device substrate to the circumference of a circle in which the fixed The point is the center, and the plurality of light emitting device mounting parts are arranged at intervals of a given angle.

(5) According to the light-emitting device mounting substrate described in the above-mentioned embodiment (2), each light-emitting device mounting portion is arranged such that the sides of an equilateral polygon with the fixed point of the light-emitting device mounting substrate as the center of gravity and The straight lines along the longitudinal direction of the light emitting device mounting portion are almost coincident.

(6) The substrate for mounting a light-emitting device according to the above-mentioned embodiment (4) or (5), wherein the fixed point is the center of the substrate for mounting a light-emitting device.

(7) The light-emitting device mounting substrate according to the above-mentioned embodiment (4) or (5), further comprising a plurality of fixing points.

(8) The light-emitting device mounting substrate according to any one of the above-mentioned embodiments (1)-(7), wherein the position where the light-emitting device mounting portion is provided on the light-emitting device mounting substrate further includes a protrusion, wherein, The light emitting device installation part is disposed on the protrusion.

(9) The light emitting device mounting substrate according to the above embodiment (8), wherein the protrusion is made of the same material as that of the light emitting device mounting substrate.

(10) The substrate for mounting a light emitting device according to any one of the above embodiments (1) to (9), wherein the substrate for mounting a light emitting device is a metal base substrate.

(11) The light emitting device mounting substrate according to any one of the above embodiments (1) to (10), wherein the light emitting device is a light emitting diode (LED).

(12) The light emitting device mounting substrate according to the above embodiment (11), wherein the light emitting diode (LED) is a light emitting diode (LED) chip.

(13) The light emitting device mounting substrate according to the above embodiment (12), further comprising substrate electrode pads connected to the cathode and anode of the light emitting diode (LED) chip by wire bonding on both sides of the light emitting device mounting portion.

(14) A light-emitting device mounting assembly, comprising a light reflector at a position corresponding to the light-emitting device mounting part on the light-emitting device mounting substrate according to any one of the above-mentioned embodiments (1)-(13) An opening is provided on the top.

(15) The light emitting device mounting assembly according to the above embodiment (14), wherein the opening portion is embedded with a sealing resin such that the top of the opening portion is flush with the surface of the light reflector.

(16) A planar light source device, wherein the light emitting device mounting assembly according to the above embodiment (14) or (15) is installed on the bottom surface of the chassis.

Effect of the present invention

The light-emitting device-mounting substrate according to the present invention has a configuration in which light-emitting devices having different light-emitting colors can be mounted while changing the distance between adjacent light-emitting devices. Therefore, since light-emitting devices of different sizes or different amounts of heat can be mounted in one light-emitting-device mounting assembly, it is not necessary to design and produce many kinds of light-emitting-device mounting substrates and light-emitting-device mounting assemblies, thereby reducing costs.

In addition, it is also possible to mount a plurality of sets of light emitting devices in one light emitting device mounting substrate or one light emitting device mounting assembly, thereby making the brightness look high.

Therefore, a high-performance planar light source device can be obtained at low cost by using the light-emitting device mounting assembly of the present invention.

Description of drawings

FIG. 1 is a schematic top view of a first embodiment of a substrate for mounting a light-emitting device of the present invention;

Fig. 2 is a schematic cross-sectional view of a light-emitting device mounting substrate taken along line X-X in Fig. 1;

Fig. 3 is a schematic top view of an assembly in which a group of LED chips are mounted on a light emitting device mounting substrate shown in Fig. 1;

Fig. 4 is a schematic cross-sectional view of the assembly shown in Fig. 3;

Fig. 5 is a schematic top view of an assembly, in which three groups of LED chips are mounted on a light emitting device mounting substrate shown in Fig. 1;

Fig. 6 is a schematic cross-sectional view of the assembly shown in Fig. 5;

Fig. 7 is a schematic plan view similar to Fig. 2 of the second embodiment of the light-emitting device mounting substrate of the present invention;

Fig. 8 is a schematic top view of a third embodiment of a light-emitting device mounting substrate of the present invention; and

Fig. 9 is a schematic top view of a conventional three-in-one assembly.

Detailed ways

An embodiment (example) of the present invention will be described in detail below in conjunction with the accompanying drawings.

FIG. 1 is a top view of a first embodiment of a substrate for mounting a light-emitting device of the present invention. Fig. 2 is a cross-sectional view of the light-emitting device mounting substrate taken along line X-X in Fig. 1 .

In the configuration of the embodiment shown in FIG. 1, a red light emitting LED chip R, a green light emitting LED chip G and a blue light emitting LED chip B are used to mount a light emitting device from a light emitting device on a substrate 1. From the fixed point O to the circumference centered on the fixed point O, there are light emitting device mounting parts 10 extending in three directions, and three LED chips R, G and B can be respectively mounted on each light emitting device mounting part 10 .

The entire configuration described above is referred to as a mounted substrate unit 6 .

More specifically, the mounting substrate unit 6 has a configuration in which, using the center O on the light emitting device mounting substrate 1 as a base point, the central plane extending through the three light emitting device mounting portions 10 in the longitudinal direction Among the straight lines, the included angle between two straight lines passing through the central planes of the adjacent light emitting device installation parts 10 is about 120° ((360/3)°).

About 120° means that it does not have to be strictly 120°, but a slight difference is allowed. Preferably, the difference is within 1/10 of the included angle to be formed.

In the following description, a suffix numeral is added to the red-emitting LED chip R, the green-emitting LED chip G, and the blue-emitting LED chip B to distinguish a plurality of LED chips.

More specifically, the LED chips R1, G1, and B1 can be mounted at a distance d1 away from the center O on the light emitting device mounting substrate 1, and the LED chips R2, G2, and B2 can be mounted at a distance from the center O on the light emitting device mounting substrate 1. At a distance d2, the LED chips R3, G3, and B3 may be mounted at a distance d3 from the center O on the substrate 1 on which the light-emitting device is mounted.

That is, the present invention can be used in three configurations with different distances between LED chips.

In the embodiment shown in FIG. 1, d1 is smaller than d2, and d2 is smaller than d3.

The LED chip is bonded to a metal substrate with good thermal conductivity or copper foil or aluminum foil used as the substrate through paste or heat dissipation grease, so that the LED chip can dissipate heat well.

Both sides of each light-emitting device mounting portion 10 on the light-emitting device mounting substrate 1 are provided with substrate electrode sheets (anode A and cathode) electrically connected to electrodes (anode and cathode) of LED chips (not shown) by wire bonding. C).

The electrode pads RA, RC, GA, GC, BA and BC of each color are electrically connected to the substrate lead 3 to supply power to the electrode pads.

As shown in Figure 2, on the surface of the light-emitting device mounting substrate 1, except for the area where the LED chip is installed, an insulating layer 2 is formed, and substrate leads made of copper or similar materials are formed on the insulating layer 2 3. On the substrate lead 3, the insulating layer 2 is also formed except for the substrate electrode pad region so that the surface of the substrate electrode pad is almost flush with the surface of the insulating layer 2, although this is not shown in the figure.

As described above, the electrodes of the LED chip and the substrate electrode pads are connected to each other by wire bonding (not shown).

In the case of using gold wires as bonding wires, a gold-plated layer is formed on the electrode surface of the LED chip and the surface of the substrate electrode pad to obtain good connection.

3 and 4 are schematic top views of a light-emitting device mounting assembly 12 in which a group of LED chips R1, G1 and B1 are mounted on the light-emitting device mounting substrate 1 (mounting substrate unit 6) only at a distance d1 from the center O. and schematic cross-sections.

The light emitting device mounting assembly 12 shown in FIG. 3 only includes LED chips R1, G1 and B1, and a light reflector 4 with an opening is arranged on the light emitting device mounting substrate 1 (mounting substrate unit 6), so that the light reflector Light emitted from the LED chip is efficiently reflected upward from the light emitting device mounting substrate 1 by covering the periphery of the LED chip.

The reflector 4 is preferably bonded to the surface of the mounting substrate unit 6 by adhesive.

Therefore, in the light-emitting device mounting assembly 12 shown in FIG. layout.

Wire bonding interconnects electrode pads (not shown) mounted on the LED chips R1, G1, and B1 with their surrounding substrate electrode pads.

In the case of using small-sized LED chips as shown in FIG. 3, LED chips of various colors can be adjacently mounted at a small distance from the center O of the substrate to advantageously uniform the chromaticity.

The larger the size of the LED chip, the greater the amount of heat radiation accompanying light emission.

Therefore, when a large-sized LED chip is used, the LED chip can be mounted on the light emitting device mounting substrate 1 (mounting substrate unit 6 ) at a position far from the center O.

As described above, according to the size of the LED chip and the amount of heat radiation, the mounting position of the LED chip can be changed in a light emitting device mounting assembly.

The distance between the substrate electrode (anode and cathode) sheets is larger than the width of the formed light emitting device area so that the largest LED chip to be used can be mounted.

In the light emitting device mounting assembly 12 shown in FIGS. 5 and 6 , LED chips are mounted on the light emitting device mounting substrate 1 (mounting substrate unit 6 ) at distances d1, d2 and d3 from the center O.

By using the above configuration, the brightness of the LED lamp can be increased.

In this case, the light reflector 4 provided with the circular opening portion for efficiently reflecting upward from the light emitting device mounting substrate 1 the light emitted from the LED chip is arranged so that the light reflector covers the distance from the mounting substrate unit 6. The center O of the substrate is outside of the distance d3.

Wire bonding interconnects the electrode pads (not shown) mounted on the LED chips R1, G1, B1, R2, G2, B2, R3, G3 and B3 with their surrounding substrate electrode pads.

Preferably, LED chips with the same light emitting color are mounted on one light emitting device mounting portion 10 . More specifically, it is preferable to mount LED chips R1, R2 and R3 on the first light emitting device mounting portion, mount LED chips G1, G2 and G3 on the second light emitting device mounting portion, and mount LED chips on the third light emitting device mounting portion. Chips B1, B2 and B3, electrode pads of LED chips with the same luminescent color are connected to a single electrode pad arranged on both sides of the light emitting device mounting portion by wire bonding.

Even when the shapes of the respective LED chips are the same, the driving current differs depending on the light emission color. Therefore, when LED chips having the same light emitting color are mounted on one light emitting device mounting portion 10 , it is easy to collectively control the LED chips.

However, the present invention may also include configurations other than those described above.

Although the material of the light reflector 4 to be used is not particularly limited, it is preferable to use a material having a high reflectivity such as an aluminum material.

The inner surface 5 of the opening portion of the reflector 4 is tapered (inclined) and serves to efficiently reflect light emitted from the LED chip upward from the light emitting device mounting substrate 1 (mounting substrate unit 6 ). The angle α of the extension of the inner surface 5 is preferably 90°-120°.

The opening of the light reflector 4 is embedded with a sealing resin 7 such as silicone resin so that the top of the opening is almost flush with the upper surface of the light reflector 4, thereby protecting the bonding wires. "Nearly flush" means that the two upper surfaces do not have to be strictly flush, but a small amount of irregularity and some extrinsic waviness are allowed.

Although in the light-emitting device mounting assembly 12 shown in FIG. The LED chip can be mounted only at the distances d1 and d2, d1 and d3, or d2 and d3 from the center O on the light emitting device mounting substrate 1 (mounting substrate unit 6).

Although in this embodiment, the light emitting device mounting parts are arranged at three different positions, the present invention is not limited to this embodiment, and the light emitting device mounting parts 10 may also be arranged at four or more positions. Furthermore, although in this embodiment, each light emitting device mounting portion is formed to have substantially the same width from the center of the substrate in the direction of a circle centered on the center of the substrate, each light emitting device mounting portion may also be formed such that The width becomes wider as the light emitting device mounting portion is closer to the circumference.

Furthermore, although up to three LED chips can be mounted on one light emitting device mounting portion 10 in this embodiment, the present invention is not limited to this embodiment. The mounting positions of the LED chips of each color and the number of mountable LED chips can be appropriately selected, and can be changed according to the light emitting device mounting portion.

Fig. 7 is a schematic plan view showing a light emitting device mounting substrate 1 according to a second embodiment of the present invention.

The configuration of the light emitting device mounting substrate 1 shown in FIG. 7 is basically the same as that of the light emitting device mounting substrate 1 according to the first embodiment shown in FIG. 2 . Therefore, the same components as those shown in FIG. 2 are denoted by the same reference numerals, and no detailed description of the same elements will be given here.

The difference from the first embodiment above is that a protrusion 8 is formed on the metal substrate 1 in the area where the LED chip is mounted.

The protrusion 8 is made of metal with good thermal conductivity such as copper and aluminum or ceramic material such as aluminum nitride, preferably made of the same material as the metal substrate, so as to dissipate the heat of the LED chip through the protrusion 8 .

In this embodiment, first insulating layer 2 is formed such that the surface of protrusion 8 is almost flush with the surface of first insulating layer 2 , and substrate lead 3 is formed on first insulating layer 2 .

In addition, the second insulating layer 2' is formed on the substrate lead 3 except for the substrate electrode pad so that the surface of the substrate electrode pad is almost flush with the surface of the second insulating layer 2'.

A white resist is preferably used as the second insulating layer 2' because the light emitted from the LED chip can be effectively reflected upward from the light emitting device mounting substrate 1.

A light reflector (not shown) is arranged in the area where the second insulating layer 2' and the substrate electrode sheet are located.

Since the surface of the second insulating layer 2' is almost flush with the surface of the region where the substrate electrode sheet is located, there is almost no gap between these surfaces and the surface of the facing reflector (not shown), thereby obtaining a good bonding.

Fig. 8 is a plan view showing a light emitting device mounting substrate 1 according to a third embodiment of the present invention.

The configuration of the light emitting device mounting substrate 1 shown in FIG. 8 is basically the same as that of the light emitting device mounting substrate 1 according to the first embodiment shown in FIG. 1 . Therefore, the same parts as those shown in FIG. 1 are denoted by the same reference numerals, and no detailed description of the same elements will be given.

FIG. 8 shows only the LED chip mounting area and the substrate electrode sheet in a schematic top view. This embodiment also explains the case where LED chips of three colors are used.

The sides of the equilateral triangle with the center O such as the fixed point of the light emitting device mounting substrate 1 as the center of gravity almost coincide with the straight line passing through the center plane along the longitudinal direction of each light emitting device mounting part 10. In each light emitting device mounting part, three The LED chip is mounted between a pair of opposing substrate electrode pads. "Nearly coincident" means that it does not have to be strictly coincident, but slight inclinations and deviations are allowed.

More specifically, the LED chips R4, G4 and B4 can be mounted on the light emitting device mounting substrate 1 at a distance d4 from the center O, the LED chips R5, G5 and B5 can be mounted at a distance d5 from the center O, and the LED chips R6, G6 and B6 can be installed at a distance d6 from the center O.

That is, the present invention can be used in three configurations with different distances between LED chips.

In the embodiment shown in FIG. 8, d4 is smaller than d5, and d5 is smaller than d6.

Similar to the first embodiment, LED chips may be mounted only on one set of LED chip mounting regions, or on two or three sets of LED chip mounting regions.

In addition, the mounting position of the LED chip of each color and the number of LED chips to be mounted may be changed according to the light emitting device mounting portion.

Although LED chips of three colors are used in the first to third embodiments described above, LED chips of four or more colors may be used.

When four-color LED chips are used, olive is preferably used as the fourth color because it plays a role in color development.

When using n kinds (n is equal to or greater than 4) colors in the configuration similar to the first and second embodiments, a plurality of LED chips can be placed on the light emitting device mounting substrate 1 in n directions from the center O Installation (the angle between two adjacent straight lines in the n direction is about (360/n)°).

More specifically, when four colors are used, the included angle between two straight lines passing through the central planes of adjacent light emitting device mounting parts is about 90°.

When n kinds (n is equal to or greater than 4) colors are used in a configuration similar to the third embodiment, a light emitting device mounting portion on which a plurality of LED chips mounted to emit light can be arranged. The center O on the device mounting substrate 1 is each side of an equilateral polygon having n sides with the center of gravity.

Although the number of light emitting colors is equal to the number of light emitting device regions in the above-described embodiments, the number of light emitting device regions may be greater than the number of light emitting colors.

For example, for the three colors of R, G and B, one light emitting device area can be arranged for R, two light emitting device areas for G, and one light emitting device area for B, that is, the number of light emitting device areas is four.

At this time, the number of regions of the light emitting device and the configuration of the electrode sheets may be the same as those of the four colors in the above-mentioned first to third embodiments.

As for the metal substrate used in the first to third embodiments described above, it is preferable to use a printed wiring board including a metal plate material having good thermal conductivity as the base.

Although the material and manufacturing method of the metal substrate are not particularly limited, conventional materials and conventional manufacturing processes for printed circuit boards can be directly applied.

This embodiment is fabricated by using a copper-clad laminate in which glass epoxy is laminated on the surface of the copper plate as an insulating layer, the copper foil is processed into a lead pattern (gold plating is formed on the surface of the electrode sheet), and then the light emitting device is selectively removed Insulation layer on the mounting part.

The configuration of the planar light source device using the light emitting device mounting assembly of the present invention is similar to that of the conventional planar light source device. Specifically, a predetermined number of light emitting device mounting assemblies of the present invention may be mounted on the bottom surface of a chassis made of a material such as aluminum. Although in each of the first to third embodiments, the center of the substrate is a fixed point, that is, a white light source unit is formed by mounting LEDs of various colors on one substrate, the present invention is not limited by these embodiments. Example limitations. Instead, a substrate may contain multiple fixed points, ie, a plurality of light source units arranged in a row or in an array on a large-sized substrate.

The planar light source device may be embodied, for example, as a backlight or advertisement lighting for a liquid crystal display device.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various changes, modifications, and added functions can be made without departing from the scope of the present invention. For example, although the light-emitting-device mounting substrate and light-emitting-device mounting assembly of the present invention are used to mount a plurality of light-emitting devices that emit light of different colors, white light-emitting devices that do not need to mix colors can also be mounted.

Claims (16)

1. light-emitting device mounted substrate, the different multiple light-emitting device of glow color is installed in this light-emitting device mounted substrate, this light-emitting device mounted substrate comprises a plurality of light-emitting device installation portions, each light-emitting device installation portion light-emitting device that is used to pack into corresponding to a kind of glow color, wherein, described light-emitting device installation portion has a configuration, on each light-emitting device installation portion a plurality of light-emitting devices can be installed in this configuration.

2. by the described light-emitting device mounted substrate of claim 1, it is characterized in that the quantity of formed light-emitting device installation portion is equal to or greater than the quantity of the different glow colors of the light-emitting device that will install.

3. by claim 1 or 2 described light-emitting device mounted substrates, it is characterized in that described light-emitting device installation portion is arranged on this light-emitting device mounted substrate with constant pitch.

4. by the described light-emitting device mounted substrate of claim 2, it is characterized in that, a plurality of light-emitting device installation portions stretch from the girth of the on-chip fixing point of light-emitting device to a circle, and described fixing point is the center of circle of described circle, and described a plurality of light-emitting device installation portions are with given angle intervals setting.

5. by the described light-emitting device mounted substrate of claim 2, it is characterized in that, described light-emitting device installation portion is arranged to like this, make fixing point with the light-emitting device mounted substrate be center of gravity equilateral polygon the limit with along the light-emitting device installation portion longitudinally straight line almost overlap.

6. by claim 4 or 5 described light-emitting device mounted substrates, it is characterized in that described fixing point is the center of described light-emitting device mounted substrate.

7. by claim 4 or 5 described light-emitting device mounted substrates, it is characterized in that, also comprise a plurality of fixing points.

8. by the described light-emitting device mounted substrate of arbitrary claim among the claim 1-7, the position that also described therein light-emitting device installation portion is arranged on the described light-emitting device mounted substrate comprises a projection, wherein, described light-emitting device installation portion is arranged on this projection.

9. by the described light-emitting device mounted substrate of claim 8, it is characterized in that described projection is by making with the material identical materials of described light-emitting device mounted substrate.

10. by the described light-emitting device mounted substrate of arbitrary claim among the claim 1-9, it is characterized in that described light-emitting device mounted substrate is a metallic matrix substrate.

11., it is characterized in that described light-emitting device is a light-emitting diode (LED) by the described light-emitting device mounted substrate of arbitrary claim among the claim 1-10.

12., it is characterized in that described light-emitting diode (LED) is a light-emitting diode (LED) chip by the described light-emitting device mounted substrate of claim 11.

13. by the described light-emitting device mounted substrate of claim 12, it is characterized in that, also be included in the substrate electrod sheet that described light-emitting device installation portion both sides are connected with anode by the wire-bonded and the negative electrode of light-emitting diode (LED) chip.

14. a light-emitting device installation component comprises a reflector, the position corresponding to the light-emitting device installation portion on the described light-emitting device mounted substrate of this reflector arbitrary claim in by claim 1-13 is provided with a peristome.

15. by the described light-emitting device installation component of claim 14, it is characterized in that described peristome is embedding by sealing resin, make the top of described peristome almost flush with the surface of described reflector.

16. a planar light source device wherein, is equipped with one by claim 14 or 15 described light-emitting device installation components on the bottom surface on chassis.

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