[go: up one dir, main page]

CN101260551B - Cyanide-free silver electroplating method - Google Patents

Cyanide-free silver electroplating method Download PDF

Info

Publication number
CN101260551B
CN101260551B CN2008100110059A CN200810011005A CN101260551B CN 101260551 B CN101260551 B CN 101260551B CN 2008100110059 A CN2008100110059 A CN 2008100110059A CN 200810011005 A CN200810011005 A CN 200810011005A CN 101260551 B CN101260551 B CN 101260551B
Authority
CN
China
Prior art keywords
electroplating
silver
solution
nickel
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008100110059A
Other languages
Chinese (zh)
Other versions
CN101260551A (en
Inventor
付宇
侯明
徐洪峰
侯中军
明平文
衣宝廉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sunrise Power Co Ltd
Original Assignee
Sunrise Power Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sunrise Power Co Ltd filed Critical Sunrise Power Co Ltd
Priority to CN2008100110059A priority Critical patent/CN101260551B/en
Publication of CN101260551A publication Critical patent/CN101260551A/en
Application granted granted Critical
Publication of CN101260551B publication Critical patent/CN101260551B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

The invention relates to a cyanide-free silver electroplating method. Plating nickel on the surface of a base material, then electrically activating a nickel layer in an acid solution, and then carrying out double-pulse silver electroplating in a nicotinic acid silver electroplating system after chemical silver plating. After the treatment by the method, the surface of the base material obtains a compact silver coating with good binding force.

Description

一种无氰电镀银的方法 A kind of method of cyanide-free electroplating silver

技术领域technical field

本发明涉及电镀技术,具体涉及无氰电镀银的方法。The invention relates to electroplating technology, in particular to a method for cyanide-free electroplating silver.

背景技术Background technique

电镀银广泛应用于电子器件、半导体、仪器仪表、装饰以及其他功能性镀银领域。目前,国内外电镀银仍然以氰化物体系镀银为主。由于氰化物对环境污染严重,随着人们环保意识的不断增强,有氰电镀将逐渐被淘汰。已有技术中已有专利文献公开了无氰镀银的工艺方法,相关专利如下:Electroplating silver is widely used in electronic devices, semiconductors, instrumentation, decoration and other functional silver plating fields. At present, the electroplating silver at home and abroad is still dominated by cyanide system silver plating. Due to the serious environmental pollution caused by cyanide, with the continuous enhancement of people's awareness of environmental protection, cyanide electroplating will gradually be eliminated. Existing patent literature discloses the processing method of cyanide-free silver plating in the prior art, and relevant patent is as follows:

专利200510023573涉及一种无氰镀银工艺方法,它是在磁场和脉冲电流作用下的无氰镀银工艺方法。该方法包括以下工艺过程和步骤:镀件化学除油、化学除绣、光亮镀镍、活化处理、浸银、脉冲镀银、钝化处理、干燥,最终制得镀银成品。活化处理采用化学方法,浸银溶液的络合剂为硫脲,脉冲镀银液的配方为:硝酸银50-60g/L,硫代硫酸钠250-350g/L,焦亚硫酸钾90-110g/L,硫酸钾20-30g/L,硼酸25-35g/L,光亮剂5ml/L.Patent 200510023573 relates to a cyanide-free silver plating process, which is a cyanide-free silver plating process under the action of a magnetic field and a pulse current. The method includes the following technological processes and steps: chemical degreasing of plated parts, chemical deembroidery, bright nickel plating, activation treatment, immersion silver, pulse silver plating, passivation treatment, drying, and finally obtains a finished silver plated product. The activation treatment adopts chemical methods, the complexing agent of the silver immersion solution is thiourea, and the formula of the pulse silver plating solution is: silver nitrate 50-60g/L, sodium thiosulfate 250-350g/L, potassium metabisulfite 90-110g /L, potassium sulfate 20-30g/L, boric acid 25-35g/L, brightener 5ml/L.

专利200710009207涉及一种无氰镀银镀液,其特征在于所述电镀液的原料配方各组分的质量浓度为:含有银的无机盐或有机盐1-200g/L,嘌呤类配位剂1-800g/L,支持电解质1-200g/L,镀液pH调节剂0-550g/L及电镀添加剂体系。Patent 200710009207 relates to a cyanide-free silver plating solution, which is characterized in that the mass concentration of each component of the raw material formula of the electroplating solution is: inorganic salt or organic salt containing silver 1-200g/L, purine complexing agent 1 -800g/L, supporting electrolyte 1-200g/L, bath pH regulator 0-550g/L and electroplating additive system.

专利200710009208涉及一种用于镀银的无氰型电镀液,其特征在于所述电镀液的原料配方各组分的质量浓度为:含有银的无机盐或有机盐1-200g/L,嘧啶类配位剂1-800g/L,支持电解质1-200g/L,镀液pH调节剂0-550g/L及电镀添加剂体系。Patent 200710009208 relates to a cyanide-free electroplating solution for silver plating, which is characterized in that the mass concentration of each component of the raw material formula of the electroplating solution is: inorganic salt or organic salt containing silver 1-200g/L, pyrimidine Complexing agent 1-800g/L, supporting electrolyte 1-200g/L, bath pH regulator 0-550g/L and electroplating additive system.

发明内容Contents of the invention

本发明的目的在于提供一种无氰电镀银的方法,以获得结合力好、致密的镀银层。为实现上述目的,本发明采用的技术方案为:一种无氰电镀银的方法,包括:将基体材料表面镀镍、镀镍层活化处理、在镀镍层上电镀银,镀镍层活化处理是将镀镍层在酸溶液中电活化处理,电镀银方法包括在镀镍层上化学镀银和在烟酸电镀银体系中双脉冲电镀银,其特征在于所述电活化镀镍层的方法是:将表面镀镍的基体材料放入装有H2SO4溶液的电活化槽中,H2SO4溶液为每升H2SO4溶液中含有80-250毫升的H2SO4,H2SO4浓度为98%,溶液温度保持在4-8℃,电活化的阴极电流密度为1-2.5A/dm2,电活化时间为1-5min,活化后取出用清水冲洗干净;所述的化学镀银工艺方法是:将镀镍层活化后的基体材料放入装有Na2SO3和AgNO3混合溶液的电镀槽中,电镀槽中每升混合溶液中Na2SO3含量为100-200g,AgNO3含量为0.8-1.5g,溶液温度保持12-25℃,电镀时间为5-60s;所述的在烟酸电镀银体系中双脉冲电镀银的工艺方法是:烟酸电镀银溶液由烟酸:80-150g/L、AgNO3:20-55g/L、K2CO3:60-100g/L、KOH:40-65g/L、NH4AC:60-80g/L、NH3·H2O:15-40ml/L组成,电镀溶液温度保持在12-25℃,双脉冲电镀电源的正向脉宽为2ms,占空比为20%,工作时间为100ms;反向脉宽为1ms,占空比为10%,工作时间为10ms,电镀时间0.5-6h。The object of the present invention is to provide a method for cyanide-free electroplating silver, so as to obtain a silver plating layer with good bonding force and compactness. In order to achieve the above object, the technical solution adopted in the present invention is: a method for cyanide-free electroplating silver, comprising: nickel-plating the surface of the base material, activating the nickel-plated layer, electroplating silver on the nickel-plated layer, and activating the nickel-plated layer The nickel-plated layer is electroactivated in an acid solution, and the electro-silvering method includes electroless silver-plating on the nickel-plated layer and double-pulse electro-silvering in a nicotinic acid electroplating silver system, and is characterized in that the method of electro-activating the nickel-plated layer Yes: put the nickel-plated base material into the electroactivation tank filled with H 2 SO 4 solution, the H 2 SO 4 solution contains 80-250 ml of H 2 SO 4 per liter of H 2 SO 4 solution, H The concentration of 2 SO 4 is 98%, the temperature of the solution is kept at 4-8°C, the cathode current density of electroactivation is 1-2.5A/dm 2 , the electroactivation time is 1-5min, and after activation, take it out and rinse it with clean water; The electroless silver plating process method is: put the base material after the activation of the nickel plating layer into the electroplating tank containing the mixed solution of Na2SO3 and AgNO3 , and the content of Na2SO3 in each liter of the mixed solution in the electroplating tank is 100 -200g, the content of AgNO3 is 0.8-1.5g, the solution temperature is maintained at 12-25°C, and the electroplating time is 5-60s; the process method of double-pulse electroplating silver in the niacin electroplating system is: The solution consists of niacin: 80-150g/L, AgNO 3 : 20-55g/L, K 2 CO 3 : 60-100g/L, KOH: 40-65g/L, NH 4 AC: 60-80g/L, NH 3 ·H 2 O: 15-40ml/L composition, the temperature of the electroplating solution is kept at 12-25°C, the forward pulse width of the double-pulse electroplating power supply is 2ms, the duty cycle is 20%, and the working time is 100ms; The width is 1ms, the duty cycle is 10%, the working time is 10ms, and the plating time is 0.5-6h.

本发明具有如下优点:The present invention has the following advantages:

1.通过电化学活化保证了结合力,使无氰镀银得到应用,从而最大程度的降低了对环境的污染。1. The binding force is guaranteed through electrochemical activation, so that cyanide-free silver plating can be applied, thereby reducing the pollution to the environment to the greatest extent.

2.双脉冲电镀电源的使用,在提高耐腐蚀能力的同时,也可以有效降低镀层厚度,节约成本。2. The use of double-pulse electroplating power supply can effectively reduce the thickness of the coating and save costs while improving the corrosion resistance.

具体实施方式Detailed ways

实施例1Example 1

不锈钢上电镀银。不锈钢的型号为316L。除去表面的氧化膜,在100ml/L盐酸(d=1.19)中浸渍30min使表面活化,酸溶液温度12℃。电镀镍采用在NiSO4·7H2O:270g/L、NiCl2·7H2O:50g/L、H3BO3:35g/L的镀液中进行,电镀工艺为:电镀温度:20℃,电镀时间:3min,阴极电流:2.0A/dm2。电化学活化镀镍层在电活化槽中进行,将镀镍后的材料放入装有H2SO4溶液的电活化槽中,H2SO4溶液为每升H2SO4溶液中含有100毫升的H2SO4,H2SO4浓度为98%,溶液温度保持在8℃,电活化的阴极电流密度为1.5A/dm2,电活化时间为5min,活化后取出用清水冲洗干净。再进行化学镀银,将镀镍层活化后的材料放入装有Na2SO3和AgNO3混合溶液的镀槽中,镀槽中每升混合溶液中Na2SO3含量为150g,AgNO3含量为0.8g,溶液温度保持25℃,镀银时间为5s。最后在烟酸电镀银体系中双脉冲电镀银,烟酸电镀银溶液由烟酸:100g/L、AgNO3:35g/L、K2CO3:80g/L、KOH:55g/L、NH4AC:70g/L、NH3·H2O:30ml/L组成,电镀溶液温度保持在25℃,电镀时间3h,双脉冲电镀电源的正向脉宽为2ms,占空比为20%,工作时间为100ms;反向脉宽为1ms,占空比为10%,工作时间为10ms。Silver plated over stainless steel. The stainless steel model is 316L. Remove the oxide film on the surface, immerse in 100ml/L hydrochloric acid (d=1.19) for 30min to activate the surface, the temperature of the acid solution is 12°C. Nickel electroplating is carried out in the plating solution of NiSO 4 7H 2 O: 270g/L, NiCl 2 7H 2 O: 50g/L, H 3 BO 3 : 35g/L. The electroplating process is: electroplating temperature: 20°C, Electroplating time: 3min, cathode current: 2.0A/dm 2 . The electrochemically activated nickel plating layer is carried out in an electroactivation bath, and the nickel-plated material is placed in an electroactivation bath filled with H2SO4 solution, and the H2SO4 solution contains 100 per liter of H2SO4 solution . Milliliters of H 2 SO 4 , the concentration of H 2 SO 4 is 98%, the temperature of the solution is kept at 8°C, the cathode current density of electroactivation is 1.5A/dm 2 , and the electroactivation time is 5min. After activation, take it out and rinse it with clean water. Carry out electroless silver plating again, put the material after nickel plating layer activation into the plating tank that is equipped with Na 2 SO 3 and AgNO 3 mixed solution, the content of Na 2 SO 3 in every liter of mixed solution in the plating tank is 150g, AgNO 3 The content is 0.8g, the solution temperature is kept at 25°C, and the silver plating time is 5s. Finally, double-pulse silver plating in the niacin electroplating silver system, the niacin electroplating silver solution consists of niacin: 100g/L, AgNO 3 : 35g/L, K 2 CO 3 : 80g/L, KOH: 55g/L, NH 4 AC: 70g/L, NH 3 ·H 2 O: 30ml/L, the temperature of the electroplating solution is kept at 25°C, the electroplating time is 3h, the forward pulse width of the double-pulse electroplating power supply is 2ms, and the duty cycle is 20%. The time is 100ms; the reverse pulse width is 1ms, the duty cycle is 10%, and the working time is 10ms.

实施例2Example 2

在铜上电镀银。首先,采用普通方法在铜上电镀一层镍,然后电化学活化镀镍层,电化学活化镀镍层在电活化槽中进行,将镀镍后的铜放入装有H2SO4溶液的电活化槽中,H2SO4溶液为每升H2SO4溶液中含有250毫升的H2SO4,H2SO4浓度为98%,溶液温度保持在4℃,电活化的阴极电流密度为1.0A/dm2,电活化时间为1min,活化后取出用清水冲洗干净。再进行化学镀银,将镀镍层活化后的铜放入装有Na2SO3和AgNO3混合溶液的镀槽中,镀槽中每升混合溶液中Na2SO3含量为100g,AgNO3含量为1g,溶液温度保持20℃,镀银时间为30s。最后在烟酸电镀银体系中双脉冲电镀银,烟酸电镀银溶液由烟酸:150g/L、AgNO3:55g/L、K2CO3:100g/L、KOH:65g/L、NH4AC:80g/L、NH3·H2O:40ml/L组成,电镀溶液温度保持在20℃,电镀时间0.5h,双脉冲电镀电源的正向脉宽为2ms,占空比为20%,工作时间为100ms;反向脉宽为1ms,占空比为10%,工作时间为10ms。Plating silver on copper. First, a layer of nickel is electroplated on copper by common methods, and then the nickel plating layer is activated electrochemically. The electrochemical activation of the nickel plating layer is carried out in an electroactivation tank, and the nickel-plated copper is placed in a H2SO4 solution. In the electro-activation tank, the H 2 SO 4 solution contains 250 ml of H 2 SO 4 per liter of H 2 SO 4 solution, the concentration of H 2 SO 4 is 98%, the temperature of the solution is kept at 4°C, and the cathode current density of electro-activation is 1.0A/dm 2 , the electrical activation time is 1min, after activation, take it out and rinse it with clean water. Carry out electroless silver plating again, put the copper after nickel plating layer activation into the plating tank that is equipped with Na 2 SO 3 and AgNO 3 mixed solution, in the plating tank, Na 2 SO 3 content is 100g in every liter of mixed solution, AgNO 3 The content is 1g, the solution temperature is kept at 20°C, and the silver plating time is 30s. Finally, double-pulse silver electroplating in the nicotinic acid electroplating silver system, the nicotinic acid electroplating silver solution consists of nicotinic acid: 150g/L, AgNO 3 : 55g/L, K 2 CO 3 : 100g/L, KOH: 65g/L, NH 4 AC: 80g/L, NH 3 ·H 2 O: 40ml/L, the temperature of the electroplating solution is kept at 20°C, the electroplating time is 0.5h, the forward pulse width of the double-pulse electroplating power supply is 2ms, and the duty cycle is 20%. The working time is 100ms; the reverse pulse width is 1ms, the duty cycle is 10%, and the working time is 10ms.

实施例3Example 3

在纯钛上电镀银。采用通常方法在纯钛上电镀一层镍,然后电化学活化镀镍层,电化学活化镀镍层在电活化槽中进行,将镀镍后的钛放入装有H2SO4溶液的电活化槽中,H2SO4溶液为每升H2SO4溶液中含有80毫升的H2SO4,H2SO4浓度为98%,溶液温度保持在6℃,电活化的阴极电流密度为2.5A/dm2,电活化时间为3min,活化后取出用清水冲洗干净。再进行化学镀银,将镀镍层活化后的钛放入装有Na2SO3和AgNO3混合溶液的镀槽中,镀槽中每升混合溶液中Na2SO3含量为200g,AgNO3含量为1.5g,溶液温度保持12℃,镀银时间为60s。最后在烟酸电镀银体系中双脉冲电镀银,烟酸电镀银溶液由烟酸:80g/L、AgNO3:20g/L、K2CO3:60g/L、KOH:40g/L、NH4AC:60g/L、NH3·H2O:15ml/L组成,电镀溶液温度保持在12℃,电镀时间6h,双脉冲电镀电源的正向脉宽为2ms,占空比为20%,工作时间为100ms;反向脉宽为1ms,占空比为10%,工作时间为10ms。Electroplated silver on pure titanium. Electroplate a layer of nickel on pure titanium by the usual method, and then electrochemically activate the nickel plating layer. The electrochemical activation of the nickel plating layer is carried out in an electroactivation tank. Put the nickel-plated titanium into the electrolytic tank containing H2SO4 solution In the activation tank, the H 2 SO 4 solution contains 80 milliliters of H 2 SO 4 per liter of H 2 SO 4 solution, the concentration of H 2 SO 4 is 98%, the temperature of the solution is kept at 6°C, and the cathode current density for electroactivation is 2.5A/dm 2 , the electrical activation time is 3min, after activation, take it out and rinse it with clean water. Carry out electroless silver plating again, put the titanium after the nickel plating layer activation into the plating tank that is equipped with Na 2 SO 3 and AgNO 3 mixed solution, the Na 2 SO 3 content in the mixed solution per liter in the plating tank is 200g, AgNO 3 The content is 1.5g, the solution temperature is maintained at 12°C, and the silver plating time is 60s. Finally, double-pulse silver plating in the nicotinic acid silver plating system, the nicotinic acid silver plating solution consists of nicotinic acid: 80g/L, AgNO 3 : 20g/L, K 2 CO 3 : 60g/L, KOH: 40g/L, NH 4 AC: 60g/L, NH 3 ·H 2 O: 15ml/L, the temperature of the electroplating solution is kept at 12°C, the electroplating time is 6h, the forward pulse width of the double-pulse electroplating power supply is 2ms, and the duty cycle is 20%. The time is 100ms; the reverse pulse width is 1ms, the duty cycle is 10%, and the working time is 10ms.

上述实施例的镀层都经过如下测试:The coating of above-mentioned embodiment all passes through following test:

1)外观1) Appearance

镀层外观均匀致密,光亮,无起皮、鼓泡、斑点等缺陷。采用超深度表面形态测定显微镜所获得的200倍3D图像显示,镀层微观呈波浪状,无孔隙,整个镀银层的平整度为4μm。The appearance of the coating is uniform and compact, bright, without defects such as peeling, bubbling, and spots. The 200x 3D image obtained by the ultra-deep surface morphology microscope shows that the coating is microscopically wavy, without pores, and the flatness of the entire silver coating is 4 μm.

2)结合力2) binding force

用划针在镀层上划若干条深达基体的划痕,这些划痕是相互平行和交错的,划痕间距离不大于2mm,未观察到镀层起皮脱落等现象。Use a scratch needle to draw several scratches deep to the substrate on the coating. These scratches are parallel and staggered to each other. The distance between the scratches is not greater than 2mm. No phenomenon such as peeling off of the coating is observed.

Claims (1)

1.一种无氰电镀银的方法,包括:将基体材料表面镀镍、镀镍层活化处理、在镀镍层上电镀银,镀镍层活化处理是将镀镍层在酸溶液中电活化处理,电镀银方法包括在镀镍层上化学镀银和在烟酸电镀银体系中双脉冲电镀银,其特征在于所述电活化镀镍层的方法是:将表面镀镍的基体材料放入装有H2SO4溶液的电活化槽中,H2SO4溶液为每升H2SO4溶液中含有80-250毫升的H2SO4,H2SO4浓度为98%,溶液温度保持在4-8℃,电活化的阴极电流密度为1-2.5A/dm2,电活化时间为1-5min,活化后取出用清水冲洗干净;所述的化学镀银工艺方法是:将镀镍层活化后的基体材料放入装有Na2SO3和AgNO3混合溶液的电镀槽中,电镀槽中每升混合溶液中Na2SO3含量为100-200g,AgNO3含量为0.8-1.5g,溶液温度保持12-25℃,电镀时间为5-60s;所述的在烟酸电镀银体系中双脉冲电镀银的工艺方法是:烟酸电镀银溶液由烟酸:80-150g/L、AgNO3:20-55g/L、K2CO3:60-100g/L、KOH:40-65g/L、NH4AC:60-80g/L、NH3·H2O:15-40ml/L组成,电镀溶液温度保持在12-25℃,双脉冲电镀电源的正向脉宽为2ms,占空比为20%,工作时间为100ms;反向脉宽为1ms,占空比为10%,工作时间为10ms,电镀时间0.5-6h。1. A method for cyanide-free electroplating silver, comprising: base material surface nickel-plated, nickel-plated layer activation treatment, electroplating silver on the nickel-plated layer, nickel-plated layer activation treatment is that the nickel-plated layer is electrically activated in acid solution Treatment, the silver electroplating method comprises chemical silver plating on the nickel plating layer and double pulse electroplating silver in the nicotinic acid electroplating silver system, it is characterized in that the method for electroactivating the nickel plating layer is: put the base material of nickel plating on the surface into In the electroactivation cell filled with H 2 SO 4 solution, the H 2 SO 4 solution contains 80-250 ml of H 2 SO 4 per liter of H 2 SO 4 solution, the concentration of H 2 SO 4 is 98%, and the solution temperature is kept At 4-8°C, the cathode current density of electroactivation is 1-2.5A/dm 2 , and the electroactivation time is 1-5min. After activation, take it out and rinse it with clean water; the electroless silver plating process method is: The matrix material after layer activation is put into an electroplating tank containing a mixed solution of Na 2 SO 3 and AgNO 3 , the content of Na 2 SO 3 in each liter of mixed solution in the electroplating tank is 100-200g, and the content of AgNO 3 is 0.8-1.5g , the solution temperature is maintained at 12-25°C, and the electroplating time is 5-60s; the process method of double-pulse electroplating silver in the nicotinic acid electroplating silver system is: the nicotinic acid electroplating silver solution is composed of nicotinic acid: 80-150g/L, AgNO 3 : 20-55g/L, K 2 CO 3 : 60-100g/L, KOH: 40-65g/L, NH 4 AC: 60-80g/L, NH 3 ·H 2 O: 15-40ml/L Composition, the temperature of the electroplating solution is kept at 12-25°C, the forward pulse width of the double-pulse electroplating power supply is 2ms, the duty cycle is 20%, and the working time is 100ms; the reverse pulse width is 1ms, and the duty cycle is 10%. The working time is 10ms, and the plating time is 0.5-6h.
CN2008100110059A 2008-04-11 2008-04-11 Cyanide-free silver electroplating method Expired - Fee Related CN101260551B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008100110059A CN101260551B (en) 2008-04-11 2008-04-11 Cyanide-free silver electroplating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2008100110059A CN101260551B (en) 2008-04-11 2008-04-11 Cyanide-free silver electroplating method

Publications (2)

Publication Number Publication Date
CN101260551A CN101260551A (en) 2008-09-10
CN101260551B true CN101260551B (en) 2010-06-09

Family

ID=39961238

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008100110059A Expired - Fee Related CN101260551B (en) 2008-04-11 2008-04-11 Cyanide-free silver electroplating method

Country Status (1)

Country Link
CN (1) CN101260551B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5346965B2 (en) * 2011-02-08 2013-11-20 Dowaメタルテック株式会社 Silver plating material and method for producing the same
CN102181892B (en) * 2011-05-18 2012-07-25 中国电子科技集团公司第三十八研究所 Method for improving bonding force of non-cyanide silver plating layer on nickel layer
CN103436931A (en) * 2013-08-26 2013-12-11 中国人民解放军第五七一九工厂 Bidirectional pulse silver-plating method
US10889907B2 (en) 2014-02-21 2021-01-12 Rohm And Haas Electronic Materials Llc Cyanide-free acidic matte silver electroplating compositions and methods
CN107419267A (en) * 2017-07-21 2017-12-01 广东欧珀移动通信有限公司 Processing technology of terminal shell, electronic equipment and terminal shell
CN107541759A (en) * 2017-09-05 2018-01-05 江小平 A kind of method for combining stainless steel with silver

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1286321A (en) * 1999-09-01 2001-03-07 中国科学院金属研究所 Process for plating flexible graphite products with thick silver layer
CN1680630A (en) * 2005-01-26 2005-10-12 上海大学 Process method of cyanide-free silver plating

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1286321A (en) * 1999-09-01 2001-03-07 中国科学院金属研究所 Process for plating flexible graphite products with thick silver layer
CN1680630A (en) * 2005-01-26 2005-10-12 上海大学 Process method of cyanide-free silver plating

Non-Patent Citations (10)

* Cited by examiner, † Cited by third party
Title
张允诚、胡如南、向荣.电镀手册 3.国防工业出版社,2007,313,473.
张允诚、胡如南、向荣.电镀手册 3.国防工业出版社,2007,313,473. *
朱志平.脉冲无氰镀银工艺技术探讨.电镀与环保8 6.1988,8(6),16-17.
朱志平.脉冲无氰镀银工艺技术探讨.电镀与环保8 6.1988,8(6),16-17. *
杨哲龙、安茂忠,李国强,张景双,屠振密,张桐滨.双向脉冲电镀银对抗变色能力的影响.哈尔滨工业大学学报29 2.1997,29(2),77-79.
杨哲龙、安茂忠,李国强,张景双,屠振密,张桐滨.双向脉冲电镀银对抗变色能力的影响.哈尔滨工业大学学报29 2.1997,29(2),77-79. *
苏永堂,成旦红,李科军,曹铁华,徐伟一.脉冲无氰镀银及镀层抗变色性能的研究.电镀与涂饰24 1.2005,24(1),1-5.
苏永堂,成旦红,李科军,曹铁华,徐伟一.脉冲无氰镀银及镀层抗变色性能的研究.电镀与涂饰24 1.2005,24(1),1-5. *
赵永岗,孙慧艳,赵林,周英杰.耐磨性脉冲镀银工艺研究.涂料涂装与电镀4 5.2006,4(5),30.
赵永岗,孙慧艳,赵林,周英杰.耐磨性脉冲镀银工艺研究.涂料涂装与电镀4 5.2006,4(5),30. *

Also Published As

Publication number Publication date
CN101260551A (en) 2008-09-10

Similar Documents

Publication Publication Date Title
CN102691081B (en) A kind of electroplating silver solution and electroplating method
CN102260891B (en) Method for electrodepositing nanocrystalline nickel-cobalt alloy by double-pulse
CN101445946B (en) Anticorrosive wearable electrodeposit clad layer of Ni-W-P ternary alloy and manufacturing technique and electroplate liquid thereof
CN104357883B (en) A kind of cyanide-free electroforming gold solution and electroforming gold method
CN102936742B (en) Method for electroplating black trivalent chromium on surface of plastic for vehicle decorating strip
CN101260551B (en) Cyanide-free silver electroplating method
CN102677116B (en) Method for dipulse preplating non-cyanide alkaline copper on ferro matrix
CN101054672B (en) Decorative Chrome Plating Process
JPS5932553B2 (en) How to form a strippable copper coating on aluminum
CN103014681A (en) Preparation method of Ni-P alloy gradient coating
CN102605393B (en) Ni-W-Fe-Co alloy electroplating liquid and electroplating process thereof
CN102363884B (en) Surface treatment process for zinc alloy die casting
CN110117783A (en) A kind of method of Electroless Nickel Plating of Aluminum Alloy mixed metal activation
CN105970197A (en) Electroless copper plating solution for zinc alloy and application of electroless copper plating solution
CN100410424C (en) Method for carrying out electroless plating and electroplating plating Ni-P coating in the same plating solution
CN204589340U (en) A kind of super anti-corrosion nickel plating-chromium parts
CN102181892B (en) Method for improving bonding force of non-cyanide silver plating layer on nickel layer
CN104514020A (en) Thiosulfate silvering plating solution
CN106591897B (en) A kind of cyanide-free ionic liquid copper plating solution and copper plating process
CN101555611B (en) Method for electroplating nickel on surface of magnesium alloy
CN100467675C (en) A kind of aluminum or aluminum alloy surface direct electroplating method
CN106245069A (en) A kind of preparation method of the quick electronickelling steel band for battery case
CN106535513B (en) Electronic product casing and its manufacturing method
CN101724871A (en) Double-pulse cyanide-free alkali silver electroplating method
CN102936741A (en) Nickel base alloy pre-planting electroplating method for aluminum or aluminum alloy

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100609