CN101266961A - Flip chip package structure and method for manufacturing the same - Google Patents

Abstract

The invention relates to a flip chip package structure and a manufacturing method thereof, wherein a support colloid is arranged between a chip with a plurality of gold bumps and a substrate with a slot hole and is positioned in a space which is not covered by the gold bumps at the periphery of the slot hole. The gold bump is arranged between the substrate and the chip and around the slot hole, and is electrically connected with the substrate and the chip by a flip chip bonding method. Finally, an encapsulation material at least covers the gold bump and the slot. Therefore, the invention can reduce the processing time, increase the welding reliability of the gold bump, improve the yield, reduce the processing temperature of flip chip bonding and reduce the production cost.

Description

Flip-chip package structure and manufacturing method thereof

technical field

The present invention relates to a packaging structure and a manufacturing method thereof, in particular, to a flip-chip packaging structure and a manufacturing method thereof.

Background technique

Referring to FIG. 1 , it shows a flowchart of a manufacturing method of a conventional flip-chip package structure; FIG. 2 shows a schematic diagram of a conventional flip-chip package structure. Referring to FIG. 1 and FIG. 2 , first referring to step S11 , a plurality of solder bumps 11 are formed on a chip 10 by a bump implantation process. Referring to step S12, the chip 10 is set on a substrate 12, and the solder bumps 11 are electrically connected to several pads (not shown) of the chip 10 and the substrate 12, the chip 10 and the substrate 12 are Flip-chip bonding is performed using a reflow process. Wherein, the solder bumps 11 need to be pre-coated with flux (pre-solder), and aligned with the pads of the substrate 12, and then undergo a reflow process (the process temperature is about 240-260° C./minute), The chip 10 and the substrate 12 are flip-chip bonded. Referring to step S13 , a primer material 13 is filled between the chip 10 and the substrate 12 to cover the solder bumps 11 . Referring to step S14 , a first baking step is performed to cure the primer material 13 . Referring to step S15 , an encapsulation process is performed to cover the chip 10 and the substrate 12 with the encapsulant 14 . Referring to step S16 , finally, a second baking step is performed to cure the encapsulant 14 to complete a conventional flip-chip package structure 1 .

The manufacturing method of the conventional flip-chip packaging structure has the following disadvantages:

(1) The cost of manufacturing chips with solder bumps using a bumping process is relatively high.

(2) Flux needs to be used, so the cost is increased, and if non-volatile flux is used, a cleaning process is required. In addition to increasing the process time and cost, there will be a problem of flux residue.

(3) The reflow process is used for flip-chip bonding, and the primer material is baked. The high temperature in the process will cause the substrate to warp.

(4) Flip-chip bonding needs to be carried out in a reflow process, plus the dispensing and filling of the primer material for each chip is required, and the subsequent baking process of the primer material is required. The required process time is long, so it will be Significantly reduce the yield of the product.

Therefore, it is necessary to provide an innovative and progressive flip-chip packaging structure and its manufacturing method to solve the above problems.

Contents of the invention

An object of the present invention is to provide a flip-chip package structure. The flip-chip packaging structure includes a substrate, a chip, at least one supporting colloid and sealing glue material. The substrate has a slot. The chip is arranged on the substrate, the chip has an active surface, the active surface has several gold bumps, the gold bumps are arranged between the substrate and the chip and around the slot hole, and are electrically connected The substrate and the chip. The supporting colloid is disposed between the substrate and the chip, and is located in a space around the slot not covered by the gold bumps. The sealing material covers at least the gold bump and the slot.

Another object of the present invention is to provide a method for manufacturing a flip-chip package structure. The manufacturing method comprises the following steps: (a) providing a substrate, the substrate has a slot hole; (b) providing a chip, the chip has an active surface, and the active surface has several gold bumps; (c) setting at least A supporting colloid is between the substrate and the chip, and the supporting colloid is located in the space around the slot that is not covered by the gold bump, and does not cover the gold bump and the slot; (d) bonding The substrate and the chip, the gold bumps of the chip are arranged between the substrate and the chip and are located around the slot hole, and are electrically connected to the substrate and the chip; and (e) setting a sealing material to At least the gold bump and the slot are covered.

The flip-chip packaging structure and its manufacturing method of the present invention form several gold bumps on the surface of the chip (wire bonding or electroplating process) to replace the traditional high-cost bump planting process. In addition, the support colloid is placed on the chip or the substrate at one time (dispensing method, screen printing method or glue application method), so as to avoid the production rate reduction caused by slow dispensing one by one in the traditional primer process. question. Furthermore, the present invention can carry out flip-chip bonding of the substrate and the chip through an ultrasonic process or a thermocompression bonding process, so as to greatly reduce the process temperature and time of traditional flip-chip bonding, and can also omit the use of flux.

In addition, since the supporting gel and the sealing material can be filled between the chip and the substrate, the traditional undercoating process can be omitted and the reliability of the welding bump can be ensured, thereby saving process time. In addition, the supporting colloid of the present invention can be baked in the post moldcure process, so the required baking and curing time is greatly shortened compared with the traditional primer process.

Description of drawings

FIG. 1 shows a flowchart of a manufacturing method of a conventional flip-chip package structure;

FIG. 2 shows a schematic diagram of a conventional flip chip package structure;

FIG. 3 shows a flowchart of a manufacturing method of a flip-chip package structure according to a first embodiment of the present invention;

4 shows a schematic diagram of a chip disposed on a substrate using a supporting gel according to the first embodiment of the present invention;

5 shows a schematic diagram of a flip-chip package structure in which gold bumps are disposed on the periphery of one side of the slot hole according to the first embodiment of the present invention;

6 shows a schematic diagram of another implementation of the flip-chip package structure in which gold bumps are disposed on the periphery of one side of the slot hole according to the first embodiment of the present invention;

7 shows a schematic diagram of a flip-chip package structure in which gold bumps are formed on the periphery of both sides of the slot hole of the substrate according to the first embodiment of the present invention;

8 is a schematic diagram showing another implementation of the flip-chip package structure in which gold bumps are formed on the periphery of both sides of the slot hole of the substrate according to the first embodiment of the present invention;

9 shows a schematic diagram of a flip-chip package structure in which gold bumps are disposed on the periphery of one side of the slot hole according to the second embodiment of the present invention;

10 is a schematic diagram showing another implementation of the flip-chip package structure in which gold bumps are disposed on the periphery of one side of the slot hole according to the second embodiment of the present invention;

FIG. 11 shows a schematic diagram of a flip-chip package structure in which gold bumps are formed on the periphery of both sides of the slot hole of the substrate according to the second embodiment of the present invention;

FIG. 12 is a schematic diagram of another implementation of the flip-chip package structure in which gold bumps are formed on the periphery of both sides of the slot hole of the substrate according to the second embodiment of the present invention.

Detailed ways

Fig. 3 shows the flow chart of the manufacturing method of the flip-chip packaging structure according to the first embodiment of the present invention; Fig. 4 shows the schematic diagram of setting a chip on a substrate according to the first embodiment of the present invention; Fig. 5 shows the flip-chip according to the first embodiment of the present invention Schematic diagram of the package structure. With reference to FIG. 3 , FIG. 4 and FIG. 5 , first referring to step S21 , a substrate 21 is provided, and the substrate has a slot 211 . Referring to step S22 , a chip 22 is provided, and the chip 22 has an active surface 221 with a plurality of gold bumps 222 . Wherein, the gold bumps 222 can be formed on the active surface 221 of the chip 22 by a wire bonding process, or the gold bumps 222 can also be formed on the active surface 221 of the chip 22 by an electroplating process. Next, a supporting colloid 23 is disposed between the substrate 21 and the chip 22 , and is located in a space around the slot 211 not covered by the gold bump 222 . Wherein, the supporting colloid 23 can be disposed on the active surface 221 of the chip 22 by dispensing, screen printing or pasting. It should be noted that the supporting colloid 23 can also be disposed on the substrate 21 first, and then the substrate 21 and the chip 22 are bonded together.

Referring to step S23 , the substrate 21 and the chip 22 are bonded. Wherein, the gold bump 222 of the chip 22 is arranged between the substrate 21 and the chip 22 and around the slot 211 (in this embodiment, the gold bump 222 is arranged on a side of the slot 211 side), and electrically connect the substrate 21 and the chip 22. Preferably, the substrate 21 and the chip 22 are flip-chip bonded by an ultrasonic process, or the substrate 21 and the chip 22 can also be flip-chip bonded by a thermocompression bonding process. Preferably, after the step of bonding the substrate 21 and the chip 22 , a first baking step may be further included to cure the supporting glue 23 .

Referring to step S24 , finally, an encapsulation process is performed to cover part of the substrate 21 , the chip 22 , the supporting colloid 23 , the gold bumps 222 and the slots 211 with an encapsulant material 24 . Preferably, after the step of setting the sealing material 24 , a second baking step may be included to cure the sealing material 24 .

Referring to FIG. 5 again, it shows a schematic diagram of the flip-chip package structure according to the first embodiment of the present invention. The flip-chip package structure 2 includes a substrate 21 , a chip 22 , a supporting colloid 23 and a sealing material 24 . The substrate 21 has a slot 211 , and in this embodiment, the substrate 21 is a printed circuit board.

The chip 22 has an active surface 221, and the active surface 221 has a plurality of gold bumps 222, and the gold bumps 222 are arranged between the substrate 21 and the chip 22 and are located on the periphery of one side of the slot hole 211, And electrically connect the substrate 21 and the chip 22 . In this embodiment, the active surface 221 has several pads (not shown), and the gold bumps 222 are electrically connected to the pads.

The supporting colloid 23 is disposed between the substrate 21 and the chip 22 , and is located in a space around the slot 211 not covered by the gold bumps 222 . Preferably, the supporting colloid 23 is B-stage phenolic resin, or the supporting colloid 23 can be epoxy resin. It should be noted that the supporting colloid 23 can be ring-shaped or discontinuous.

The sealing material 24 covers a surface of the substrate 21 , the chip 22 , the support colloid 23 , the gold bump 222 and the slot 211 , wherein one side surface of the sealing material 24 and a surface of the substrate 21 The sides are flush. Preferably, the sealing material 24 is a solid epoxy resin molding material. In this embodiment, the sealing material 24 covering the slot 211 is a protrusion relative to a bottom surface of the substrate 21 . In other applications, the sealing material 24 covering the slot 211 may also be flush with the bottom surface of the substrate 21 , as shown in FIG. 6 .

Referring to FIG. 7 and FIG. 8 , it should be noted that the gold bumps 22 on the active surface 221 can be respectively disposed on the substrate 21 at the periphery of two sides of the periphery of the slot hole 211 . Wherein, the sealing material 24 covering the slot 211 can also be a convex portion (as shown in FIG. 7 ) relative to a bottom surface of the substrate 21, or be flush with the bottom surface of the substrate 21 (as shown in FIG. 8 ). shown).

Referring to FIG. 9 , it shows a schematic diagram of a flip-chip package structure according to a second embodiment of the present invention. The flip-chip package structure 3 includes a substrate 31 , a chip 32 , a supporting gel 33 and a sealing material 34 . The difference between the flip-chip package structure 3 of the second embodiment and the flip-chip package structure 2 of the first embodiment is that in the first embodiment, the sealing material 24 covers a surface of the substrate 21, the chip 22. The supporting colloid 23, the gold bump 222 and the slot 211, in the second embodiment, the sealing material 34 covers the part of the active surface 321 of the chip 32 in the slot 311 of the substrate 31 , part of the supporting colloid 33 , the gold bump 322 and the slot 311 .

Preferably, in the second embodiment, the sealing material 34 is a primer or a liquid molding material. Wherein, the sealing material 34 covering the slot 311 can also be a convex portion (as shown in FIG. 9 ) relative to a bottom surface of the substrate 31, or be flush with the bottom surface of the substrate 31 (as shown in FIG. 10 ). shown).

It should be noted that the gold bumps 322 can also be respectively disposed between the substrate 31 and the chip 32 and located on two sides of the periphery of the slot 311 . In addition, the sealing material 34 covering the slot 311 can also be a convex portion relative to a bottom surface of the substrate 31 (as shown in FIG. 11 ), or be flush with the bottom surface of the substrate 31 (as shown in FIG. 12 ). shown).

The flip-chip packaging structure and its manufacturing method of the present invention utilize wire bonding or electroplating process to form several gold bumps on the surface of the chip to replace the traditional high-cost bump planting process. In addition, the support colloid is placed on the chip or the substrate at one time (dispensing method, screen printing method or glue application method), so as to avoid the problem of lower productivity caused by slow dispensing one by one in the traditional primer process. Furthermore, the present invention can carry out flip-chip bonding of the substrate and the chip through an ultrasonic process or a thermocompression bonding process, so as to greatly reduce the process temperature and time of traditional flip-chip bonding, and can also omit the use of flux.

In addition, because the supporting colloid and sealing material can be filled between the chip and the substrate, the traditional undercoating process can be omitted and the reliability of the solder bump can be ensured, thereby saving process time. In addition, the supporting colloid of the present invention can be baked in a post mold cure process, so the required baking and curing time is greatly shortened compared with the traditional primer process.

However, the above-mentioned embodiments are only to illustrate the principles and effects of the present invention, not to limit the present invention. Therefore, those skilled in the art can modify and change the above embodiments without departing from the spirit of the present invention. The scope of rights of the present invention should be listed in the following claims.

Claims (15)

1. A flip-chip packaging structure, comprising: the substrate has a slot; Chip, arranged on the substrate, the chip has an active surface, the active surface has several gold bumps, the gold bumps are arranged between the substrate and the chip and around the slot hole, and are electrically connected the substrate and the chip; At least one supporting colloid is arranged between the substrate and the chip, and is located in the space around the slot not covered by the gold bump; and The sealing material covers at least the gold bump and the slot. 2. The flip-chip package structure as claimed in claim 1, wherein the supporting colloid can be ring-shaped or discontinuous. 3. The flip-chip package structure as claimed in claim 1, wherein the encapsulant further covers a surface of the substrate, the chip and the supporting colloid. 4. The flip-chip package structure as claimed in claim 3, wherein one side surface of the encapsulant is flush with one side of the substrate. 5. The flip-chip package structure as claimed in claim 1, wherein the encapsulant further covers part of the active surface and part of the supporting colloid of the chip. 6. The flip-chip package structure as claimed in claim 1, wherein the gold bump is disposed on at least one side of the slot hole. 7. The flip-chip package structure as claimed in claim 1, wherein the encapsulant covering the slot portion is flush with a bottom surface of the substrate. 8 . The flip chip package structure of claim 1 , wherein the encapsulant covering the slot portion is a protrusion relative to a bottom surface of the substrate. 9. A method for manufacturing a flip-chip packaging structure, comprising the following steps: (a) providing a substrate having a slot; (b) providing a chip having an active surface with gold bumps; (c) at least one supporting colloid is arranged between the substrate and the chip, and the supporting colloid is located in the space around the slot hole not covered by the gold bump, and does not cover the gold bump and the slot hole ; (d) bonding the substrate and the chip, the gold bumps of the chip are disposed between the substrate and the chip and are located around the slot hole, and are electrically connected to the substrate and the chip; and (e) disposing a sealing material to at least cover the gold bump and the slot. 10. The manufacturing method as claimed in claim 9, wherein step (c) comprises the steps of: (c1) disposing the support colloid on the active surface of the chip; and (c2) bonding the substrate and the chip, so that the supporting colloid is disposed between the substrate and the chip. 11. The manufacturing method as claimed in claim 10, wherein in the step (c1), the supporting colloid is disposed on the active surface of the chip by dispensing, screen printing or pasting. 12. The manufacturing method as claimed in claim 9, wherein step (c) comprises the steps of: (c1) disposing the supporting colloid on the substrate; and (c2) bonding the substrate and the chip, so that the supporting colloid is disposed between the substrate and the chip. 13. The manufacturing method according to claim 12, wherein in the step (c1), the supporting colloid is disposed on the substrate by dispensing, screen printing or pasting. 14. The manufacturing method of claim 9, wherein in step (e), the encapsulant further covers a surface of the substrate, the chip and the supporting colloid. 15. The manufacturing method according to claim 9, wherein in step (e), the encapsulant further covers part of the active surface and part of the supporting colloid of the chip.

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