CN101207989A - Fixing structure of heat sink - Google Patents
Fixing structure of heat sink Download PDFInfo
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- CN101207989A CN101207989A CNA2006101687346A CN200610168734A CN101207989A CN 101207989 A CN101207989 A CN 101207989A CN A2006101687346 A CNA2006101687346 A CN A2006101687346A CN 200610168734 A CN200610168734 A CN 200610168734A CN 101207989 A CN101207989 A CN 101207989A
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- 238000010438 heat treatment Methods 0.000 claims abstract description 34
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 238000005452 bending Methods 0.000 claims description 14
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Abstract
Description
技术领域 technical field
本发明涉及一种固定结构,更详而言之,涉及一种散热件固定结构。The present invention relates to a fixing structure, more specifically, to a fixing structure of a heat sink.
背景技术 Background technique
随着半导体技术以及集成电路发展的日新月异,整合强大运算功能的集成电路芯片纷纷问世,这些集成电路芯片大幅提升如个人电脑、服务器、笔记型电脑等数据处理装置处理数据的速度。另一方面,为考虑数据处理装置的体积不能随数据处理速度的增加而扩大,该些集成电路芯片自然必须集成在极小体积的芯片中。With the rapid development of semiconductor technology and integrated circuits, integrated circuit chips integrating powerful computing functions have emerged one after another. These integrated circuit chips greatly increase the processing speed of data processing devices such as personal computers, servers, and notebook computers. On the other hand, in order to consider that the size of the data processing device cannot be expanded with the increase of the data processing speed, these integrated circuit chips must naturally be integrated in a chip with a very small size.
上述的情况导致处理速度快的集成电路芯片于运行时会产生更高的热量,该些热量入无法有效散逸,极易导致该集成电路芯片的故障,进而造成数据处理装置的故障。据此,如何有效的将散热件固设于该集成电路芯片上,从而于该集成电路芯片运行时的热量能通过该散热件予以散逸,遂成为极重要的课题。The above situation leads to higher heat generated by the integrated circuit chip with fast processing speed during operation, and the heat cannot be effectively dissipated, which easily leads to failure of the integrated circuit chip, and further causes failure of the data processing device. Accordingly, how to effectively fix the heat sink on the integrated circuit chip, so that the heat during the operation of the integrated circuit chip can be dissipated through the heat sink has become a very important issue.
请参阅图1,其为现有的散热件固定结构的结构示意图。如图所示,现有的散热件固定结构用以固定散热件10的底座101于发热元件(未图标)上,该发热元件固设于基板11上,该现有的散热件固定结构主要包括限位部12,该限位部12接近角缘处设置有卡扣部121并于相对的另一角缘处设置有枢接孔122;以及曲杆13,该曲杆13具有枢接部131、弯折部132以及卡勾部133。其中,该枢接部131枢接于该枢接孔122,当该弯折部132因该曲杆13的枢转而压抵至该底座101时,进一步将该曲杆13向该底座101下压,以令该卡勾部133卡扣至该卡扣部121,从而固定该散热件10于该发热元件上。Please refer to FIG. 1 , which is a structural schematic diagram of an existing radiator fixing structure. As shown in the figure, the existing radiator fixing structure is used to fix the
上述现有的散热件固定结构的缺点在于,该弯折部132因该曲杆13的枢转而压抵至该底座101时,该弯折部132与该底座101的接触点因受力会导致该散热件10发生倾斜,由于该底座101与该发热元件的固接位至取决于该弯折部132形变后的压制位置,则该散热件10发生倾斜会导致该弯折部132形变后的压制位置改变,一但位置改变会造成该散热件10的底座101与该发热元件间不紧密的结合,影响介于该底座101与该发热元件间的散热材料的散热效果。The disadvantage of the above conventional heat sink fixing structure is that when the
综上所述,如何提供一种能稳定紧密的固定该散热件的底座于该发热元件上的散热件固定结构,遂成为目前亟待解决的课题。To sum up, how to provide a heat sink fixing structure capable of stably and tightly fixing the base of the heat sink on the heating element has become an urgent problem to be solved.
发明内容 Contents of the invention
为解决前述现有技术的缺点,本发明提供一种能稳定紧密的固定该散热件的底座于该发热元件上的散热件固定结构。In order to solve the aforementioned shortcomings of the prior art, the present invention provides a heat sink fixing structure capable of stably and tightly fixing the base of the heat sink on the heating element.
本发明的散热件固定结构,用以固定散热件的底座于发热元件上,该发热元件为固设于基板上,该散热件固定结构包括:限位部,其固设于该基板上靠近该发热元件的周缘的位置,并具有用以包覆于该散热件的底座以限制该散热件移动的容设空间,该限位部复于接近二角缘处分别设置有二个卡扣部;至少一压制部,其分别固设于该散热件的底座背对该发热元件的表面,并具有与该表面间形成贯通孔的贯通部,该贯通部设置于该表面的中间位置;曲杆,于一端具有第一弯折部且于相对的另一端具有第二弯折部,该曲杆介于该第一弯折部与该第二弯折部的部分贯穿该二压制部的贯通部,以令该曲杆以该贯通部为支点转动,该第一弯折部与该第二弯折部的前端分别具有卡扣件,该二个卡扣件分别卡扣于该二个卡扣部,从而通过该曲杆的形变固定该散热件的底座于该发热元件上。The radiator fixing structure of the present invention is used to fix the base of the radiator on the heating element. The heating element is fixed on the substrate. The position of the periphery of the heating element has an accommodating space for covering the base of the heat sink to limit the movement of the heat sink, and the limiting portion is respectively provided with two buckle portions near the two corners; At least one pressing part, which is respectively fixed on the surface of the base of the heat sink facing away from the heating element, and has a through part forming a through hole with the surface, and the through part is arranged in the middle of the surface; the curved rod, There is a first bent portion at one end and a second bent portion at the opposite end, and a part of the curved rod interposed between the first bent portion and the second bent portion passes through the through portion of the two pressing portions, To make the curved rod rotate with the through portion as a fulcrum, the front ends of the first bending portion and the second bending portion are respectively provided with buckling parts, and the two buckling parts are respectively buckled on the two buckling parts , so that the base of the heat sink is fixed on the heating element through the deformation of the curved rod.
相比于现有技术,本发明的热件固定结构,通过固设于该散热件的底座背对该发热元件的表面中间部分的压制部,能限定该曲杆于该发热元件的底座的中间部分施力,能稳定紧密的固定该散热件的底座于该发热元件上。Compared with the prior art, the heating element fixing structure of the present invention can define the curved rod in the middle of the base of the heating element through the pressing part fixed on the middle part of the surface of the heat sink base facing away from the heating element Partial application of force can stably and tightly fix the base of the heat sink on the heating element.
附图说明 Description of drawings
图1为现有的散热件固定结构的示意图;FIG. 1 is a schematic diagram of an existing radiator fixing structure;
图2a与图2b为本发明的散热件固定结构的示意图;以及2a and 2b are schematic diagrams of the heat sink fixing structure of the present invention; and
图3为本发明的散热件固定结构固定后的示意图。FIG. 3 is a schematic diagram of the heat sink fixing structure of the present invention after being fixed.
符号说明Symbol Description
10散热件10 radiator
101底座101 base
11基板11 substrate
12限位部12 limit part
121卡扣部121 buckle part
122枢接孔122 pivot holes
13曲杆13 curved bars
131枢接部131 pivot joint
132弯折部132 bending part
133卡勾部133 Hook Department
20散热件20 radiator
201底座201 base
201a表面201a surface
201b贯通孔201b through hole
21发热元件21 heating element
21a表面21a surface
22基板22 substrates
23限位部23 limit part
231容设空间231 storage space
232卡扣部232 buckle part
24压制部24 Press Department
241贯通部241 Penetrating Department
241a固定部241a fixed part
25曲杆25 curved rod
251第一弯折部251 The first bending part
252第二弯折部252 second bending part
251a、252a卡扣件251a, 252a buckle
26固定件26 fixing parts
具体实施方式 Detailed ways
以下通过特定的具体实施例说明本发明的实施方式,本领域技术人员可由本说明书所揭示的内容轻易地了解本发明的其它优点与功效。本发明亦可通过其它不同的具体实施例加以施行或应用,本说明书中的各项细节也可基于不同观点与应用,在不背离本发明的精神下进行各种修饰与变更。The implementation of the present invention is described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.
请参阅图2a与图2b,本发明的散热件固定结构,用以固定散热件20的底座201于发热元件21上,该发热元件21固设于基板22上,本发明的散热件固定结构包括限位部23、压制部24、曲杆25以及固定件26。Please refer to Fig. 2a and Fig. 2b, the radiator fixing structure of the present invention is used to fix the
该限位部23固设于该基板22上靠近该发热元件21的周缘的位置,并具有用以包覆于该散热件20的底座201,藉以限制该散热件20移动的容设空间231,该限位部23复于接近二角缘处分别设置有二个卡扣部232。于本实施例中,该二个卡扣部232设置于该限位部23的相对侧的二角缘处。The limiting
二个压制部24分别固设于该散热件20的底座201背对该发热元件21的表面21a,该二个压制部24具有与该表面201a间形成贯通孔201b的贯通部241,该贯通部241设置于该表面201a的之中间位置。具体言之,该二个压制部24分别固设于该散热件20的底座201背对该发热元件21的表面21a的相对二外围。The two pressing parts 24 are respectively fixed on the
于本实施例中,该二个压制部24复具有固定部241a,用以通过该固定件26与该固定部241a将该二个压制部24固定于该散热件20的底座201背对该发热元件21的表面。更具体言之,该散热件20的底座201相对该固定部241a的位置是具有螺孔或凹孔(未图示),该固定部241a为贯孔,该固定件26为相对该螺孔与贯孔的螺丝钉或铆钉。In this embodiment, the two pressing parts 24 further have a fixing
曲杆25于一端具有第一弯折部251且于相对的另一端具有第二弯折部252,该曲杆25介于该第一弯折部251与该第二弯折部252的部分贯穿该二压制部24的贯通部241,以令该曲杆25以该贯通部241为支点转动。该第一弯折部251与该第二弯折部252的前端分别具有卡扣件251a与252a。The
请参阅图3,其为本发明的散热件固定结构固定后的示意图。如图所示,同时将该二个卡扣件251a与252a分别卡扣于该二个卡扣部232,从而通过该曲杆25的形变固定该散热件20的底座201于该发热元件21表面上。Please refer to FIG. 3 , which is a schematic diagram of the heat sink fixing structure of the present invention after being fixed. As shown in the figure, the two
需补充说明者,于本发明的另一实施例中,该二个卡扣部232设置于该限位部23的同一侧的二角缘处。相对的,该第一弯折部251与该第二弯折部252则朝向相同的方向弯折,从而该卡扣件251a与252a能分别卡扣于该二个卡扣部232。It should be added that, in another embodiment of the present invention, the two locking
上述实施例仅为例示性说明本发明的原理及其功效,而非用于限制本发明。任何本领域技术人员均可在不违背本发明的精神及范畴下,对上述实施例进行修饰与变化。因此,本发明的权利保护范围,应以权利要求书为依据。The above-mentioned embodiments are only illustrative to illustrate the principles and effects of the present invention, and are not intended to limit the present invention. Any person skilled in the art can modify and change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be based on the claims.
Claims (7)
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CN107611098A (en) * | 2016-07-12 | 2018-01-19 | 恒劲科技股份有限公司 | Electronic package and manufacturing method thereof |
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CN107611098A (en) * | 2016-07-12 | 2018-01-19 | 恒劲科技股份有限公司 | Electronic package and manufacturing method thereof |
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Open date: 20080625 |