CN101198632B - Epoxy resin composition and cured product - Google Patents
Epoxy resin composition and cured product Download PDFInfo
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- CN101198632B CN101198632B CN2006800158038A CN200680015803A CN101198632B CN 101198632 B CN101198632 B CN 101198632B CN 2006800158038 A CN2006800158038 A CN 2006800158038A CN 200680015803 A CN200680015803 A CN 200680015803A CN 101198632 B CN101198632 B CN 101198632B
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
本发明涉及环氧树脂组合物，其产生高导热性、低热膨胀性优异的固化物，用于半导体元件等的密封、印刷电路板等时，发挥优异的高放热性、尺寸稳定性。该环氧脂组合物，通过配合在环氧树脂成分中占50wt％以上的由下述通式(1)(其中，n表示0以上的整数，m表示1～3的整数)表示的二苯醚型环氧树脂作为环氧树脂成分，和在固化剂成分中占20wt％以上的由下述通式(2)
(其中，n表示0以上的整数，m表示1～3的整数)表示的二苯醚型酚性树脂作为固化剂成分而形成。The present invention relates to an epoxy resin composition that produces a cured product having high thermal conductivity and low thermal expansion, and exhibits excellent high heat dissipation and dimensional stability when used for sealing of semiconductor elements and the like, printed circuit boards, and the like. This epoxy resin composition, accounts for more than 50wt% by the following general formula (1) by blending in the epoxy resin composition
(wherein, n represents an integer of 0 or more, and m represents an integer of 1 to 3) represents a diphenyl ether type epoxy resin as an epoxy resin component, and accounts for more than 20 wt % in the curing agent component by the following general formula ( 2) (where n represents an integer of 0 or more, and m represents an integer of 1 to 3), the diphenyl ether type phenolic resin represented is formed as a curing agent component.
Description
Technical field
The present invention relates to it and be electrical insulating property, and have the composition epoxy resin and the cured article thereof of excellent thermal conductivity.
Background technology
The resin combination that with Resins, epoxy is host is widely used in electric-electronic applications such as casting, sealing, laminated plate.Along with miniaturization, the lightweight of electronics in recent years, carrying out the high-density installationization of electronic unit.Accompany with it, highly integrated, the high speed of LSI constantly develop, and the heat release countermeasure that is produced by electronic unit becomes important.Therefore, will be applied to heat release members such as printed circuit board (PCB), package semiconductor, basket, heat pipe, heat liberation board, thermal diffusion plate by the thermal conductivity formed body that exothermic material such as metal, pottery, polymeric composition form.
In these heat release members, the cured article that obtains by composition epoxy resin, because therefore excellences such as electrical insulating property, mechanical properties, thermotolerance, chemical-resistant, binding property are that the center is widely-used as casting product, laminated plate, sealing material, tackiness agent etc. with the electric and electronic field.
Composition epoxy resin in this area in order to give high thermal conductivity, has used the composition that has cooperated inorganic filling materials such as glass, fused silica, talcum in resin matrix, but the most normally takes high method of filling fused silica.
Requiring to have used metal oxides such as aluminum oxide, magnesium oxide, zinc oxide, quartz, metal nitrides such as boron nitride, aluminium nitride under the situation of high thermal conductivity more, metallic carbide such as silicon carbide, metal hydroxidess such as aluminium hydroxide, metals such as gold and silver, copper, carbon fiber, graphite etc.
Document in advance as related to the present invention has following document.
Patent documentation 1: the spy opens the 2001-207031 communique
Patent documentation 2: special fair 6-51778 communique
Patent documentation 3: the spy opens the 2001-172472 communique
Patent documentation 4: the spy opens the 2001-348488 communique
Patent documentation 5: the spy opens flat 11-323162 communique
Patent documentation 6: the spy opens flat 2004-331811 communique
But along with high performance, the multifunction of nearest electronic unit, thermal value is also increasing, and therefore by the epoxy resin cured product of above-mentioned prior art combinations gained, it is not enough that its thermal conductivity becomes, and required the high thermal conductivityization of matrix resin self.For example, proposed to have used the resin combination of liquid crystal liquid crystal property resin in patent documentation 5 and the patent documentation 6 with upright and outspoken meso base.But, these Resins, epoxy with meso base are the high crystallines with upright and outspoken structures such as biphenyl structural, azomethine structures, it is single in fact epoxy compounds with dystectic molecular weight distribution, therefore there are problems such as solvent solubility difference, the shortcoming of the operability difference when existing as composition epoxy resin.In addition, in order under solid state, molecule to be orientated efficiently, must to put and add high-intensity magnetic field it is solidified, in order on equipment, to have big restriction in industrial extensive utilization.
Disclose in the patent documentation 1 and will be dispersed in sealing resin layer efficiently and it is alleviated at the load that the connection of adopting upside-down mounting chip etc. that the semiconductor device of semiconductor element is installed adds with electrode part, even under severe environmental conditions such as temperature cycle, guarantee the composition epoxy resin that the semiconductor device conduction is used, but as Resins, epoxy, bisphenol-type epoxy resin etc. is only disclosed.Disclose the composition epoxy resin that the encapsulating semiconductor that used bisphenol-type epoxy resin is used in the patent documentation 2, but solidifying agent has not been studied, and with agent of low hygroscopicity and the stable on heating purpose that rises to.Disclose in the patent documentation 3 and formed that good fluidity, die wear are few, the high thermal conductivity composition epoxy resin that contains spherical cristobalite of cured article with high thermal conductivity, but realized that its method is to improve packing material, rather than will improve resin.Disclose in the patent documentation 4 by the high inorganic filling material of filling, can access the composition epoxy resin of the forming composition of excellent thermal conductivity, but realized that its method is to improve packing material, rather than will improve resin.
Summary of the invention
The problem that invention will solve
The invention provides and handle operability and low heat expansion property excellence, have the composition epoxy resin and the cured article thereof of excellent thermal conductivity simultaneously.
Be used to solve the method for problem
The present inventor has carried out active research in view of the above problems, found that when being combined to specific solidifying agent in the specific Resins, epoxy, also will form this new fact that does not have so far of high crystalline state behind the formation cured article, has finished the present invention.
That is, the present invention relates to composition epoxy resin, it is characterized in that: in the composition epoxy resin that contains Resins, epoxy, solidifying agent, as the employed following general formula of Resins, epoxy composition (1)
The diphenyl ether type Resins, epoxy of (wherein, n represents the number more than 0, and m represents 1～3 integer) expression accounts for more than the 50wt% in the Resins, epoxy composition, as the employed following general formula of curing agent component (2)
The diphenyl ether type phenol resin of (wherein, n represents the number more than 0, and m represents 1～3 integer) expression accounts for more than the 20wt% in the curing agent component.
By the inorganic filling material of further cooperation more than 50%, composition epoxy resin of the present invention can further improve low heat expansion property, thermal conductivity.Composition epoxy resin of the present invention can be cured, and wishes that it is crystalline texture more than the 5J/g that this cured article has the caloric receptivity that is obtained by differential thermal analysis.
The Resins, epoxy of above-mentioned general formula (1) expression can be by making following general formula (3)
Bisphenol cpd of (wherein, m represents 1～3 integer) expression and Epicholorohydrin react and make.This reaction can similarly be carried out with common epoxidation reaction.
For example, after can enumerating bisphenol cpd with above-mentioned general formula (3) and being dissolved in excessive Epicholorohydrin, in the presence of alkali metal hydroxides such as sodium hydroxide, potassium hydroxide, 50～150 ℃, preferred 60～100 ℃ 1～10 hour method of scope internal reaction.At this moment, with respect to the hydroxyl 1mol in the bisphenol cpd, the usage quantity of alkali metal hydroxide is 0.8～1.2mol, is preferably the scope of 0.9～1.0mol.With respect to the hydroxyl in the bisphenol cpd, the excessive use of Epicholorohydrin usually with respect to the hydroxyl 1mol in the bisphenol cpd, is 1.5～15mol.Reaction is heated up in a steamer excessive Epicholorohydrin after finishing, and residue is dissolved in toluene, the methyl iso-butyl ketone (MIBK) equal solvent, filters, and inorganic salt are removed in washing, then heat up in a steamer and desolvate, and can obtain target Resins, epoxy thus.
In the above-mentioned general formula (1), n is the number more than 0, and used Epicholorohydrin can easily be regulated the n value with respect to the mol ratio of bisphenol cpd when changing the Resins, epoxy building-up reactions.In addition, as the mean value of n, from the fusing point aspect, preferred 1.1～3.0 scope.If bigger than it, then fusing point raises, the property handled reduction.
In addition, in order to obtain high-molecular weight Resins, epoxy, can also take to make with n in the above-mentioned general formula (1) is that 0 material is the method that bisphenol cpd that Resins, epoxy and the above-mentioned general formula (3) of principal constituent represented reacts in advance.
Be used as the bisphenol cpd of the raw material of Resins, epoxy of the present invention, by above-mentioned general formula (3) expression, m is 1,2 or 3, but is preferably 1 or 2.Specifically, can enumerate 4,4 '-dihydroxy diphenyl ether, 1, two (4-hydroxyphenoxy) benzene, 4 of 4-, 4 '-two (4-hydroxyphenoxy) phenyl ether.As the raw material of Resins, epoxy, can be their mixture, but preferred 4, the containing ratio of 4 '-dihydroxy diphenyl ether is more than the 50wt%.
The Resins, epoxy that uses among the present invention contains in whole Resins, epoxy more than the 50wt%, the Resins, epoxy by general formula (1) expression that preferred 70wt% is above.Epoxy equivalent (weight) by the Resins, epoxy of general formula (1) expression is generally 160～10000 scope, but preferred epoxy equivalent (weight) can suitably be selected according to purposes.For example, in the formed material purposes,, be principal constituent preferably therefore with n=0 body in the above-mentioned general formula (1) owing to, require low viscosity from the high fill-ratioization of mineral filler and the viewpoint consideration that improves flowability, epoxy equivalent (weight) is the Resins, epoxy of 160～400 scopes.In addition, in purposes such as laminated plate, owing to require film, flexible etc., therefore preferred epoxy equivalent (weight) is the Resins, epoxy of 400-40000.When using more than 2 kinds Resins, epoxy, this epoxy equivalent (weight) preferably satisfies these contents, in the case, calculates epoxy equivalent (weight) by gross weight g/ epoxy group(ing) (mol).
By the Resins, epoxy of general formula (1) expression, in the formed material purposes, be the crystalline material of solid at normal temperatures preferably particularly, wish that its fusing point is more than 70 ℃.In addition, the melt viscosity under preferred 150 ℃ is 0.005～0.5Pas.When using more than 2 kinds Resins, epoxy, as mixture, this crystallinity, fusing point and melt viscosity preferably satisfy these contents.
From the viewpoint consideration of the reliability that improves the electronic unit be suitable for, the purity of the Resins, epoxy that uses among the present invention, particularly water-disintegrable chlorine dose is few more good more.Be not particularly limited, but be preferably below the 1500ppm, more preferably below the 700ppm.Should illustrate that said water-disintegrable chlorine is the value of measuring by the following method among the present invention.That is, the 0.5g test portion is dissolved in the 30ml diox after, add the 1N-KOH of 10ml and boiling reflux after 30 minutes, be cooled to room temperature, further add the 80% acetone water of 100ml, use 0.002N-AgNO
3The aqueous solution carries out the resulting value of potential difference titration.
In the present invention in the Resins, epoxy of Shi Yonging, except as the Resins, epoxy that must composition uses of the present invention by general formula (1) expression, can also be also with the common Resins, epoxy that has 2 above epoxy group(ing) in the molecule.Can exemplify by dihydroxyphenyl propane, Bisphenol F, 3,3 ', 5,5 '-tetramethyl--4,4 '-dihydroxyl ditan, 4,4 '-dihydroxy diphenylsulphone, 4,4 '-dihydroxyl diphenyl sulfide, 4,4 '-dihydroxy benzophenone, the fluorenes bis-phenol, 4,4 '-xenol, 3,3 ', 5,5 '-tetramethyl--4,4 '-dihydroxybiphenyl, 2,2 '-xenol, Resorcinol, Resorcinol, pyrocatechol, tert-butyl catechol, Tert. Butyl Hydroquinone, 1, the 2-dihydroxy naphthlene, 1, the 3-dihydroxy naphthlene, 1, the 4-dihydroxy naphthlene, 1, the 5-dihydroxy naphthlene, 1, the 6-dihydroxy naphthlene, 1, the 7-dihydroxy naphthlene, 1, the 8-dihydroxy naphthlene, 2, the 3-dihydroxy naphthlene, 2, the 4-dihydroxy naphthlene, 2, the 5-dihydroxy naphthlene, 2, the 6-dihydroxy naphthlene, 2, the 7-dihydroxy naphthlene, 2, the 8-dihydroxy naphthlene, the allylate of above-mentioned dihydroxy naphthlene or multi-allylation thing, the allylation dihydroxyphenyl propane, the allylation Bisphenol F, the phenols that allylation phenol novolak etc. are 2 yuan, perhaps phenol novolak, the dihydroxyphenyl propane novolak, the ortho-cresol novolak, the meta-cresol novolak, the p-cresol novolak, the xylenol novolak, poly(4-hydroxystyrene), three-(4-hydroxy phenyl) methane, 1,1,2,2-four (4-hydroxy phenyl) ethane, fluoroglycinol, pyrogallol, tertiary butyl pyrogallol, the allylation pyrogallol, the multi-allylation pyrogallol, 1,2, the 4-benzenetriol, 2,3, the 4-trihydroxybenzophenone, phenol aralkyl resin, naphthols aralkyl resin, phenols more than 3 yuan such as Dicyclopentadiene (DCPD) resinoid, perhaps halogenation bisphenols deutero-glycidyl ether thing such as tetrabromo-bisphenol etc.These Resins, epoxy can be used alone, or mixing two or more.
The cooperation ratio of Resins, epoxy in composition epoxy resin by general formula (1) expression more than the 50wt% in the Resins, epoxy composition, is preferably more than the 70wt%.If lack than it, the crystallinity when then having formed cured article is poor, and the raising effect of thermal conductivity is little.
The phenol resin that uses among the present invention contains the above diphenyl ether type phenol resin by above-mentioned general formula (2) expression of 20wt% in the phenol resin.Hydroxyl equivalent by the phenol resin of general formula (2) expression is generally 100 to 5000 scope.Preferred hydroxyl equivalent can suitably be selected according to purposes.For example, in the formed material purposes,, therefore preferably use with the phenol resin of n=0 body in the general formula (2) as principal constituent owing to, require low viscosity from the high fill-ratioization of mineral filler and the viewpoint consideration that improves flowability.In the said phenol resin, also be included in the bisphenol cpd of n=0 in the general formula (2) herein, consider, wish to contain the bisphenol cpd (m=1～3) of the above n=0 of 50wt% from the viewpoint of low viscosity.As bisphenol cpd, specifically, can enumerate 4,4 '-dihydroxy diphenyl ether, 1, two (4-hydroxyphenoxy) benzene, 4 of 4-, 4 '-two (4-hydroxyphenoxy) phenyl ether, but preferred 4,4 '-dihydroxy diphenyl ether.
In purposes such as laminated plate, owing to require film, flexible etc., therefore preferably using in general formula (2) n is high-molecular weight phenol resin more than 1.Preferred hydroxyl equivalent is 200～20000.
In order to obtain in general formula (2) n is high-molecular weight phenol resin more than 1, can compare the method that the excessive bisphenol cpd by general formula (3) expression reacts in advance with it and synthesizes by making with respect to the Resins, epoxy that with n=0 body in the general formula (1) is principal constituent.
In composition epoxy resin of the present invention, the phenol resin that must composition except as the present invention by general formula (2) expression, can also and with common known solidifying agent as solidifying agent.Can enumerate amine curing agent, acid anhydride type curing agent, phenols curing agent, polythiol class solidifying agent, polyaminoamide class (polyaminoamides) solidifying agent, isocyanates solidifying agent, blocked isocyanate class solidifying agent etc.The use level of these solidifying agent can be considered the rerum natura of the thermal conductivity molding for epoxy resin body of the kind of the solidifying agent that cooperated and gained, suitably sets.
As the concrete example of amine curing agent, can enumerate aliphatics amine, polyether polyamine class, ester ring type amine, aromatic amine etc.As the aliphatics amine, can enumerate quadrol, 1,3-diaminopropanes, 1,4-diaminopropanes, hexamethylene-diamine, 2,5-dimethyl hexamethylene-diamine, trimethylhexamethylenediamine, diethylenetriamine, the two propylamine of imino-, two (hexa-methylene) triamine, Triethylenetetramine (TETA), tetren, penten, N-hydroxyethyl-ethylenediamine, four (hydroxyethyl) quadrol etc.As the polyether polyamine class, can enumerate triethylene glycol diamine, Tetraglycol 99 diamines, glycol ether two (propylamine), polypropyleneoxide diamine, polyoxypropylene three amines etc.As the ester ring type amine, can enumerate isophorone diamine, メ タ セ Application diamines, N-aminoethyl piperazine, two (4-amino-3-methyl bicyclic hexyl) methane, two (amino methyl) hexanaphthene, 3, two (the 3-aminopropyls) 2 of 9-, 4,8,10-four oxaspiros (5,5) undecane, norbornylene diamines etc.As aromatic amine, can enumerate tetrachloro p-Xylol diamines, m-xylene diamine, the p-Xylol diamines, mphenylenediamine, O-Phenylene Diamine, Ursol D, 2, the 4-diamino anisole, 2, the 4-tolylene diamine, 2, the 4-diaminodiphenyl-methane, 4,4 '-diaminodiphenyl-methane, 4,4 '-diaminostilbene, the 2-diphenylethane, 2, the 4-diaminodiphenylsulfone(DDS), 4,4 '-diaminodiphenylsulfone(DDS), Metha Amino Phenon, between amino-benzylamine, benzyldimethylamine, 2-(dimethylaminomethyl) phenol, trolamine, methylbenzylamine, α-(m-aminophenyl base) ethamine, α-(p-aminophenyl) ethamine, diamino diethyl-dimethyl ditan, α, α '-two (4-aminophenyl) p-Diisopropylbenzene etc.
Concrete example as acid anhydride type curing agent, can enumerate dodecenyl succinic anhydride, poly-adipic anhydride, poly-nonane diacid acid anhydride, poly sebacic polyanhydride, poly-(ethyl octadecane diacid) acid anhydride, poly-(phenyl Thapsic acid) acid anhydride, methyl tetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, methyl Poria cocos acid anhydrides, Tetra Hydro Phthalic Anhydride, the trialkyl Tetra Hydro Phthalic Anhydride, the tetrahydrotoluene dicarboxylic acid anhydride, the tetrahydrotoluene tetracarboxylic acid anhydride, Tetra hydro Phthalic anhydride, trimellitic acid 1,2-anhydride, pyromellitic dianhydride, the benzophenone tetracarboxylic acid anhydride, the ethylene glycol bis trimellitate, the hexachloro endoethylene tetrahydrophthalic acid acid anhydride, nadic anhydride, the methyl nadic anhydride, 5-(2,5-dioxo tetrahydrochysene-3-furyl)-3-methyl-3-hexanaphthene-1, the 2-dicarboxylic acid anhydride, 3,4-dicarboxyl-1,2,3,4-tetrahydrochysene-1-naphthalene succinic dianhydride, 1-methyl-dicarboxyl-1,2,3,4-tetrahydrochysene-1-naphthalene succinic dianhydride etc.
Concrete example as phenols curing agent, can enumerate dihydroxyphenyl propane, Bisphenol F, the phenol novolak, the dihydroxyphenyl propane novolak, the ortho-cresol novolak, the meta-cresol novolak, the p-cresol novolak, the xylenol novolak, poly(4-hydroxystyrene), Resorcinol, pyrocatechol, tert-butyl catechol, Tert. Butyl Hydroquinone, fluoroglycinol, pyrogallol, tertiary butyl pyrogallol, the allylation pyrogallol, the multi-allylation pyrogallol, 1,2, the 4-benzenetriol, 2,3, the 4-trihydroxybenzophenone, 1, the 2-dihydroxy naphthlene, 1, the 3-dihydroxy naphthlene, 1, the 4-dihydroxy naphthlene, 1, the 5-dihydroxy naphthlene, 1, the 6-dihydroxy naphthlene, 1, the 7-dihydroxy naphthlene, 1, the 8-dihydroxy naphthlene, 2, the 3-dihydroxy naphthlene, 2, the 4-dihydroxy naphthlene, 2, the 5-dihydroxy naphthlene, 2, the 6-dihydroxy naphthlene, 2, the 7-dihydroxy naphthlene, 2, the 8-dihydroxy naphthlene, the allylate of above-mentioned dihydroxy naphthlene or multi-allylation thing, the allylation dihydroxyphenyl propane, the allylation Bisphenol F, allylation phenol novolak, allylation pyrogallol etc.
In whole curing agent components in composition epoxy resin, be more than the 20wt%, be preferably more than the 40wt%, more preferably more than the 60wt% by the content of the phenol resin of general formula (2) expression.If lack than it, then the degree of crystallinity when having formed epoxy resin cured product reduces, and can not expect the raising of thermal conductivity.In addition, consider from the viewpoint of thermotolerance, wet fastness and electrical insulating property, as used solidifying agent beyond the phenol resin of general formula (2), the preferred solidifying agent that uses with phenol hydroxyl.
In order to improve the thermal conductivity of epoxy resin cured product, in composition epoxy resin of the present invention, can cooperate inorganic filling material in right amount.As inorganic filling material, can enumerate metal, metal oxide, metal nitride, metallic carbide, metal hydroxides, carbon material etc.As metal, can enumerate silver, copper, gold, platinum, zircon etc., as metal oxide, can enumerate silicon-dioxide, aluminum oxide, magnesium oxide, titanium oxide, tungstic oxide etc., as metal nitride, can enumerate boron nitride, aluminium nitride, silicon nitride etc., as metallic carbide, can enumerate silicon carbide etc., as metal hydroxides, can enumerate aluminium hydroxide, magnesium hydroxides etc. as carbon material, can be enumerated carbon fiber, graphitized carbon fibre, natural graphite, synthetic graphite, the globular graphite particle, the middle carbon microballoon, whisker shape carbon, carbon microcoil, carbon nanocoil, carbon nanotube, carbon nanohorn etc.As the shape of inorganic filling material, broken shape, spherical, whisker shape, fibrous can have been made.These inorganic filling materials can cooperate separately, also two or more combinations can be cooperated.In addition,, improve interface reinforcement, dispersiveness of inorganic filling material etc., can impose common coupling agent treatment inorganic filling material in order to improve the wettability of inorganic filling material and Resins, epoxy.
As the use level of inorganic filling material, more than the preferred 50wt%, more preferably more than the 70wt%.If lack than it, then the raising effect of thermal conductivity is little.
In composition epoxy resin of the present invention, can use known in the past curing catalyst.Can enumerate amine, imidazoles, the organic phosphine class, Lewis acid etc., specifically, have 1,8-diazabicylo (5,4,0) undecylene-7, triethylenediamine, benzyldimethylamine, trolamine, dimethylaminoethanol, tertiary amines such as three (dimethylamino methyl) phenol, glyoxal ethyline, the 2-phenylimidazole, 2-phenyl-4-methylimidazole, imidazoles such as 2-heptadecyl imidazoles, three fourth phosphines, the methyldiphenyl phosphine, triphenyl phosphine, diphenyl phosphine, organic phosphine classes such as phosphniline, the tetraphenylphosphoniphenolate tetraphenyl borate salts, tetraphenylphosphoniphenolate ethyl triphenyl borate, four Qu Dai Phosphonium, four substituted boracic acid salt such as 4-butyl-phosphonium tetrabutyl borate, the 2-ethyl-4-methylimidazole tetraphenyl borate salts, tetraphenyl boron salt such as N-methylmorpholine-tetraphenyl borate salts etc.With respect to 100 weight part Resins, epoxy, addition is generally the scope of 0.2～10 weight part.
In addition, the viewpoint of the flowability during from the improvement moulding and the adaptation of raising and lead frame etc. is considered, can add thermoplastic oligopolymer class in composition epoxy resin of the present invention.As thermoplastic oligopolymer class, can enumerate petroleum resin, styrene resin, indene resin, indenes styrene copolymerized resin, indenes vinylbenzene phenol copolymer resins, indenes coumarone copolymer resins, indenes thionaphthene copolymer resins of C5 class and C9 class etc.With respect to 100 weight part Resins, epoxy, addition is generally the scope of 2～30 weight parts.
In addition, as required, in composition epoxy resin of the present invention, can use fire retardants such as bromination epoxy, releasing agent such as carnauba wax, ester wax, coupling agents such as epoxy silane, aminosilane, urea groups silane, vinyl silanes, alkyl silane, organic titanate, aluminium-alcohol salt, tinting materials such as carbon black, flame retardants such as ANTIMONY TRIOXIDE SB 203 99.8 PCT, silicone oil equal stress depressant, lubricants such as higher fatty acid, higher fatty acid metal-salt etc.
Composition epoxy resin of the present invention usually can be by using mixing machine etc., and with gradation compositions such as the above-mentioned Resins, epoxy of use level thorough mixing of regulation, curing agent components, it is mixing to use mixing roller, forcing machine etc. to carry out then, cooling, pulverizes and obtain.
Perhaps, above-mentioned gradation composition can be dissolved in aromatic solvents such as benzene,toluene,xylene, chlorobenzene, ketones solvents such as acetone, methylethylketone, methyl iso-butyl ketone (MIBK), pimelinketone, aliphatic hydrocarbon solvents such as hexane, heptane, methylcyclohexane, alcoholic solvents such as ethanol, Virahol, butanols, ethylene glycol, ether solvents such as diethyl ether, diox, tetrahydrofuran (THF), diglyme, N, form the composition epoxy resin of varnish shape in dinethylformamide, N,N-dimethylacetamide, dimethyl sulfoxide (DMSO), the N-Methyl pyrrolidone isopolarity solvent.The composition epoxy resin of varnish shape also can be removed the composition epoxy resin that organic solvent forms preimpregnation blank shape by drying after fibrous packing materials such as impregnated glass fiber, carbon fiber, Kevlar.
In order to use composition epoxy resin of the present invention to obtain cured article, can use for example methods such as transfer molding, moulded section, cast molding, injection molding, extrusion moulding.In addition, can take the method for method such as vacuum pressing mold as the composition epoxy resin that is used to solidify preimpregnation blank shape.
Consider that from the viewpoint of high thermal conductivity epoxy resin cured product of the present invention preferably has crystallinity.Can be by estimating crystalline degree with fusion caloric receptivity together in the differential thermal analysis.Endotherm(ic)peak in the differential thermal analysis observes in 120 ℃～250 ℃ scope usually, and preferred caloric receptivity is the resinous principle of per unit weight except that packing material, more than 5J/g.More preferably more than the 10J/g, be preferably more than the 30J/g especially.If littler than it, then the thermal conductivity raising effect as epoxy resin cured product is little.Should illustrate that said caloric receptivity is meant by the differential thermal analysis meter, uses the test portion of the accurate weighing of about 10mg herein, under stream of nitrogen gas, under the condition of 10 ℃/minute of heat-up rates, measure resulting caloric receptivity.
Epoxy resin cured product of the present invention can obtain by using above-mentioned forming method that it is heating and curing, and usually, mold temperature is 80 ℃～250 ℃, and molding time is 1 minute～20 hours.In order to improve the degree of crystallinity of epoxy resin cured product, wish at low temperatures with making its curing for a long time.Preferred solidification value is 100 ℃～180 ℃ a scope, more preferably 120 ℃～160 ℃.In addition, be 10 minutes～6 hours preferred set time, more preferably 30 minutes～3 hours.And then after moulding, can further improve degree of crystallinity by after fixing.Usually, the after fixing temperature is 130 ℃～250 ℃, and the time is 1 hour～20 hours scope, preferably under low 5 ℃～40 ℃ than the endotherm peak temperature in the differential thermal analysis temperature with carrying out after fixing in 1 hour to 24 hours.
Epoxy resin cured product of the present invention can carry out lamination with the base material of other kinds.Base material as lamination, be sheet, membranaceous base material, can exemplify metal bases such as Copper Foil, aluminium foil, stainless steel foil, polymer-based materials such as polyethylene, polypropylene, polystyrene, polyacrylic ester, polymethacrylate, polyethylene terephthalate, polybutylene terephthalate, PEN, liquid crystalline polymers, polymeric amide, polyimide, tetrafluoroethylene.
Composition epoxy resin of the present invention forms the cured article of high thermal conductivity and low heat expansion property excellence, when sealing that is applied to semiconductor element etc. and printed circuit board (PCB) etc., can bring into play excellent high exothermicity and dimensional stability.
Description of drawings
The differential thermal analysis figure of [Fig. 1] epoxy resin cured product
Embodiment
By the following examples the present invention is described more specifically.
Reference example 1
With 4 of 1010g, 4 '-dihydroxy diphenyl ether is dissolved in the Epicholorohydrin of 7000g, in decompression (about 120mmHg), under 60 ℃, with 48% aqueous sodium hydroxide solution of 4 hours 808g that drip.Therebetween, the water of generation is expelled to outside the system by the azeotropic with Epicholorohydrin, and the distilled Epicholorohydrin is back in the system.Drip after the end, continue reaction 1 hour again.Then,, heat up in a steamer Epicholorohydrin after the washing in addition, obtain the faint yellow aqueous rough Resins, epoxy of 1515g by removing by filter the salt of generation.Epoxy equivalent (weight) is 171, and water-disintegrable chlorine is 4500ppm.The Resins, epoxy of the 1500g of gained is dissolved in the methyl iso-butyl ketone (MIBK) of 6000ml, adds 20% aqueous sodium hydroxide solution of 76.5g, 80 ℃ of reactions 2 hours down.After after the reaction, filtering, washing, the methyl iso-butyl ketone (MIBK) as solvent is heated up in a steamer in decompression, obtains the faint yellow aqueous Resins, epoxy of 1380g.The epoxy equivalent (weight) of gained Resins, epoxy (Resins, epoxy A) is 163, and water-disintegrable chlorine is 280ppm, and fusing point is 78～84 ℃, and the viscosity under 150 ℃ is 0.0062Pas.Wherein, fusing point is the value that obtains under 2 ℃/minute heat-up rate by capillary tube technique.
Reference example 2
Under 150 ℃,, after 4 '-dihydroxy diphenyl ether melting mixing, add the triphenyl phosphine of 0.075g, under nitrogen gas stream, reacted 2 hours 4 of synthetic Resins, epoxy and 25.3g in the reference example 1 of 163g.After the reaction, be cooled to room temperature by placement, the gained resin demonstrates crystallinity and solidifies.The epoxy equivalent (weight) of gained resin (Resins, epoxy B) is 261, and fusing point is 100～122 ℃, and softening temperature is 127 ℃, and the viscosity under 150 ℃ is 0.037Pas.In addition, each composition ratio of being measured in the general formula (1) obtain by GPC of gained resin is: n=0 is 42.5%, and n=2 is 29.2%, and n=4 is 17.6%, and n 〉=6 are 10.7%.Wherein, the レ オ マ Star ト 115 that uses コ Application ト ラ バ ス company to make measures viscosity, measures softening temperature according to JIS K-6911 and by ring and ball method.In addition, the condition that GPC measures is: device: HLC-82A (eastern Cao (strain) manufacturings), post: TSK-GEL2000 * 3 piece and TSK-GEL4000 * 1 piece (all being eastern Cao (strain) manufacturings), solvent: tetrahydrofuran (THF), flow: 1ml/min, temperature: 38 ℃, detector: RI.
Reference example 3
Use 4 of synthetic Resins, epoxy and 50.5g in the reference example 1 of 163g, 4 '-dihydroxy diphenyl ether similarly reacts with reference example 2.After the reaction, be cooled to room temperature by placement, the gained resin demonstrates crystallinity and solidifies.The epoxy equivalent (weight) of gained resin (Resins, epoxy C) is 482, and fusing point is 145～165 ℃, and softening temperature is 163 ℃.In addition, each composition ratio of being measured in the general formula (1) obtain by GPC of gained resin is: n=0 is 16.7%, and n=2 is 22.1%, and n=4 is 32.1%, and n 〉=6 are 29.1%.
Embodiment 1
Under 120 ℃ with the Resins, epoxy (Resins, epoxy A) of gained in the reference example 1 of 92.5g, 57.3g as 4 of solidifying agent, the triphenyl phosphine as curing catalyst of 4 '-dihydroxy diphenyl ether (solidifying agent A) and 1.5g carries out melting mixing, forms composition epoxy resin.Then, under 120 ℃, be heating and curing 2 hours, form forming composition.Under 175 ℃, the gained forming composition further carried out 12 hours after fixing, obtain epoxy resin cured product after, it is carried out the mensuration of various rerum naturas.Use hot mechanical determinator under the condition of 10 ℃/minute of heat-up rates, to obtain second-order transition temperature and linear expansivity.Use the differential thermal analysis device under the condition of 10 ℃/minute of heat-up rates, to obtain fusing point and caloric receptivity.Measurement result is shown in Fig. 1.In addition, use the disk of diameter 50mm, thickness 3mm, obtain thermal conductivity by non-permanent probe method.
Embodiment 2～5 and comparative example 1～3
(Resins, epoxy A～C), (Resins, epoxy D: Dongdu changes into manufacturing to bisphenol A type epoxy resin, YD-8125 to use the Resins, epoxy of reference example 1～3; Epoxy equivalent (weight) 174) as the Resins, epoxy composition, 4, (solidifying agent B: group Rong Huaxue makes PSM-4261 for 4 '-dihydroxy diphenyl ether (solidifying agent A), phenol novolak; The OH equivalent is 103, and softening temperature is 82 degree, and the melt viscosity under 150 ℃ is 0.16Pas) as solidifying agent, triphenyl phosphine carries out melting mixing as curing catalyst with the cooperation shown in the table 1, thereby obtains composition epoxy resin.Use this composition epoxy resin, be cured under the conditions shown in Table 1 and after fixing, similarly to Example 1 the physicals of evaluate cure thing.
The result all is shown in Table 1.
[table 1]
Claims (4)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP137228/2005 | 2005-05-10 | ||
| JP2005137228 | 2005-05-10 | ||
| PCT/JP2006/309231 WO2006120993A1 (en) | 2005-05-10 | 2006-05-08 | Epoxy resin composition and curing product thereof |
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| CN101198632A CN101198632A (en) | 2008-06-11 |
| CN101198632B true CN101198632B (en) | 2010-06-09 |
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| US (1) | US20100016498A1 (en) |
| JP (1) | JP5324094B2 (en) |
| KR (1) | KR101262138B1 (en) |
| CN (1) | CN101198632B (en) |
| TW (1) | TWI402288B (en) |
| WO (1) | WO2006120993A1 (en) |
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| JP5037370B2 (en) * | 2008-01-23 | 2012-09-26 | 新日鐵化学株式会社 | Epoxy resin composition and cured product |
| WO2009113392A1 (en) * | 2008-03-13 | 2009-09-17 | 新日本製鐵株式会社 | Electromagnetic steel sheet having insulating coating film with excellent thermal conductivity therein, and process for production thereof |
| TWI494341B (en) * | 2008-03-31 | 2015-08-01 | Nippon Steel & Sumikin Chem Co | Epoxy resin compositions and shaped articles |
| CN102203183B (en) * | 2008-10-30 | 2013-04-17 | 株式会社钟化 | High thermal conductivity thermoplastic resin composition and thermoplastic resin |
| CN102498149B (en) | 2009-09-16 | 2013-11-27 | 株式会社钟化 | Thermally-conductive organic additive, resin composition, and cured product |
| KR20130103310A (en) | 2010-04-19 | 2013-09-23 | 카네카 코포레이션 | Thermoplastic resin with high thermal conductivity |
| EP2562201B1 (en) | 2010-04-19 | 2016-04-06 | Kaneka Corporation | Thermoplastic resin with high thermal conductivity |
| JP5584538B2 (en) * | 2010-07-08 | 2014-09-03 | 新日鉄住金化学株式会社 | Epoxy resin composition, molded product, varnish, film adhesive and copper foil with film adhesive |
| JP5844290B2 (en) | 2011-02-08 | 2016-01-13 | 株式会社カネカ | High thermal conductivity thermoplastic resin, resin composition and molded body |
| CN102658259B (en) * | 2012-05-24 | 2013-12-04 | 哈尔滨玻璃钢研究院 | Method for preparing resin matrix composite external protection structure by using vapor deposition method |
| CN102658260B (en) * | 2012-05-24 | 2013-10-30 | 哈尔滨玻璃钢研究院 | Method for preparing resin-base composite material inner layer by aid of vapor deposition process |
| CN102658261B (en) * | 2012-05-24 | 2013-09-25 | 哈尔滨玻璃钢研究院 | Method for preparing resin-base composite material thermal protection structure from modified resin by vapor deposition process |
| WO2014084555A1 (en) * | 2012-11-30 | 2014-06-05 | 엘지이노텍 주식회사 | Epoxy resin composition, and printed circuit board comprising insulation layer using epoxy resin composition |
| KR102012311B1 (en) * | 2012-12-12 | 2019-08-20 | 엘지이노텍 주식회사 | Resin composite and printed circuit board using the same |
| KR101984791B1 (en) * | 2012-12-12 | 2019-09-03 | 엘지이노텍 주식회사 | Epoxy resin composite, prepreg and printed circuit board using the same |
| KR101973685B1 (en) * | 2012-12-12 | 2019-08-26 | 엘지이노텍 주식회사 | Epoxy resin composite and printed circuit board using the same |
| KR101973686B1 (en) * | 2012-12-12 | 2019-08-26 | 엘지이노텍 주식회사 | Epoxy resin composite and printed circuit board using the same |
| KR102034228B1 (en) * | 2012-12-14 | 2019-10-18 | 엘지이노텍 주식회사 | Epoxy resin composite, prepreg and printed circuit board using the same |
| KR102104524B1 (en) * | 2013-08-23 | 2020-04-24 | 엘지이노텍 주식회사 | Epoxy resin composite and printed circuit board comprising isolation using the same |
| KR102104525B1 (en) * | 2013-08-23 | 2020-04-24 | 엘지이노텍 주식회사 | Epoxy resin composite and printed circuit board comprising isolation using the same |
| US20150062140A1 (en) * | 2013-08-29 | 2015-03-05 | Monotype Imaging Inc. | Dynamically Adjustable Distance Fields for Adaptive Rendering |
| US9809735B2 (en) | 2013-12-04 | 2017-11-07 | Kaneka Corporation | Highly-thermally-conductive resin composition, and resin material for heat dissipation/heat transfer and thermally conductive film comprising same |
| KR102135413B1 (en) * | 2013-12-20 | 2020-07-17 | 엘지이노텍 주식회사 | Epoxy resin composite and printed circuit board comprising isolation using the same |
| WO2015174023A1 (en) * | 2014-05-15 | 2015-11-19 | パナソニックＩｐマネジメント株式会社 | Insulating thermally conductive resin composition |
| CN109219637B (en) * | 2016-05-30 | 2021-05-25 | 昭和电工材料株式会社 | Sealing composition and semiconductor device |
| KR101899088B1 (en) | 2017-01-17 | 2018-09-17 | 한국과학기술연구원 | Liquid crystalline epoxy compound with terminal mesogen connected by flexible linkage and method for preparing the same |
| US11572437B2 (en) | 2017-06-12 | 2023-02-07 | Kaneka Corporation | Thermoplastic resin, thermoplastic resin composition, and heat conductive sheet |
| JPWO2019188291A1 (en) * | 2018-03-27 | 2021-04-22 | 日鉄ケミカル＆マテリアル株式会社 | Epoxy resin composition and its cured product |
| JP7247003B2 (en) * | 2019-04-12 | 2023-03-28 | 本田技研工業株式会社 | Heat-dissipating paint composition and method for producing heat-dissipating coating |
| KR102702453B1 (en) * | 2021-11-16 | 2024-09-04 | 국도화학 주식회사 | Higher Arc resistance bio-based Epoxy resin material composition for heavy electric and method of manufacturing the same |
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- 2006-05-08 JP JP2007528263A patent/JP5324094B2/en active Active
- 2006-05-08 KR KR1020077028623A patent/KR101262138B1/en active Active
- 2006-05-08 US US11/919,587 patent/US20100016498A1/en not_active Abandoned
- 2006-05-08 WO PCT/JP2006/309231 patent/WO2006120993A1/en active Application Filing
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| CN1605599A (en) * | 2004-09-14 | 2005-04-13 | 孙忠贤 | Epoxy resin composition with high content filling and method for making same |
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| KR20080015434A (en) | 2008-02-19 |
| TW200702353A (en) | 2007-01-16 |
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| US20100016498A1 (en) | 2010-01-21 |
| JP5324094B2 (en) | 2013-10-23 |
| JPWO2006120993A1 (en) | 2008-12-18 |
| CN101198632A (en) | 2008-06-11 |
| WO2006120993A1 (en) | 2006-11-16 |
| KR101262138B1 (en) | 2013-05-14 |
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