CN101241125A - Piezoelectric sensor for liquid phase measuring and encapsulation method - Google Patents
Piezoelectric sensor for liquid phase measuring and encapsulation method Download PDFInfo
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- CN101241125A CN101241125A CNA200810065779XA CN200810065779A CN101241125A CN 101241125 A CN101241125 A CN 101241125A CN A200810065779X A CNA200810065779X A CN A200810065779XA CN 200810065779 A CN200810065779 A CN 200810065779A CN 101241125 A CN101241125 A CN 101241125A
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- 238000000034 method Methods 0.000 title claims abstract description 38
- 239000007791 liquid phase Substances 0.000 title claims abstract description 14
- 238000005538 encapsulation Methods 0.000 title abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims abstract description 53
- 239000002184 metal Substances 0.000 claims abstract description 53
- 239000013078 crystal Substances 0.000 claims description 47
- 230000035945 sensitivity Effects 0.000 claims description 43
- 238000012856 packing Methods 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 9
- 239000012530 fluid Substances 0.000 claims description 8
- 238000001704 evaporation Methods 0.000 claims description 7
- 230000008020 evaporation Effects 0.000 claims description 7
- 239000011810 insulating material Substances 0.000 claims description 6
- 230000007797 corrosion Effects 0.000 claims description 4
- 238000005260 corrosion Methods 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 238000010276 construction Methods 0.000 claims description 3
- 238000010008 shearing Methods 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 2
- 239000004033 plastic Substances 0.000 claims description 2
- 229920003023 plastic Polymers 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 229920000052 poly(p-xylylene) Polymers 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 238000003754 machining Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 abstract description 17
- 238000005259 measurement Methods 0.000 abstract description 6
- 238000012360 testing method Methods 0.000 abstract description 5
- 230000010354 integration Effects 0.000 abstract 1
- 239000010453 quartz Substances 0.000 description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 15
- 239000000523 sample Substances 0.000 description 14
- 238000001514 detection method Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 11
- 239000012528 membrane Substances 0.000 description 7
- 238000003380 quartz crystal microbalance Methods 0.000 description 7
- 238000013461 design Methods 0.000 description 6
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 3
- 238000004401 flow injection analysis Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000000427 antigen Substances 0.000 description 2
- 102000036639 antigens Human genes 0.000 description 2
- 108091007433 antigens Proteins 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 238000003745 diagnosis Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000006664 bond formation reaction Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The present invention provides a piezoelectric sensor for measuring liquid phase and encapsulation method thereof, which characterized of employing an insulated board with metal film attached on the surface connected to at least one piezoelectric sensor to realize the integration structure encapsulation and electric connection. Wherein, the edge of piezoelectric sensor is sealed and fixed to pylome bottom on the insulated board to realize contact of single side of piezoelectric sensor and measured liquid, the metal electrode of piezoelectric sensor is connected with drive or testing circuit by metal film wire. The sensor and the encapsulation method of present invention are easy, reliable and convenient, and the cost is low. Disposable piezoelectric sensor or sensor array made by the present invention can be used in all kinds of liquid phase measurement, including medical diagnose, biochemistry molecule detecting and environment detecting fields.
Description
Technical field
The invention belongs to electronic measuring technology field, particularly a kind of piezoelectric sensor and method for packing that is suitable for liquid phase measuring.
Background technology
Piezoelectric sensor based on QCM (Quartz Crystal Microbalance) (QCM, Quartz crystal microbalance) principle has been widely used in the biological chemistry measurement of various gas phases and liquid phase.The piezoelectric sensitivity device of qcm sensor is cut quartz crystal slice by AT usually and is constituted with the one group of electrode that is distributed in the crystal wafer two sides.Because the piezoelectric effect of quartz crystal applies alternating voltage and can produce the highdensity plywood ripple of propagating along thickness direction at crystals on the electrode.When this Sensitive Apparatus surface contacted with liquid or adsorbs small quality, the oscillation frequency of shearing wave or amplitude can change in the device, thereby can reflect the variation of fluid to be measured or surface adsorption quality.
Yet there is bigger difficulty in the piezoelectric sensor of traditional structure in liquid phase measuring.This mainly is to be caused by following two reasons:
1, liquid phase measuring needs piezoelectric sensitivity device single face to contact with fluid to be measured, promptly needs Sensitive Apparatus is encapsulated in Liquid Detection pond or the probe to contact with liquid with the inoperative surface of avoiding device.Here the surface that contacts with fluid to be measured of piezoelectric sensitivity device is called working surface, and the surface that contacts with fluid to be measured is not called the inoperative surface.Two distribution of electrodes of the piezoelectric sensitivity device of traditional structure are in the two sides of crystal wafer, produce with the encapsulation of crystal wafer with the lead-in wire of liquid electrodes in contact and conflict, and very difficulty and cost are higher to cause crystal package.
2, the liquid method for packing of the piezoelectric sensor of report mainly contains bonding and the pressure-tight mode of rubber ring at present.Dual mode all needs piezoelectric crystal plate is installed to a liquid detection cell bottom of being made by insulating material, is connected with external circuit with lead or the bus electrode with the piezoelectric sensitivity device simultaneously.Because in these method for packing, the insulating material of implementation structure encapsulation is separate with lead or bus that realization is electrically connected, simultaneously the two is separate with the interlock circuit module of piezoelectric sensor again, causes the encapsulating structure complexity of piezoelectric sensor, and cost is high and to be electrically connected reliability low.These deficiencies are particularly outstanding when the multicrystal piezoelectric sensor array of structure.
For solving piezoelectric sensor liquid phase measuring problem, piezoelectric sensitivity device and method for packing that some are new are applied in the Design of Sensor, for example there is report to adopt at crystal on side face evaporation metal film, the mode of employing at two electrodes of piezoelectric crystal single face evaporation also arranged crystal working surface electrode is guided to the mode on inoperative surface.But these new device architectures all can not solve the big and high problem of cost of piezoelectric sensor encapsulation difficulty fully.
Summary of the invention
The objective of the invention is to overcome the deficiency of existing piezoelectric sensor liquid phase measuring, propose a kind of structure set encapsulation and the novel sensor and the method for packing that are electrically connected to one.As required, the interlock circuit module of the piezoelectric sensor that the present invention proposes comprises that driving and metering circuit, calculating, demonstration and memory circuit etc. can directly be integrated into the insulcrete that is used to encapsulate.Sensor and method for packing that the present invention proposes are not only simple in structure, easy to use, and cost is low, the reliability height.Device can also make disposable sensor or sensor array is applied in the various liquid phase measurings, comprises fields such as medical diagnosis, biochemical molecule mensuration and environmental pollution detection.
The technical scheme that the present invention proposes comprises:
1, a kind of piezoelectric sensor and method for packing that is used for liquid phase measuring is characterized in that the insulcrete that adopts a surface to have the adhesion metal film links to each other with at least one piezoelectric sensitivity device, realizes incorporate construction packages and is electrically connected.Wherein the via bottoms that is sealingly clamped on the insulcrete of the edge of piezoelectric sensitivity device contacts with fluid to be measured to realize piezoelectric sensitivity device single face, and the metal electrode of piezoelectric sensitivity device then is connected with driving or metering circuit by the metal film cabling on the insulcrete.Here, the mode of piezoelectric sensitivity device sealing and fixing comprises bonding, rubber ring pressure seal and other encapsulating method.
2, the insulcrete in the piezoelectric sensor of the present invention's proposition is made by insulating material with excellent machinability and corrosion resistant single component or composite insulating material, comprises plastics, nylon or resin etc.The adhesion metal film then is made of such as copper by the metal material of thickness less than the good conductivity of 0.5mm usually, adopt plating, evaporation, pressing, method such as bonding to be fixed in described insulcrete surface or through-hole wall, and to adopt chemical corrosion or alternate manner to be processed into the flat shape and the size of designing requirement.As required, the direct interlock circuit module of design and installation piezoelectric sensor on the insulcrete comprises driving various circuit such as measuring, calculate demonstration.Owing to can realize the construction packages of piezoelectric sensor, be electrically connected integrated with the interlock circuit module, the reliability of sensor and other performance improve greatly.
3, the piezoelectric sensitivity device in the piezoelectric sensor of the present invention's proposition comprises a metal electrode that has certain tangential piezoelectric crystal plate and be distributed in crystal wafer single face or two sides.Wherein metal electrode is connected with external drive or metering circuit, be used for exciting the shearing sound wave of piezoelectric crystal plate, and piezoelectric crystal plate is made by the piezoelectric crystal material of any support thickness shear wave mode, comprises the piezoelectric of quartz, lithium niobate, lithium tantalate and gallium lanthanum row etc.
4, normally center thickness is at the crystal microchip of 0.01mm to circle, rectangle or other Any shape of 2mm for the piezoelectric crystal plate in the piezoelectric sensor of the present invention's proposition, and its section configuration has biplane, biconvex and flat-multiple structures such as convex surface.Crystalline electrode is that gold, silver or other any metal material that is not easy to oxidation and corrosion are made.
5, the through-hole diameter on the insulcrete in the piezoelectric sensor that proposes of the present invention is less than the crystal wafer diameter of piezoelectric sensitivity device, and greater than the diameter of piezoelectric sensitivity device surface electrode.Fix (as bonding) during to the bottom of the through hole of insulcrete when the piezoelectric sensitivity device, point of fixity keeps relative larger distance with the electrode of crystal, the influence of not fixed with the performance of assurance piezoelectric sensor.
6, the electrode of the piezoelectric sensitivity device in the piezoelectric sensor of the present invention's proposition directly bonds on the metal film of insulcrete correspondence by conducting resinl, or bonds on the metal film of insulcrete correspondence by one section metal short-term or metal short-movie.Because the existing circuit trace of making according to design on insulcrete, the electrode of piezoelectric sensitivity device can be connected with external circuit easily.Because the thickness of adhesion metal film is very little, can not produce any adverse effect simultaneously to the encapsulation of crystal.
7, the method for packing of the present invention's proposition not only can be used for the encapsulation of single piezoelectric sensor, also can be advantageously used in the encapsulation of two and two above piezoelectric sensor arrays.In this case, on bigger wiring an in advance and insulcrete that have a plurality of through holes, the piezoelectric sensitivity device is fixed (as bonding) to bottom of each through hole with resin, being connected of the metal film on realizing piezoelectric sensitivity device electrode and be attached to insulcrete with conducting resinl.This piezoelectric sensor array can be realized the signal compensation of sensor, detects when also can realize the same index of a plurality of samples or detects a plurality of index of same sample the time.
8, the insulcrete with adhesion metal film in the piezoelectric sensor of the present invention's proposition comprises the printed circuit board (PCB) of various materials, as glass or flexible printed circuit board etc.Can adopt known method design and make the printed circuit board (PCB) with through hole and special metal film cabling, the piezoelectric sensitivity device is installed on the liquid detection cell that can directly constitute sensor behind the through-holes of printed circuit boards bottom.In some application such as biomolecule are measured, can be on printed circuit board (PCB) evaporation or apply the material modified biocompatibility that improves the PCB detecting pond as Parylene.
Because the printed circuit board (PCB) daily use is very extensive, have very ripe design software and manufacturing process, cost is very low, and the present invention can make disposable liquid phase piezoelectric sensor, enlarge range of application, also can be used as can duplicate measurements sensor use as online viscosity sensor etc.
In the practical application, the piezoelectric sensor that the present invention proposes need connect piezoelectric sensitivity device and external drive or testing circuit by the adhesion metal symphysis on the insulcrete, and constitute the piezoelectric sensor measuring system with data acquisition and display circuit part, reflect the variation of detected object by the variation of measuring piezoelectric sensitivity device resonant parameter such as frequency, amplitude and phase place.In addition, all circuit modules of measuring system also can be integrated on the insulcrete, between piezoelectric sensitivity device and the circuit module and the connection between the different circuit module can realize by adhesion metal film on the insulcrete.This integrated piezoelectric sensor can be installed in the liquid measure system of various complexity as a standard module, as on-line measurement system, flow injection system etc.
When the piezoelectric sensor of the present invention's proposition was used for biomolecule detection, step and method comprised:
1. the surface cure biological or chemical sensitive membrane that contacts with liquid at sensor is in order to detect different samples.
2. the record sensor is at airborne output parameter such as the frequency or the amplitude etc. of drying.
3. add a certain amount of sample in the liquid detection cell, if sample is positive, the resonant parameter of sensor output such as oscillation frequency or amplitude can change.The output of record sensor can be determined the test result of sample.
4. question response finishes, and the output parameter of sensor no longer changes, with the surface of deionized water cleaning sensor.Treat the aerial output parameter of survey sensor after the sensor drying then.Relatively aerial parameter changes before and after the sensor response, further the demonstration test result.This step also can make separately with the step that (3) are described and be used for measuring sample.
Description of drawings
Below in conjunction with accompanying drawing invention is described in further detail.
Accompanying drawing 2 is for having the piezoelectric sensitivity device structural representation of single-side electrode lead-in wire;
Accompanying drawing 3 is the encapsulating structure front schematic view of the piezoelectric sensor of the present invention's proposition;
Accompanying drawing 5 is the structural representation of the piezoelectric sensor of the integrated interlock circuit module of the present invention's proposition;
Accompanying drawing 9 is the encapsulating structure synoptic diagram of the piezoelectric sensor array Application Example of the present invention's proposition
Front and section structure synoptic diagram that the piezoelectric sensor that accompanying drawing 3 and accompanying drawing 4 propose for the present invention encapsulates.As shown in the figure, the adhesion metal film 5 and 8 that through hole is arranged on the insulcrete 6 and have design shape and size.Piezoelectric crystal plate 1 usefulness resin glue bonds to the via bottoms of insulcrete 6, the crystalline electrode that contacts with fluid to be measured 3 directly links to each other with adhesion metal film 5 by conducting resinl, and the electrode 2 on the inoperative surface that contacts with air passes through lead or conductive metal sheet 7 and links to each other with metal film 8 on the insulcrete.
Accompanying drawing 5 is the structural representation of the piezoelectric sensor of the integrated interlock circuit module of the present invention's proposition.Design has the relevant circuit module 12 of piezoelectric sensor on the insulcrete 9 among the figure, comprises all and part driving, measurement, calculating, demonstration and memory circuit.The electrode of piezoelectric sensor links to each other with 11 circuit modules direct and on the insulcrete that coexists by the metal film 10 that adheres on the insulcrete.
The piezoelectric sensor array example structure synoptic diagram that accompanying drawing 8 proposes for the present invention.As seen, 4 piezoelectric sensitivity devices are installed on the insulcrete 22 among the figure, the electrode of each device links to each other with corresponding attachment metal film cabling 24 on the insulcrete 22, and by unified edge line bank 23 places that guide to insulcrete 22.In the practical application, this piezoelectric sensor array is connected with outside gated sweep circuit, crystal-driven circuit by line bank 23, under the control of single chip circuit, can finish the measurement to each piezoelectric sensor in the array.
The piezoelectric sensor array application mode embodiment that accompanying drawing 9 proposes for the present invention.As shown in the figure, the insulcrete 26 that is fixed with two piezoelectric sensitivity devices is installed on the bottom in a flow injection pond 25.One of them piezoelectric sensitivity device surface fixed biologically or chemical-sensitive film, another piezoelectric sensitivity device as a reference, any sensitive membrane is not fixed on the surface.Sample enters flow injection pond 25 and flows out from outlet 28 from injection port 27.Contain in the sample measured matter can with piezoelectric sensor surface-sensitive film reaction, cause the variation of piezoelectric sensor resonant parameter such as frequency, thereby can realize measuring continuously in real time of sample.
Embodiment
Embodiment 1: sensor and method for packing that utilization the present invention proposes, can finish piezoelectric sensitivity device single face encapsulation to any electrode structure.Fig. 3 shows the method for packing to the piezoelectric sensor with traditional circular configuration, and Fig. 5 and Fig. 6 then show two kinds of encapsulation to piezoelectric sensor with single face extraction electrode structure.
Embodiment 2: sensor and method for packing that utilization the present invention proposes, can make disposable single piezoelectric sensor.As shown in Figure 3, adopt traditional circular piezoelectric quartz crystal Sensitive Apparatus, centre frequency is 5MHz, and the quartz crystal surface electrode adopts silver electrode.Insulcrete adopts the printed circuit board (PCB) that contains the glass material, adopts known processes to go out through hole and metallic copper cabling on the printed circuit board (PCB).Quartz crystal is adhered to the through-holes of printed circuit boards bottom with resin glue, and its electrode is introduced to the edge of printed circuit board (PCB) by the metal routing on the printed circuit board (PCB).In the practical application, the surperficial predetermined fixed sensitive membrane of quartz crystal Sensitive Apparatus will be bonded with the printed circuit board (PCB) of quartz crystal and corresponding circuit connection then, add sample in the liquid detection cell that through-holes of printed circuit boards forms, and measure.After test is finished, take off the sensor and the printed circuit board (PCB) that use and put into special-purpose garbage reclaiming barrel, can take out the new printed circuit board (PCB) that quartz crystal is arranged of a slice next time when measuring and use.
Embodiment 3: sensor and method for packing that utilization the present invention proposes, can make disposable hyperchannel piezoelectric sensor array.As shown in Figure 8, adopt traditional circular quartz crystal Sensitive Apparatus, centre frequency is 5MHz, and surface electrode adopts silver electrode.Insulcrete adopts the printed circuit board (PCB) that contains the glass material, adopts known processes to go out a plurality of through holes and metallic copper cabling on it.Quartz crystal is adhered to the through-holes of printed circuit boards bottom with resin glue, and its electrode is guided to the edge of printed circuit board (PCB) by the metal routing on the printed circuit board (PCB).In the practical application, a Sensitive Apparatus is as the reference crystal in the piezoelectric sensor array, and any sensitive membrane is not fixed on the surface, the identical or different sensitive membrane of surperficial predetermined fixed of other Sensitive Apparatus.With sensor array and corresponding circuit connection, in the liquid detection cell that through-holes of printed circuit boards forms, add sample during use.Depend on the fixing sensitive membrane in Sensitive Apparatus surface, this sensor array can detect the same a kind of measured matter in the different samples, also can detect the different measured matters in the same sample.
Embodiment 4: the specific bond of antigen and antibody has been widely used in every field such as medical diagnosis, food hygiene detection and environmental pollution monitoring.Though the kit method that extensively adopts has the advantage of accuracy height and good reproducibility at present, also exists detection time long, the deficiency that complicated operation and cost are higher.Sensor and method for packing that utilization the present invention proposes can be made disposable piezoelectric immunosensor array.Adopt tradition silver-plated piezoelectric quartz crystal Sensitive Apparatus and printed circuit board (PCB), make hyperchannel as 16 or 24 passage piezoelectric sensor arrays.At each quartz crystal surface immobilized antigen or antibody, adopt the measuring method identical with embodiment 3, just can make the piezoelectric immunosensor array of measuring a plurality of samples simultaneously.
Embodiment 5: sensor and method for packing that utilization the present invention proposes, can make the piezoelectric sensor systems of continuous coverage.As shown in Figure 9, adopt printed circuit board (PCB) two piezoelectric quartz crystal Sensitive Apparatuses of encapsulation and being installed in the flow detection pond with injection port and outlet.Here detection cell is made by the material such as the Polyvinylchloride of good biocompatibility, and its injection port is connected with the micro-sampling pump, realizes sample continuous flow.The piezoelectric crystal that the surface is fixed with sensitive membrane is connected with outer detecting circuit, and the variation of output signals of measuring piezoelectric sensor can be measured the tested molecule in the sample that flows or the variation of material concentration.
Claims (10)
1, a kind of piezoelectric sensor and method for packing that is used for liquid phase measuring, it is characterized in that the insulcrete that adopts a surface to have the adhesion metal film links to each other with at least one piezoelectric sensitivity device, realize incorporate construction packages and be electrically connected, wherein the via bottoms that is sealingly clamped on the insulcrete of the edge of piezoelectric sensitivity device contacts with fluid to be measured to realize piezoelectric sensitivity device single face, and the metal electrode of piezoelectric sensitivity device then is connected with driving or metering circuit by the adhesion metal film cabling on the insulcrete.
2, piezoelectric sensor according to claim 1 and method for packing, it is characterized in that described piezoelectric sensitivity device comprises a metal electrode that has certain tangential piezoelectric crystal plate and be distributed in crystal wafer single face or two sides, wherein metal electrode is connected with external drive or metering circuit, is used for exciting the shearing sound wave of piezoelectric crystal plate.
3, piezoelectric sensor according to claim 1 and method for packing is characterized in that described insulcrete made by the insulating material of single component such as plastics or composite insulating material.
4, piezoelectric sensor according to claim 1 and method for packing, it is characterized in that the adhesion metal film on the described insulcrete at first adopts plating, evaporation, pressing, adhering method to be fixed in described insulcrete surface or through-hole wall, adopts certain way such as machining or chemical corrosion to be processed into the flat shape and the size of designing requirement then.
5, piezoelectric sensor according to claim 1 and method for packing is characterized in that described surface has the interlock circuit module that on the insulcrete of adhesion metal film piezoelectric sensor can be installed directly, comprise driving measuring, calculate the various circuit of demonstration.
6, piezoelectric sensor according to claim 1 and method for packing is characterized in that through-hole diameter on the described insulcrete is less than the crystal wafer diameter of piezoelectric sensitivity device, greater than the diameter of piezoelectric sensitivity device surface electrode.
7, piezoelectric sensor according to claim 1 and method for packing, the metal electrode that it is characterized in that described piezoelectric sensitivity device directly bonds on the metal film corresponding on the described insulcrete by conducting resinl, or bonds on the metal film corresponding on the described insulcrete by one section metal short-term or metal short-movie.
8, piezoelectric sensor according to claim 1 and method for packing is characterized in that described method for packing comprises:
A) single piezoelectric sensitivity device is packaged on the insulcrete with adhesion metal film.
B) two or more piezoelectric sensitivity devices are packaged on the insulcrete with adhesion metal film, and the same index that is used for a plurality of samples detects or a plurality of indexs of same sample detect.
9, piezoelectric sensor according to claim 1 and method for packing is characterized in that described insulcrete with adhesion metal film comprises the printed circuit board (PCB) of various materials.
10, according to claim 1 or 9 described piezoelectric sensor and method for packing, it is characterized in that on the described printed circuit board (PCB) evaporation or apply material modified as Parylene to improve the biocompatibility in PCB detecting pond.
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102466489A (en) * | 2010-11-15 | 2012-05-23 | 中国科学院微电子研究所 | Multi-piezoelectric sensor lattice system and multi-piezoelectric sensor array system |
| CN102692513A (en) * | 2012-06-26 | 2012-09-26 | 长沙理工大学 | Piezoelectric immunosensing chip and device for detecting oncogene C-myc recombinant protein |
| CN102980826A (en) * | 2011-09-03 | 2013-03-20 | 崔学晨 | Quartz crystal microbalance detection cell |
| CN106253875A (en) * | 2016-10-09 | 2016-12-21 | 湖南农业大学 | High flux piezoelectric resonator chip preparation method and the system of measurement |
| CN108878251A (en) * | 2018-06-20 | 2018-11-23 | 中国科学院高能物理研究所 | A kind of microchannel plate component |
| CN110174704A (en) * | 2019-06-24 | 2019-08-27 | 青岛科技大学 | A kind of electric field sensor for marine environments based on TRIZ theory |
| CN110268236A (en) * | 2017-02-13 | 2019-09-20 | 高级波传感器有限责任公司 | Measuring unit |
| CN113785194A (en) * | 2019-04-23 | 2021-12-10 | 诺沃皮尼奥内技术股份有限公司 | Sensor arrangement and method for measuring scaling and/or erosion and machine for monitoring scaling and/or erosion |
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| CN102466489A (en) * | 2010-11-15 | 2012-05-23 | 中国科学院微电子研究所 | Multi-piezoelectric sensor lattice system and multi-piezoelectric sensor array system |
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| CN102692513A (en) * | 2012-06-26 | 2012-09-26 | 长沙理工大学 | Piezoelectric immunosensing chip and device for detecting oncogene C-myc recombinant protein |
| CN106253875A (en) * | 2016-10-09 | 2016-12-21 | 湖南农业大学 | High flux piezoelectric resonator chip preparation method and the system of measurement |
| CN106253875B (en) * | 2016-10-09 | 2019-12-27 | 湖南农业大学 | High-flux piezoelectric resonance chip and measuring system |
| CN110268236A (en) * | 2017-02-13 | 2019-09-20 | 高级波传感器有限责任公司 | Measuring unit |
| CN108878251A (en) * | 2018-06-20 | 2018-11-23 | 中国科学院高能物理研究所 | A kind of microchannel plate component |
| CN108878251B (en) * | 2018-06-20 | 2022-01-25 | 中国科学院高能物理研究所 | Microchannel plate assembly |
| CN113785194A (en) * | 2019-04-23 | 2021-12-10 | 诺沃皮尼奥内技术股份有限公司 | Sensor arrangement and method for measuring scaling and/or erosion and machine for monitoring scaling and/or erosion |
| CN113785194B (en) * | 2019-04-23 | 2023-11-17 | 诺沃皮尼奥内技术股份有限公司 | Sensor arrangements and methods for measuring fouling and/or corrosion and machines for monitoring fouling and/or corrosion |
| CN110174704A (en) * | 2019-06-24 | 2019-08-27 | 青岛科技大学 | A kind of electric field sensor for marine environments based on TRIZ theory |
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