CN101259920B - Chip suction nozzle structure with elastic pad and manufacturing method thereof - Google Patents
Chip suction nozzle structure with elastic pad and manufacturing method thereof Download PDFInfo
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- CN101259920B CN101259920B CN2007100800312A CN200710080031A CN101259920B CN 101259920 B CN101259920 B CN 101259920B CN 2007100800312 A CN2007100800312 A CN 2007100800312A CN 200710080031 A CN200710080031 A CN 200710080031A CN 101259920 B CN101259920 B CN 101259920B
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- elastic pad
- suction nozzle
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- hole
- cushion
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000002994 raw material Substances 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 13
- 238000005520 cutting process Methods 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 6
- 238000003466 welding Methods 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 2
- 239000012790 adhesive layer Substances 0.000 claims 4
- 239000010410 layer Substances 0.000 claims 1
- 238000004080 punching Methods 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 29
- 238000001179 sorption measurement Methods 0.000 abstract description 4
- 230000002159 abnormal effect Effects 0.000 abstract 1
- 239000007779 soft material Substances 0.000 abstract 1
- 238000010521 absorption reaction Methods 0.000 description 15
- 239000011148 porous material Substances 0.000 description 10
- 238000010079 rubber tapping Methods 0.000 description 6
- 230000035807 sensation Effects 0.000 description 6
- 241001274660 Modulus Species 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005303 weighing Methods 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 3
- 239000012467 final product Substances 0.000 description 3
- 238000011084 recovery Methods 0.000 description 3
- 230000002745 absorbent Effects 0.000 description 2
- 239000002250 absorbent Substances 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
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Abstract
The invention relates to a chip suction nozzle structure with an elastic pad and a manufacturing method thereof, wherein the elastic pad has different elastic coefficients, so when the elastic pad is fixedly arranged on a suction nozzle and adsorbs a chip, the elastic pad cannot be twisted and closed due to axial pressure, and the situation of chip adsorption failure is relatively avoided. In addition, the invention changes the position of the elastic pad fixed on the suction nozzle, so that the suction nozzle can adsorb chips with smaller size without the problem of abnormal suction. In addition, the elastic cushion is obtained by cutting a strip-shaped elastic cushion raw material, so that the elastic cushion is easier to manufacture, and the cost of the elastic cushion can be reduced. Moreover, the strip-shaped elastic pad material can be a high-density elastic sponge elastic pad material which has the characteristics of soft material, high resilience and the like, so that when the elastic pad manufactured by the method is used for adsorbing a chip, the tin balls on the surface of the chip can be prevented from being crushed.
Description
Technical field
The present invention relates to a kind of chip suction nozzle structure and manufacture method thereof of tool cushion, especially refer to a kind of being applicable to when adsorbing chip, can avoid cushion to produce the closed problem of distortion, and can avoid weighing wounded the chip suction nozzle structure and the manufacture method thereof of the tool cushion of the tin ball on the chip because of axial pressure.
Background technology
After general chip manufacturing is finished, must test this chip, whether normal to understand this chip.And chip must adsorb this chip with suction nozzle when desiring to test, and moves between the carrier after carrier, test section, the test before test.
Seeing also Fig. 1 is the exploded drawings of existing chip adsorption structure, wherein shows a suction nozzle 91, an elastic sponge 92 and a chip of desiring to test 93.Wherein, elastic sponge 92 is to be sleeve-like and directly being sheathed on the suction nozzle 91, and after elastic sponge 92 is sheathed on the suction nozzle 91, elastic sponge 92 can protrude a little with respect to suction nozzle 91, afterwards, suction nozzle 91 is promptly inhaled hole 911 absorption chips 93 with it, and chip 93 can be therefore and elastic sponge 92 mutual pressings.
Have most tin balls 931 on the wherein one side of general chip 93, originally in order to avoid tin ball 931, suction nozzle 91 can adsorb the other one side that chip 93 does not have tin ball 931, but if chip 93 is image sensing component (Chip Image Sensor, CIS), then the wherein one side of this chip 93 is most tin balls 931, one side then is light sensation drafting board 932 in addition, because light sensation drafting board 932 can't adsorb (can cause 932 damages of light sensation drafting board), so suction nozzle 91 promptly must be adsorbed in the side that chip 93 has most tin balls 931.
Yet, with conventional confguration shown in Figure 1, elastic sponge 92 is directly to be sheathed on the suction nozzle 91, when period of service of a specified duration after, elastic sponge 92 can produce elastic fatigue most probably even understand therefore by dropping on the suction nozzle 91, so suction nozzle 91 in absorption during chip 93, can cause suction nozzle 91 directly touch chip 93 most tin balls 931, and therefore weigh most tin balls 931 wounded.
In addition, conventional confguration shown in Figure 1 is that elastic sponge 92 directly is sheathed on suction nozzle 91, so the area of suction nozzle 91 absorption must add the area of elastic sponge 92, that is when absorption, whole adsorption area is bigger, but chip 93 is because of designing chip 93 appearance that difference has reduced size, in in the case, suction nozzle 91 unusual phenomenon promptly might occur drawing, for example chip 93 run-off the straights etc. when the chip 93 of absorption reduced size.
Moreover traditional elastic sponge 92 only has an elasticity modulus, thus when suction nozzle 91 in absorption during chip 93, elastic sponge 92 is as easy as rolling off a log to twist closure because of axial pressure, chip 93 can't be adsorbed on the suction nozzle 91 and cause the absorption failure, real non-very good.
Summary of the invention
The object of the invention provides a kind of chip suction nozzle structure and manufacture method thereof of tool cushion.
The chip suction nozzle manufacture method of tool cushion of the present invention comprises the following steps:
Steps A: cutting one strip shape cushion raw material is to obtain at least one cushion;
Step B: heat a tapping machine, and run through above-mentioned at least one cushion obtaining a through hole, and heat through hole simultaneously to form a internal ring wall ring week in it than hard with the processing of aforesaid tapping machine; And
Step C: set firmly above-mentioned at least one cushion in the lower surface of a suction nozzle.
Therefore, the through hole of cushion can encircle the internal ring wall that forms in week than hard because of heating in it, that is cushion can have different elasticity moduluss, so when cushion is fixedly arranged on the suction nozzle lower surface and carries out the absorbent core sheet, the through hole of cushion can or not cause the situation of chip absorption failure relatively because of axial pressure produces the closed problem of distortion.
Moreover cushion is to be fixedly arranged on the suction nozzle lower surface, so can change cushion and be fixedly arranged on position on the suction nozzle, thus therefore make the chip of the adsorbable reduced size of suction nozzle, and can not draw unusual problem.
Again, cushion is cutting one a strip shape cushion raw material and getting, and gets final product so only need cut out step, so not only can make cushion be easier to make, and can reduce the cost of cushion again.
The strip shape cushion raw material of above-mentioned steps A can be a high density elastic sponge cushion raw material, and characteristics such as material is soft, recovery height that it can have are so its cushion that manufactures can avoid weighing wounded the tin ball on the chip surface when the absorption chip.
In addition, the chip suction nozzle structure of tool cushion of the present invention comprises a suction nozzle and a cushion.Wherein, suction nozzle includes a medium pore and a lower surface, and medium pore wherein is to penetrate lower surface.
In addition, cushion is the lower surface that is fixedly arranged on said suction nozzle, and this cushion and include a through hole, and it is corresponding and is communicated to the medium pore of suction nozzle, simultaneously, and the ring of through hole week and around becoming an internal ring wall.
The characteristic of said structure is that cushion has two kinds of different elasticity moduluss, and wherein, the elasticity modulus of the internal ring wall of through hole is the elasticity modulus greater than other position of cushion.
Therefore, said structure is the internal ring wall hard relatively that makes the cushion through hole, so can make through hole keep certain stiffness, so when making the cushion pressurized when suction nozzle absorption chip, the through hole of cushion can not twist closure because of axial pressure, can not cause the situation of chip absorption failure relatively.
In addition, same, cushion is to be fixedly arranged on the suction nozzle lower surface, so can change cushion and be fixedly arranged on position on the suction nozzle, thus therefore make the chip of the adsorbable reduced size of suction nozzle, and can not draw unusual problem.
Again, above-mentioned cushion can be a high density elastic sponge cushion, and characteristics such as material is soft, recovery height that it can have are so cushion can avoid weighing wounded the tin ball on the chip surface when the absorption chip.
Above-mentioned cushion can include a gum layer, and cushion is to see through gum layer is fixedly arranged on suction nozzle with gluing lower surface.Aforesaid gum layer central authorities can offer a through hole, this through hole be the corresponding medium pore that is communicated with suction nozzle, with the through hole of cushion.
Description of drawings
Fig. 1 is the exploded drawings of existing chip adsorption structure;
Fig. 2 is the diagram of circuit of a preferred embodiment of the present invention step;
Fig. 3 is the diagram of circuit that a preferred embodiment of the present invention is made;
Fig. 4 is the exploded drawings of a preferred embodiment of the present invention;
Fig. 5 is the cutaway view of a preferred embodiment of the present invention.
[primary clustering nomenclature]
Strip shape cushion raw material 11 cushions 12
Needle-like rod member 141 plugs 142 external power receptacles 15
242 light sensation drafting boards, 243 tin ball districts 244, operating area
The specific embodiment
Please consult simultaneously diagram of circuit that Fig. 2 is a preferred embodiment of the present invention step, and Fig. 3 be the diagram of circuit that a preferred embodiment of the present invention is made, wherein show the chip suction nozzle manufacture method of a tool cushion.
At first, be that cutting one strip shape cushion raw material 11 is to obtain a cushion 12 (SA), in the present embodiment, this strip shape cushion raw material 11 is a high density elastic sponge cushion raw material, and being with a blade 13 cutting strip shape cushion raw materials 11, is that 3.5mm, thickness are 1mm and the length of the cushion 12 that is cut out is 3.5mm, width.
Afterwards, heat a tapping machine 14, and run through above-mentioned cushion 12, on cushion 12, obtain a through hole 121, simultaneously, heat aforesaid through hole 121, to form a internal ring wall 120 (SB) ring week in it than hard with these tapping machine 14 processing.
In the present embodiment, tapping machine 14 is a welding gun 140, and this welding gun 140 includes a plug 142 and a needle-like rod member 141, needle-like rod member 141 wherein is to be circular bar shape, and its diameter is 0.8mm, and plug 142 is to be inserted in an external power receptacle 15 to heat aforesaid needle-like rod member 141.Therefore, be to utilize 141 pairs of cushions 12 of needle-like rod member of welding gun 140 to run through processing, with acquisition one through hole 121 on cushion 12, and heat aforesaid through hole 121 simultaneously, to form internal ring wall 120 ring week in it than hard.
Finish after the above-mentioned steps, set firmly the lower surface 161 (SC) of cushion 12 again in a suction nozzle 16.In present embodiment, cushion 12 is to see through a gum layer 17 is fixedly arranged on suction nozzle 16 with gluing lower surface 161.
Please consult simultaneously exploded drawings that Fig. 3, Fig. 4 are a preferred embodiment of the present invention, and Fig. 5 be the cutaway view of a preferred embodiment of the present invention, utilize above-mentioned manufacture method, can obtain the chip suction nozzle structure of a tool cushion, this structure below is described in detail in detail.
The chip suction nozzle structure of above-mentioned tool cushion includes a suction nozzle 16 and a cushion 12.Wherein, suction nozzle 16 is to be assembled in chip retrieval 160 (pick-up head) below, in order to absorption and put (pick-up and place) chip 24, and this suction nozzle 16 includes a medium pore 162 and a lower surface 161, and medium pore 162 wherein is to penetrate lower surface 161.
In the present embodiment, suction nozzle 16 is a metal suction nozzle, and this suction nozzle 16 is to be a hollow circular tube shape, and the diameter of this suction nozzle 16 is 3mm.
In addition, cushion 12 is to be fixedly arranged on the lower surface 161 of suction nozzle 16 and to have an elastic thickness t to provide a buffering pre-power with its upper surface 122, simultaneously, this cushion 12 includes a through hole 121, this through hole 121 is corresponding and is communicated to the medium pore 162 of said suction nozzle 16 that the ring of this through hole 121 week is also around becoming an internal ring wall 120 simultaneously.
In present embodiment, cushion 12 is to include a gum layer 17, and the upper surface 122 of cushion 12 is to see through this gum layer 17 is fixedly arranged on suction nozzle 16 with gluing lower surface 161.Aforesaid gum layer 17 central authorities offer a through hole 171, and this through hole 171 be the corresponding medium pore 162 that is communicated with suction nozzle 16, with the through hole 121 of cushion 12.
Again in present embodiment, cushion 12 is that a high density elastic sponge cushion (sees also Fig. 3, because of strip shape cushion raw material 11 is the event of a high density elastic sponge cushion raw material), and cushion 12 is that 3.5mm, width are that 3.5mm, thickness are 1mm as above-mentioned its length, simultaneously, the diameter of the through hole 121 of cushion 12 be 0.8mm (also see also Fig. 3, because of the diameter of the needle-like rod member 141 of welding gun 140 be 0.8mm so).
Above-mentioned structure is to be adsorbed on the tin sphere 240 of chip 24 in order to correspondence, include a tin ball district 244 and an operating area 242 on this tin sphere 240, wherein, tin ball district 244 is around operating area 242, and convex with most tin balls 241 in the Yu Xiqiu district 244, and the height of these most tin balls 241 is 0.2mm, is meant the specific plane district of protruding without any tin ball 241 on tin sphere 240 as for 242 of operating areas.
Again, the lower surface 123 of cushion 12 includes a contact surface 124 and a vacancy section 125, contact surface 124 wherein is to be surrounded on vacancy section 125 peripheries, vacancy section 125 is to correspond to through hole 121 and less than tin sphere 240, contact surface 124 is that correspondence is pressed in the tin ball district 244 and/or operating area 242 of tin sphere 240, therefore, it is airtight to impel vacancy section 125 to form.
So be connected to an exterior vacuum pump (figure does not show) so that a pull of vacuum to be provided when suction nozzle 16 sees through its medium pore 162, because the contact surface 124 of cushion 12 is over against answering cover cap to stress in the tin ball district 244 of chip 24 tin spheres 240 and forming airtight, so pull of vacuum just can see through the through hole 121 of cushion 12 and adsorb chip 24 with vacancy section 125, chip 24 can move to next processing procedure along with suction nozzle 16 afterwards.
Above-mentioned chip 24 is that (Chip Image Sensor, CIS), that is the another side of this chip 24 comprises a light sensation drafting board 243 to an image sensing component, and the length of chip 24 is that 4mm, width are 2.6mm in present embodiment.
Above-mentioned structure is to make cushion 12 have two kinds of different elasticity moduluss, wherein, the elasticity modulus K of the internal ring wall 120 of through hole 121 is the elasticity modulus K2 greater than cushion 12 other positions, that is the internal ring wall 120 of through hole 121 hard relatively, can make through hole 121 keep certain stiffness, so when cushion 12 pressurizeds, through hole 121 can not twist closure because of axial pressure.
Comprehensive speech, by by said structure, the through hole 121 of cushion 12 can encircle the internal ring wall 120 that forms in week than hard because of heating in it, that is cushion 12 can have different elasticity moduluss, so when cushion 12 is fixedly arranged on suction nozzle 16 lower surfaces 161 and carries out absorbent core sheet 24, the through hole 121 of cushion 12 can be because of axial pressure not produce the closed problem of distortion, can not cause the situation (for example distortion closed and make pull of vacuum can't pass through through hole 121) of chip 24 absorption failures relatively.
Moreover, cushion 12 is the lower surfaces 161 that are fixedly arranged on suction nozzle 16, so can change cushion 12 and be fixedly arranged on position on the suction nozzle 16, thus therefore make the chip 24 (for example the length 4mm of said chip 24, width 2.6mm) of suction nozzle 16 adsorbable reduced sizes, and can not draw unusual problem.
Again, cushion 12 is cutting one strip shape cushion raw materials 11 and getting, and gets final product (see also Fig. 3, for example carry out cutting with general blade 13 and get final product) so only need cut out step, so not only can make cushion 12 be easier to make, and can reduce the cost of cushion 12 again.
Strip shape cushion raw material 11 is a high density elastic sponge cushion raw material, and characteristics such as material is soft, recovery height that it can have are so its cushion that manufactures 12 can avoid weighing wounded chip 24 lip-deep tin balls 241 when absorption chip 24.
The foregoing description is only given an example for convenience of description, and the interest field that the present invention advocated should be as the criterion so that claim is described certainly, but not only limits to the foregoing description.
Claims (13)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100800312A CN101259920B (en) | 2007-03-05 | 2007-03-05 | Chip suction nozzle structure with elastic pad and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100800312A CN101259920B (en) | 2007-03-05 | 2007-03-05 | Chip suction nozzle structure with elastic pad and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101259920A CN101259920A (en) | 2008-09-10 |
| CN101259920B true CN101259920B (en) | 2011-11-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007100800312A Active CN101259920B (en) | 2007-03-05 | 2007-03-05 | Chip suction nozzle structure with elastic pad and manufacturing method thereof |
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| Country | Link |
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| CN (1) | CN101259920B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5921323B2 (en) * | 2012-05-11 | 2016-05-24 | 株式会社妙徳 | Transport holding tool and transport holding device |
| CN102730445B (en) * | 2012-06-29 | 2015-07-29 | 四川长虹电器股份有限公司 | A kind of vacuum sucking device |
| CN107402345B (en) * | 2016-05-18 | 2019-12-27 | 无锡华润安盛科技有限公司 | Vacuum adsorption device for chip testing equipment |
| CN107478259A (en) * | 2017-07-18 | 2017-12-15 | 上海申矽凌微电子科技有限公司 | The test device and method of testing of sensor chip batch production |
| CN110018409A (en) * | 2019-04-22 | 2019-07-16 | 蒙泽喜 | A kind of chip-detecting apparatus of safe and reliable anti-tamper |
| CN111889902B (en) * | 2020-06-11 | 2022-04-15 | 苏州富强科技有限公司 | Suction mechanism for laser welding |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2430407Y (en) * | 2000-06-02 | 2001-05-16 | 陈聪智 | Improved structure of gasket suction device |
| CN1740797A (en) * | 2004-08-27 | 2006-03-01 | 京元电子股份有限公司 | Method and device for picking and placing electronic components to be tested |
| CN1754796A (en) * | 2004-09-30 | 2006-04-05 | 东京毅力科创株式会社 | Base board delivery device |
| EP1685930A1 (en) * | 2003-11-21 | 2006-08-02 | Mitsuboshi Diamond Industrial Co., Ltd. | Vacuum suction head, and vacuum suction device and table using the same |
-
2007
- 2007-03-05 CN CN2007100800312A patent/CN101259920B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2430407Y (en) * | 2000-06-02 | 2001-05-16 | 陈聪智 | Improved structure of gasket suction device |
| EP1685930A1 (en) * | 2003-11-21 | 2006-08-02 | Mitsuboshi Diamond Industrial Co., Ltd. | Vacuum suction head, and vacuum suction device and table using the same |
| CN1740797A (en) * | 2004-08-27 | 2006-03-01 | 京元电子股份有限公司 | Method and device for picking and placing electronic components to be tested |
| CN1754796A (en) * | 2004-09-30 | 2006-04-05 | 东京毅力科创株式会社 | Base board delivery device |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2005-22844A 2005.01.27 |
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| CN101259920A (en) | 2008-09-10 |
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