CN101196763A - Expansion structure of memory module slot - Google Patents

Abstract

The invention discloses an expansion structure of memory module slots, wherein a circuit adapter plate and a substrate are arranged on a mainboard, the mainboard is provided with a plurality of first memory module slots, one side surface of the substrate is provided with at least one second memory module slot, the other side surface is provided with a plurality of third memory module slots, the third memory module slots are electrically connected with the second memory module slots, two ends of the circuit adapter plate are inserted into the first memory module slots and the second memory module slots, when the memory modules are inserted into the third memory module slots, each memory module can be electrically connected with the first memory module slots through the circuit adapter plate, and data and signal transmission is carried out between the circuit adapter plate and the mainboard.

Description

Expansion structure of the memory module slot

technical field

The invention relates to an expansion structure for a memory module slot, in particular to an expansion structure for a memory module slot, which can increase the number of memory modules assembled on a motherboard.

Background technique

The Central Processing Unit (CPU) of the host computer uses Random Access Memory (RAM) as a data storage area, and the calculation results and program instructions of the Central Processing Unit are placed in the Random Access Memory. The data in the storage area can be accessed when the program is executed.

However, the functions of computer mainframes are becoming more and more powerful nowadays, and the requirements for computing functions are correspondingly increased, so the requirements for the quantity of random access memory are also increased accordingly. Refer to [FIG. 1A] and [FIG. 1B], where [FIG. 1A] is a side view of a memory module inserted into a motherboard, and [FIG. 1B] is a perspective view of a memory module. The main board 20a (Mother Board) is provided with a North Bridge chip 21a (North Bridge), adjacent to the North Bridge chip 21a is provided with a plurality of memory module slots 22a, and the memory module slots 22a can be used for the memory module 50a in a golden finger mode (Golden Finger). Finger), this memory module 50a also includes a printed circuit board 51a and a plurality of memory 52a, and each memory 52a is respectively assembled on the two ends of the printed circuit board 51a, and the north bridge chip 21a mainly controls the central processing unit and Signal transmission between memory modules 50a.

Therefore, in the case of increasing data processing speed and data volume, while the capacity of the matched memory modules is getting higher and higher, correspondingly, the number of memory module slots is also increasing for the insertion of the memory modules. However, the memory module slots are directly located on the surface of the motherboard. If you want to assemble more memory modules, you must increase the number of memory module slots on the surface of the motherboard. The more the number of memory module slots, the more the motherboard will be occupied. A lot of area, under the limited motherboard assembly area, will crowd out the assembly of other electronic components. Or increase the area of the motherboard to assemble more memory module slots, but the increase in the area of the motherboard will increase the volume of the computer host, which runs counter to the trend of the computer host becoming smaller and thinner.

In the above-mentioned prior art, when the capacity of the memory module is to be increased, the memory module slots on the surface of the mainboard must be increased, thus occupying a lot of area of the mainboard.

Contents of the invention

The technical problem to be solved by the present invention is to provide an expansion structure of the memory module slot, which can expand the capacity of the memory module without occupying too much assembly area of the motherboard.

According to the expansion structure of the memory module slot disclosed by the present invention, it is applied to a motherboard, and the motherboard is provided with a plurality of first memory module slots. The expansion structure of the memory module slot includes a circuit adapter board and a base board. The two ends of the circuit adapter board respectively form a first connection terminal and a second connection terminal which are electrically connected to each other, wherein the first connection terminal is electrically connected to one of the first memory module slots, and one side of the substrate is provided with At least one second memory module slot, the other side is provided with a plurality of third memory module slots, wherein the third memory slots are electrically connected to the second memory module slots, and the second connection terminal of the circuit adapter board Electrically connected to the second memory module slot, so that a plurality of memory modules can be respectively connected to each third memory module slot, electrically connected to the first memory module slot through the circuit adapter board, and carry out signals with the motherboard transmission.

The expansion structure of the memory module slot disclosed by the present invention has the effect that the memory module can be expanded in a limited space without occupying too much assembly area of the motherboard, and can greatly reduce the host computer occupied by the memory module. In addition to the surface area of the board, the maximum performance of the memory module can also be brought into play, and the memory module is stacked on the motherboard by using the circuit adapter board and the substrate, so the user can expand the memory module according to the demand. Moreover, the circuit adapter board is not only used as a support for the substrate, but also serves as a connecting pipe between the main board and the substrate, without additional assembly of connectors, so as to reduce manufacturing costs.

Description of drawings

FIG. 1A is a side view of an existing memory module inserted into a motherboard;

FIG. 1B is a three-dimensional schematic diagram of an existing memory module;

2A is a three-dimensional schematic diagram of an embodiment of the present invention without a memory expansion card;

2B is a three-dimensional schematic diagram of a memory expansion card in an embodiment of the present invention;

Fig. 3 is a schematic side view of a memory expansion card provided in an embodiment of the present invention;

4 is a schematic top view of a circuit adapter board inserted into a first memory module slot according to an embodiment of the present invention;

5 is a schematic top view of a circuit adapter board inserted into a third memory module slot according to an embodiment of the present invention;

FIG. 6 is a schematic diagram of signal transmission between the north bridge chip and the fully buffered memory module through the bus according to the embodiment of the present invention.

Among them, reference signs:

current technology

20a: Motherboard 21a: North Bridge chip

22a: Memory module slot 50a: Memory module

51a: Printed circuit board 52a: Memory

this invention

20: Motherboard 21: Northbridge chip

22: The first memory module slot 30: Circuit adapter board

31: The first connection terminal 32: The second connection terminal

40: Baseboard 42: Second memory module slot

43: Third memory module slot 50: Fully buffered memory module

51: Circuit board 52: Memory

53: Advanced memory buffer chip 60: Bus

C1: The first group C2: The second group

C3: The third group C4: The fourth group

Detailed ways

According to the expansion structure of the memory module slot disclosed in the present invention, the types of the memory module include, for example, a single-line memory module (Single In-line Memory Module, SIMM), a dual-line memory module (DualIn-line Memory Module, DIMM), memory Bus memory module (Rambus In-line MemoryModule, RIMM), etc., but not limited to the above-mentioned memory module, in the following specific embodiments of the present invention, will use the dual-line memory module as the best embodiment of the present invention.

Refer to [FIG. 2A], [FIG. 2B] and [FIG. 3], where [FIG. 2A] is a three-dimensional schematic diagram of an uninstalled memory expansion card according to an embodiment of the present invention, and [FIG. 2B] is a perspective view of an existing memory expansion card according to an embodiment of the present invention. A three-dimensional schematic diagram of the expansion card, [Fig. 3] is a side view schematic diagram of the installed memory expansion card according to the embodiment of the present invention. The expansion structure of the memory module slot is applied on the main board 20 and includes the circuit adapter board 30 and the base board 40 . Again, the motherboard 20 is provided with a central processing unit, a north bridge chip 21 and other electronic components, adjacent to the north bridge chip 21 is provided with a plurality of first memory module slots 22, and this first memory module slot 22 can be used for full buffering. The memory modules 50 (Fully Buffered DIMMs) are inserted with gold fingers. The full-buffer memory module 50 also includes a circuit board 51, a plurality of memories 52 and an advanced memory buffer chip 53 (Advanced Memory Buffer, AMB), and each memory 52 is respectively assembled on both ends of the circuit board 51, and the advanced memory buffer chip 53 is also assembled on the end surface of the circuit board 51 . In addition, the north bridge chip 21 mainly controls the signal transmission between the central processing unit and the fully buffered memory module 50 . In this way, the central processing unit can execute the program, and can store data or read data from the storage area at any time.

The circuit adapter board 30 is a printed circuit board with a signal transmission line, and its two ends respectively form a first connection terminal 31 and a second connection terminal 32 that are electrically conductive to each other, wherein the first connection terminal 31 is inserted into the main board 20 The other end of one of the first memory module slots 22 extends away from the motherboard 20 for supporting the substrate 40 , thereby making the substrate 40 electrically connected to the motherboard 20 . The number of circuit adapter boards 30 is the minimum number that can stabilize the substrate 40 on the motherboard 20 so that the substrate 40 will not fall over. Here, the number of circuit adapter boards 30 is two, but not limited thereto.

One side of the substrate 40 is provided with at least one second memory module slot 42 , and the other side is provided with a plurality of third memory module slots 43 , and the third memory module slots 43 are electrically connected to the second memory module slots. Wherein, the second memory module slot 42 of the substrate 40 corresponds to the second connection terminal 32 of the circuit adapter board 30, for the second connection terminal of the circuit adapter board 30 to be electrically connected, and each third memory module slot 42 for each fully buffered memory module 50 to be inserted in a gold finger manner. Here, the number of the second memory module slots 42 is two, but not limited thereto, and each second memory module slot 42 corresponds to a group of third memory module slots 43 .

Refer to Fig. 2A, Fig. 2B and Fig. 3, and refer to Fig. 4, Fig. 5 and Fig. 6 together, wherein, Fig. 4 is a schematic top view of the circuit adapter board inserted into the first memory module slot, and Fig. A schematic top view of the connecting board inserted into the third memory module slot, and FIG. 6 is a schematic diagram of signal transmission between the north bridge chip and the fully buffered memory module through the bus. According to the above-mentioned components, when assembling, insert the first connection terminal 31 of the circuit adapter board 30 into the first memory module slot 22 of the motherboard 20 to serve as the supporting part of the substrate 40, and then, the first connection terminal 31 of the substrate 40 The second memory module slot 42 is aligned with the second connection terminal 32 of the circuit adapter board 30, so that the second connection terminal 32 is inserted into the second memory module slot 42 and electrically connected, so that the substrate 40 and the motherboard 20 are mutually connected. are parallel, and there is a distance between them, so that the substrate 40 is stacked above the first memory module slot 22 of the motherboard 20 . The first memory module slot 22 and the third memory module slot 43 allow the assembler to insert the fully buffered memory module 50 . Here, the number of fully-buffered memory modules 50 in this embodiment of the present invention is eight, and according to their positions, they are divided into four groups: the first group C1, the second group C2, the third group C3 and the fourth group C4, wherein, The fully buffered memory module 50 inserted in the first memory module slot 22 is divided into two groups C1 and C2, and the fully buffered memory module 50 inserted in the third memory module slot 43 is divided into two groups C3 and C4. , but the number is not limited to this. The assembler inserts golden fingers into the first memory module slot 22 and the third memory module slot 43 depending on the required quantity of the fully buffered memory module 50 .

In actual application, the north bridge chip 21 will transmit signals to C1, C2, C3 and C4 through the bus 60, that is, the fully buffered memory module 50 inserted in the first memory module slot 22 and the third memory module slot 43 signal can be received. However, as the positions of the fully buffered memory modules 50 are different, the signal transmission paths are different. Wherein, the route from the bus 60 to C1 and C2 only passes through the motherboard 20 . The route from the bus 60 to C3 and C4 passes through the motherboard 20 and then passes through the second circuit adapter board 30 to the third memory module slot 43 respectively. In this way, the fully buffered memory module 50 inserted into the third memory module slot 43 can perform data and signal transmission with the north bridge chip 21 on the motherboard 20 .

It should be noted that the height of the circuit adapter board 40 takes into account the internal space configuration of the computer host, for example, the first connection terminal 31 and the second connection terminal 32 of the circuit adapter board 40 are inserted into the first memory module slot 22 When connecting with the second memory module slot 42, the distance between the substrate 40 and the motherboard 20 needs to be greater than the height of the fully buffered memory module 50 inserted in the first memory module slot 22, so as to prevent the substrate 40 from being pressed against the first memory module slot 22. The fully buffered memory module 50 of a memory module slot 22 is damaged.

Similarly, according to the above assembly steps, another substrate can be stacked on the substrate 40 in a direction away from the main board 20 to meet the needs of assemblers.

To sum up, the present invention uses an upward stacking method to increase the capacity of the memory module. When the capacity of the memory module is insufficient or to meet the needs of the assembler, the area where the memory module is provided on the main board is provided through the circuit adapter board. The base board is erected to install more memory modules. In this way, the motherboard does not need to increase the assembly area to set up memory module slots, and the memory module slots occupy too much motherboard area, which can be greatly reduced. The area it occupies on the motherboard. In addition, the assembler only needs to insert both ends of the circuit adapter board into the original memory module slot, so that the substrate and the motherboard can be electrically connected for data transmission between the two without adding additional memory modules. Connectors to save costs. In addition, under the limited usable area of the motherboard, extending the memory module toward the top of the motherboard can also exert its best performance.

Certainly, the present invention also can have other various embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these Corresponding changes and deformations should belong to the scope of protection of the appended claims of the present invention.

Claims (5)

1. the expanded structure of a memory module slot is applied to a motherboard, and this motherboard also is provided with a plurality of first memory module slots, it is characterized in that, includes:

One circuit switch plate, its two end form one first splicing ear and one second splicing ear of conducting each other respectively, and this first splicing ear is electrically connected at this first memory module slot; And

One substrate, the one side is provided with at least one second memory module slot, the another side is provided with a plurality of the 3rd memory module slots, the 3rd memory module slot is electrically connected at this second memory module slot, and this second splicing ear of this circuit switch plate is electrically connected at this second memory module slot;

This memory modules is connected to the 3rd memory module slot, and electrically connects with this first memory module slot via this circuit switch plate, and carries out the signal transmission with this motherboard.

2. the expanded structure of memory module slot according to claim 1 is characterized in that, the two ends of this circuit switch plate are inserted in this first memory module slot one of them and this second memory module slot respectively.

3. the expanded structure of memory module slot according to claim 1 is characterized in that, this substrate is parallel to this motherboard, and and this motherboard between have a spacing distance.

4. the expanded structure of memory module slot according to claim 3 is characterized in that, this spacing distance is greater than the height of this memory modules after being inserted in this first memory module slot.

5. the expanded structure of memory module slot according to claim 1 is characterized in that, this circuit switch plate is one to have the printed circuit board (PCB) of signal transmission line.

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