CN101230197B - Organosilicon composition for manufacturing packaging gluewater of light-emitting diode - Google Patents
Organosilicon composition for manufacturing packaging gluewater of light-emitting diode Download PDFInfo
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- CN101230197B CN101230197B CN2007101726345A CN200710172634A CN101230197B CN 101230197 B CN101230197 B CN 101230197B CN 2007101726345 A CN2007101726345 A CN 2007101726345A CN 200710172634 A CN200710172634 A CN 200710172634A CN 101230197 B CN101230197 B CN 101230197B
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- emitting diode
- gluewater
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- 239000000203 mixture Substances 0.000 title claims abstract description 49
- 238000004806 packaging method and process Methods 0.000 title claims description 25
- 238000004519 manufacturing process Methods 0.000 title abstract description 6
- -1 dimethyl siloxane Chemical class 0.000 claims abstract description 45
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 51
- 239000010703 silicon Substances 0.000 claims description 45
- 229910052710 silicon Inorganic materials 0.000 claims description 45
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 abstract description 15
- 239000003292 glue Substances 0.000 abstract description 6
- 239000005977 Ethylene Substances 0.000 abstract 2
- 229920001577 copolymer Polymers 0.000 abstract 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 239000000463 material Substances 0.000 description 9
- 239000004205 dimethyl polysiloxane Substances 0.000 description 8
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 8
- 239000013078 crystal Substances 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000002223 garnet Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 150000003376 silicon Chemical class 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 229910052771 Terbium Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 235000015110 jellies Nutrition 0.000 description 1
- 239000008274 jelly Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- GZCRRIHWUXGPOV-UHFFFAOYSA-N terbium atom Chemical compound [Tb] GZCRRIHWUXGPOV-UHFFFAOYSA-N 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention relates to an organosilicon composition used for manufacturing the glue water for the encapsulation of the light emitting diode, which is mainly composed of copolymer formed by dimethyl siloxane, methyl hydrogen radical siloxane and ethylene siloxane. The weight content of the copolymer in the organosilicon composition occupies 94-99 percent, wherein, the weight content of the dimethyl siloxane occupies 84-90 percent, the weight content of the methyl hydrogen radical siloxane occupies 4-9 percent, and the weight content of the ethylene siloxane occupies 2-7 percent.
Description
[technical field]
The invention belongs to the led technology field, or rather, relate to a kind of silicon composition that is used to make gluewater for packaging light-emitting diode.
[background technology]
Photodiode is a kind of light emitting semiconductor device, is used as pilot lamp, display screen etc. widely.White light emitting diode be described as replace fluorescent lamps and incandescent light the 4th generation lighting source.Theoretical about 100000 hours of the life-span of photodiode, still, from white light emitting diode product in the market, its life-span do not reach far away theoretical 100000 hours.
Gluewater for packaging light-emitting diode is one of principal element that influences light attenuation of light emitting diode.See also shown in Figure 1, this figure be domestic certain A company adopt the encapsulation of traditional silica gel the white light emitting diode product under 25 ℃ of room temperature conditions, constant current 25mA electric current, 2520 hours light decay graphic representation of continuously tested.As can be seen from this figure, 13% light decay rate occurred in the time of 168 hours, the light decay rate is 20% in the time of 336 hours, the light decay rate is 25% in the time of 504 hours, the light decay rate was 49% when the light decay rate was 31%, 1128 hour in the time of 648 hours, and its light decay rate has reached 80% in the time of 2520 hours.In order further to verify the light decay situation of this product, under 25 ℃ of room temperature conditions, constant current 40mA electric current, continuously tested 1032 hours, Fig. 2 are light decay graphic representation under these conditions to the contriver to this product.As can be seen from this figure, 34% light decay rate occurred in the time of 168 hours, the light decay rate is 45% in the time of 336 hours, and the light decay rate is 68% in the time of 504 hours, and the light decay rate has reached 88% in the time of 1032 hours.Therefore, need develop a kind of new gluewater for packaging to improve its influence effectively to light attenuation of light emitting diode.The present invention just is being based on this demand and is producing.
[summary of the invention]
Technical problem to be solved by this invention is to overcome above-mentioned defective, a kind of silicon composition that is used to make gluewater for packaging light-emitting diode is provided, uses photodiode by the gluewater for packaging light-emitting diode encapsulation of this silicon composition manufacturing to possess low light decay, long lifetime, characteristic cheaply.
The present invention is achieved by the following technical solutions: a kind of silicon composition that is used to make gluewater for packaging light-emitting diode mainly consists of the multipolymer that is formed by dimethyl siloxane, methyl hydrogen radical siloxane and vinylsiloxane, the weight content of multipolymer is 94%～99% in the described silicon composition, and wherein the weight content of dimethyl siloxane is 84%～90%, the weight content of methyl hydrogen radical siloxane is 4%～9%, the weight content of vinylsiloxane is 2%～7%; Also comprise r-(2, the 3-glycidoxy) propyl trimethoxy silicane in the described silicon composition, its weight content in whole silicon composition is 0.5%～3%.
The weight content of described multipolymer in whole silicon composition is preferably 98%, and wherein the weight content of dimethyl siloxane is preferably 87%, the weight content of methyl hydrogen radical siloxane is preferably 7%, the weight content of vinylsiloxane is preferably 4%.
Described r-(2, the 3-glycidoxy) weight content of propyl trimethoxy silicane in whole silicon composition is preferably 1%.
Described silicon composition also comprises the triethoxy methylsiloxane, and its weight content in whole silicon composition is 0.5%～3%.
The weight content of described triethoxy methylsiloxane in silicon composition is preferably 1%.
Compared with prior art, when use is allocated the gluewater for packaging encapsulation LED that forms in proportion by disclosed silicon composition and polydimethylsiloxane, no matter use still in the mode that above the light-emitting face of the crystal grain of photodiode, forms one deck light transmission medium and use as the arogel of joining in the white light emitting diode encapsulation process, the light decay that reduces photodiode all there is obvious effects, uses the photodiode of the gluewater for packaging encapsulation of this silicon composition manufacturing to possess advantages such as low light decay, long lifetime, low cost.
[description of drawings]
Fig. 1 is under the kindred circumstances, the white light emitting diode product of domestic certain A company under 25 ℃ of room temperature conditions, constant current 25mA electric current, 2520 hours light decay graphic representation of continuously tested.
Fig. 2 is under the kindred circumstances, the white light emitting diode product of domestic certain A company under 25 ℃ of room temperature conditions, constant current 40mA electric current, 1032 hours light decay graphic representation of continuously tested.
Fig. 3 encapsulates the encapsulation schema of white light emitting diode for the gluewater for packaging light-emitting diode that uses disclosed silicon composition manufacturing.
Fig. 4 is under the kindred circumstances, the white light emitting diode that uses the gluewater for packaging light-emitting diode encapsulation that disclosed silicon composition makes under 25 ℃ of room temperature conditions, constant current 25mA electric current, 2520 hours light decay graphic representation of continuously tested.
Fig. 5 is under the kindred circumstances, the white light emitting diode that uses the gluewater for packaging light-emitting diode encapsulation that disclosed silicon composition makes under 25 ℃ of room temperature conditions, constant current 40mA electric current, 1032 hours light decay graphic representation of continuously tested.
[embodiment]
Gluewater for packaging is a kind of important packaged material in the photodiode manufacturing processed, the component polydimethylsiloxane mixing preparation that disclosed silicon composition and another are in a liquid state thick goes out a kind of new gluewater for packaging light-emitting diode, and this kind glue has important effect to the light decay that reduces photodiode.
The disclosed silicon composition that is used to make gluewater for packaging light-emitting diode mainly consist of the multipolymer that forms by dimethyl siloxane, methyl hydrogen radical siloxane and vinylsiloxane (
), also comprise simultaneously r-(2, the 3-glycidoxy) propyl trimethoxy silicane (r-glycidyl ether propyl trimethoxy silicane) (molecular structural formula:
) and the triethoxy methylsiloxane (divide in structural formula:
).The weight content of multipolymer is 94%～99% (present embodiment is preferably 98%) in the described silicon composition, and wherein the weight content of dimethyl siloxane is that the weight content of 84%～90% (present embodiment is preferably 87%), methyl hydrogen radical siloxane is that the weight content of 4%～9% (present embodiment is preferably 7%), vinylsiloxane is 2%～7% (present embodiment is preferably 4%).Also comprise r-(2, the 3-glycidoxy) propyl trimethoxy silicane (r-glycidyl ether propyl trimethoxy silicane) in the described silicon composition, its weight content in whole silicon composition is 0.5%～3% (present embodiment is preferably 1%).Described silicon composition also comprises the triethoxy methylsiloxane, and its weight content in whole silicon composition is 0.5%～3% (present embodiment is preferably 1%).
See also shown in Figure 3ly, this figure is that the gluewater for packaging light-emitting diode that uses disclosed silicon composition and polydimethylsiloxane mixing preparation to go out carries out the schema that white light emitting diode encapsulates, and encapsulation process is as follows:
Step 1: some glue is about to insulation paste and clicks and enters in the support reflector.
Step 2: Gu brilliant, be about to above the support that ready prepd crystal grain is positioned over the insulation paste of having put.
Step 3:, make crystal grain and support fix adhesion Gu the baking of brilliant back is about to the work in-process of solid good crystal grain and puts into the high temperature baking box and toast.
Step 4: bonding wire, the crystal grain that soon toasts out is drawn two gold threads at positive and negative electrode.
Step 5: join fluorescent material, promptly prepare by 3: 3: 1 part by weight taking-up polydimethylsiloxane, silicon composition, fluorescent material, stir then, make its thorough mixing, churning time is about 5 minutes.
Step 6: vacuumize, promptly the composite that is formed by polydimethylsiloxane, silicon composition, fluorescent material allotment is carried out vacuum defoamation, the pumpdown time is about 5-10 minute.
Step 7: dot fluorescent powder, the composite that is formed by polydimethylsiloxane, silicon composition, fluorescent material allotment that is about to have taken out vacuum is poured in the syringe of point gum machine, regulate the jelly amount after, it is clicked and entered in the support reflector that has welded gold thread successively.
Step 8: toast behind the dot fluorescent powder, the support that is about to the good glue of point is put into the high temperature baking box and is toasted, so that its curing, temperature is at the 130-150 degree, and storing time was at 1-2 hour.
Step 9: join glue, be about to the good A of preheating, B agent epoxy glue, be generally 1: 1 part by weight and prepare, and stir by certain, so that its thorough mixing.
Step 10: vacuumize, promptly the composite of preparing in the step 9 is carried out vacuum defoamation, the pumpdown time is about 5-10 minute.
Step 11: encapsulating, promptly utilize the encapsulating machine that glue is injected in die cavity or the support successively.
Step 12: toast behind the encapsulating, promptly carry out high bake, the adhesive curing that makes in the step 11 to be injected, storing temperature is 125 degree, time 8-10 hour.
Step 13: cut pin: promptly utilize press tool, separately with its positive and negative electrode.
Step 14: beam split, promptly utilize light splitting machine, classify according to relevant electrical parameters such as the voltage of product, brightness, colors.
In the present embodiment, it is the LED crystal particle of 455-465nm that described chip is selected the blue light emitting wavelength for use, the crystal-bonding adhesive insulation paste, fluorescent material adopts silicate fluorescent powder, LED support adopts retort stand, joins the gluewater for packaging light-emitting diode that arogel then adopts the allotment in 1: 1 by weight proportion of above-mentioned polydimethylsiloxane, silicon composition to form.Need to prove that described fluorescent material can certainly be YAG yttrium aluminium garnet fluorescent powder, TAG terbium aluminium garnet fluorescent material or sulphide fluorescent material or their mixture etc.
In order to verify the light decay situation of using described silicon composition and polydimethylsiloxane allotment to form the white light emitting diode of gluewater for packaging light-emitting diode encapsulation, the contriver has done a large amount of experiments.
See also shown in Figure 4ly, this figure is under the kindred circumstances, the white light emitting diode that uses above-mentioned gluewater for packaging light-emitting diode encapsulation under 25 ℃ of room temperature conditions, constant current 25mA electric current, 2520 hours light decay graphic representation of continuously tested.As can be seen from this figure, the optical throughput sustainment rate is 105% in the time of 168 hours, at 336 hours optical throughput sustainment rates was 106%, the optical throughput sustainment rate still is 106% in the time of 504 hours, the optical throughput sustainment rate is 107% in the time of 648 hours, the optical throughput sustainment rate is 102% in the time of 1128 hours, and it 3% light decay rate only occurred in the time of 2520 hours.
In order further to verify the light decay situation of above-mentioned white light emitting diode, the contriver has carried out substantive test to its light decay situation again.See also shown in Figure 5ly, this figure is under the kindred circumstances, the white light emitting diode that uses above-mentioned gluewater for packaging light-emitting diode encapsulation under 25 ℃ of room temperature conditions, constant current 40mA electric current, 1032 hours light decay graphic representation of continuously tested.As can be seen from this figure, its light decay rate is 2% in the time of 168 hours, only is 3% 336 hours light decay rates, and light decay then is zero in the time of 504 hours, and the light decay rate only is 2% in the time of 1032 hours.
In order to verify that further the allotment of described silicon composition and polydimethylsiloxane forms the effect to the reduction light decay of gluewater for packaging light-emitting diode, the contriver is used for this gluewater for packaging light-emitting diode the encapsulation of light-emitting diode by another form.Specifically be exactly that described gluewater for packaging light-emitting diode is formed one deck light transmission medium above the light-emitting face of the crystal grain of described photodiode.By the photodiode that uses the encapsulation of this kind method is tested, find that equally its light decay has tangible decline.
Need to prove that above-mentioned kindred circumstances is meant: (1) each experiment is all carried out under same laboratory, same time period and envrionment conditions; (2) each test event all is 20 photodiodes randomly drawing from some single tubes wherein, as the sample of test.
Describing is embodiments of the invention only, forgives and can understand, and under the prerequisite that does not depart from the present invention's design, to simple modification of the present invention and replacement, all should be included within the technical conceive of the present invention.
Claims (4)
1. silicon composition that is used to make gluewater for packaging light-emitting diode, it is characterized in that: described silicon composition mainly consists of the multipolymer that is formed by dimethyl siloxane, methyl hydrogen radical siloxane and vinylsiloxane, the weight content of multipolymer is 94%～99% in the described silicon composition, and wherein the weight content of dimethyl siloxane is 84%～90%, the weight content of methyl hydrogen radical siloxane is 4%～9%, the weight content of vinylsiloxane is 2%～7%; Also comprise r-(2, the 3-glycidoxy) propyl trimethoxy silicane in the described silicon composition, its weight content in whole silicon composition is 0.5%～3%; Described silicon composition also comprises triethoxy methyl silicane, and its weight content in whole silicon composition is 0.5%～3%.
2. silicon composition as claimed in claim 1, it is characterized in that: the weight content of described multipolymer in whole silicon composition is preferably 98%, and wherein the weight content of dimethyl siloxane is preferably 87%, the weight content of methyl hydrogen radical siloxane is preferably 7%, the weight content of vinylsiloxane is preferably 4%.
3. silicon composition as claimed in claim 1 is characterized in that: described r-(2, the 3-glycidoxy) weight content of propyl trimethoxy silicane in whole silicon composition is preferably 1%.
4. silicon composition as claimed in claim 1 is characterized in that: the weight content of described triethoxy methyl silicane in whole silicon composition is preferably 1%.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101726345A CN101230197B (en) | 2007-12-20 | 2007-12-20 | Organosilicon composition for manufacturing packaging gluewater of light-emitting diode |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101726345A CN101230197B (en) | 2007-12-20 | 2007-12-20 | Organosilicon composition for manufacturing packaging gluewater of light-emitting diode |
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| CN101230197A CN101230197A (en) | 2008-07-30 |
| CN101230197B true CN101230197B (en) | 2011-01-19 |
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| CN101693765B (en) * | 2009-10-19 | 2012-03-21 | 株洲时代电气绝缘有限责任公司 | Organic silicon perfusion resin and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1361202A (en) * | 2000-12-29 | 2002-07-31 | 旭丽股份有限公司 | Organopolysiloxane composition |
| CN1772794A (en) * | 2004-10-27 | 2006-05-17 | 伦斯勒工业学院 | Silicone encapsulants for LEDs |
| WO2006077667A1 (en) * | 2005-01-24 | 2006-07-27 | Momentive Performance Materials Japan Llc. | Silicone composition for encapsulating luminescent element and luminescent device |
| CN1844250A (en) * | 2005-04-08 | 2006-10-11 | 信越化学工业株式会社 | Curable resin composition for sealing LED element |
-
2007
- 2007-12-20 CN CN2007101726345A patent/CN101230197B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1361202A (en) * | 2000-12-29 | 2002-07-31 | 旭丽股份有限公司 | Organopolysiloxane composition |
| CN1772794A (en) * | 2004-10-27 | 2006-05-17 | 伦斯勒工业学院 | Silicone encapsulants for LEDs |
| WO2006077667A1 (en) * | 2005-01-24 | 2006-07-27 | Momentive Performance Materials Japan Llc. | Silicone composition for encapsulating luminescent element and luminescent device |
| CN1844250A (en) * | 2005-04-08 | 2006-10-11 | 信越化学工业株式会社 | Curable resin composition for sealing LED element |
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