CN101177778A - Connection method for metal target material and target holder - Google Patents
Connection method for metal target material and target holder Download PDFInfo
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- CN101177778A CN101177778A CNA2006101143506A CN200610114350A CN101177778A CN 101177778 A CN101177778 A CN 101177778A CN A2006101143506 A CNA2006101143506 A CN A2006101143506A CN 200610114350 A CN200610114350 A CN 200610114350A CN 101177778 A CN101177778 A CN 101177778A
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Abstract
The invention relates to the connecting method of a metallic target and a target holder, essentially comprising the steps of connecting surface processing, brazing material coating and jointing, squeezing, bonding, etc. The target and the target holder are matched through corresponding boss and groove; when the target holder is heated to a temperature higher than the liquidus of the brazing material by 10 DEG C to 50 DEG C, the brazing material is coated at the combined face of the target and the target holder, and a pressure is forced at an axial direction, thus leading the target and the target holder to be matched closely; meanwhile, in the process of squeezing, all parts at the combined face are filled with the brazing material in a target holder groove, thus the rudimental air is exhausted. The steady connection between the target and the target holder can be realized in atmospheric environment by the method and the structure property and dimension of the target are not affected, thus the deformation problems in vacuum, high temperature, high pressure or other environments are avoided.
Description
Technical field
The present invention relates to the interconnection technique of metal targets and target holder, be applied to microelectronic integrated circuit, light (magnetic) recording medium, flat-panel screens and other field film preparation being connected with sputtering target material and target holder.
Background technology
The sputtered film material has extremely widely and uses in related industrieies such as electronic information, stored record and indicating meter.Simultaneously, the sputtering target material growth requirement amount that is accompanied by these industries also increases year by year.The quality of target has material impact to the performance of sputtered film, especially the preparation of semiconductor integrated circuit chip develops (8～12 inches) towards the large size direction, the size of sputtering target material and sputtering power also will increase thereupon, and be also more and more higher to the requirement that sputtering target material purity, microtexture and target are connected with target holder.The interconnection technique of large-size target and target holder has become the gordian technique of target material assembly preparation.
In sputter procedure, target material assembly at first should have good electroconductibility as negative electrode, bombards the heat that target material surface produces at a high speed in order to discharge the high-energy state ion simultaneously, and target material assembly also will have good thermal conductivity.Therefore, target should have certain bonding strength with being connected of target holder, to avoid problems such as sputtering target coming off at work, embrittlement, high thermal conductivity and conductivity is arranged again.
The common technology that target is connected with target holder comprises: mechanical compaction method, welding process etc.Adopt the mechanical compaction method, the binding surface of target and target holder is difficult to fine and close fully, and the slit that may exist can cause bonding strength reduction between target and the target holder, influences the thermal conduction in the sputter procedure simultaneously.The welding of target comprises soldering, diffusion welding etc., adopts soldering to connect, and for large-size target assembly, the bonding strength of target and target holder is difficult to meet the demands; When adopting diffusion welding, it is higher to weld required temperature, for large-size target assembly, deform easily in welding process, and microtexture will change under the high temperature, influences the performance of sputtering target.
Summary of the invention
The invention provides the method for attachment of a kind of metallic target and target holder, it can realize in atmospheric environment that target is connected with fastening densification between the target holder, can prevent simultaneously the pollution in the welding process, avoided and to have reduced production costs in the connection shaping problem under the environment such as vacuum, high temperature or high pressure.
Metal targets of the present invention comprises the steps: that with the method for attachment of target holder (1) processes corresponding boss and groove respectively to the combining site of target, target holder; (2) clean up target and target holder surface, and dry up; (3) the heating target holder is to 10～50 ℃ of the liquidus lines that is higher than braze; (4) in the concave surface of target holder, evenly be coated with and apply braze; (5) target is got in the target holder along groove gradually from target holder one side, and is axially exerting pressure, and makes target and target holder closely cooperate; (6) in extrusion process, remaining air was got rid of at each position on filling junction surface when the braze fusing in the target holder groove was flowed.
Target in the step 1 and target holder corresponding shape are trapezoidal or swallow-tail form, and the pitch angle (α) of its contact side and horizontal plane is 65 °～80 °.
The boss that target in the step 1 is corresponding with target holder and the quantity of groove are 3～6, equidistantly distribute on target and target holder, and the height of boss and groove (H) is between 2～5mm.
The thickness of coating braze is 0.5mm～1mm in the above-mentioned steps 4.
The axle pressure that is applied in the above-mentioned steps 5 is 3MPa～100MPa.
Target among the present invention mainly comprises targets such as Al, Al-Si, Al-Cu, Al-Si-Cu, and pairing target holder is Al alloy and Cu target holder; Also comprise targets such as Ti, Ti-W, Ta, Ta-Si, corresponding target holder is target holders such as oxygen free copper, brass, Al alloy and Ti alloy.
Used connection braze mainly comprises braze such as pure indium, indium alloy, tin copper, zinc-tin, SAC among the present invention.
The characteristics of present method are, the method for attachment of adopting mechanical compaction and soldering to combine wherein combines for on-plane surface between target and the target holder.Its advantage is as follows:
1, under atmospheric environment, closely be connected with welding by keyway arrangements between target and the target holder, the bonding strength height, and the microtexture of target and structure property, size etc. are unaffected, avoided target to be connected with target holder in the preparation process envrionment conditions is required high, easily embrittlement, is out of shape, occurs problem such as contact gap.
2, be filled in each bonding surface between target and the target holder by conduction and the good braze of thermal conductivity, and adopt heating agglutinating form, guarantee that bonding surface fully contacts, effectively improved thermal conductivity and conductivity.
3, method of attachment is easy, realizes easily, reduces production costs.
Method of attachment of the present invention mainly is applicable to being connected of metal targets and target holder, is particularly useful for
High-purity metal target is connected with target holder.
Description of drawings
Fig. 1 is being linked and packed and partial enlarged drawing of target and target holder among the present invention.
Fig. 2 is the vertical view (expressing symmetric half part among the figure) of target holder among Fig. 1.
Embodiment
With reference to the accompanying drawings and in conjunction with specific embodiments method of the present invention is described further below.
Embodiment 1
The target as shown in Figure 1, 2 and the syndeton of target holder, fixing between target 1 and the target holder 3 by braze 2 welding of filling.
Al-Si alloy target material and Al alloy target holder conjunction are that at present the most frequently used interconnection line is made one of material, when making, at first respectively target 1 and target holder 3 are processed by milling machine, at the binding surface of Al-Si target 1, process 5 swallow-tail form boss.Mill out 5 correspondingly-shaped grooves on the corresponding simultaneously Al alloy target holder 3, boss and groove respective heights H are 3mm, and the inclined angle alpha of contact side and horizontal plane is 65 °.
The machined surface of target 1 with target holder 3 cleaned up.At first use the acetone oil removing, after cleaning with pure water, carry out the pickling (HNO of 15wt% again
3Solution), clean hot blast drying at last with pure water.3 to 200 ℃ of target holders of heating are coated the Sn alloy brazed material 2 of 0.1mm at target holder 3 faces, and its liquidus temperature is about 180 ℃.
Target 1 is got in the target holder 3 gradually from target holder 3 one sides along groove, after cooperatively interacting, axially apply the pressure of 3MPa, each position on filling junction surface when the solder fusing in target holder 3 grooves flows along target, remaining air is got rid of fully, and last target 1 closely links together with target holder 3.
The target that this kind method connects fully contacts with the target holder bonding surface, guarantees good thermal conductivity and conductivity, and technology is simple, can realize firm connection under atmospheric environment, has reduced cost of manufacture.
Embodiment 2
High-purity Ti target and oxygen free copper target holder conjunction are usually used in preparing one of unicircuit barrier film material, and its structure is identical with enforcement 1.When making, respectively target 1 and target holder 3 are processed with milling machine, at the binding surface of high-purity Ti target, process 6 trapezoid boss.To the oxygen free copper target holder, correspondence mills out 6 grooves simultaneously, and height H is 5mm, and inclined angle alpha is 80 °.
Target 1 cleans up with acetone, salpeter solution, pure water etc. with the machined surface of target holder 3, and the reusable heat wind is done.Target holder 3 is heated to 250 ℃, coats the Sn-Cu alloy brazed material 2 of 0.3mm at target holder 3 faces, its liquidus temperature is about 200 ℃.
Target 1 is got in the target holder 3 gradually from target holder 3 one sides along groove, and again at the pressure that axially applies 20MPa, each position on filling junction surface made target 1 and target holder 3 closely link together when braze 2 fusings in target holder 3 grooves were flowed.Present embodiment has the excellent results identical with embodiment 1.
High-purity Ti-W alloy target and brass target holder conjunction are another materials that is usually used in preparing the unicircuit barrier film, and its structure is identical with embodiment 2.When making, respectively target 1 and target holder 3 are processed with milling machine, at the binding surface of Ti-W alloy target material, process 3 trapezoid boss.Simultaneously brass target holder 3 correspondences are milled out 3 grooves, height H is 2mm, and inclined angle alpha is 70 °.
Target 1 cleans up with acetone, salpeter solution, pure water etc. with the machined surface of target holder 3, and the reusable heat wind is done.Target holder 3 is heated to 230 ℃, coats the Sn-Ag-Cu alloy brazed material 2 of 0.5mm at target holder 3 faces, its liquidus temperature is about 220 ℃.
Target 1 is got in the target holder 3 gradually from target holder 3 one sides along groove, and again at the pressure that axially applies 100MPa, each position on filling junction surface made target 1 and target holder 3 closely link together when braze 2 fusings in target holder 3 grooves were flowed.Present embodiment has the advantage identical with embodiment 1 equally.
Claims (8)
1. the method for attachment of metal targets and target holder is characterized in that: comprise the steps: that (1) processes corresponding boss and groove respectively to the combining site of target, target holder; (2) clean up target and target holder surface, and dry up; (3) the heating target holder is to 10～50 ℃ of the liquidus lines that is higher than braze; , (4) evenly are coated with in the concave surface of target holder and apply braze; (5) target is got in the target holder along groove gradually from target holder one side, and is axially exerting pressure, and makes target and target holder closely cooperate; (6) in extrusion process, remaining air was got rid of at each position on filling junction surface when the braze fusing in the target holder groove was flowed.
2. the method for attachment of metal targets according to claim 1 and target holder, its feature also is: step (1) target and target holder corresponding shape are trapezoidal or swallow-tail form, the pitch angle (α) of its contact side and horizontal plane is 65 °～80 °.
3. the method for attachment of metal targets according to claim 1 and target holder, its feature also is: the quantity of boss and groove is 3～6, equidistantly distributes on target and target holder, the height of boss and groove (H) is 2～5mm.
4. the method for attachment of metal targets according to claim 1 and target holder, its feature also is: the thickness of coating braze is 0.1mm～0.5mm in the step (4).
5. the method for attachment of metal targets according to claim 1 and target holder, its feature also is: the axle pressure that is applied in the step (5) is 3MPa～100MPa.
6. the method for attachment of metal targets according to claim 1 and target holder, its feature also is: target mainly comprises Al, Al-Si, Al-Cu, Al-Si-Cu target, pairing target holder is Al alloy and Cu target holder.
7. the method for attachment of metal targets according to claim 1 and target holder, its feature also is: target also comprises Ti, Ti-W, Ta, Ta-Si target, corresponding target holder is oxygen free copper, brass, Al alloy and Ti alloy target holder.
8. the method for attachment of a kind of metal targets according to claim 1 and target holder, its feature also is: used braze mainly comprises pure indium, indium alloy, tin copper, zinc-tin, SAC braze.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101143506A CN101177778A (en) | 2006-11-07 | 2006-11-07 | Connection method for metal target material and target holder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101143506A CN101177778A (en) | 2006-11-07 | 2006-11-07 | Connection method for metal target material and target holder |
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| CN101177778A true CN101177778A (en) | 2008-05-14 |
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| CNA2006101143506A Pending CN101177778A (en) | 2006-11-07 | 2006-11-07 | Connection method for metal target material and target holder |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101811209A (en) * | 2010-04-14 | 2010-08-25 | 宁波江丰电子材料有限公司 | Manufacture method of target assembly |
| CN101972875A (en) * | 2010-10-29 | 2011-02-16 | 宁波江丰电子材料有限公司 | Welding method of tungsten-titanium alloy target |
| CN102009238A (en) * | 2010-10-29 | 2011-04-13 | 宁波江丰电子材料有限公司 | Molybdenum target welding method |
| CN104625389A (en) * | 2014-12-22 | 2015-05-20 | 有研亿金新材料有限公司 | Welding method of aluminum alloy sputtering target material for integrated circuit package material |
| CN104646817A (en) * | 2014-12-22 | 2015-05-27 | 有研亿金新材料有限公司 | Connection method of aluminum target material as sputtering target material and aluminum alloy backboard |
| CN104711526A (en) * | 2013-12-11 | 2015-06-17 | 宁波江丰电子材料股份有限公司 | Tungsten-titanium alloy target material, backboard, and tungsten-titanium alloy target material assembly |
| CN105463247A (en) * | 2015-12-03 | 2016-04-06 | 江阴恩特莱特镀膜科技有限公司 | Alloy for binding target and manufacturing method and application of alloy |
| CN107487372A (en) * | 2016-07-18 | 2017-12-19 | 宝沃汽车（中国）有限公司 | Front deck holder device |
| CN107552907A (en) * | 2017-10-09 | 2018-01-09 | 有研亿金新材料有限公司 | A green and efficient target and back plate brazing device and method |
| CN107584201A (en) * | 2017-10-31 | 2018-01-16 | 宁波江丰电子材料股份有限公司 | A kind of target vacuum diffusion bonding system and method |
| CN107584183A (en) * | 2017-08-19 | 2018-01-16 | 江苏标新工业有限公司 | A kind of welding procedure of electroslag furnace dummy electrode |
| CN108620813A (en) * | 2017-03-17 | 2018-10-09 | 宁波江丰电子材料股份有限公司 | Target blankss and its processing method |
| CN110067669A (en) * | 2019-04-28 | 2019-07-30 | 滨州渤海活塞有限公司 | Two body welding type piston structures of one kind and its manufacturing method |
| CN114619212A (en) * | 2022-04-02 | 2022-06-14 | 昆山世高新材料科技有限公司 | Novel target material connecting structure and forming process thereof |
-
2006
- 2006-11-07 CN CNA2006101143506A patent/CN101177778A/en active Pending
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101811209A (en) * | 2010-04-14 | 2010-08-25 | 宁波江丰电子材料有限公司 | Manufacture method of target assembly |
| CN101972875A (en) * | 2010-10-29 | 2011-02-16 | 宁波江丰电子材料有限公司 | Welding method of tungsten-titanium alloy target |
| CN102009238A (en) * | 2010-10-29 | 2011-04-13 | 宁波江丰电子材料有限公司 | Molybdenum target welding method |
| CN104711526A (en) * | 2013-12-11 | 2015-06-17 | 宁波江丰电子材料股份有限公司 | Tungsten-titanium alloy target material, backboard, and tungsten-titanium alloy target material assembly |
| CN104625389A (en) * | 2014-12-22 | 2015-05-20 | 有研亿金新材料有限公司 | Welding method of aluminum alloy sputtering target material for integrated circuit package material |
| CN104646817A (en) * | 2014-12-22 | 2015-05-27 | 有研亿金新材料有限公司 | Connection method of aluminum target material as sputtering target material and aluminum alloy backboard |
| CN105463247A (en) * | 2015-12-03 | 2016-04-06 | 江阴恩特莱特镀膜科技有限公司 | Alloy for binding target and manufacturing method and application of alloy |
| CN107487372A (en) * | 2016-07-18 | 2017-12-19 | 宝沃汽车（中国）有限公司 | Front deck holder device |
| CN107487372B (en) * | 2016-07-18 | 2020-01-17 | 宝沃汽车（中国）有限公司 | Front cabin bracket device |
| CN108620813A (en) * | 2017-03-17 | 2018-10-09 | 宁波江丰电子材料股份有限公司 | Target blankss and its processing method |
| CN107584183A (en) * | 2017-08-19 | 2018-01-16 | 江苏标新工业有限公司 | A kind of welding procedure of electroslag furnace dummy electrode |
| CN107552907A (en) * | 2017-10-09 | 2018-01-09 | 有研亿金新材料有限公司 | A green and efficient target and back plate brazing device and method |
| CN107584201B (en) * | 2017-10-31 | 2019-11-26 | 宁波江丰电子材料股份有限公司 | A kind of target vacuum diffusion bonding system and method |
| CN107584201A (en) * | 2017-10-31 | 2018-01-16 | 宁波江丰电子材料股份有限公司 | A kind of target vacuum diffusion bonding system and method |
| CN110067669A (en) * | 2019-04-28 | 2019-07-30 | 滨州渤海活塞有限公司 | Two body welding type piston structures of one kind and its manufacturing method |
| CN114619212A (en) * | 2022-04-02 | 2022-06-14 | 昆山世高新材料科技有限公司 | Novel target material connecting structure and forming process thereof |
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