CN101260551B - Cyanide-free silver electroplating method - Google Patents
Cyanide-free silver electroplating method Download PDFInfo
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- CN101260551B CN101260551B CN2008100110059A CN200810011005A CN101260551B CN 101260551 B CN101260551 B CN 101260551B CN 2008100110059 A CN2008100110059 A CN 2008100110059A CN 200810011005 A CN200810011005 A CN 200810011005A CN 101260551 B CN101260551 B CN 101260551B
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 57
- 238000009713 electroplating Methods 0.000 title claims abstract description 57
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 57
- 239000004332 silver Substances 0.000 title claims abstract description 57
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000007747 plating Methods 0.000 claims abstract description 51
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 9
- 239000000126 substance Substances 0.000 claims abstract description 5
- 239000002253 acid Substances 0.000 claims abstract description 4
- 239000000243 solution Substances 0.000 claims description 46
- PVNIIMVLHYAWGP-UHFFFAOYSA-N Niacin Chemical compound OC(=O)C1=CC=CN=C1 PVNIIMVLHYAWGP-UHFFFAOYSA-N 0.000 claims description 23
- 230000004913 activation Effects 0.000 claims description 20
- 229960003512 nicotinic acid Drugs 0.000 claims description 14
- 235000001968 nicotinic acid Nutrition 0.000 claims description 14
- 239000011664 nicotinic acid Substances 0.000 claims description 14
- 101710134784 Agnoprotein Proteins 0.000 claims description 13
- 239000011259 mixed solution Substances 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 2
- 239000011159 matrix material Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract description 8
- 238000000576 coating method Methods 0.000 abstract description 8
- 230000003213 activating effect Effects 0.000 abstract description 3
- VXHVELPLHCCGQL-UHFFFAOYSA-N pyridine-3-carboxylic acid;silver Chemical compound [Ag].OC(=O)C1=CC=CN=C1 VXHVELPLHCCGQL-UHFFFAOYSA-N 0.000 abstract description 3
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 8
- 239000011734 sodium Substances 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 5
- 235000011149 sulphuric acid Nutrition 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 3
- 239000008139 complexing agent Substances 0.000 description 3
- KDCGOANMDULRCW-UHFFFAOYSA-N 7H-purine Chemical compound N1=CNC2=NC=NC2=C1 KDCGOANMDULRCW-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 229910017053 inorganic salt Inorganic materials 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 2
- 235000010265 sodium sulphite Nutrition 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000003115 supporting electrolyte Substances 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- 241000080590 Niso Species 0.000 description 1
- CZPWVGJYEJSRLH-UHFFFAOYSA-N Pyrimidine Chemical compound C1=CN=CN=C1 CZPWVGJYEJSRLH-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- RWPGFSMJFRPDDP-UHFFFAOYSA-L potassium metabisulfite Chemical compound [K+].[K+].[O-]S(=O)S([O-])(=O)=O RWPGFSMJFRPDDP-UHFFFAOYSA-L 0.000 description 1
- 229940043349 potassium metabisulfite Drugs 0.000 description 1
- 235000010263 potassium metabisulphite Nutrition 0.000 description 1
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 description 1
- 229910052939 potassium sulfate Inorganic materials 0.000 description 1
- 235000011151 potassium sulphates Nutrition 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 description 1
- 235000019345 sodium thiosulphate Nutrition 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
Description
技术领域technical field
本发明涉及电镀技术,具体涉及无氰电镀银的方法。The invention relates to electroplating technology, in particular to a method for cyanide-free electroplating silver.
背景技术Background technique
电镀银广泛应用于电子器件、半导体、仪器仪表、装饰以及其他功能性镀银领域。目前,国内外电镀银仍然以氰化物体系镀银为主。由于氰化物对环境污染严重,随着人们环保意识的不断增强,有氰电镀将逐渐被淘汰。已有技术中已有专利文献公开了无氰镀银的工艺方法,相关专利如下:Electroplating silver is widely used in electronic devices, semiconductors, instrumentation, decoration and other functional silver plating fields. At present, the electroplating silver at home and abroad is still dominated by cyanide system silver plating. Due to the serious environmental pollution caused by cyanide, with the continuous enhancement of people's awareness of environmental protection, cyanide electroplating will gradually be eliminated. Existing patent literature discloses the processing method of cyanide-free silver plating in the prior art, and relevant patent is as follows:
专利200510023573涉及一种无氰镀银工艺方法,它是在磁场和脉冲电流作用下的无氰镀银工艺方法。该方法包括以下工艺过程和步骤:镀件化学除油、化学除绣、光亮镀镍、活化处理、浸银、脉冲镀银、钝化处理、干燥,最终制得镀银成品。活化处理采用化学方法,浸银溶液的络合剂为硫脲,脉冲镀银液的配方为:硝酸银50-60g/L,硫代硫酸钠250-350g/L,焦亚硫酸钾90-110g/L,硫酸钾20-30g/L,硼酸25-35g/L,光亮剂5ml/L.Patent 200510023573 relates to a cyanide-free silver plating process, which is a cyanide-free silver plating process under the action of a magnetic field and a pulse current. The method includes the following technological processes and steps: chemical degreasing of plated parts, chemical deembroidery, bright nickel plating, activation treatment, immersion silver, pulse silver plating, passivation treatment, drying, and finally obtains a finished silver plated product. The activation treatment adopts chemical methods, the complexing agent of the silver immersion solution is thiourea, and the formula of the pulse silver plating solution is: silver nitrate 50-60g/L, sodium thiosulfate 250-350g/L, potassium metabisulfite 90-110g /L, potassium sulfate 20-30g/L, boric acid 25-35g/L, brightener 5ml/L.
专利200710009207涉及一种无氰镀银镀液,其特征在于所述电镀液的原料配方各组分的质量浓度为:含有银的无机盐或有机盐1-200g/L,嘌呤类配位剂1-800g/L,支持电解质1-200g/L,镀液pH调节剂0-550g/L及电镀添加剂体系。Patent 200710009207 relates to a cyanide-free silver plating solution, which is characterized in that the mass concentration of each component of the raw material formula of the electroplating solution is: inorganic salt or organic salt containing silver 1-200g/L, purine complexing agent 1 -800g/L, supporting electrolyte 1-200g/L, bath pH regulator 0-550g/L and electroplating additive system.
专利200710009208涉及一种用于镀银的无氰型电镀液,其特征在于所述电镀液的原料配方各组分的质量浓度为:含有银的无机盐或有机盐1-200g/L,嘧啶类配位剂1-800g/L,支持电解质1-200g/L,镀液pH调节剂0-550g/L及电镀添加剂体系。Patent 200710009208 relates to a cyanide-free electroplating solution for silver plating, which is characterized in that the mass concentration of each component of the raw material formula of the electroplating solution is: inorganic salt or organic salt containing silver 1-200g/L, pyrimidine Complexing agent 1-800g/L, supporting electrolyte 1-200g/L, bath pH regulator 0-550g/L and electroplating additive system.
发明内容Contents of the invention
本发明的目的在于提供一种无氰电镀银的方法,以获得结合力好、致密的镀银层。为实现上述目的,本发明采用的技术方案为:一种无氰电镀银的方法,包括:将基体材料表面镀镍、镀镍层活化处理、在镀镍层上电镀银,镀镍层活化处理是将镀镍层在酸溶液中电活化处理,电镀银方法包括在镀镍层上化学镀银和在烟酸电镀银体系中双脉冲电镀银,其特征在于所述电活化镀镍层的方法是:将表面镀镍的基体材料放入装有H2SO4溶液的电活化槽中,H2SO4溶液为每升H2SO4溶液中含有80-250毫升的H2SO4,H2SO4浓度为98%,溶液温度保持在4-8℃,电活化的阴极电流密度为1-2.5A/dm2,电活化时间为1-5min,活化后取出用清水冲洗干净;所述的化学镀银工艺方法是:将镀镍层活化后的基体材料放入装有Na2SO3和AgNO3混合溶液的电镀槽中,电镀槽中每升混合溶液中Na2SO3含量为100-200g,AgNO3含量为0.8-1.5g,溶液温度保持12-25℃,电镀时间为5-60s;所述的在烟酸电镀银体系中双脉冲电镀银的工艺方法是:烟酸电镀银溶液由烟酸:80-150g/L、AgNO3:20-55g/L、K2CO3:60-100g/L、KOH:40-65g/L、NH4AC:60-80g/L、NH3·H2O:15-40ml/L组成,电镀溶液温度保持在12-25℃,双脉冲电镀电源的正向脉宽为2ms,占空比为20%,工作时间为100ms;反向脉宽为1ms,占空比为10%,工作时间为10ms,电镀时间0.5-6h。The object of the present invention is to provide a method for cyanide-free electroplating silver, so as to obtain a silver plating layer with good bonding force and compactness. In order to achieve the above object, the technical solution adopted in the present invention is: a method for cyanide-free electroplating silver, comprising: nickel-plating the surface of the base material, activating the nickel-plated layer, electroplating silver on the nickel-plated layer, and activating the nickel-plated layer The nickel-plated layer is electroactivated in an acid solution, and the electro-silvering method includes electroless silver-plating on the nickel-plated layer and double-pulse electro-silvering in a nicotinic acid electroplating silver system, and is characterized in that the method of electro-activating the nickel-plated layer Yes: put the nickel-plated base material into the electroactivation tank filled with H 2 SO 4 solution, the H 2 SO 4 solution contains 80-250 ml of H 2 SO 4 per liter of H 2 SO 4 solution, H The concentration of 2 SO 4 is 98%, the temperature of the solution is kept at 4-8°C, the cathode current density of electroactivation is 1-2.5A/dm 2 , the electroactivation time is 1-5min, and after activation, take it out and rinse it with clean water; The electroless silver plating process method is: put the base material after the activation of the nickel plating layer into the electroplating tank containing the mixed solution of Na2SO3 and AgNO3 , and the content of Na2SO3 in each liter of the mixed solution in the electroplating tank is 100 -200g, the content of AgNO3 is 0.8-1.5g, the solution temperature is maintained at 12-25°C, and the electroplating time is 5-60s; the process method of double-pulse electroplating silver in the niacin electroplating system is: The solution consists of niacin: 80-150g/L, AgNO 3 : 20-55g/L, K 2 CO 3 : 60-100g/L, KOH: 40-65g/L, NH 4 AC: 60-80g/L, NH 3 ·H 2 O: 15-40ml/L composition, the temperature of the electroplating solution is kept at 12-25°C, the forward pulse width of the double-pulse electroplating power supply is 2ms, the duty cycle is 20%, and the working time is 100ms; The width is 1ms, the duty cycle is 10%, the working time is 10ms, and the plating time is 0.5-6h.
本发明具有如下优点:The present invention has the following advantages:
1.通过电化学活化保证了结合力,使无氰镀银得到应用,从而最大程度的降低了对环境的污染。1. The binding force is guaranteed through electrochemical activation, so that cyanide-free silver plating can be applied, thereby reducing the pollution to the environment to the greatest extent.
2.双脉冲电镀电源的使用,在提高耐腐蚀能力的同时,也可以有效降低镀层厚度,节约成本。2. The use of double-pulse electroplating power supply can effectively reduce the thickness of the coating and save costs while improving the corrosion resistance.
具体实施方式Detailed ways
实施例1Example 1
不锈钢上电镀银。不锈钢的型号为316L。除去表面的氧化膜,在100ml/L盐酸(d=1.19)中浸渍30min使表面活化,酸溶液温度12℃。电镀镍采用在NiSO4·7H2O:270g/L、NiCl2·7H2O:50g/L、H3BO3:35g/L的镀液中进行,电镀工艺为:电镀温度:20℃,电镀时间:3min,阴极电流:2.0A/dm2。电化学活化镀镍层在电活化槽中进行,将镀镍后的材料放入装有H2SO4溶液的电活化槽中,H2SO4溶液为每升H2SO4溶液中含有100毫升的H2SO4,H2SO4浓度为98%,溶液温度保持在8℃,电活化的阴极电流密度为1.5A/dm2,电活化时间为5min,活化后取出用清水冲洗干净。再进行化学镀银,将镀镍层活化后的材料放入装有Na2SO3和AgNO3混合溶液的镀槽中,镀槽中每升混合溶液中Na2SO3含量为150g,AgNO3含量为0.8g,溶液温度保持25℃,镀银时间为5s。最后在烟酸电镀银体系中双脉冲电镀银,烟酸电镀银溶液由烟酸:100g/L、AgNO3:35g/L、K2CO3:80g/L、KOH:55g/L、NH4AC:70g/L、NH3·H2O:30ml/L组成,电镀溶液温度保持在25℃,电镀时间3h,双脉冲电镀电源的正向脉宽为2ms,占空比为20%,工作时间为100ms;反向脉宽为1ms,占空比为10%,工作时间为10ms。Silver plated over stainless steel. The stainless steel model is 316L. Remove the oxide film on the surface, immerse in 100ml/L hydrochloric acid (d=1.19) for 30min to activate the surface, the temperature of the acid solution is 12°C. Nickel electroplating is carried out in the plating solution of NiSO 4 7H 2 O: 270g/L, NiCl 2 7H 2 O: 50g/L, H 3 BO 3 : 35g/L. The electroplating process is: electroplating temperature: 20°C, Electroplating time: 3min, cathode current: 2.0A/dm 2 . The electrochemically activated nickel plating layer is carried out in an electroactivation bath, and the nickel-plated material is placed in an electroactivation bath filled with H2SO4 solution, and the H2SO4 solution contains 100 per liter of H2SO4 solution . Milliliters of H 2 SO 4 , the concentration of H 2 SO 4 is 98%, the temperature of the solution is kept at 8°C, the cathode current density of electroactivation is 1.5A/dm 2 , and the electroactivation time is 5min. After activation, take it out and rinse it with clean water. Carry out electroless silver plating again, put the material after nickel plating layer activation into the plating tank that is equipped with Na 2 SO 3 and AgNO 3 mixed solution, the content of Na 2 SO 3 in every liter of mixed solution in the plating tank is 150g, AgNO 3 The content is 0.8g, the solution temperature is kept at 25°C, and the silver plating time is 5s. Finally, double-pulse silver plating in the niacin electroplating silver system, the niacin electroplating silver solution consists of niacin: 100g/L, AgNO 3 : 35g/L, K 2 CO 3 : 80g/L, KOH: 55g/L, NH 4 AC: 70g/L, NH 3 ·H 2 O: 30ml/L, the temperature of the electroplating solution is kept at 25°C, the electroplating time is 3h, the forward pulse width of the double-pulse electroplating power supply is 2ms, and the duty cycle is 20%. The time is 100ms; the reverse pulse width is 1ms, the duty cycle is 10%, and the working time is 10ms.
实施例2Example 2
在铜上电镀银。首先,采用普通方法在铜上电镀一层镍,然后电化学活化镀镍层,电化学活化镀镍层在电活化槽中进行,将镀镍后的铜放入装有H2SO4溶液的电活化槽中,H2SO4溶液为每升H2SO4溶液中含有250毫升的H2SO4,H2SO4浓度为98%,溶液温度保持在4℃,电活化的阴极电流密度为1.0A/dm2,电活化时间为1min,活化后取出用清水冲洗干净。再进行化学镀银,将镀镍层活化后的铜放入装有Na2SO3和AgNO3混合溶液的镀槽中,镀槽中每升混合溶液中Na2SO3含量为100g,AgNO3含量为1g,溶液温度保持20℃,镀银时间为30s。最后在烟酸电镀银体系中双脉冲电镀银,烟酸电镀银溶液由烟酸:150g/L、AgNO3:55g/L、K2CO3:100g/L、KOH:65g/L、NH4AC:80g/L、NH3·H2O:40ml/L组成,电镀溶液温度保持在20℃,电镀时间0.5h,双脉冲电镀电源的正向脉宽为2ms,占空比为20%,工作时间为100ms;反向脉宽为1ms,占空比为10%,工作时间为10ms。Plating silver on copper. First, a layer of nickel is electroplated on copper by common methods, and then the nickel plating layer is activated electrochemically. The electrochemical activation of the nickel plating layer is carried out in an electroactivation tank, and the nickel-plated copper is placed in a H2SO4 solution. In the electro-activation tank, the H 2 SO 4 solution contains 250 ml of H 2 SO 4 per liter of H 2 SO 4 solution, the concentration of H 2 SO 4 is 98%, the temperature of the solution is kept at 4°C, and the cathode current density of electro-activation is 1.0A/dm 2 , the electrical activation time is 1min, after activation, take it out and rinse it with clean water. Carry out electroless silver plating again, put the copper after nickel plating layer activation into the plating tank that is equipped with Na 2 SO 3 and AgNO 3 mixed solution, in the plating tank, Na 2 SO 3 content is 100g in every liter of mixed solution, AgNO 3 The content is 1g, the solution temperature is kept at 20°C, and the silver plating time is 30s. Finally, double-pulse silver electroplating in the nicotinic acid electroplating silver system, the nicotinic acid electroplating silver solution consists of nicotinic acid: 150g/L, AgNO 3 : 55g/L, K 2 CO 3 : 100g/L, KOH: 65g/L, NH 4 AC: 80g/L, NH 3 ·H 2 O: 40ml/L, the temperature of the electroplating solution is kept at 20°C, the electroplating time is 0.5h, the forward pulse width of the double-pulse electroplating power supply is 2ms, and the duty cycle is 20%. The working time is 100ms; the reverse pulse width is 1ms, the duty cycle is 10%, and the working time is 10ms.
实施例3Example 3
在纯钛上电镀银。采用通常方法在纯钛上电镀一层镍,然后电化学活化镀镍层,电化学活化镀镍层在电活化槽中进行,将镀镍后的钛放入装有H2SO4溶液的电活化槽中,H2SO4溶液为每升H2SO4溶液中含有80毫升的H2SO4,H2SO4浓度为98%,溶液温度保持在6℃,电活化的阴极电流密度为2.5A/dm2,电活化时间为3min,活化后取出用清水冲洗干净。再进行化学镀银,将镀镍层活化后的钛放入装有Na2SO3和AgNO3混合溶液的镀槽中,镀槽中每升混合溶液中Na2SO3含量为200g,AgNO3含量为1.5g,溶液温度保持12℃,镀银时间为60s。最后在烟酸电镀银体系中双脉冲电镀银,烟酸电镀银溶液由烟酸:80g/L、AgNO3:20g/L、K2CO3:60g/L、KOH:40g/L、NH4AC:60g/L、NH3·H2O:15ml/L组成,电镀溶液温度保持在12℃,电镀时间6h,双脉冲电镀电源的正向脉宽为2ms,占空比为20%,工作时间为100ms;反向脉宽为1ms,占空比为10%,工作时间为10ms。Electroplated silver on pure titanium. Electroplate a layer of nickel on pure titanium by the usual method, and then electrochemically activate the nickel plating layer. The electrochemical activation of the nickel plating layer is carried out in an electroactivation tank. Put the nickel-plated titanium into the electrolytic tank containing H2SO4 solution In the activation tank, the H 2 SO 4 solution contains 80 milliliters of H 2 SO 4 per liter of H 2 SO 4 solution, the concentration of H 2 SO 4 is 98%, the temperature of the solution is kept at 6°C, and the cathode current density for electroactivation is 2.5A/dm 2 , the electrical activation time is 3min, after activation, take it out and rinse it with clean water. Carry out electroless silver plating again, put the titanium after the nickel plating layer activation into the plating tank that is equipped with Na 2 SO 3 and AgNO 3 mixed solution, the Na 2 SO 3 content in the mixed solution per liter in the plating tank is 200g, AgNO 3 The content is 1.5g, the solution temperature is maintained at 12°C, and the silver plating time is 60s. Finally, double-pulse silver plating in the nicotinic acid silver plating system, the nicotinic acid silver plating solution consists of nicotinic acid: 80g/L, AgNO 3 : 20g/L, K 2 CO 3 : 60g/L, KOH: 40g/L, NH 4 AC: 60g/L, NH 3 ·H 2 O: 15ml/L, the temperature of the electroplating solution is kept at 12°C, the electroplating time is 6h, the forward pulse width of the double-pulse electroplating power supply is 2ms, and the duty cycle is 20%. The time is 100ms; the reverse pulse width is 1ms, the duty cycle is 10%, and the working time is 10ms.
上述实施例的镀层都经过如下测试:The coating of above-mentioned embodiment all passes through following test:
1)外观1) Appearance
镀层外观均匀致密,光亮,无起皮、鼓泡、斑点等缺陷。采用超深度表面形态测定显微镜所获得的200倍3D图像显示,镀层微观呈波浪状,无孔隙,整个镀银层的平整度为4μm。The appearance of the coating is uniform and compact, bright, without defects such as peeling, bubbling, and spots. The 200x 3D image obtained by the ultra-deep surface morphology microscope shows that the coating is microscopically wavy, without pores, and the flatness of the entire silver coating is 4 μm.
2)结合力2) binding force
用划针在镀层上划若干条深达基体的划痕,这些划痕是相互平行和交错的,划痕间距离不大于2mm,未观察到镀层起皮脱落等现象。Use a scratch needle to draw several scratches deep to the substrate on the coating. These scratches are parallel and staggered to each other. The distance between the scratches is not greater than 2mm. No phenomenon such as peeling off of the coating is observed.
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