CN107478259A - The test device and method of testing of sensor chip batch production - Google Patents
The test device and method of testing of sensor chip batch production Download PDFInfo
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- CN107478259A CN107478259A CN201710586337.9A CN201710586337A CN107478259A CN 107478259 A CN107478259 A CN 107478259A CN 201710586337 A CN201710586337 A CN 201710586337A CN 107478259 A CN107478259 A CN 107478259A
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- 238000012360 testing method Methods 0.000 title claims abstract description 94
- 238000010923 batch production Methods 0.000 title claims abstract description 27
- 238000010998 test method Methods 0.000 title claims abstract description 9
- 238000007789 sealing Methods 0.000 claims abstract description 41
- 238000012956 testing procedure Methods 0.000 claims abstract description 9
- 238000002360 preparation method Methods 0.000 claims abstract description 6
- 230000007246 mechanism Effects 0.000 claims description 46
- 238000000034 method Methods 0.000 claims description 16
- 238000010521 absorption reaction Methods 0.000 claims description 9
- 230000005611 electricity Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 239000007789 gas Substances 0.000 description 48
- 230000008569 process Effects 0.000 description 5
- 238000005259 measurement Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 239000012855 volatile organic compound Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000036541 health Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 1
- 239000003034 coal gas Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000011067 equilibration Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000002737 fuel gas Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000003345 natural gas Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000011122 softwood Substances 0.000 description 1
- 230000004083 survival effect Effects 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 230000001131 transforming effect Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D18/00—Testing or calibrating apparatus or arrangements provided for in groups G01D1/00 - G01D15/00
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2829—Testing of circuits in sensor or actuator systems
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Abstract
The invention provides a kind of test device of sensor chip batch production, including wand body (3), delivery pipe (4) and wand contact (15), wand sealing ring (2)；The wand contact (15) is connected with one end of the wand body (3)；The delivery pipe (4) is connected with the other end of the wand body (3)；The wand sealing ring (2) is located at the outside of the wand contact (15)；The wand sealing ring (2) matches with the wand contact (15).Present invention also offers a kind of method of testing of sensor chip batch production, including step is completed in preparation process, testing procedure and test before test.The present invention has without constant temperature, constant humidity condition：Without complicated auxiliary equipment, while save and reached constant temperature, the stand-by period needed for constant humidity.The present invention has single temperature conditionss：It can carry out the beneficial effect such as testing without between different temperatures switching, at the temperature, damp condition in production environment.
Description
Technical field
The present invention relates to test device, in particular it relates to a kind of test device of sensor chip batch production and its side
Method, more particularly to the test device and its method of testing of the production of a kind of temperature, humidity, gas three-in-one sensor chip batch.
Background technology
Temperature, the humidity physical quantity basic as two, in industry, agricultural, medical treatment and the production activity of meteorological field
And need to gather in the life of people, in most cases, temperature, humidity need to gather simultaneously.Gas sensor conduct
The important means of environment for human survival monitoring, it is increasing to be measured.The toxic and harmful gas of human health is especially endangered,
Including CO, SO2、NO2、O3And VOC (Volatile Organic Compound, VOC) gas etc..With
And the flammable explosive gas of human security is endangered, include the monitoring etc. of the fuel gas such as natural gas, coal gas.And the essence of gas concentration
Really measurement is, it is necessary to the calibration of temperature and humidity.Therefore temperature, humidity, the three-in-one integrated sensor chip of gas are as environment
Humiture and the important means of gas concentration collection, before having wide application in fields such as environmental monitoring, medical treatment ＆ healths
Scape.In particular with the rise of Internet of Things, wearable device and smart home, there is an urgent need to a kind of quick, economy, it is suitable for
The measurement apparatus of production in enormous quantities.
The foundation of the test microenvironment required for sensor chip can be realized using this device, it is real by simply transforming
The test of existing new gas and multiple gases sensor chip.Such as the patent document of Application No. 201510114499.3,
The response time measurement apparatus and measuring method of a kind of humidity sensor under two different damp conditions, it is necessary to measure two groups
Data, test device is complicated in addition, testing time length, it has not been convenient to for producing in enormous quantities.Application No. for another example
03800112.8 (the applying date：2013.1.3 patent document), although need not be tested under multiple temperature conditionss, need
Two groups of data are tested under two pressure conditions, same test device is complicated, and time-consuming.Such as Application No. again
201611142346.0 the patent document of entitled gas sensor measurer and method of testing, the test for gas,
Need the mechanical mechanism and control device of complexity, such as air distribution system, gas handling system etc..
Quickly, economic requirement refers on the premise of meeting measuring accuracy, takes detector (Tester), processor
(Handler) time is short.The present invention does not have particular/special requirement to Tester, Handler, in order to build a metastable temperature
Degree, humidity and gaseous environment, increase a special socket (Socket), and the temperature, humidity in Socket do not require constant,
As shown in Figure 2.Certain equilibration time is needed because the humidity-sensitive material of humidity sensor chip absorbs steam and discharges steam, is
Raising measurement efficiency, every time can be tested simultaneously using multiple Xi Bi ＆Socket, such as 4,8 or 16, it is so single
Chips mean test time is short, can accomplish to be less than 5 seconds.
The content of the invention
For in the prior art the defects of, it is an object of the invention to provide a kind of sensor chip batch production test dress
Put and its method.
The test device produced in batches according to a kind of sensor chip provided by the invention, it is characterised in that including wand
Body, delivery pipe and wand contact, wand sealing ring；
The wand contact is connected with one end of the wand body；
The delivery pipe is connected with the other end of the wand body；
The wand sealing ring is located at the outside of the wand contact；
The wand sealing ring matches with the wand contact.
Preferably, in addition to the wand sealing ring socket and cavity mechanism to match；
The wand contact includes wand contact suction nozzle；
The cavity mechanism is located in the socket；
The socket includes sensor chip installing space；
After sensor chip is arranged on the sensor chip installing space, the wand contact suction nozzle and sensor core
Cavity mechanism is formed between piece, cavity mechanism is formed between the wand sealing ring and socket；
The socket has groove；
The sensor chip installing space is located in the groove of the socket；
The socket also includes temperature sensor；
The temperature sensor is located at the inwall of the socket；
One end of the wand contact is connected with one end of the wand body；
The other end of the wand contact extends longitudinally out wand contact absorption end；
The wand contact suction nozzle is circumferentially placed on the wand contact absorption end；
The wand contact absorption end is located at the bottom of the wand sealing ring；
Junction between the wand body and wand contact is located at the top of the wand sealing ring.
Preferably, in addition to load testing plate；
The load testing plate is located at the bottom of the socket；
The wand body has groove and fin；
There is mounting hole on the wand sealing ring；
The wand contact is along longitudinally through in the mounting hole；
It is brought into close contact between the wand contact and the mounting hole.
Preferably, there is salient point on the surface of the wand sealing ring；
The salient point is used to increase the frictional force between the wand sealing ring and the socket；
The surface of the wand contact suction nozzle has groove and fin；
The groove and fin of the wand contact suction nozzle are used to increase the wand contact suction nozzle and the sensor chip
Between frictional force, make to be brought into close contact between both the wand contact suction nozzle and the sensor chip.
Preferably, in addition to delivery pipe, branched pipe and electromagnetic valve mechanism；
The electromagnetic valve mechanism includes vavuum pump magnetic valve, dry air magnetic valve, humid air magnetic valve, first gas electricity
Magnet valve and second gas magnetic valve；
One end of the delivery pipe is connected with the wand body phase；
The other end of the delivery pipe is connected with one end of branched pipe；
The other end of the branched pipe extends the electromagnetic valve mechanism.
Preferably, cavity mechanism includes the first cavity and the second cavity；
After sensor chip is arranged on the sensor chip installing space, the wand contact suction nozzle and sensor core
The second cavity is formed between piece, the first cavity is formed between the wand sealing ring and socket.
It is to utilize above-mentioned sensor chip present invention also offers a kind of method of testing of sensor chip batch production
The test device of batch production carries out the method for testing of batch testing to sensor chip；
Step is completed including preparation process, testing procedure and test before test.
Preferably, preparation process includes cavity forming step before test, step is placed in crawl；
In cavity forming step,
Other magnetic valves in addition to vavuum pump magnetic valve in electromagnetic valve mechanism are closed, make to form the 3rd sky in wand contact
Chamber；
In step is placed in the crawl,
Sensor chip is captured with wand contact；Sensor chip is placed in the socket, and forms the cavity
The first cavity and the second cavity of mechanism.
Preferably, the testing procedure includes microenvironment forming step, residual gas drain steps；
In microenvironment forming step,
The vavuum pump magnetic valve of the electromagnetic valve mechanism is closed, opens the dry air magnetic valve of the electromagnetic valve mechanism,
Make to form test microenvironment in the second cavity of the cavity mechanism；
Carry out to sensor core built-in testing；
In residual gas drain steps,
The dry air magnetic valve is closed, the vavuum pump magnetic valve is opened, wand contact is moved up；Make described first
The residual gas of cavity and the second cavity is discharged.
Preferably, in testing procedure is completed,
Vavuum pump magnetic valve is closed, humid air magnetic valve is opened, microenvironment is formed in the second cavity, to the sensor
Chip is tested；
Wherein, according to different test environments and purpose, vavuum pump magnetic valve is closed, is opened in corresponding electromagnetic valve mechanism except true
Any of other magnetic valves outside empty pump magnetic valve；
Complete the test to sensor chip.
Compared with prior art, the present invention has following beneficial effect：
1st, without constant temperature, constant humidity condition：Auxiliary equipment that need not be complicated, also save required for reaching constant temperature, constant humidity
Stand-by period.
2nd, single temperature conditionss：Without switching between different temperatures, can be carried out at the temperature, damp condition in production environment
Test.
3rd, set test environment time short：Test environment cavity [10], absolute volume is small, therefore the gas in space is very
It is filled and is evacuated soon.
4th, gas consumption is small：Microenvironment cavity [10] is tested, absolute volume is small, therefore the gas flow full of this space
Very little.
5th, new gas is increased, by simply changing, you can realize, easily extension.
Brief description of the drawings
The detailed description made by reading with reference to the following drawings to non-limiting example, further feature of the invention,
Objects and advantages will become more apparent upon：
Fig. 1 is the test device of sensor of the invention chip batch production.
Fig. 2 is that the vacuum chamber of the test device of sensor of the invention chip batch production forms schematic diagram.
Fig. 3 is the sensor chip schematic diagram mentioned by the present invention.
Fig. 4 be Fig. 3 along A-A to profile.
Fig. 5 is the structural representation of the wand body and delivery pipe in the present invention.
Fig. 6 is the schematic diagram that the wand body in the present invention is connected with wand contact suction nozzle.
Fig. 7 is the upward view of the wand contact suction nozzle in the present invention.
Shown in figure：
Embodiment
With reference to specific embodiment, the present invention is described in detail.Following examples will be helpful to the technology of this area
Personnel further understand the present invention, but the invention is not limited in any way.It should be pointed out that the ordinary skill to this area
For personnel, without departing from the inventive concept of the premise, some changes and improvements can also be made.These belong to the present invention
Protection domain.
As shown in figure 1, a kind of test device of sensor chip batch production, including wand body 3, delivery pipe 4 and suction
Style of writing is first 15, wand sealing ring 2；The wand contact 15 is connected with one end of the wand body 3；The delivery pipe 4 and institute
The other end for stating wand body 3 is connected；The wand sealing ring 2 is located at the outside of the wand contact 15；The wand sealing
Circle 2 matches with the wand contact 15.
As shown in Fig. 2 a kind of test device of sensor chip batch production, in addition to the phase of wand sealing ring 2
The socket 1 and cavity mechanism of matching；The wand contact 15 includes wand contact suction nozzle 11；The wand contact suction nozzle 11 is excellent
Choosing for flexible softwood matter；The cavity mechanism is located in the socket 1；The socket 1 is pacified including sensor chip
Fill space；After sensor chip 12 is arranged on the sensor chip installing space, the wand contact suction nozzle 11 and sensing
Cavity mechanism is formed between device chip 12, cavity mechanism is formed between the wand sealing ring 2 and socket 1；The socket 1 has
Groove；The sensor chip installing space is located in the groove of the socket 1；The socket 1 also includes temperature sensor 13；
The temperature sensor 13 is located at the inwall of the socket 1；One end of the wand contact 15 and one end phase of the wand body 3
Connection；The other end of the wand contact 15 extends longitudinally out wand contact absorption end 16；The edge of wand contact suction nozzle 11
It is circumferentially disposed on wand contact absorption end 16；The wand contact absorption end 16 is located under the wand sealing ring 2
Portion；Junction between the wand body 3 and wand contact 15 is located at the top of the wand sealing ring 2.
A kind of test device of sensor chip batch production, in addition to load testing plate 8；The load testing plate 8
In the bottom of the socket 1；The wand body 3 has groove and fin；The wand contact suction nozzle 11 by the groove and
The structure that fin is formed is connected with one end of the wand body 3；In addition, wand sealing ring 2 passes through the groove and fin structure
Into structure be in contact with wand body 3；The delivery pipe 4 is another by the structure that groove and fin are formed and the wand body 3
One end is connected, so as to have the function that to increase frictional force；There is mounting hole on the wand sealing ring 2；The wand contact
15 along longitudinally through in the mounting hole；It is brought into close contact between the wand contact 15 and the mounting hole.
Specifically, the groove and fin that the wand body 3 has, respectively positioned at the sidepiece and wand of the wand body 3
The both ends of body 3.
As shown in fig. 6, one end of the wand body 3 has a groove and fin, one end of the wand body 3 have groove and
Fin forms the installation position of the wand contact suction nozzle 11, wand contact suction nozzle 11 is circumferentially embedded in installation position fixed.
Due to this feature, the wand body 3 can be enable preferably closely to be pasted with sensor chip by wand contact suction nozzle 11
Close, so as to form microenvironment, make test result more accurate.The wand contact suction nozzle 11 is preferably cushion rubber, can make wand
Contact suction nozzle 11 is brought into close contact with sensor chip.
As shown in figure 5, the other end of the wand body 3 has a groove and fin, and the other end of the wand body 3 with
One end 401 of the delivery pipe is connected, and the delivery pipe 4 is preferably flexible pipe；The flexible pipe can easily with it is described
Wand body 3 has the part of groove and fin to close connection；Because the another port of wand body 3 has this of groove and fin
One feature, the other end of wand body 3 is closely connected with the delivery pipe 4, the phenomenon without producing gas leakage, reach simultaneously
To closed effect, other gases to get into the air herein will not be made, and influence test effect.
There is salient point on the surface of the wand sealing ring 2；The salient point be used for increase the wand sealing ring 2 with it is described
Frictional force between socket 1；The surface of the wand contact suction nozzle 11 has groove and fin；The wand contact suction nozzle 11
Groove and fin are used to increase the frictional force between the wand contact suction nozzle 11 and the sensor chip 12, make the wand
It is brought into close contact between both contact suction nozzle 11 and the sensor chip 12.
A kind of test device of sensor chip batch production, in addition to delivery pipe 4, branched pipe 5 and electromagnetic valve mechanism
6；The electromagnetic valve mechanism 6 includes vavuum pump magnetic valve 61, dry air magnetic valve 62, humid air magnetic valve 63, first gas
Magnetic valve 64 and second gas magnetic valve 65；One end 401 of the delivery pipe is connected with the wand body 3；The conveying
The other end of pipe 4 is connected with one end of branched pipe 5；The other end of the branched pipe 5 extends the electromagnetic valve mechanism 6.
Cavity mechanism includes the first cavity 9 and the second cavity 10；When sensor chip 12 is arranged on the sensor chip
After installing space, the second cavity 10, the wand sealing ring 2 are formed between the wand contact suction nozzle 11 and sensor chip 12
The first cavity 9 is formed between socket 1.
A kind of method of testing of sensor chip batch production, is the test produced in batches using above-mentioned sensor chip
Device carries out the method for testing of batch testing to sensor chip 12；Including preparation process, testing procedure and test before test
Complete step.
Preparation process includes cavity forming step before test, step is placed in crawl；In cavity forming step, electromagnetism is closed
Other magnetic valves in valve system 6 in addition to vavuum pump magnetic valve 61, make to form the 3rd cavity in wand contact 15；Grabbed described
Pick and place and put in step, sensor chip 12 is captured with wand contact 15；Sensor chip 12 is placed in the socket 1, and
Form the first cavity 9 and the second cavity 10 of the cavity mechanism.
The testing procedure includes microenvironment forming step, residual gas drain steps；In microenvironment forming step, close
The vavuum pump magnetic valve 61 of the electromagnetic valve mechanism 6 is closed, the dry air magnetic valve 62 of the electromagnetic valve mechanism 6 is opened, makes institute
State and test microenvironment is formed in the second cavity 10 of cavity mechanism；Sensor chip 12 is tested；Discharged in residual gas
In step, the dry air magnetic valve 62 is closed, the vavuum pump magnetic valve 61 is opened, wand contact 15 is moved up；Make institute
The residual gas for stating the first cavity 9 and the second cavity 10 is discharged.
In testing procedure is completed, vavuum pump magnetic valve 61 is closed, humid air magnetic valve 63 is opened, in the second cavity 10
Microenvironment is formed, the sensor chip 12 is tested；Wherein, according to different test environments and purpose, vavuum pump is closed
Magnetic valve 61, open any of other magnetic valves in corresponding electromagnetic valve mechanism 6 in addition to vavuum pump magnetic valve 61；Complete
Test to sensor chip 12.
Specifically, the cavity that first cavity 9 is formed by wand sealing ring 2, the centre bore of socket 1；Described second is empty
The cavity that chamber 10 is formed by wand suction nozzle 11, the upper surface of sensor chip 12；The temperature sensor 13 senses for reference temperature
Device (Reference Temperature Sensor).
Heretofore described sensor chip is preferably temperature, humidity, gas and passes three-in-one sensor chip, the temperature
Degree, humidity, gas pass three-in-one sensor chip, are that automatic test is realized on gripping-type manipulator (Pick＆Place Handler)
, test process is described as follows.
After wand body 3 grabs sensor chip 12 by opening vavuum pump magnetic valve 61, socket 1 is put it to
(Socket1) in the cavity that five faces have been closed, and compress, now, wand contact suction nozzle 11 and the surface of sensor chip 12 are direct
The second cavity 10 of opposing seal is formed, builds the test microenvironment of sensor chip 12.
Now, the upper surface of the wand sealing ring 2 on wand body 3 and socket 1 is closely adjacent to, and is so just formed another relative
First cavity 9 of sealing, the buffering area as test the second cavity of microenvironment 10.The centre bore of wand body 3, it is test microenvironment
The unique passage that second cavity 10 and external environment exchange.
The end of wand body 3 is connected to branched pipe 5 by delivery pipe 4, and branched pipe 5 extends electromagnetic valve mechanism 6, magnetic valve
Multiple magnetic valves extend again in mechanism 6, and each of which magnetic valve is respectively connecting to different sources of the gas, for example, vavuum pump, dry air
(RH=20%), humid air (RH=80%), first gas prescribed concentration, second gas prescribed concentration etc..Need what is illustrated
It is a kind of embodiment that it is the present invention that above-mentioned these sources of the gas being previously mentioned, which are, NM source of the gas is also in this hair in the present invention
In bright protection domain, the magnetic valve in the electromagnetic valve mechanism 6 can also be connected with NM source of the gas in other present invention
Connect, so as to reach the test purpose different to sensor chip 12.
Each magnetic valve marks into 61-65 respectively, can have individually switch respectively, to control different sources of the gas to be injected into survey
The second cavity of microenvironment 10 is tried, the gas test environment of the needs of sensor chip 12 is built in the second cavity 10.Change every time
Become microenvironment, inject before different gas, connect vavuum pump magnetic valve 61, the gas of the second cavity 10 will be by vacuum pumping
Walk.Prepared so as to build vacuum environment for test next time.
After all tests terminate, in addition to vavuum pump magnetic valve 61, other all magnetic valve 62-65 are closed, wand body 3 from
Taken out in socket 1, according to test result (acceptance or rejection), sensor chip 12 is placed on corresponding pallet or winding
It is interior.
The method of testing (hereinafter referred to as method) of sensor chip batch production provided by the invention can decompose more in detail
Into some following important steps (it should be noted that important step of the following steps for method provided by the invention, the present invention
In NM step it is also within the scope of the present invention)：
Step 1：Close other magnetic valves i.e. dry air magnetic valve 62, humid air magnetic valve 63, first gas magnetic valve
64th, second gas magnetic valve 65, vavuum pump magnetic valve 61 is opened, the inner chamber of wand body 3 is formed negative pressure.
Step 2：Wand body 3 captures sensor chip 12, it is ensured that sensing can be completely covered in the inner chamber of wand contact suction nozzle 11
The perforate of device chip 12.
Step 3：After grabbing sensor chip 12, by motor-driven mechanical device, put it into socket 1, and will
It is compressed, it is ensured that the surface of wand contact suction nozzle 11 and sensor chip 12 is adjacent to, and so as to form the second cavity 10, is ensured simultaneously
The surface of wand sealing ring 2 and socket 1 is adjacent to, and forms the first cavity 9.
Step 4：Vavuum pump magnetic valve 61 is closed, according to the testing process of sensor chip 12, opens dry air electromagnetism
Valve 62, the microenvironment required for the second cavity 10 establishes sensor chip 12, and malleation is formed in the second cavity 110, to passing
Sensor chip 12 is tested accordingly.
Step 5：After this item test terminates, dry air magnetic valve 62 is closed, vavuum pump magnetic valve 61 is opened, wand is touched
Head suction nozzle 11 is gently moved up, and the gas remained in the second cavity 10 and the first cavity 9 is discharged.
Step 6：Vavuum pump magnetic valve 61 is closed, according to the testing process of sensor chip 12, opens humid air magnetic valve 63,
Microenvironment required for the second cavity 10 establishes sensor chip 12, and malleation is formed in the second cavity 10, to sensor core
Piece 12 is tested accordingly.
Step 7：Repeat step 5.
Step 8：Vavuum pump magnetic valve 61 is closed, according to the testing process of sensor chip 12, opens first gas magnetic valve
64, the microenvironment required for the second cavity 10 establishes sensor chip 12, and malleation is formed in the second cavity 10, to sensor
Chip 12 is tested accordingly.
Step 9：Repeat step 5.
Step 10：Vavuum pump magnetic valve 61 is closed, according to the testing process of sensor chip 12, opens second gas magnetic valve
65, sensor chip 12 is tested accordingly.
Step 11：Repeat step 5.
Until the test of all test items terminates.Life explanation is needed exist for, the present invention is not restricted to above-mentioned carried
Five magnetic valves arrived, it can also be in more or less protection domain all in the present invention.
If multiple gases sensor, this test device can be extended, and corresponding mark is connected to by electromagnetic valve mechanism
Quasi- concentration gases, then it can be achieved according to above step handover operation.
The embodiment mentioned in above-mentioned is only one of which embodiment in the present invention, and accompanying drawing is only to be of the invention in the present invention
One of which embodiment, the present invention in NM embodiment, also within the scope of the present invention；It should be noted that accompanying drawing
7 be the one of which embodiment of the test object in the present invention, and in other words, the sensor chip in Fig. 7 is this present invention's
Test object, this sensor chip are one of which embodiment of the invention, and the present invention can also use other kinds of sensing
Device chip is as test object, within the scope of the present invention.
The specific embodiment of the present invention is described above.It is to be appreciated that the invention is not limited in above-mentioned
Particular implementation, those skilled in the art can make a variety of changes or change within the scope of the claims, this not shadow
Ring the substantive content of the present invention.In the case where not conflicting, the feature in embodiments herein and embodiment can any phase
Mutually combination.
Claims (10)
- A kind of 1. test device of sensor chip batch production, it is characterised in that including wand body (3), delivery pipe (4) and Wand contact (15), wand sealing ring (2)；The wand contact (15) is connected with one end of the wand body (3)；The delivery pipe (4) is connected with the other end of the wand body (3)；The wand sealing ring (2) is located at the outside of the wand contact (15)；The wand sealing ring (2) matches with the wand contact (15).
- 2. the test device of sensor chip according to claim 1 batch production, it is characterised in that also include with it is described The socket (1) and cavity mechanism that wand sealing ring (2) matches；The wand contact (15) includes wand contact suction nozzle (11)；The cavity mechanism is located in the socket (1)；The socket (1) includes sensor chip installing space；After sensor chip (12) is arranged on the sensor chip installing space, the wand contact suction nozzle (11) and sensing Cavity mechanism is formed between device chip (12), cavity mechanism is formed between the wand sealing ring (2) and socket (1)；The socket (1) has groove；The sensor chip installing space is located in the groove of the socket (1)；The socket (1) also includes temperature sensor (13)；The temperature sensor (13) is located at the inwall of the socket (1)；One end of the wand contact (15) is connected with one end of the wand body (3)；The other end of the wand contact (15) extends longitudinally out wand contact absorption end (16)；The wand contact suction nozzle (11) is circumferentially placed on wand contact absorption end (16)；Wand contact absorption end (16) is located at the bottom of the wand sealing ring (2)；Junction between the wand body (3) and wand contact (15) is located at the top of the wand sealing ring (2).
- 3. the test device of sensor chip batch production according to claim 1, it is characterised in that also include load and survey Test plate (panel) (8)；The load testing plate (8) is located at the bottom of the socket (1)；The wand body (3) has groove and fin；There is mounting hole on the wand sealing ring (2)；The wand contact (15) is along longitudinally through in the mounting hole；It is brought into close contact between the wand contact (15) and the mounting hole.
- 4. the test device of sensor chip batch production according to claim 1, it is characterised in that the wand sealing Enclosing on the surface of (2) has salient point；The salient point is used to increase the frictional force between the wand sealing ring (2) and the socket (1)；The surface of the wand contact suction nozzle (11) has groove and fin；The groove and fin of the wand contact suction nozzle (11) are used to increase the wand contact suction nozzle (11) and the sensor Frictional force between chip (12), make close between both the wand contact suction nozzle (11) and the sensor chip (12) Fitting.
- 5. the test device of sensor chip batch production according to claim 1, it is characterised in that also including delivery pipe (4), branched pipe (5) and electromagnetic valve mechanism (6)；The electromagnetic valve mechanism (6) includes vavuum pump magnetic valve (61), dry air magnetic valve (62), humid air magnetic valve (63), first gas magnetic valve (64) and second gas magnetic valve (65)；One end (401) of the delivery pipe is connected with the wand body (3)；The other end of the delivery pipe (4) is connected with one end of branched pipe (5)；The other end of the branched pipe (5) extends the electromagnetic valve mechanism (6).
- 6. the test device of sensor chip batch production according to claim 1, it is characterised in that cavity mechanism includes First cavity (9) and the second cavity (10)；After sensor chip (12) is arranged on the sensor chip installing space, the wand contact suction nozzle (11) and sensing The second cavity (10) is formed between device chip (12), the first cavity (9) is formed between the wand sealing ring (2) and socket (1).
- 7. a kind of method of testing of sensor chip batch production, it is characterised in that be to utilize any in claim 1 to 6 The test device of sensor chip batch production described in carries out the method for testing of batch testing to sensor chip (12)；Step is completed including preparation process, testing procedure and test before test.
- 8. the method for testing of sensor chip batch production according to claim 7, it is characterised in that prepare step before test Suddenly cavity forming step is included, step is placed in crawl；In cavity forming step,Other magnetic valves in addition to vavuum pump magnetic valve (61) in electromagnetic valve mechanism (6) are closed, make wand contact (15) interior shape Into the 3rd cavity；In step is placed in the crawl,With wand contact (15) crawl sensor chip (12)；Sensor chip (12) is placed in the socket (1), and shape Into the first cavity (9) and the second cavity (10) of the cavity mechanism.
- 9. the method for testing of sensor chip batch production according to claim 7, it is characterised in that the testing procedure Including microenvironment forming step, residual gas drain steps；In microenvironment forming step,The vavuum pump magnetic valve (61) of the electromagnetic valve mechanism (6) is closed, opens the dry air electricity of the electromagnetic valve mechanism (6) Magnet valve (62), make to form test microenvironment in the second cavity (10) of the cavity mechanism；Sensor chip (12) is tested；In residual gas drain steps,The dry air magnetic valve (62) is closed, the vavuum pump magnetic valve (61) is opened, wand contact (15) is moved up；Make First cavity (9) and the residual gas of the second cavity (10) are discharged.
- 10. the method for testing of sensor chip batch production according to claim 7, it is characterised in that complete to test In step,Vavuum pump magnetic valve (61) is closed, opens humid air magnetic valve (63), microenvironment is formed in the second cavity (10), to institute Sensor chip (12) is stated to be tested；Wherein, according to different test environments and purpose, vavuum pump magnetic valve (61) is closed, is opened in corresponding electromagnetic valve mechanism (6) Any of other magnetic valves in addition to vavuum pump magnetic valve (61)；Complete the test to sensor chip (12).
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Cited By (1)
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Application publication date: 20171215 |