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CN101230459A - Micro-drill needle surface electroplating method and structure thereof - Google Patents

Micro-drill needle surface electroplating method and structure thereof Download PDF

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CN101230459A
CN101230459A CNA2007100036658A CN200710003665A CN101230459A CN 101230459 A CN101230459 A CN 101230459A CN A2007100036658 A CNA2007100036658 A CN A2007100036658A CN 200710003665 A CN200710003665 A CN 200710003665A CN 101230459 A CN101230459 A CN 101230459A
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micro
coating layer
electroplating method
drill
surface electroplating
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黄续镡
周钟霖
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Cosmos Vacuum Technology Corp
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Cosmos Vacuum Technology Corp
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Abstract

The invention relates to a micro drill point surface electroplating method and a structure thereof, which comprises the following steps: a) providing a micro-drilling needle and a vacuum cavity, and placing the micro-drilling needle in the vacuum cavity; b) depositing the surface of the micro-drill point in an arc deposition mode to form a first coating layer; c) and depositing the surface of the first coating layer in a sputtering deposition mode to form a second coating layer. Therefore, the micro-drill needle has the mechanical properties of high hardness, low friction coefficient and high stability, and has the characteristics of wear resistance and improvement on processing precision.

Description

微钻针表面电镀方法及其结构 Surface electroplating method and structure of micro-drill needle

技术领域 technical field

本发明与切削工具有关,特别是指一种微钻针表面电镀方法及其结构。The invention relates to cutting tools, in particular to a micro-drill surface electroplating method and its structure.

背景技术 Background technique

一般钻针可区分为一柄部以及一刃部,柄部供工具机械夹持,刃部用于对工件进行加工。由于刃部为进行钻孔加工的主要部位,必需要具备相比于工件更高硬度的机械性质,以达到顺利进行加工的目的。Generally, the drill can be divided into a shank and a blade, the shank is used for mechanical clamping of the tool, and the blade is used for processing the workpiece. Since the cutting edge is the main part of the drilling process, it must have mechanical properties with higher hardness than the workpiece in order to achieve the purpose of smooth processing.

为提高钻针的机械性质,习知方式是采用电弧沉积(arc deposition)在钻针表面镀上一层硬度较高的薄膜,以提高钻针刃部表面的硬度。然而,若以电弧沉积(arcdeposition)方式镀膜,容易在镀膜表面产生金属液滴(metal droplet),致使镀膜表面不平滑。其中,金属液滴的大小约介于0.7μm~2μm,对于一般的钻针而言,由于其刃径较大,且对于钻孔的精密度要求较低,金属液滴对于一般钻针的钻孔的精密度影响较小,且在摩擦系数的影响并不显著,故金属液滴所造成的影响尚在可以容许的范围内。但是,若同样以电弧沉积方式对微钻针(micro drill)进行镀膜,同样可以提高微钻针刃部表面的硬度。但是,由于其刃径较小约在3.175mm以下,且钻孔的精密度要求较高;金属液滴则显得过大,不但大幅降低精密度,且相对钻针的摩擦系数影响也大幅提高。故习用以电弧沉积(arc deposition)方式镀膜并不适用于微钻针。In order to improve the mechanical properties of the drill, a known method is to coat the surface of the drill with a film with a higher hardness by arc deposition, so as to increase the hardness of the surface of the drill edge. However, if the film is coated by arc deposition, it is easy to generate metal droplets on the surface of the coating, which makes the surface of the coating uneven. Among them, the size of the metal droplet is about 0.7 μm to 2 μm. For the general drill, due to its large blade diameter and low precision requirements for drilling, the metal droplet is very important for the drill of the general drill. The precision of the hole is less affected, and the influence on the friction coefficient is not significant, so the influence caused by the metal droplet is still within the allowable range. However, if the micro drill (micro drill) is also coated by arc deposition, the hardness of the surface of the micro drill can also be improved. However, because the blade diameter is less than 3.175mm, and the drilling precision is required to be high; the metal droplet is too large, which not only greatly reduces the precision, but also greatly increases the impact on the friction coefficient of the drill. Therefore, the conventional method of coating by arc deposition is not suitable for micro drills.

为改善上述问题,一般采用溅射沉积(sputter deposition)的方式进行镀膜,其能够使镀膜的膜厚较为平均且不会形成金属液滴,镀膜表面较为平滑。其相比于电弧沉积能够降低摩擦系数,提高钻孔的精密度以及速度。然而,在以溅射沉积方式进行镀膜前,若不在钻针刃部表面预先制作一附着度高的键植层(under-layer)作为底材,例如:钛氮化物(TiN),则镀膜会产生附着力不足较容易剥离的问题。此种类型的微钻针使用寿命较短,不能有效达到提升微钻针机械性质的目的,具有机械性质较差的缺点而有待改进。In order to improve the above problems, sputter deposition is generally used for coating, which can make the film thickness of the coating more uniform without forming metal droplets, and the surface of the coating is relatively smooth. Compared with arc deposition, it can reduce the friction coefficient and improve the precision and speed of drilling. However, before coating by sputtering deposition, if an under-layer with high adhesion is not prepared on the surface of the drill bit as a substrate, such as: titanium nitride (TiN), the coating will be damaged. The problem of insufficient adhesion and easier peeling occurs. This type of microdrill has a short service life and cannot effectively achieve the purpose of improving the mechanical properties of the microdrill. It has the disadvantage of poor mechanical properties and needs to be improved.

综上所述,习用微钻针表面镀膜方法具有上述的缺点而有待改进。To sum up, the conventional method of coating the surface of micro-drills has the above-mentioned shortcomings and needs to be improved.

发明内容 Contents of the invention

本发明的主要目的在于提供一种微钻针表面电镀方法及其结构,具有耐磨耗以及提高加工精度的特色。The main purpose of the present invention is to provide a micro-drill surface electroplating method and its structure, which have the characteristics of wear resistance and improved processing accuracy.

为达到上述目的,本发明所提供的一种微钻针表面电镀方法,其特征在于包含下列各步骤:a)提供一微钻针以及一真空腔,将所述微钻针置于所述真空腔内;b)以电弧沉积方式对所述微钻针表面进行沉积,以形成一第一镀膜层;c)以溅射沉积方式对所述第一镀膜层表面进行沉积,以形成一第二镀膜层。In order to achieve the above object, a method for electroplating the surface of a micro-drill provided by the present invention is characterized in that it comprises the following steps: a) providing a micro-drill and a vacuum chamber, placing the micro-drill in the vacuum In the cavity; b) depositing the surface of the micro drill by arc deposition to form a first coating layer; c) depositing the surface of the first coating layer by sputtering deposition to form a second coating layer.

上述本发明的技术方案中,步骤a)中的所述微钻针,预先用超声波去除表面油污并烘干水分后,再置于所述真空腔内。In the above-mentioned technical solution of the present invention, the micro-drilling needle in step a) is placed in the vacuum chamber after removing surface oil stains and drying water by ultrasonic waves in advance.

上述本发明的技术方案中,步骤a)中的所述真空腔,具有一真空管路,以供将所述真空腔抽成真空状态。In the above-mentioned technical solution of the present invention, the vacuum chamber in step a) has a vacuum pipeline for pumping the vacuum chamber into a vacuum state.

上述本发明的技术方案中,步骤a)中的所述真空腔,抽真空至8×10-3Pa。In the above-mentioned technical solution of the present invention, the vacuum chamber in step a) is evacuated to 8×10 -3 Pa.

上述本发明的技术方案中,步骤b)所述及的电弧沉积方式,为旋转式电弧沉积。In the above-mentioned technical solution of the present invention, the arc deposition method mentioned in step b) is rotary arc deposition.

上述本发明的技术方案中,步骤b)的所述第一镀膜层,其厚度在3μm以下。In the above-mentioned technical solution of the present invention, the thickness of the first coating layer in step b) is less than 3 μm.

上述本发明的技术方案中,步骤c)所述及的溅射沉积方式,为非平衡磁控溅射沉积。In the above-mentioned technical solution of the present invention, the sputtering deposition method mentioned in step c) is unbalanced magnetron sputtering deposition.

上述本发明的技术方案中,步骤c)的所述第二镀膜层,为以非导电性靶材进行溅射沉积。In the above technical solution of the present invention, the second coating layer in step c) is deposited by sputtering with a non-conductive target.

上述本发明的技术方案中,步骤c)所述及的非导电性靶材,选自二硼化钛、三氧化二铝以及氮化硼其中一种。In the above-mentioned technical solution of the present invention, the non-conductive target mentioned in step c) is selected from one of titanium diboride, aluminum oxide and boron nitride.

上述本发明的技术方案中,步骤c)的所述第二镀膜层,其厚度在3μm以下。In the above-mentioned technical solution of the present invention, the thickness of the second coating layer in step c) is less than 3 μm.

一种以权利要求1所述电镀方法制得的薄膜,其特征在于包含有:一微钻针;一第一镀膜层,以电弧沉积方式形成于所述微钻针表面;一第二镀膜层,以溅射沉积方式形成于第一镀膜层表面。A film obtained by the electroplating method according to claim 1, characterized in that it comprises: a micro-drill; a first coating layer formed on the surface of the micro-drill by arc deposition; a second coating layer , formed on the surface of the first coating layer by sputtering deposition.

所述第一镀膜层的厚度在3μm以下。The thickness of the first coating layer is below 3 μm.

所述第二镀膜层的厚度在3μm以下。The thickness of the second coating layer is below 3 μm.

所述第二镀膜层为具有碳基、硼基、氮基或钛基的合金。The second coating layer is an alloy with a carbon base, a boron base, a nitrogen base or a titanium base.

采用以上技术方案,本发明先以电弧沉积方式提供微钻针刃部高硬度的机械性质,使其具有耐磨耗的特色,再以溅射沉积方式提供微钻针刃部形成光滑表面,可以减少不平滑面的形成,具有低摩擦系数的特色。由此,本发明相比于习用镀膜方式,能够克服电弧沉积镀膜表面粗糙以及溅射沉积镀膜附着力不高的缺点,并进一步提升微钻针刃部的机械性质,使微钻针具有较高的稳定性以及较长的使用寿命。因此本发明能克服习用微钻针的缺点,提供微钻针高硬度、低摩擦系数、高稳定性的机械性质,具有耐磨耗以及提高加工精度的特色。By adopting the above technical scheme, the present invention first provides the mechanical properties of high hardness of the micro-drill blade by arc deposition, so that it has the characteristics of wear resistance, and then provides the micro-drill blade by sputtering deposition to form a smooth surface, which can Reduces the formation of rough surfaces and features a low coefficient of friction. Therefore, compared with the conventional coating method, the present invention can overcome the shortcomings of arc deposition coating surface roughness and sputtering deposition coating adhesion, and further improve the mechanical properties of the micro-drill blade, so that the micro-drill has a higher stability and long service life. Therefore, the present invention can overcome the disadvantages of conventional micro-drills, provide micro-drills with high hardness, low friction coefficient, and high stability mechanical properties, and have the characteristics of wear resistance and improved processing accuracy.

附图说明 Description of drawings

图1是本发明一较佳实施例的镀膜流程图;Fig. 1 is a coating flow chart of a preferred embodiment of the present invention;

图2是本发明一较佳实施例的微钻针的正面视图;Fig. 2 is the front view of the microdrill needle of a preferred embodiment of the present invention;

图3是本发明一较佳实施例的加工示意图,其揭示真空腔的结构;Fig. 3 is a processing schematic diagram of a preferred embodiment of the present invention, which reveals the structure of the vacuum chamber;

图4是本发明一较佳实施例的局部放大图,其揭示微钻针刃部表面在镀膜前的状态;Figure 4 is a partial enlarged view of a preferred embodiment of the present invention, which reveals the state of the micro-drilling needle blade surface before coating;

图5是本发明一较佳实施例的结构示意图,其揭示微钻针刃部表面经过电弧沉积处理后的状态;Fig. 5 is a schematic structural view of a preferred embodiment of the present invention, which reveals the state of the micro-drilling needle blade surface after arc deposition treatment;

图6是本发明一较佳实施例的结构示意图,其揭示微钻针刃部表面经过溅射沉积处理后的状态。FIG. 6 is a schematic structural view of a preferred embodiment of the present invention, which reveals the state of the micro-drill blade surface after sputtering deposition.

具体实施方式 Detailed ways

为了详细说明本发明的结构及所达到的功效,现举以下较佳实施例并配合附图说明如下。In order to illustrate the structure and the achieved effects of the present invention in detail, the following preferred embodiments are given below together with the accompanying drawings.

如图1~图6所示,为本发明所提供的一种微钻针表面电镀方法及其结构的一较佳实施例,其镀膜程序如下:As shown in Figures 1 to 6, it is a preferred embodiment of a micro-drill surface electroplating method and its structure provided by the present invention, and its coating program is as follows:

a)首先,提供一微钻针(micro drill)10以及一真空腔20,将微钻针10置于真空腔20内(如图3所示)。其中,微钻针10具有一柄部12以及一刃部14。微钻针10在放置入真空腔20前预先用超声波去除表面油污,以提高离子在沉积时的附着力。再烘干附着于微钻针10的水分,防止微钻针10沉积时形成氧化物,而在微钻针10表面形成凸起。真空腔20具有一真空管路22,以供将真空腔20抽成8×10-3Pa的真空状态。a) First, a micro drill 10 and a vacuum chamber 20 are provided, and the micro drill 10 is placed in the vacuum chamber 20 (as shown in FIG. 3 ). Wherein, the micro-drill 10 has a handle 12 and a blade 14 . Before the micro-drilling needle 10 is placed into the vacuum chamber 20, the surface oil is removed by ultrasonic waves in advance, so as to improve the adhesion of ions during deposition. Then dry the moisture attached to the microdrill 10 to prevent the formation of oxides when the microdrill 10 is deposited, and form protrusions on the surface of the microdrill 10 . The vacuum chamber 20 has a vacuum pipeline 22 for pumping the vacuum chamber 20 into a vacuum state of 8×10 −3 Pa.

b)以电弧沉积(arc deposition)方式对微钻针10表面进行沉积,以形成一第一镀膜层30。其中电弧沉积方式包含有阴极电弧沉积(cathodic arc deposition)、过滤式阴极电弧沉积(filtered cathodic arc deposition)以及旋转式电弧沉积(steering arcdeposition)。在上述电弧沉积方式中,以旋转式电弧沉积所形成的薄膜硬度效果较好。因此本实施例的电弧沉积方式选用旋转式电弧沉积为例,并以导电性靶材对微钻针10表面进行电弧沉积,以形成第一镀膜层30(如图5所示)。第一镀膜层30的厚度为3μm。其中可预见的是,第一镀膜层30在表面将具有数个金属液滴形成凸起,以旋转式电弧沉积而言,其所形成的金属液滴大小恰好在微钻针可以容许的范围的上限值。b) Depositing the surface of the micro-drill 10 by means of arc deposition to form a first coating layer 30. The arc deposition methods include cathodic arc deposition, filtered cathodic arc deposition and rotating arc deposition. Among the above-mentioned arc deposition methods, the hardness of the film formed by rotary arc deposition is better. Therefore, the arc deposition method of the present embodiment uses rotary arc deposition as an example, and conducts arc deposition on the surface of the microdrill 10 with a conductive target to form the first coating layer 30 (as shown in FIG. 5 ). The thickness of the first coating layer 30 is 3 μm. Wherein it can be foreseen that the first coating layer 30 will have several metal droplets forming protrusions on the surface. In terms of rotary arc deposition, the size of the formed metal droplets is just within the allowable range of the micro drill. Upper limit.

c)以溅射沉积(sputter deposition)方式对第一镀膜层30表面进行溅射沉积,以形成一第二镀膜层40。溅射沉积方式包含直流溅射沉积(DC-diode Sputtering)、磁控溅射沉积(magnetron sputtering)、非平衡磁控溅射沉积(unbalanced magnetronsputtering)、高周波溅射沉积(ratio-frequency sputtering)以及反应性气体溅射沉积(reactive gas sputtering)。在上述溅射沉积方式中,由于非平衡磁控溅射沉积的工作距离较长,使靶材在溅射沉积时较为平均,进而能够使镀膜形成较为平滑的表面。再者,以非平衡磁控溅射沉积方式进行溅射沉积时,不会受限于导电性靶材以及非导电性靶材的适用种类,具有较好的适用性。因此本实施例的溅射沉积方式选用非平衡磁控溅射沉积为例。在靶材种类中,以非导电性靶材的硬度为最好,其硬度由高到低的前三种依序分别为二硼化钛(TiB2)、氮化硼(BN)以及三氧化二铝(Al2O3)。再者,若以离子的附着力考虑来选择靶材,其中以含钛(Ti)者为好,可以提高离子的附着力,能进一步使离子较容易地进行附着。此外,非导电性靶材的成本比导电性靶材低,具有降低成本的特色。本实施例选用二硼化钛(TiB2)为靶材,对微钻针10的刃部14表面进行溅射沉积,以形成第二镀膜层40(如图6所示),第二镀膜层40的厚度为3μm。经实验证明,当第二镀膜层40的镀膜厚度为3μm时较为适当。其中可预见的是,第二镀膜层40在金属液滴形成凸起处会形成较为平坦的表面,能够降低金属液滴造成的影响,使第二镀膜层40可以同时兼顾提高机械性质以及钻孔作业在精密度上的要求,以取得较好的效果。第二镀膜层40为具有碳基(carbon-base)、硼基(boron-base)、氮基(nitrogen-base)或钛基(titanic-base)的合金。c) performing sputter deposition on the surface of the first coating layer 30 by means of sputter deposition to form a second coating layer 40 . Sputtering deposition methods include DC-diode Sputtering, magnetron sputtering, unbalanced magnetron sputtering, high frequency sputtering (ratio-frequency sputtering) and reaction Reactive gas sputtering deposition (reactive gas sputtering). In the above sputtering deposition method, due to the long working distance of the unbalanced magnetron sputtering deposition, the target material is relatively uniform during the sputtering deposition, thereby enabling the coating to form a relatively smooth surface. Furthermore, when the unbalanced magnetron sputtering deposition method is used for sputtering deposition, it is not limited to the applicable types of conductive targets and non-conductive targets, and has good applicability. Therefore, unbalanced magnetron sputtering deposition is used as an example for the sputtering deposition method in this embodiment. Among the target types, the hardness of the non-conductive target is the best, and the first three types of hardness from high to low are titanium diboride (TiB 2 ), boron nitride (BN) and trioxide Dialuminum (Al 2 O 3 ). Furthermore, if the target material is selected in consideration of the adhesion of ions, it is better to include titanium (Ti), which can improve the adhesion of ions and further facilitate the adhesion of ions. In addition, the cost of non-conductive targets is lower than that of conductive targets, which has the characteristics of reducing costs. In this embodiment, titanium diboride (TiB 2 ) is selected as the target material, and the surface of the blade portion 14 of the microdrill 10 is sputtered and deposited to form a second coating layer 40 (as shown in FIG. 6 ). The second coating layer 40 has a thickness of 3 μm. Experiments have proved that it is more appropriate when the coating thickness of the second coating layer 40 is 3 μm. It is foreseeable that the second coating layer 40 will form a relatively flat surface where the metal droplets form protrusions, which can reduce the impact caused by the metal droplets, so that the second coating layer 40 can simultaneously improve the mechanical properties and drill holes. The precision of the operation is required to achieve better results. The second coating layer 40 is an alloy with carbon-base, boron-base, nitrogen-base or titanic-base.

由此,本发明经由上述步骤,其先对微钻针刃部表面以电弧沉积(arc deposition)方式处理,提供其较佳的硬度,接着,再以溅射沉积(sputter deposition)的方式进行镀膜,能够在微钻针刃部形成光滑表面,以减少摩擦力的形成。其相比于习用方法,能够提供微钻针高硬度、低摩擦系数、高稳定性的机械性质,具有耐磨耗以及提高加工精度的特色。Thus, the present invention, through the above-mentioned steps, first treats the surface of the micro-drilling needle with arc deposition (arc deposition) to provide better hardness, and then coats the surface with sputter deposition (sputter deposition) , can form a smooth surface on the edge of the micro-drill to reduce the formation of friction. Compared with conventional methods, it can provide micro-drills with high hardness, low friction coefficient, and high stability mechanical properties, and has the characteristics of wear resistance and improved processing accuracy.

再者,习用微钻针表面以溅射沉积镀膜前,需要预先在微钻针刃部表面制作一附着度高的键植层(under-layer)的程序,以利于第二镀膜层进行附着。本发明不需预先制作键植层(under-layer)即可使第二镀膜层进行附着,尤其以非导电性靶材进行溅射沉积时,其附着度相比于习用预先制作键植层的方式更高,具有简化溅射沉积步骤的特色。此外,当选用硬度较高的非导电性靶材进行溅射沉积镀膜时,第二镀膜层同样可兼具有高硬度、耐磨损的特色,能够进一步提升微钻针刃部的机械性质,延长微钻针的使用寿命。Furthermore, prior to depositing coatings by sputtering on the surface of the conventional microdrill, it is necessary to prepare an under-layer with high adhesion on the surface of the blade of the microdrill in advance, so as to facilitate the adhesion of the second coating layer. The present invention can make the second coating layer adhere without prefabricating the under-layer, especially when the non-conductive target material is used for sputtering deposition, its adhesion is compared with that of the conventional prefabricated under-layer Way higher, featuring a simplified sputter deposition step. In addition, when a non-conductive target with high hardness is selected for sputtering deposition coating, the second coating layer can also have the characteristics of high hardness and wear resistance, which can further improve the mechanical properties of the micro-drill blade. Extend the life of microdrills.

经由以上实施例可知,本发明经由上述步骤,先以电弧沉积方式提供微钻针刃部高硬度的机械性质,使其具有耐磨耗的特色,再以溅射沉积方式提供微钻针刃部形成光滑表面,可以减少不平滑面的形成,具有低摩擦系数的特色。由此,本发明相比于习用镀膜方式,能够克服电弧沉积镀膜表面粗糙以及溅射沉积镀膜附着力不高的缺点,并进一步提升微钻针刃部的机械性质,使微钻针具有较高的稳定性以及较长的使用寿命。当然,在实施上,本发明的微钻针表面电镀方法不仅可以对钻针刃部实施加工,也同样适用于对整支钻针进行加工。It can be seen from the above examples that the present invention firstly provides the mechanical properties of high hardness of the micro-drill blade by arc deposition, so that it has the characteristics of wear resistance, and then provides the micro-drill blade by sputtering deposition. Forms a smooth surface, can reduce the formation of uneven surfaces, and has the characteristics of a low coefficient of friction. Therefore, compared with the conventional coating method, the present invention can overcome the shortcomings of arc deposition coating surface roughness and sputtering deposition coating adhesion, and further improve the mechanical properties of the micro-drill blade, so that the micro-drill has a higher stability and long service life. Of course, in terms of implementation, the micro-drill surface electroplating method of the present invention can not only process the cutting edge of the drill, but also be suitable for processing the entire drill.

综上所述,本发明在上述实施例中所揭示的构成组件及方法步骤,仅为举例说明,并不能用来限制本发明的保护范围,本发明的保护范围应以权利要求书为准,其它等效组件或步骤的替代或变化,均应包含在本发明的专利保护范围内。To sum up, the constituent components and method steps disclosed in the above embodiments of the present invention are only for illustration and cannot be used to limit the protection scope of the present invention. The protection scope of the present invention should be determined by the claims. Substitution or change of other equivalent components or steps shall be included in the patent protection scope of the present invention.

Claims (14)

1.一种微钻针表面电镀方法,其特征在于包含下列各步骤:1. A microdrilling needle surface electroplating method is characterized in that comprising the following steps: a)提供一微钻针以及一真空腔,将所述微钻针置于所述真空腔内;a) providing a micro-drilling needle and a vacuum chamber, placing the micro-drilling needle in the vacuum chamber; b)以电弧沉积方式对所述微钻针表面进行沉积,以形成一第一镀膜层;b) Depositing the surface of the micro-drill by arc deposition to form a first coating layer; c)以溅射沉积方式对所述第一镀膜层表面进行沉积,以形成一第二镀膜层。c) Depositing the surface of the first coating layer by sputtering to form a second coating layer. 2.如权利要求1所述的微钻针表面电镀方法,其特征在于:步骤a)中的所述微钻针,预先用超声波去除表面油污并烘干水分后,再置于所述真空腔内。2. The surface electroplating method for micro-drilling needles as claimed in claim 1, characterized in that: the micro-drilling needles in step a) remove surface oil stains and dry moisture with ultrasonic waves in advance, and then place them in the vacuum chamber Inside. 3.如权利要求1所述的微钻针表面电镀方法,其特征在于:步骤a)中的所述真空腔,具有一真空管路,以供将所述真空腔抽成真空状态。3. The surface electroplating method for micro-drilling needles according to claim 1, characterized in that: the vacuum chamber in step a) has a vacuum pipeline for evacuating the vacuum chamber into a vacuum state. 4.如权利要求3所述的微钻针表面电镀方法,其特征在于:步骤a)中的所述真空腔,抽真空至8×10-3Pa。4. The surface electroplating method for micro-drilling needles according to claim 3, characterized in that: the vacuum chamber in step a) is evacuated to 8×10 −3 Pa. 5.如权利要求1所述的微钻针表面电镀方法,其特征在于:步骤b)所述的电弧沉积方式,为旋转式电弧沉积。5. The microdrill surface electroplating method as claimed in claim 1, characterized in that: the arc deposition method described in step b) is rotary arc deposition. 6.如权利要求1所述的微钻针表面电镀方法,其特征在于:步骤b)的所述第一镀膜层,其厚度在3μm以下。6. The microdrill surface electroplating method as claimed in claim 1, characterized in that: the first coating layer in step b) has a thickness below 3 μm. 7.如权利要求1所述的微钻针表面电镀方法,其特征在于:步骤c)所述的溅射沉积方式,为非平衡磁控溅射沉积。7. The surface electroplating method of the microdrill according to claim 1, characterized in that: the sputtering deposition method described in step c) is unbalanced magnetron sputtering deposition. 8.如权利要求7所述的微钻针表面电镀方法,其特征在于:步骤c)的所述第二镀膜层,为以非导电性靶材进行溅射沉积。8. The microdrill surface electroplating method according to claim 7, characterized in that: the second coating layer in step c) is deposited by sputtering with a non-conductive target. 9.如权利要求8所述的微钻针表面电镀方法,其特征在于:步骤c)所述的非导电性靶材,选自二硼化钛、三氧化二铝以及氮化硼其中一种。9. The surface electroplating method for micro-drilling needles as claimed in claim 8, characterized in that: the non-conductive target material described in step c) is selected from one of titanium diboride, aluminum oxide and boron nitride . 10.如权利要求1所述的微钻针表面电镀方法,其特征在于:步骤c)的所述第二镀膜层,其厚度在3μm以下。10. The surface electroplating method for micro-drilling needles according to claim 1, characterized in that: the second coating layer in step c) has a thickness below 3 μm. 11.一种以权利要求1所述电镀方法制得的薄膜,其特征在于包含有:11. A thin film made by the electroplating method according to claim 1, characterized in that it comprises: 一微钻针;a micro drill; 一第一镀膜层,以电弧沉积方式形成于所述微钻针表面;A first coating layer is formed on the surface of the micro-drill by arc deposition; 一第二镀膜层,以溅射沉积方式形成于第一镀膜层表面。A second coating layer is formed on the surface of the first coating layer by sputtering deposition. 12.如权利要求11所述的微钻针表面电镀方法,其特征在于:所述第一镀膜层的厚度在3μm以下。12. The surface electroplating method of the micro-drill according to claim 11, characterized in that: the thickness of the first coating layer is below 3 μm. 13.如权利要求11所述的微钻针表面电镀方法,其特征在于:所述第二镀膜层的厚度在3μm以下。13. The surface electroplating method for micro-drilling needles according to claim 11, characterized in that: the thickness of the second coating layer is below 3 μm. 14.如权利要求11所述的微钻针表面电镀方法,其特征在于:所述第二镀膜层为具有碳基、硼基、氮基或钛基的合金。14. The surface electroplating method for micro-drilling needles according to claim 11, characterized in that: the second coating layer is an alloy with a carbon base, a boron base, a nitrogen base or a titanium base.
CNA2007100036658A 2007-01-23 2007-01-23 Micro-drill needle surface electroplating method and structure thereof Pending CN101230459A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101824618A (en) * 2010-05-07 2010-09-08 武汉大学 Superhard DLC (Diamond-like Carbon) base nano composite coating PCB (Printed Circuit Board) microdriller and manufacturing method thereof
CN103418987A (en) * 2013-07-23 2013-12-04 太原科技大学 Micro-hole grinding and drilling technology
CN106756849A (en) * 2016-12-21 2017-05-31 深圳先进技术研究院 A kind of PCB with transition metal boride coating micro- brills and preparation method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101824618A (en) * 2010-05-07 2010-09-08 武汉大学 Superhard DLC (Diamond-like Carbon) base nano composite coating PCB (Printed Circuit Board) microdriller and manufacturing method thereof
CN103418987A (en) * 2013-07-23 2013-12-04 太原科技大学 Micro-hole grinding and drilling technology
CN106756849A (en) * 2016-12-21 2017-05-31 深圳先进技术研究院 A kind of PCB with transition metal boride coating micro- brills and preparation method thereof
CN106756849B (en) * 2016-12-21 2019-06-25 深圳先进技术研究院 A kind of micro- brill and preparation method thereof of the PCB with transition metal boride coating

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