CN101179088A - Multidirectional conduction electrical reinforced CCM packaging structure and packaging method thereof - Google Patents

Abstract

The present invention relates to a multi-conductivity electrically enhanced micro lens module (CCM for short) packaging structure, which includes: a conductor platform, an image sensing chip, a plurality of metal wires, a sealing glue, and a transparent cover plate. The conductor platform further includes a metal conductor frame and an insulating portion. A plurality of open grooves are provided on the four sides of the insulating portion, and a conductor pin extending from the metal conductor frame is embedded in the open groove to form a socket-type conductor platform. The image sensing chip is bonded to the metal conductor frame at the central recess of the conductor platform, and a plurality of metal wires are applied to make the conductor pin at the upper edge of the conductor platform electrically conductive with the image sensing chip. The transparent cover plate is then fixed to the top surface of the conductor platform by a sealing glue containing a plurality of spacers.

Description

Multi-directional conductivity enhanced CCM packaging structure and packaging method

technical field

The present invention relates to a packaging structure and packaging method of a multi-directional conductivity enhanced miniature lens module, in particular to a miniature lens module (Compact CameraModule, CCM) in the form of a socket (Socket Type), so that it can be used with Other electronic-related products with pin-shaped pins are connected to each other, which can effectively improve the optimization of product manufacturing process and assembly.

Background technique

With the rapid development of the technology era, various portable information electronic products and equipment have emerged accordingly, and all kinds of product components are moving towards the goal of being thin, light and small. How to make the product more user-friendly, the concept of multi-machine integration, the compact size and the convenience of carrying are in line with human factors engineering, and more in line with the needs of consumers for convenience and fashion, which is one of the main issues in the current market. Combining mobile phones with digital camera functions or even MP3 or notebook computers, or combining PDAs with digital camera functions is one of the important improvement breakthroughs.

Observing all mobile phones currently on the market, we can find that they are all developing towards miniaturization, especially mobile phones with camera functions, which are even more popular models. Now mobile phones are more integrated with 3G functions, using network video calls to make both users Can communicate by video. Therefore, the future mobile phone route will be diversified and full-featured equipment, which has the opportunity to replace the existing digital camera and become a multi-functional integrated model that combines photography, communication, and Internet access. How to make it more assembled Convenience and speed, simpler manufacturing process, and thinner volume will be the main goals of the industry's development.

Please refer to FIG. 1 , which is a structural schematic diagram of an existing CCM packaging structure (Compact Camera Module, CCM for short). The existing CCM package structure 1 includes: a substrate 10 , an image sensing chip 11 , a ring bank 12 , a plurality of metal wires 13 , a glass cover 14 , and a plurality of solder balls 15 . Wherein, the image sensor chip 11 is arranged on the substrate 10, the image sensor chip 11 is electrically connected to the substrate 10 by the plurality of metal wires 13, and the image is surrounded by the ring embankment 12. The sensing chip 11 is arranged on the substrate 10 to protect the image sensing chip 11 and a number of metal wires 13 connected to the substrate 10, and then the glass is arranged on the ring bank 12 Cover plate 14, so that the image sensor chip 11 can capture the external image through the glass cover plate 14 provided on the ring bank 12, and a plurality of solder balls 15 and Connect with other electronic products.

However, in the existing CCM packaging structure, when it is connected with different electrical products, it must be connected by spot welding with the solder balls or solder pads under the CCM module substrate and the circuit board of the connected electronic products, so that all The CCM module and the electronic product can be electrically connected, not only the assembly process of the CCM module itself is complicated, but also the step of spot welding connection must be added when the CCM module is electrically connected with other electronic products, which increases the production cost and reduces the assembly efficiency.

Contents of the invention

The first object of the present invention is to provide a multi-directional conductivity-enhanced CCM packaging structure and method, which uses a wire platform with a concave frame with a certain thickness to place the image sensor chip in its central depression. Several open grooves are provided on the adjacent four sides of the wire platform to form a Socket Type CCM module for corresponding pin positions.

Another object of the present invention is to provide a multi-directional conductivity-enhanced CCM packaging structure and method, which can make the CCM The module is immune to other electromagnetic or electrostatic interference.

Yet another object of the present invention is to provide a multi-directional conductivity-enhanced CCM packaging structure and method, in which a transparent cover plate is fixed on the top of the concave frame-shaped frame of the wire platform by using a sealant containing a number of spacers On the other hand, the transparent cover and the image sensing chip can be maintained in a parallel state, and the purpose of protecting the metal wires from extrusion and deformation can be achieved.

Another object of the present invention is to provide a multi-directional conductivity enhanced CCM packaging structure and method, which is a plurality of metal leads extended from the metal lead frame on the lead platform to be bent and attached to the lead The bottom surface of the platform, the open groove on the side, and the top surface of the frame form a multi-directional conductive CCM module that can be connected to the bottom and connected to the side.

In order to achieve the above-mentioned purpose, the present invention provides a multi-directional conductivity-enhanced CCM packaging structure, including: a lead platform, which is a concave frame-shaped frame body, which includes a metal lead frame and an insulating portion; an image The sensing chip has an active surface and a non-active surface, and is combined with the non-active surface on the metal lead frame at the central depression of the lead platform; a plurality of metal wires are stamped with a plurality of metal wires The way to make the wire platform and the image sensor chip conduct electrical conduction; encapsulation, containing a plurality of spacers with a predetermined particle size, which is filled in the transparent cover plate and the wire platform Between the top surfaces of a frame-shaped frame; and a transparent cover, covering an image sensing area of the image sensing chip, and fixed to the frame-shaped frame of the wire platform through the sealing glue On the top surface; wherein, the distance between the transparent cover plate and the image sensing chip is determined by the predetermined particle size of the spacer.

A metal chip seat on the metal lead frame can be exposed and attached to the central depression of the lead platform, which can be used for bonding the non-active surface of the image sensing chip, and on the four sides adjacent to the lead platform. On the side surface, several open grooves are provided in a nearly equidistant manner, and the several open grooves penetrate through a bottom surface of the insulating part and a top surface of a frame-shaped frame body.

In addition, one of the plurality of metal guide pins extending around the metal chip holder can be roughly divided into four conductive sections, and the four conductive sections include in sequence: a ground conductive section, a bottom conductive section segment, a side-connected conductive segment, and a chip conductive segment. Wherein, the grounding conductive section is connected around the metal chip holder and buried inside the central depression of the insulating part, and other respective conductive sections connected to the grounding conductive section run through On the outer side of the bottom surface of the insulating part, the respective conductive segments are sequentially attached to the bottom surface of the insulating part, the open groove on the side, and the top surface of the frame-shaped frame body in a bending manner to form a Corresponding to the socket type (Socket Type) wire platform of the pin position.

An image sensing region is provided on the operating surface of the image sensing chip, and a plurality of aluminum pads are arranged around the image sensing region, and the plurality of aluminum pads are connected to the lead platform through a plurality of metal wires. The conductive segments of the chip on the top surface of the frame-shaped frame body are connected to each other, so that the image sensing chip is electrically connected to the lead platform. Then apply the sealant on the top surface of the frame-shaped frame of the wire platform, and because the sealant contains a number of spacers, the predetermined particle size of the spacers can be used as the wire The space between the platform and the transparent cover can protect the metal wire from extrusion deformation due to the predetermined particle size of the spacer, and at the same time, the transparent cover is bonded to the wire platform.

The present invention also provides a method for multi-directional conductivity-enhanced CCM packaging, which includes the following steps: providing a lead platform, where an insulating part and a metal lead frame are pressed into a concave frame by filling or injection. A frame body; a non-active surface of an image sensor chip is combined with a central depression of the lead platform, and bonded to a metal chip seat of the metal lead frame of the lead platform; in the image Several aluminum pads on the sensing chip are electrically connected to a chip conductive section on the top surface of a frame-shaped frame body of the wire platform by putting a number of metal wires on it; coating a sealant on the wire platform The top surface of the frame-shaped frame body, wherein the sealant includes a plurality of spacers with a predetermined particle size to protect the metal wire from extrusion deformation; before the sealant is hardened , cover a transparent cover plate on the top of the sealant, and press it adhesively, and use the predetermined particle size of the spacer contained in the sealant to make the transparent cover plate and the sealant The image sensing chips are parallel to each other and keep a fixed distance; wherein, the sealant is cured by heat or ultraviolet light, so that the transparent cover can be fixed on the lead platform through the sealant superior.

The present invention also provides a wire platform structure of a multi-conductivity reinforced CCM, which includes: a metal lead frame, and the metal lead frame further includes a metal chip seat and a plurality of metal guide pins; an insulating part with A concave frame with a certain thickness, so that the metal chip seat on the metal lead frame can be exposed and attached to a central depression of the lead platform; wherein, the insulating part is molded or injected The method is to press the metal lead frame into a concave frame body, the metal chip seat on the metal lead frame is exposed and attached to the central depression of the insulating part, and the metal guide pins are equidistant The method extends outward along the periphery of the metal chip holder, and each of the metal pins is divided into four conductive sections, wherein a conductive section connected to the metal chip holder is embedded in the insulating part The other conductive sections of the metal guide pin penetrate the outer side of the bottom surface of the insulating part, and respectively attach the respective conductive sections to the bottom surface and side surfaces of the insulating part in a bending manner. In the open groove and the top surface of the frame-shaped frame body.

In the present invention, the insulating part and the metal lead frame are pressed into a lead platform by means of mold filling or injection, and it is a concave frame-shaped frame body. There are four adjacent sides of the lead platform. A number of open grooves make it possible to form a socket type (Socket Type) wire platform for corresponding pin positions, so that the CCM package structure becomes a socket type CCM module (Socket Type CCM) its main purpose.

Description of drawings

1 is a cross-sectional view of an existing CCM package structure;

Fig. 2 is a three-dimensional exploded view of the first preferred embodiment of the multi-directional conductivity-enhanced CCM packaging structure of the present invention;

3A and 3B are respectively a top view and a side view of the metal lead frame of the first preferred implementation of the multi-directional conductivity-enhanced CCM package structure of the present invention;

3C and 3D are schematic diagrams of the manufacturing process of the lead platform of the first preferred implementation of the multi-directional conductivity-enhanced CCM packaging structure of the present invention;

Fig. 4 is a stereoscopic view of the wire platform of the first preferred implementation of the multi-directional conductivity-enhanced CCM package structure of the present invention;

Figure 5 is an A-A sectional view of the wire platform of Figure 4;

6 is a top view of the combination of the wire platform and the image sensor chip in the first preferred implementation of the multi-directional conductivity-enhanced CCM package structure of the present invention;

Fig. 7 is a cross-sectional side view of the first preferred embodiment of the multi-conductivity enhanced CCM package structure of the present invention;

Fig. 8 is a cross-sectional view of the use state of the first preferred embodiment of the multi-directional conductivity-enhanced CCM package structure of the present invention;

9 is a top view of the wire platform of the second preferred embodiment of the multi-directional conductivity enhanced CCM package structure of the present invention;

FIG. 10A to FIG. 10D are schematic flowcharts of the steps of the multi-conductivity-enhanced CCM packaging method of the present invention.

Explanation of reference numerals; 1-existing CCM packaging structure; 10-substrate; 11-image sensing chip; 12-ring bank; 13-several metal wires; 14-glass cover plate; 30～conductor platform; 301～central depression; 302～side; 303～open groove; 31～metal lead frame; 311～metal chip seat; 312～metal guide pin; 3121～ Grounding conductive section; 3122~bottom connected conductive section; 3123~side connected conductive section; 3124~chip conductive section; 32~insulation part; 321~bottom surface; 322~frame top surface; Measuring chip; 41～active surface; 411～image sensing area; 412～aluminum pad; 42～non-active surface; 50～metal wire; 60～sealant; 61～spacer; 70～transparent cover plate; 80 ~ Stitches.

Detailed ways

In order to more clearly describe the multi-directional conductivity-enhanced CCM packaging structure and packaging method proposed by the present invention, it will be described in detail below with illustrations.

Please refer to FIG. 2 , which is a three-dimensional exploded view of the first preferred embodiment of the multi-directional conductivity-enhanced CCM package structure of the present invention. Among them, the CCM module 20 with enhanced multi-directional conductivity is mainly composed of: a wire platform 30, an image sensing chip 40, a number of metal wires 50 (also shown in FIG. 6 and FIG. Fig. seven), and a transparent cover plate 70 are jointly formed. The lead platform 30 includes a metal lead frame 31 and an insulating portion 32 .

Please refer to FIGS. 3A to 3D , wherein FIGS. 3A and 3B are respectively a top view and a side view of a metal lead frame semi-finished product in the first preferred implementation of the multi-conductivity enhanced CCM package structure of the present invention. 3C and 3D are schematic diagrams of the manufacturing process of the lead platform 30 in the first preferred implementation of the multi-directional conductivity-enhanced CCM package structure of the present invention.

As shown in FIGS. 3A and 3B , the metal lead frame 31 further includes a metal chip holder 311 and a plurality of metal leads 312 . In the side view shown in FIG. 3B , it can be seen that the metal lead frame 31 is roughly in the shape of a flat thin metal sheet, and the position of the metal chip holder 311 located in the central area of the metal lead frame 31 is slightly higher. The metal guide pin 312 on its periphery. Among the plurality of metal leads 312, some are connected to the periphery of the metal chip holder 311, while others are not connected to the metal chip holder 311, and these metal leads 312 are all radially extended outwards . The metal lead frame 31 can be made of copper, aluminum, alloy, or other conductive metal materials, or alloys thereof.

Please refer to FIG. 3C , the lead platform 30 is molded or injected, and the metal lead frame 31 and the insulating part 32 are pressed into a concave frame body, and the metal lead frame 31 is The metal die holder 311 is exposed and attached to the surface of a central recess 301 of the lead platform 30 . As for the metal guide pins 312 , they protrude horizontally out of the periphery of the bottom of the insulating portion 32 , and the positions of the metal guide pins 312 correspond to the open grooves 303 provided on the four sides 302 of the insulating portion 32 . In this embodiment, the insulating portion 32 may be made of epoxy resin or plastic. Afterwards, as shown in FIG. 3D, the protruding metal guide pins 312 are bent through a stamping process, so that the middle section of the metal guide pins 312 is bent and embedded in the corresponding groove 303, and the metal guide pins The end of 312 is bent and pressed against the top surface 322 of the insulating part 32 .

Please refer to FIG. 4 and FIG. 5 , which are respectively a perspective view and an A-A cross-sectional view of the lead platform of the first preferred implementation of the multi-conductivity enhanced CCM package structure of the present invention. On the four adjacent sides 302 of the conductor platform 30 (that is, the adjacent four sides on the outer side of the insulating portion 32), several open grooves 303 are equidistantly arranged, and the several open grooves 303 are then It penetrates between a bottom surface 321 of the insulating portion 32 and a frame top surface 322 .

As shown in FIG. 5 , each metal guide pin 312 of the metal lead frame 31 can be roughly divided into four conductive segments, which include in sequence: a ground wire segment 3121, a lower conductive segment 3122, one side Connect the conductive segment 3123 and a chip conductive segment 3124 .

One end of the grounding wire segment 3121 can be connected (or not connected) around the metal chip holder 311, and the grounding wire segment 3121 is buried inside the insulating part 32, and goes to the The insulating portion 32 extends in the direction of the bottom surface 321 , so that other conductive segments connected behind the ground wire segment 3121 can pass through the insulating portion 32 . The lower conductive section 3122 is connected behind the ground wire section 3121 and penetrates through the bottom surface 321 of the insulating part 32, and is bent toward the outer surface of the insulating part 32 and attached to the the bottom surface 321 of the insulating portion 32 . The side connecting conductive section 3123 is connected behind the bottom connecting wire section 3122, and is bent towards the top surface of the insulating part 32 and attached to the outer adjacent side of the insulating part 32 (that is, In the open groove 303 on the outer side 302 adjacent to the outer side of the wire platform 30 ). The chip conductive section 3124 is connected behind the side connecting wire section 3123 , and is bent toward the image sensing chip 40 and attached to the top surface 322 of the frame-shaped frame of the insulating part 31 .

Please refer to FIG. 6 , which is a top view of the combination of the wire platform and the image sensor chip in the first preferred implementation of the multi-directional conductivity-enhanced CCM package structure of the present invention. The image sensing chip 40 is used to capture external images, usually a charge coupled device (CCD) or complementary metal oxide semiconductor (complementary metal oxide semiconductor, CMOS) image sensing device, and the image The sensing chip 40 has an active surface 41 and a non-active surface 42 (also shown in FIG. 7 ). The active surface 41 refers to the surface capable of capturing external images. In the first preferred embodiment of the present invention, the image sensor chip 40 is arranged on the central depression 301 on the wire platform 30 in conjunction with the non-active surface 42 (not shown in the figure), and is bonded to On the metal chip holder 311, the operating surface 41 of the image sensing chip 40 faces upward, and an image sensing region 411 is arranged in the center above the operating surface 41 for capturing images, and Several aluminum pads 412 are provided near the outer edge of the sensing area 411 .

Please refer to FIG. 7 , which is a cross-sectional side view of the first preferred embodiment of the multi-directional conductivity-enhanced CCM package structure of the present invention. Wherein, the non-active surface 42 of the image sensing chip 40 is combined with the central depression 301 of the wire platform 30 and bonded to the metal chip holder 311, and the central depression 301 of the wire platform 30 The longitudinal depth ΔH must be at least greater than or equal to the chip thickness Δh of the image sensing chip 40 . The plurality of aluminum pads 412 on the image sensing chip 40 are connected to the chip conductive section 3124 on the top surface 322 of the frame-shaped frame body of the lead platform 30 through the plurality of metal wires 50, so that the The image sensing chip 40 and the wire platform 30 can be electrically connected. Furthermore, the sealant 60 is evenly coated on the top surface 322 of the frame-shaped frame body of the wire platform 30 so that the transparent cover plate 70 can be adhesively bonded to the top surface 322 of the frame-shaped frame body of the wire platform 30 , and the transparent cover 70 can be infrared filter glass, plain glass, anti-reflection glass or blue glass.

In the first preferred embodiment of the present invention, the sealant 60 is mainly composed of a plurality of spacers 61 with a predetermined particle size Δd. The spacer 61 can be made of glass balls, silicon dioxide balls, metal balls, plastic balls or other composite materials, and utilizes the predetermined particle diameter Δd of the spacer 61 (in the first preferred embodiment of the present invention) Among them, the predetermined particle size Δd can be preferably between 0.1 ~ 1000um) as the spacing support between the wire platform 30 and the transparent cover plate 70, and can be used to control the distance between the transparent cover plate 70 and the wire platform 30 The size of the gap, while maintaining the parallelism of the transparent cover 70 . In addition, the metal wire 50 is also encapsulated by the sealant 60 at the same time, which can also protect the metal wire 50 from extrusion deformation.

Please refer to FIG. 8 together with FIG. 6 , wherein FIG. 8 is a cross-sectional view of the use state of the first preferred embodiment of the multi-conductivity enhanced CCM package structure of the present invention. The four side surfaces 302 of the lead platform 30 of the multi-conductivity enhanced CCM module 20 are respectively embedded in the grooves 303 with side-connected conductive sections 3123 corresponding to the metal guide pins 312, so that the multi-conductivity can be enhanced. The enhanced CCM module 20 becomes a CCM module (Socket Type CCM) of a socket type (Socket Type), and is joined (plugged) with a corresponding pin position 80 provided by other connected related electronic products, so that The pin position 80 is attached to and in contact with the side conductive section 3123 of the metal lead 312 to achieve the purpose of electrical conduction.

Since the metal chip holder 311 on the metal lead frame 31 and the ground wire section 3121 extending from the metal lead pin 312 around it can generally provide a barrier effect to the image sensor chip 40 , It can further provide the effect of preventing electromagnetic interference (EMI), and, because the image sensing chip 40 is directly fixed on the metal chip holder 311 , it can also have the function of promoting heat dissipation.

In addition, in the multi-conductivity enhanced CCM module 20 of the present invention, the lower conductors that penetrate through the bottom surface 321 of the insulating part 30 and are attached to the outer edge of the bottom surface 321 of the insulating part 32 Section 3122 can provide other different electrical conduction modes (such as surface mount technology SMT, or solder ball soldering, etc.) other than the aforementioned pins to connect with related electronic products, so as to achieve another different The purpose of the direction conduction link.

Please refer to FIG. 9 , which is a top view of the wire platform of the second preferred embodiment of the multi-directional conductivity-enhanced CCM package structure of the present invention. Since the wire platform of the second preferred embodiment of the multi-directional conductivity-enhanced CCM package structure of the present invention shown in FIG. 9 is generally similar to the wire platform of the first preferred implementation shown in FIG. 4 , the same components and structures will be described below No longer.

As shown in FIG. 9 , the difference of the second preferred embodiment of the present invention is that the open grooves 303 on the adjacent four sides 302 of the conductor platform 30 can be arc-shaped grooves or is a square groove.

Please refer to FIG. 10A to FIG. 10D , which are schematic flow charts of steps of the multi-conductivity enhanced CCM packaging method of the present invention.

As shown in FIG. 10A , first a lead platform 30 is manufactured through the process shown in FIGS. 3B to 3D , and then the non-active surface 42 of the image sensing chip 40 is bonded to the central depression of the lead platform 30 . 301, and bonded to the metal chip holder 311 of the metal lead frame 31.

As shown in FIG. 10B , on the several aluminum pads 412 of the image sensing chip 40 , the conductive section of the chip on the top surface 322 of the frame-shaped frame body of the wire platform 30 is connected with the conductive section of the chip by marking a number of metal wires 50 . 3124 for electrical conduction.

As shown in FIG. 10C , evenly coat the sealant 60 on the top surface 322 of the frame body of the lead platform 30 , wherein the sealant 60 includes a plurality of spacers with a predetermined particle size 61, to further protect the metal wire 50 from extrusion deformation.

As shown in FIG. 10D , before the sealant 60 is hardened, the transparent cover 70 is covered on the sealant 60 and adhesively pressed, so that the sealant 60 can be used The predetermined particle size of the plurality of spacers 61 included makes the transparent cover plate 70 and the image sensor chip 40 parallel to each other and maintains a fixed distance, and then the sealant 60 is cured by heat or ultraviolet light. Light (UV) cures it, so that the transparent cover 70 can be fixed on the wire platform 30 through the sealant 60 .

In summary, the multi-conductivity enhanced CCM packaging structure and packaging method of the present invention, wherein, the multi-conductivity enhanced CCM package module 20 is the metal lead frame 31 and the The insulating part 32 is pressed into a socket type wire platform 30, and can be electrically connected with the image sensor chip 40 by putting a metal wire 50 on the wire platform 30, and is connected with the wire platform 30. The sealant 60 containing a plurality of spacers 61 inside the transparent cover 70 is packaged and bonded to form a Socket Type CCM module (Socket Type CCM).

The above description is to illustrate the present invention with preferred embodiments, but not to limit the scope of the present invention. Generally, those skilled in the art can understand that appropriate slight changes and adjustments will not lose the gist of the present invention, nor depart from the spirit and scope of the present invention.

Claims (10)

1. a multidirection conductive electric enhanced type CCM packaging structure is characterized in that, includes:

One lead platform is a concavity shaped as frame support body, and it is to include a conductive metal frames and an insulation division;

One image sensing chip, it is to have a start face and a non-start face, and is incorporated into described non-start face on the conductive metal frames at concavity place of described lead platform;

The number of metal line by stamping the mode of number of metal line, conducts described lead platform and described image sensing chip;

One sealing includes a plurality of septs of tool predetermined particle diameter, and it is that filling is between a shaped as frame support body end face of described transparent cover plate and described lead platform; And

One transparent cover plate is covered in the image sensing district of described image sensing chip, and is fixed in by described sealing on the shaped as frame support body end face of described lead platform;

Wherein, the spacing of described transparent cover plate and described image sensing chip is determined by the predetermined particle diameter of described sept.

2. multidirection conductive electric enhanced type CCM packaging structure as claimed in claim 1, it is characterized in that, the described start face of described image sensing chip is provided with an image sensing district, and be provided with some aluminium pads around in described image sensing district, and, described transparent cover plate is infrared ray filter glass, plain glass, anti-reflective glass or smalt, and described insulation division is epoxy resin or plastic material, and described conductive metal frames is copper, aluminium, alloy or other conductive metallic material.

3. multidirection conductive electric enhanced type CCM packaging structure as claimed in claim 1, it is characterized in that, the predetermined particle diameter of described sept is between 0.1～1000um, the described predetermined particle diameter of described sept supports as the interval of described lead platform and transparent cover plate, and the material of sept is glass, silicon dioxide, metal, plastics, macromolecular material or composite material.

4. multidirection conductive electric enhanced type CCM packaging structure as claimed in claim 1; it is characterized in that; described lead platform is to irritate the mode of mould or ejaculation; described insulation division and described conductive metal frames are pressed into concavity shaped as frame support body; metal-cored bar on the described conductive metal frames is exposed and be attached to described lead platform concavity place; engage with the non-start face of described image sensing chip; on four adjacent sides of described lead platform; be provided with some open grooves in equidistant mode, described some open grooves are then through between the bottom surface and a shaped as frame support body end face of described insulation division.

5. multidirection conductive electric enhanced type CCM packaging structure as claimed in claim 4, it is characterized in that, described conductive metal frames more includes the number of metal lead foot, described number of metal lead foot all around stretches out along described metal-cored bar in equidistant mode, and each other described metal lead foot branch has four conductive sections, wherein being connected in a conductive section of described metal-cored bar is the concavity place lower inner that is embedded in described insulation division, other conductive section then runs through the outside, described insulation division bottom surface, respectively conductive section out of the ordinary is attached to the bottom surface of described insulation division in the bending mode, in the described open groove on the side, and shaped as frame end face.

6. multidirection conductive electric enhanced type CCM packaging structure as claimed in claim 5 is characterized in that, four conductive sections of described metal lead foot include in regular turn:

One earth lead section, the one end is to be connected around described metal-cored bar, and described earth lead section is the inside that is embedded in described insulation division, and extend toward the bottom surface direction of described insulation division, make other be connected and run through described insulation division in each conductive section of the other end of described earth lead section;

Connecing conductive section once, is to be connected after described earth lead section, and runs through described insulation division bottom surface, and bends and be attached to the bottom surface of described insulation division toward described insulation division lateral surface direction;

One side joint conductive section is to be connected under described to connect after the lead section, and bends and be attached in the described open groove of described insulation division side toward described insulation division end face direction; And

One chip conductive section is to be connected after described side joint lead section, and also is attached to the shaped as frame end face of described insulation division toward described image sensing chip direction bending.

7. a multidirection conductive electric enhanced type CCM method for packing is characterized in that, may further comprise the steps:

One lead platform is provided, and described lead platform is in the mode of irritating mould or ejaculation one insulation division and a conductive metal frames to be pressed into concavity shaped as frame support body;

One non-start face of one image sensing chip is incorporated into a concavity place of described lead platform, and is bonding on the metal-cored bar of conductive metal frames of described lead platform;

Some aluminium pads on described image sensing chip, the chip conductive section on a mode by stamping the number of metal line and the shaped as frame support body end face of described lead platform conducts;

Being coated with the described shaped as frame support body end face of a sealing in described lead platform, wherein, is a plurality of septs that include the tool predetermined particle diameter in described sealing, protects the not extrusion of described metal wire;

Before described sealing is still unhardened, one transparent cover plate is covered on the top of described sealing, and give the stickiness pressing, utilize the predetermined particle diameter of the described sept that is included in the described sealing to make to be parallel to each other between described transparent cover plate and the described image sensing chip and be maintained fixed spacing;

Wherein, described sealing is made its curing with hot curing or according to ultraviolet light, described transparent cover plate can be fixed on the described lead platform by described sealing.

8. the lead platform structure of a multidirection conductive electric enhanced type CCM is characterized in that, includes:

One conductive metal frames more comprises a metal-cored bar and number of metal lead foot on the described conductive metal frames;

One insulation division is to have certain thickness concavity shaped as frame support body, and a concavity place that makes the described metal-cored bar on the described conductive metal frames can expose and be attached to described lead platform;

Wherein, described insulation division is to irritate the mode of mould or ejaculation; described conductive metal frames is pressed into concavity shaped as frame support body; described metal-cored bar on the described conductive metal frames is exposed and be attached to described insulation division concavity place; and described metal lead foot all around stretches out along described metal-cored bar in equidistant mode; and each other described metal lead foot branch has four conductive sections; wherein being connected in a conductive section of described metal-cored bar is the concavity place lower inner that is embedded in described insulation division; other conductive section of described metal lead foot then runs through the outside, described insulation division bottom surface, respectively conductive section out of the ordinary is attached to the bottom surface of described insulation division in the bending mode; in the described open groove on the side; and shaped as frame support body end face.

9. the lead platform structure of multidirection conductive electric enhanced type CCM as claimed in claim 8 is characterized in that, four conductive sections of described metal lead foot include in regular turn:

One earth lead section, the one end is to be connected around described metal-cored bar, and described earth lead section is the inside that is embedded in described insulation division, and extend toward the bottom surface direction of described insulation division, make other be connected and run through described insulation division in each conductive section of the other end of described earth lead section;

Connecing conductive section once, is to be connected after described earth lead section, and runs through described insulation division bottom surface, and bends and be attached to the bottom surface of described insulation division toward described insulation division lateral surface direction;

One side joint conductive section is to be connected under described to connect after the lead section, and bends and be attached in the described open groove of described insulation division side toward described insulation division end face direction; And

One chip conductive section is to be connected after described side joint lead section, and also is attached to the shaped as frame end face of described insulation division toward described image sensing chip direction bending.

10. the lead platform structure of multidirection conductive electric enhanced type CCM as claimed in claim 9 is characterized in that, described multidirection conductive electric enhanced type CCM module more includes:

One image sensing chip, it is to have a start face and a non-start face, and is incorporated into described non-start face on the metal-cored bar of described conductive metal frames at concavity place of described lead platform;

The number of metal line by stamping the mode of number of metal line, conducts described lead platform and described image sensing chip;

One sealing, include a plurality of septs of tool particle diameter between 0.1～1000um, it is the shaped as frame support body end face of filling in described transparent cover plate and described lead platform, and the material of described sept is glass, silicon dioxide, metal, plastics, macromolecular material or composite material;

One transparent cover plate is covered in the image sensing district of described image sensing chip, and is fixed in by described sealing on the shaped as frame support body end face of described lead platform;

Wherein, the spacing of described transparent cover plate and described image sensing chip is determined by the predetermined particle diameter of described sept.

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