CN204088375U - Led module and lighting device - Google Patents

Abstract

The utility model provides a linear mounting type LED module capable of improving brightness at both ends in the short side direction of a lighting fixture and a lighting device equipped with the LED module. The LED module (1) includes: an elongated substrate (2); LED chips (3) mounted in a plurality of rows on one side (2a) of the substrate (2) along the long side direction; a translucent sealing resin ( 4, 5), the encapsulation resin (5) arranged on the one side (2a) side of the substrate (2) in such a way that the LED chips (3) are respectively sealed into a dome shape, and the endmost row of the substrate (2) The shape or size of the sealing resin ( 4 ) is different from the shape or size of the sealing resin ( 4 ) of the row adjacent to the endmost row.

Description

LED module and lighting device

technical field

Embodiments of the present invention relate to an LED module in which an LED chip serving as a light source is sealed with a translucent sealing resin, and a lighting device equipped with the LED module. the

Background technique

A COB (chip on board) type LED module is used in a lighting device. In the COB type LED module, a plurality of LED chips are arranged side by side on one side of the substrate and a bank (frame) surrounding the LED chip is provided. The inside is filled with a translucent resin mixed with a phosphor, and each LED chip is embedded in the translucent resin (for example, refer to Patent Document 1). If the LED module does not have a bank, the peripheral side of the translucent resin tends to flow out along the surface of the substrate, and the translucent resin cannot be formed into a predetermined stable shape due to the outflow. the

However, if the bank is provided, it takes time to make a material or form the bank, which increases the cost of the LED module. In addition, there is a problem that the appearance of the LED module is spoiled by the banks that do not emit light. Furthermore, in recent years, large-scale lighting fixtures such as basic lighting lamps for facilities have become popular, and it has been difficult to manufacture large-scale LED modules used in the lighting fixtures. the

Therefore, there has been a wire-mount LED module in which LED chips are directly sealed with a translucent resin without forming a bank (for example, refer to Patent Document 2). That is, LED chips are mounted on a substrate at regular intervals, and a thixotropic sealing resin containing phosphor is coated and coated on the LED chips. the

Patent Document 1: Japanese Patent Laid-Open No. 2011-60961 (page 6, Figure 3)

Patent Document 2: Japanese Patent Laid-Open No. 2013-4941 (page 4, Figure 1)

In the linear mounting type LED module, illumination light is emitted from the encapsulation resin that seals the LED chips, so that uneven illumination tends to occur between the encapsulation resins that are adjacent to each other. As a result, the illuminance at the extreme end side in the short-side direction of the substrate becomes lower in the entire long-side direction, and if it is installed in a large-scale lighting fixture such as a basic lighting lamp for facilities, both sides in the short-side direction (width direction) of the lighting fixture will be reduced. The end side is darkened in the entire lengthwise direction, and there is a problem of giving a sense of discomfort. the

Contents of the invention

An object of embodiments of the present invention is to provide a linear mounting type LED module capable of improving brightness at both ends in the short-side direction of a lighting fixture, and a lighting device including the LED module. the

An LED module according to an embodiment includes a substrate, an LED chip, and a sealing resin. the

The substrate is formed in an elongated shape, and the LED chips are mounted on one surface in a plurality of rows along the longitudinal direction. The sealing resin has translucency, and is provided on one side of the substrate so as to seal the LED chips in a dome shape. Furthermore, regarding the sealing resin, the shape or size of the sealing resin of the row at the end side of the substrate is different from the shape or size of the sealing resin of the row adjacent to the row at the end side. the

The linear mounting type LED module in which the LED chip is directly sealed on the substrate of the present invention includes a sealing resin formed in such a way that light is radiated from the end in the short side direction of the substrate toward the outside. the

The lighting device of the present invention includes an LED module, a device main body and a lighting device, wherein the LED module is the LED module of the present invention, the device main body is equipped with the LED module, and the lighting device lights up the LED chip. the

According to the LED module of this embodiment, since the shape or size of the sealing resin of the row at the end side of the substrate is different from the shape or size of the sealing resin of the row adjacent to the row at the end side, The light is radiated in the outermost end portion of the substrate and in the outer direction than the end portion, and it can be expected that the endmost side in the short side direction of the substrate is illuminated brightly throughout the long side direction. the

Description of drawings

FIG. 1 is a schematic plan view showing an LED module according to a first embodiment of the present invention. the

FIG. 2 is a partial schematic plan view of the above-mentioned LED module with the encapsulating resin seen through. the

FIG. 3 is an enlarged view of part A of FIG. 2 . the

Fig. 4 is a schematic cross-sectional view taken along the arrow BB in Fig. 3 . the

5 is an explanatory view showing the shape and size of the sealing resin in the short-side direction of the LED module. the

Fig. 6 is a configuration diagram of the above-mentioned LED module in a lighting device. the

Fig. 7 is a schematic plan view showing an LED module according to a second embodiment of the present invention. the

Fig. 8 is a schematic side view in the short-side direction of the LED module. the

9( a ) and FIG. 9( b ) show a lighting device according to a third embodiment of the present invention, FIG. 9( a ) is a schematic perspective view, and FIG. 9( b ) is a partially cutaway schematic side view. the

In the figure: 1-LED module, 2, 36-substrate, 3-LED chip, 4, 5, 37-encapsulation resin, 41-lighting fixture as lighting device, 42-apparatus main body as the main body of the device, 43-lighting device. the

Detailed ways

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. First, the first embodiment of the present invention will be described. The structure of the LED module 1 of this embodiment is shown in FIGS. 1 to 6 . In addition, in each figure, the same code|symbol is attached|subjected to the same part, and overlapping description is abbreviate|omitted. The LED module 1 includes a substrate 2 , an LED chip 3 and sealing resins 4 and 5 . the

In FIG. 1 , the substrate 2 is made of a synthetic resin such as glass epoxy material, and is formed into a long rectangle (elongated shape) in which one side 2 a and the other side 2 b (shown in FIG. 4 ) are planar. For example, the long side dimension is 280 to 300 mm, and the short side (width) dimension is 15 to 20 mm. In addition, as the substrate 2, a substrate having a plate thickness of 0.5 to 1.8 mm is used, and a substrate of 1.2 mm is used here. the

Furthermore, as shown in FIG. 3 , the substrate 2 is provided with a mounting portion 9 having a mounting region 7 and connectors 8 , 8 and a pair of wiring bodies 10 , 11 on one surface 2 a side. The LED chip 3 is mounted on the mounting area 7 , and the sealing resin 4 or the sealing resin 5 is provided on the mounting portion 9 . The mounting portions 9 are used as light emitting portions of the LED module 1 and, as shown in FIG. 1 , are provided at equal intervals along the long-side direction of the substrate 2 and in two rows at predetermined intervals in the short-side direction. the

The substrate 2 is provided with an input terminal 12 and a connection terminal 13 on both end sides 2c and 2d in the longitudinal direction, respectively. In addition, a plurality of mounting holes 14 and the like are provided on the substrate 2 . Furthermore, as shown in FIG. 4 , for example, a copper foil 15 is formed over the entire area of the other surface 2 b of the substrate 2 , and a resist layer 16 is formed on the copper foil 15 . The copper foil 15 and the resist layer 16 prevent the bending of the substrate 2 and thus reinforce the substrate 2 in cooperation with each other. the

The mounting region 7 has a three-layer structure of first to third metal layers 17 , 18 , and 19 formed on one surface 2 a of the substrate 2 . The first metal layer 17 is formed, for example, by etching copper foil formed on one surface 2 a of the substrate 2 into a predetermined shape. The second metal layer 18 is made of, for example, nickel plated on the first metal layer 17 , and the third metal layer 19 is made of, for example, silver or gold plated on the second metal layer 18 . The first to third metal layers 17 , 18 , and 19 are each formed to have a thickness of, for example, 10 μm. the

In addition, the connectors 8 and 8 are formed in a three-layer structure similarly to the mounting region 7 . That is, it includes a metal layer 20 made of, for example, nickel plated on the wiring bodies 10 and 11 made of copper foil, and a metal layer 21 made of, for example, silver or gold plated on the metal layer 20 . The wiring bodies 10 , 11 and the metal layers 20 , 21 are each formed to have a thickness of, for example, 10 μm. the

The mounting region 7 is also called a mounting pad, and as shown in FIG. 3 , the upper surface 7 a is formed in a roughly ax shape in which arcs are cut off on both sides of the ellipse in the minor axis direction. Connectors 8, 8 are also called wiring pads, and upper surfaces 8a, 8a are formed in oval shapes. Furthermore, the connection bodies 8 and 8 are formed so as to secure a predetermined insulating distance from the mounting area 7 on both sides in the minor axis direction of the mounting area 7 . the

In addition, a white protective layer 22 is formed on one surface 2a of the substrate 2, for example, by screen printing to expose the upper surface 7a of the mounting region 7 and the upper surfaces 8a, 8a of the connectors 8, 8. The white protective layer 22 has electrical insulation and functions as a light reflection layer. In addition, as shown in FIG. 4 , white protective layer 22 is applied to one surface 2 a of substrate 2 so as to protrude outward from upper surface 7 a of mounting region 7 and upper surfaces 8 a, 8 a of connectors 8 , 8 . The white protective layer 22 prevents the pair of wiring bodies 10 , 11 from coming into contact with the air, thereby preventing deterioration of the pair of wiring bodies 10 , 11 . the

Furthermore, the LED chip 3 is mounted on the upper surface 7 a of the mounting region 7 . The LED chip 3 is bonded to the upper surface 7 a of the mounting region 7 using a light-transmitting die-bonding material 23 . The LED chip 3 emits blue light, and is formed, for example, in a face-up substantially rectangular parallelepiped shape according to a known structure. the

Furthermore, as shown in FIG. 3 , the LED chip 3 is mounted on the central portion of the upper surface 7 a of the mounting region 7 . In addition, the LED chip 3 is arranged such that its long side direction is along the short axis direction of the mounting region 7 . In addition, the electrodes 3 a of the LED chips 3 are electrically connected to the upper surface 8 a of one connecting body 8 through welding wires 24 , and the electrodes 3 b are electrically connected to the upper surface 8 a of the other connecting body 8 through welding wires 24 . The electrode 3a constitutes the anode side, and the electrode 3b constitutes the cathode side. Electrodes 3 a and 3 b are connected to a pair of wiring bodies 10 and 11 via connectors 8 and 8 . the

The pair of wiring bodies 10 , 11 is formed into a predetermined wiring pattern by, for example, etching copper foil formed on one surface 2 a of the substrate 2 , and is formed to have a predetermined width of, for example, a thickness of 10 μm. And, as shown in FIG. 2 , a pair of wiring bodies 10 and 11 connects four sets of LED chips 3 in parallel, and connects each of the four sets of LED chips in series. Further, the wiring bodies 10 and 10 on the one end side 2 c of the substrate 2 are electrically connected to the input terminal 12 , and the wiring bodies 11 and 11 on the other end side 2 d of the substrate 2 are electrically connected to the connection terminal 13 . the

The electrodes 3 a and 3 b of the LED chip 3 are connected to a pair of wiring bodies 10 and 11 via connectors 8 and 8 so that a current flows between the electrodes 3 a and 3 b. In addition, the number of groups of LED chips 3 connected in parallel via a pair of wiring bodies 10 and 11 is not limited to four, and may be any number of groups. the

The connection terminal 13 is electrically connected to the input terminal 12 of the adjacent LED module 1 of the LED modules 1 arranged in parallel through an electrical connection mechanism (not shown) such as a wire. In addition, among the connection terminals 13 of one LED module 1 or the rear end LED modules 1 arranged in parallel, the unillustrated terminals electrically connected to the wiring bodies 11, 11 are short-circuited by a short-circuit mechanism such as a wire, so that The wiring bodies 11 and 11 of the two columns are electrically connected to each other. the

In the LED module, when predetermined power is supplied to the input terminal 12 from a lighting device not shown, a predetermined voltage is applied between the wiring bodies 10 and 10 electrically connected to the input terminal 12, and a predetermined current flows through the LED chip 3. . As a result, the LED chips 3 each emit light (light up) and emit blue light. the

In FIG. 4 , the sealing resin 4 is provided on the white protective layer 22 so as to cover the LED chip 3 , the mounting area 7 and the connectors 8 , 8 . In addition, the sealing resin 5 is also the same. The sealing resins 4 and 5 contain, for example, a translucent resin-based silicone resin or a hybrid silicone resin as a main component, and are mixed with a predetermined amount of phosphor particles 25 and fillers not shown. Phosphor particles 25 have a particle diameter of 1 μm or more, and are substantially uniformly dispersed in the sealing resins 4 and 5 . Yellow phosphor particles that are excited by blue light emitted from the LED chip 3 to emit yellow light are used as phosphor particles 25 . the

The sealing resins 4 , 5 are formed into a cross-sectional hemispherical shape by setting a predetermined amount in the mounting portion 9 and curing in a predetermined dome-like shape such as a hemispherical shape in cross-section. Further, as shown in FIG. 1 , the sealing resin 4 seals the LED chips 3 mounted in a row along the longitudinal direction of the substrate 2 on one end side 2 e in the short direction of the substrate 2 . Further, the sealing resin 5 seals the LED chips 3 mounted in a row along the longitudinal direction of the substrate 2 on the other end side 2 f of the substrate 2 in the short direction. the

5, the sealing resin 4 is provided so that the ratio of the height H1 from the one surface 2a side of the substrate 2 to the dome-shaped apex 27 to the maximum diameter D1 of the sealing bottom surface 26 on the one surface 2a side of the substrate 2 (hereinafter (referred to as an aspect ratio) is 0.2 or more and 1.0 or less. In addition, the height H1 is strictly speaking the height from the white protective layer 22 to the apex 27 . the

In addition, the sealing resin 5 is set so that the ratio of the height H2 from the one surface 2a side of the substrate 2 to the dome-shaped apex 29 to the maximum diameter D2 of the sealing bottom surface 28 on the one surface 2a side of the substrate 2 (hereinafter referred to as aspect ratio) The aspect ratio greater than that of the sealing resin 4 is higher than 5% in this embodiment. The height H2 is strictly speaking the height from the white protective layer 22 to the apex 29 . the

Furthermore, since the sealing bottom surface 26 of the sealing resin 4 and the sealing bottom surface 28 of the sealing resin 5 are formed identically in this embodiment, the sealing resin 5 is provided so that its height H2 is greater than the height H1 of the sealing resin 4 . That is, the sealing resin 5 only needs to have its height H2 greater than the height H1 of the sealing resin 4, and the sizes and shapes of the sealing bottom surfaces 26 and 28 may be different. Thus, in this embodiment, the sealing resins 4 and 5 are provided so that the size of the sealing resin 5 is different from the size of the sealing resin 4 . the

The sealing resins 4 and 5 are arranged so that the LED chip 3 is located directly below the vertices 27 and 29 . Inside the sealing resins 4 and 5 , the blue light emitted by the LED chip 3 and the yellow light emitted by the phosphor particles 25 are mixed, and white light is emitted from the outer surfaces 4 a and 5 a of the sealing resins 4 and 5 . Since the LED chip 3 is located directly below the vertices 27 and 29 of the sealing resins 4 and 5 , the blue light from the LED chip 3 is emitted substantially uniformly over the entire area. Furthermore, if the sealing resins 4 and 5 are formed with the aforementioned aspect ratio, mixing of blue light and yellow light can be performed appropriately. Thereby, white light with suppressed chromaticity unevenness can be obtained. the

In addition, when the LED module 1 is an LED module emitting blue light, it is not necessary to mix the phosphor particles 25 with the sealing resins 4 and 5 . Furthermore, the cross-sectional shape of the sealing resins 4 and 5 may be triangular. the

Furthermore, as shown in FIG. 6 , the LED module 1 according to the present embodiment is mounted in a lighting device 30 such as a basic lighting lamp. For example, two LED modules 1 are arranged along the longitudinal direction of the device main body 31 . Two LED modules 1 are arranged such that one end side 2c of one LED module 1 and the other end side 2d of the other LED module 1 are located at one end side 31a in the longitudinal direction of the device main body 31, and the other end side 2d of one LED module 1 and the other The one end side 2c of one LED module 1 is located in the other end side 31b of the apparatus main body 31 in the longitudinal direction. Thus, in the lighting device 30, the sealing resins 5, 5 of the LED modules 1, 1 are positioned at both end sides 31c, 31d in the short direction of the device main body 31 and extend along the long side direction of the device main body 31, and the sealing resin 4 , 4 are located inside the short side direction of the device main body 31 and extend along the long side direction of the device main body 31 . the

Next, the action of the first embodiment of the present invention will be described. the

In the LED module 1 , when predetermined power is supplied to the input terminal 12 of the substrate 2 , a predetermined current flows through the LED chip 3 via the pair of wiring bodies 10 and 11 . The LED chip 3 emits blue light. A part of the blue light is wavelength-converted into yellow light by the yellow phosphor 25 mixed with the sealing resin 4,5. In addition, white light obtained by mixing the blue light and the yellow light is emitted outward from the outer surfaces 4 a , 5 a of the sealing resins 4 , 5 . The sealing resins 4, 5 are arranged so that the LED chip 3 is located directly below the vertices 27, 29 thereof, and the cross-sectional shape of the sealing resins 4, 5 is formed into a predetermined shape such as a hemispherical shape, so that mounting from the substrate 2 can be suppressed. The chromaticity of the white light emitted from the portion 9 is not uniform, and the white light is emitted in predetermined directions. the

In addition, since the height H2 of the sealing resin 5 provided along the longitudinal direction of the substrate 2 at the other end side 2f in the short direction of the substrate 2 is greater than the height H1 of the sealing resin 4, the white light radiated from the outer surface 5a goes toward The outermost side of the other end side 2f of the substrate 2 is emitted. The endmost portion of the other end side 2 f in the short side direction of the substrate 2 is illuminated slightly brightly over the long side direction of the substrate 2 . Thus, the lighting device 30 shown in FIG. 6 can prevent the short end sides 31c and 31d of the device main body 31 from being dark throughout the long direction of the device main body 31, thereby making it less likely to give people a sense of discomfort. the

According to the LED module 1 of the present embodiment, since the height H2 of the sealing resin 5 sealing the LED chips 3 on the endmost row in the short side direction of the substrate 2 from the side 2 a side of the substrate 2 to the apex 29 thereof is greater than that of the sealing resin 5 Therefore, the height H1 of the sealing resin 4 adjacent to the solid resin 5 can be radiated toward the end portion on the most end side in the short side direction of the substrate 2 and further outward than the end portion, thereby making the substrate 2 short side direction The effect that the endmost side of the substrate 2 becomes slightly brighter throughout the long side direction of the substrate 2 . the

In addition, in the present embodiment, the LED chips 3 are provided in two rows along the longitudinal direction of the substrate 2 , but the present invention is not limited thereto, and three or more rows may be provided. At this time, the sealing resin 5 may be provided on the extreme ends of both end sides 2e and 2f in the short direction of the substrate 2 along the long direction of the substrate 2, and on the middle side in the short direction along the length of the substrate 2. The sealing resin 4 may be provided in the side direction, and may be provided such that the size (height) of the sealing resin gradually increases as one end side 2e in the short side direction goes toward the other end side 2f. The former can mount, for example, one LED module on the lighting device, and the latter, as shown in FIG. 6 , can mount, for example, two LED modules in a parallel arrangement. the

In addition, in this embodiment, although one LED chip 3 is provided between the connection bodies 8, 8, it is not limited to this, You may arrange several in parallel. In addition, the LED chip 3 is formed in a substantially rectangular parallelepiped shape, but is not limited thereto, and may be in the shape of a cube, a cylinder, or a prism, or the like. In addition, although the LED chip 3 uses a face-up type having two electrodes 3a, 3b on the upper surface side of the main body, it is not limited to this, and may have one electrode 3a on the upper surface side of the main body. Also, it is a vertical type having another electrode 3b on the lower surface side, or a face-down type having two electrodes 3a, 3b on the lower surface side of the main body. In the above-mentioned up-and-down type, for example, one electrode 3a is connected to one connection body 8 via a welding wire 24, and a pair of wiring bodies 10, 11 is provided in such a manner that the other electrode 3b is directly connected to the other connection body 8. In addition, in the face-down type, a pair of wiring bodies 10 , 11 are provided so that the two electrodes 3 a , 3 b are directly connected to the connection bodies 8 , 8 . In these cases, the connection body 8 is included in the mounting area 7 of the LED chip 3 . the

Next, a second embodiment of the present invention will be described. the

The structure of the LED module 35 of this embodiment is shown in FIG. 7. In addition, the same code|symbol is attached|subjected to the same part as FIG. 1, and repeated description is abbreviate|omitted. the

The LED chips 3 of the LED module 35 are mounted in three rows at equal intervals along the longitudinal direction on the one surface 36 a side of the substrate 36 . The substrate 36 is the same as the substrate 2 except that the length in the short-side direction is larger than that of the substrate 2 . In addition, sealing resins 37 and 37 are provided on the LED chips 3 and 3 mounted on both end sides 36e and 36f in the short direction of the substrate 36 along the long direction of the substrate 36, and at the central part in the short direction along the substrate. The sealing resin 4 is provided on the LED chip 3 mounted in the longitudinal direction of 36 . the

As shown in FIG. 8, in the sealing resin 37, 37, the center 38c, 38c and the apex 39, 39 of the sealing bottom surface 38, 38 differ in the height direction. The sealing resins 37 , 37 are provided such that the positions of the apexes 39 , 39 are located on the outer side of the outermost sides 36 e , 36 f of the substrate 36 than the positions of the centers 38 c , 38 c of the sealing bottom surfaces 38 , 38 . The inclination angle K1 of the vertices 39 , 39 relative to the centers 38 c , 38 c of the sealing bottom surfaces 38 , 38 is inclined 5° to 70° relative to the height direction. In addition, the sealing resins 37, 37 are provided such that the LED chips 3, 3 are located directly below the vertices 39, 39 thereof. As a result, the shapes of the sealing resins 37 and 37 in the row on the endmost side of the substrate 36 differ from the shape of the sealing resin 4 in the adjacent row. the

Since the vertices 39 and 39 of the encapsulating resin 37 and 37 are in the outer direction of the two ends 36e and 36f in the direction of the short side of the substrate 36, and the LED chips 3 and 3 are arranged directly below the vertices 39 and 39, they face both sides. The outermost outer surfaces 37a, 37a of the end sides 36e, 36f are closer to the LED chips 3, 3 than the outer surfaces 37a, 37a on the opposite side, so that the blue light emitted from the LED chips 3, 3 and the fluorescent light The wavelength-converted yellow light of the body 25 is easily emitted from the outer surface 37a, 37a side facing the endmost side. That is, among the radiated light radiated from the outer surfaces 37 a , 37 a of the sealing resins 37 , 37 , the amount of light radiated toward the respective both end sides 36 e , 36 f in the short-side direction of the substrate 36 is larger. Thereby, it is possible to slightly brighten the end-most spaces at both end sides 36 e and 36 f in the short-side direction of the substrate 36 over the long-side direction of the substrate 36 . The illuminating device equipped with the LED module 35 can prevent darkening in the longitudinal direction at both ends in the short-side direction, thereby making it less likely to give people a sense of discomfort or the like. the

In addition, even if the sealing resin 37, 37 is inclined, and the apexes 39, 39 are shifted to the outer direction than the center 38c, 38c of the sealing bottom surface 38, 38, but since the LED chips 3, 3 are positioned on the sealing resin 37 , 37 directly below the vertices 39, 39, so it is possible to suppress large chromaticity unevenness between the LED chips 3, 3 and the entire outer surfaces 37a, 37a of the encapsulation resin 37, 37, thereby suppressing the chromaticity from the outside. The chromaticity of the white light emitted from the surface 37a, 37a is reduced or uneven. the

Next, a third embodiment of the present invention will be described. the

The mechanism of the lighting fixture 41 of this embodiment is shown in FIG.9(a) and FIG.9(b). In addition, the same code|symbol is attached|subjected to the same part as FIG. 1, and description is abbreviate|omitted. the

As shown in FIG. 9( b ), the lighting fixture 41 is a lighting device (ceiling light) directly mounted on the ceiling surface, and includes a fixture main body 42 as a device main body, the LED module 1 shown in FIG. 1 , and a lighting device 43 . The tool main body 42 is formed, for example, in the shape of a rectangular plate having a relatively short standing portion 42a on four sides by cold-rolled steel plate. And, as shown in FIG. 9( a), the appliance main body 42 is provided with a V-shaped cover 44 throughout the longitudinal direction at the central portion in the short-side direction, and covers 45 are provided on both sides of the V-shaped cover 44 throughout the longitudinal direction. . the

The V-shaped cover 44 is formed in a substantially V-shaped cylindrical shape from a thin steel plate, and the outer surface 44a is formed in white. In addition, the cover 45 is formed in a substantially concave cylindrical shape, for example, from translucent polycarbonate (PC) resin, and is whitened. The cover 45 has low diffusivity. End plates 46 , 46 are attached to both ends in the longitudinal direction of the V-shaped cover 44 , and covers 47 , 47 are attached to both ends in the longitudinal direction of the cover 45 . The end plate 46 and the cover 47 are each formed of polycarbonate resin. the

As shown in FIG. 9( b ), the LED module 1 is mounted on a mounting plate 48 fixed to the device main body 42 within the cover 45 with screws not shown. A plurality of, for example, four LED modules 1 are installed in each cover 45 . In each diffusion cover 45, a plurality of LED modules 1 are connected in series. In addition, the LED module 1 is connected to the lighting device 43 by a wire not shown. the

The lighting device 43 is attached to the equipment main body 42 within the V-shaped cover 44 . In addition, an unillustrated input line of the lighting device 43 is connected to an external commercial AC power supply, and an unillustrated lead wire (output line) is connected to the LED modules 1 in each diffuser cover 45 . The lighting device 43 is formed by a known structure that supplies a predetermined current to the LED module 1 to light the LED chip 3 . the

In the lighting fixture 41 of this embodiment, since a plurality of LED modules 1 are arranged on the ends of the board 2 in the short-side direction of both ends 2e, 2f over the long-side direction of the board 2, it is possible to prevent the two sides of the fixture main body 42 in the short-side direction. The end side is darkened throughout the longitudinal direction, and has the effect of being able to illuminate the side to be irradiated with desired illumination light. the

In addition, the above-mentioned embodiments of the present utility model are just examples, and are not intended to limit the scope of the present utility model. These new embodiments can be implemented in other various forms, and various omissions, substitutions, and changes can be made without departing from the scope of the present invention. These embodiments and modifications thereof are included in the scope and gist of the present invention, and are also included in the invention described in the claims and the equivalent scope thereof. the

Claims (7)

1. a LED module, is characterized in that, possesses:

Microscler substrate;

LED chip, is mounted to multiple row in the one side side of this substrate along its long side direction;

The sealing resin of light transmission, to be sealed to the one side side that dome-type mode is arranged at substrate respectively by LED chip;

The shape of the sealing resin of the shape of the sealing resin of the row of the most side of described substrate or the row adjoined in the row with described most side that vary in size or size.

2. LED module according to claim 1, is characterized in that,

The sealing resin height be arranged to from the one side side of described substrate to summit of the row of the most side of described substrate is greater than the described height of the sealing resin of the row adjoined with the row of described most side.

3. LED module according to claim 1 and 2, is characterized in that,

The described ratio that height from the one side side of described substrate to summit and the ratio of the maximum diameter of sealing bottom surface are greater than the sealing resin of the row adjoined with the row of described most side is arranged to by the sealing resin of the row of the most side of described substrate.

4. LED module according to claim 1 and 2, is characterized in that,

Center that its sealing bottom surface is arranged to by the sealing resin of the row of the most side of described substrate is different in the height direction from summit, and the position on described summit is positioned at the lateral direction of the most side more partially leaning on described substrate than the position at described center.

5. LED module according to claim 1 and 2, is characterized in that,

Described LED chip is arranged on immediately below the summit of described sealing resin in the one side of described substrate.

6. LED chip is directly sealed in the wire mount type LED module on substrate, it is characterized in that,

Have sealing resin, described sealing resin is formed in the mode making light and radiate toward the outer side from the end of described substrate short side direction.

7. a lighting device, is characterized in that, possesses:

LED module described in any one of claim 1 to 6;

Apparatus main body, is equipped with this LED module;

Ignition device, lights described LED chip.