CN1907636A - Oxidation resistance tin-based no-lead solder capable of proceeding welding without welding flux in air - Google Patents
Oxidation resistance tin-based no-lead solder capable of proceeding welding without welding flux in air Download PDFInfo
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Abstract
本发明公开了一种能在空气中进行无焊剂焊接的抗氧化锡基无铅焊料,由0.1~6重量份的银Ag、0.5~6重量份的钛Ti、0.1~2.5重量份的钇Y和余量的锡Sn组成。本发明焊料能够在空气中不使用任何焊剂、焊接温度240℃~260℃条件下直接对同类、异类材料进行焊接。所述抗氧化锡基无铅焊料的接头剪切强度为30~50MPa。The invention discloses an oxidation-resistant tin-based lead-free solder capable of flux-free soldering in air, which consists of 0.1-6 parts by weight of silver Ag, 0.5-6 parts by weight of titanium Ti, and 0.1-2.5 parts by weight of yttrium Y And the balance of tin Sn composition. The solder of the invention can directly weld materials of the same type and different types without using any flux in the air at a welding temperature of 240°C to 260°C. The joint shear strength of the oxidation-resistant tin-based lead-free solder is 30-50 MPa.
Description
技术领域technical field
本发明属于焊接领域,涉及一种钎焊料。具体是指一种能够在空气中不采用任何焊剂直接焊接金属与金属、金属与非金属、非金属与非金属等同类和异类材料组合,尤其适合于陶瓷与陶瓷、陶瓷与金属之间的焊接的具有抗氧化性的锡基无铅焊料。The invention belongs to the field of welding and relates to a brazing material. Specifically, it refers to a combination of similar and dissimilar materials that can directly weld metal and metal, metal and non-metal, non-metal and non-metal in the air without using any flux, especially suitable for welding between ceramics and ceramics, ceramics and metals Oxidation-resistant tin-based lead-free solder.
背景技术Background technique
由于锡铅焊料中的铅及其化合物属于剧毒物质,严重危害人类生存环境和安全,世界各国都已经明令禁止使用含铅焊料。因此,国内外相继开发了一系列无铅焊料,如Sn-Zn、Sn-Ag、Sn-Ag-Cu等,但这些焊料只能焊接金属,并且必须使用焊剂。而焊剂则可能造成环境污染,并且有的焊剂还需要焊后清洗,清洗过程同样会对环境造成一定的污染。Since lead and its compounds in tin-lead solder are highly toxic substances, which seriously endanger the living environment and safety of human beings, countries all over the world have banned the use of lead-containing solder. Therefore, a series of lead-free solders have been developed at home and abroad, such as Sn-Zn, Sn-Ag, Sn-Ag-Cu, etc., but these solders can only solder metals, and flux must be used. The flux may cause environmental pollution, and some fluxes also need to be cleaned after welding, and the cleaning process will also cause certain pollution to the environment.
要从根本上解决上述问题,无焊剂钎焊技术势在必行。国外对此进行了大量的研究,如日本日立制作所通过Ar原子溅射去除氧化膜,在气氛保护环境下实现了无焊剂钎焊;日本三菱电机公司开发了无氧气氛中的激光无焊剂软钎焊方法;日本富士通公司通过在基片和芯片电极上蒸镀In,然后用再流焊方法焊接,开发了VPS无焊剂钎焊方法;IBM公司通过在被焊引线和焊盘上预先镀覆焊料,利用高温高压氮气加热实现了无焊剂钎焊等。上述方法存在如下缺点:1、需要在保护气氛条件下焊接;2、上述方法都不能直接焊接陶瓷等非金属。To fundamentally solve the above problems, flux-free brazing technology is imperative. Abroad has done a lot of research on this, such as Japan's Hitachi Manufacturing Co., Ltd. removed the oxide film by sputtering Ar atoms, and realized flux-free brazing in an atmosphere protection environment; Japan's Mitsubishi Electric Corporation developed laser flux-free brazing in an oxygen-free atmosphere. Brazing method; Fujitsu Corporation of Japan has developed a VPS flux-free soldering method by evaporating In on the substrate and chip electrodes, and then soldering with reflow soldering method; Solder, using high-temperature and high-pressure nitrogen heating to realize flux-free brazing, etc. The above-mentioned method has the following disadvantages: 1. It needs to be welded under protective atmosphere conditions; 2. The above-mentioned method cannot directly weld non-metals such as ceramics.
专利文献WO9703789(Alloy,in particular a solder alloy,method forjoining workpieces by soldering using the solder alloy and use of the alloyfor soldering)公开的所述焊料虽然可以不使用焊剂来焊接大多数的金属、陶瓷等非金属材料组合,但该专利文献公开的组分中含有铅元素,并且在焊接过程中需要采取气体保护或去除表面氧化物的措施。Although the solder disclosed in the patent document WO9703789 (Alloy, in particular a solder alloy, method for joining workpieces by soldering using the solder alloy and use of the alloy for soldering) can solder most non-metallic materials such as metals and ceramics without using flux Combination, but the components disclosed in this patent document contain lead elements, and it is necessary to take measures to protect the gas or remove surface oxides during the welding process.
目前,电子产品生产中存在众多的陶瓷与陶瓷、陶瓷与金属的连接,由于陶瓷与金属组织性能差异巨大,在较低温度条件下连接陶瓷与金属,一般采用陶瓷表面金属化、然后再进行钎焊的工艺方法。因此,为克服上述焊接技术中存在的问题,本发明提供了一种新型的无铅、可以直接在空气中不采用任何焊剂进行焊接金属与金属、金属与非金属、非金属与非金属等同类和异类材料组合的焊料。At present, there are many connections between ceramics and ceramics and between ceramics and metals in the production of electronic products. Due to the huge difference in the structure and properties of ceramics and metals, ceramics and metals are connected at relatively low temperatures. Generally, the surface of ceramics is metallized and then brazed. Welding process method. Therefore, in order to overcome the problems existing in the above-mentioned soldering technology, the present invention provides a new type of lead-free solder that can directly weld metal to metal, metal to nonmetal, nonmetal to nonmetal, etc. in the air without using any flux. Solder in combination with dissimilar materials.
发明内容Contents of the invention
本发明的目的是提供一种能在空气中进行无焊剂焊接的抗氧化锡基无铅焊料,所述抗氧化锡基无铅焊料通过在Sn-Ag-Ti体系中添加抗氧化元素钇Y,有效地实现了金属与金属、金属与非金属、非金属与非金属等同类和异类材料组合的焊接,并且本发明的焊料能够在空气中、无焊剂、焊接温度240~260℃的条件下直接进行焊接。The object of the present invention is to provide a kind of oxidation-resistant tin-based lead-free solder that can be soldered without flux in the air. The oxidation-resistant tin-based lead-free solder is added by adding antioxidant element yttrium Y in the Sn-Ag-Ti system, Effectively realize the welding of metal and metal, metal and non-metal, non-metal and non-metal and other similar and dissimilar material combinations, and the solder of the present invention can be directly welded in air, without flux, and at a welding temperature of 240-260 ° C. Do the welding.
本发明是一种能在空气中进行无焊剂焊接的抗氧化锡基无铅焊料,由0.1~6重量份的银Ag、0.5~6重量份的钛Ti、0.1~2.5重量份的钇Y和余量的锡Sn组成。所述的抗氧化锡基无铅焊料采用真空熔炼的方法加以制备,制备得到的Sn-0.1~6wt%Ag-0.5~6wt%Ti-0.1~2.5wt%Y焊料能够在空气中、无任何焊剂、焊接温度240~260℃的条件下直接对金属与金属、金属与非金属、非金属与非金属等同类和异类材料组合的焊接对象进行焊接。The invention is an anti-oxidation tin-based lead-free solder capable of flux-free soldering in air, which consists of 0.1-6 parts by weight of silver Ag, 0.5-6 parts by weight of titanium Ti, 0.1-2.5 parts by weight of yttrium Y and The balance is composed of tin and Sn. The oxidation-resistant tin-based lead-free solder is prepared by vacuum smelting, and the prepared Sn-0.1-6wt% Ag-0.5-6wt% Ti-0.1-2.5wt% Y solder can be used in the air without any flux 1. Under the condition of welding temperature 240-260 ℃, directly weld the welding objects of the same and dissimilar material combinations such as metal and metal, metal and non-metal, non-metal and non-metal.
所述的能在空气中进行无焊剂焊接的抗氧化锡基无铅焊料,其焊料焊接的接头剪切强度为30~50MPa。The anti-oxidation tin-based lead-free solder capable of flux-free soldering in air has a joint shear strength of 30-50 MPa.
本发明抗氧化锡基无铅焊料的优点在于:1、焊料中不含铅、不使用任何焊剂,完全保证了焊料的绿色环保性能;2、在空气中直接焊接,并且具有一定的抗氧化性,避免了采用气体或真空保护带来的工艺和设备的复杂;3、可以直接钎焊同类、异类材料(包括金属和非金属)的组合,尤其更适合于电子产品中的陶瓷与陶瓷、陶瓷与金属的组合,并且还可以焊接其他多种难焊的同异类金属或非金属材料,如钛、石墨、硅以及复合材料等;4、焊接温度在250℃左右,和当前电子产品封装制造的温度基本相同,并且工件氧化轻,提高连接质量和性能。The advantages of the anti-oxidation tin-based lead-free solder of the present invention are: 1. The solder does not contain lead and does not use any flux, which completely guarantees the green performance of the solder; 2. It can be directly soldered in the air and has certain oxidation resistance , avoiding the complexity of the process and equipment brought about by the use of gas or vacuum protection; 3. It can directly braze the combination of similar and dissimilar materials (including metals and non-metals), especially more suitable for ceramics and ceramics in electronic products. Combination with metals, and can also weld other difficult-to-solder metals or non-metallic materials, such as titanium, graphite, silicon and composite materials; The temperature is basically the same, and the workpiece is lightly oxidized, which improves the connection quality and performance.
具体实施方式Detailed ways
下面将结合实施例对本发明作进一步的详细说明。The present invention will be further described in detail below in conjunction with examples.
本发明是一种能在空气中进行无焊剂焊接的抗氧化锡基无铅焊料,由0.1~6重量份的银Ag、0.5~6重量份的钛Ti、0.1~2.5重量份的钇Y和余量的锡Sn组成。The invention is an anti-oxidation tin-based lead-free solder capable of flux-free soldering in air, which consists of 0.1-6 parts by weight of silver Ag, 0.5-6 parts by weight of titanium Ti, 0.1-2.5 parts by weight of yttrium Y and The balance is composed of tin and Sn.
本发明的抗氧化锡基无铅焊料采用真空熔炼的方法加以制备,The oxidation-resistant tin-based lead-free solder of the present invention is prepared by vacuum smelting,
步骤一,将0.1~6重量份的银Ag、0.5~6重量份的钛Ti、0.1~2.5重量份的钇Y和余量的锡Sn材料放入非自耗真空电弧炉内;Step 1, putting 0.1-6 parts by weight of silver Ag, 0.5-6 parts by weight of titanium Ti, 0.1-2.5 parts by weight of yttrium Y and the rest of tin Sn materials into a non-consumable vacuum electric arc furnace;
步骤二,抽真空度至1×10-1~1×10-2Pa,然后充入高纯氩气;Step 2: Vacuumize to 1×10 -1 ~ 1×10 -2 Pa, and then fill with high-purity argon;
步骤三,调节熔炼温度1400℃~1600℃、熔炼时间5~30min制成铸锭;Step 3, adjusting the melting temperature to 1400°C to 1600°C and the melting time to 5 to 30 minutes to make ingots;
步骤四,将Sn-0.1~6wt%Ag-0.5~6wt%Ti-0.1~2.5wt%Y焊料铸锭随炉冷却后取出。Step 4, taking out the Sn-0.1-6wt%Ag-0.5-6wt%Ti-0.1-2.5wt%Y solder ingot after being cooled in the furnace.
在真空熔炼的制备步骤三中,Sn、Ag、Ti、Y元素可以在炉内根据焊料的多少熔炼一至五遍左右,使焊料熔炼均匀即可。In the third preparation step of vacuum smelting, Sn, Ag, Ti, and Y elements can be smelted in the furnace for about one to five times according to the amount of solder, so that the solder can be smelted evenly.
为了对比添加抗氧化元素Y之后的焊料的抗氧化性能,本发明人对Sn-4wt%Ag-4wt%Ti焊料与Sn-4wt%Ag-4wt%Ti-0.5wt%Y焊料在焊接温度250℃条件下,进行加热后焊料表面氧化膜的厚度(采用俄歇电子能谱仪分析),在相同的工艺规范条件下,Sn-4wt%Ag-4wt%Ti焊料表面氧化层的厚度达到了59nm,而Sn-4wt%Ag-4wt%Ti-0.5wt%Y焊料表面氧化层的厚度仅有12nm。由此证明,本发明公开的Sn-4wt%Ag-4wt%Ti-0.5wt%Y焊料具有良好的抗氧化性。抗氧化元素Y的添加解决了Sn-4wt%Ag-4wt%Ti焊料在焊接过程中由于表面氧化而必须采用气体保护,由此带来的设备的增加、工艺的复杂等问题。本发明Sn-4wt%Ag-4wt%Ti-0.5wt%Y焊料简化了焊接工艺(无保护气氛、无焊剂、直接焊接),降低了焊接成本(无保护气设备、简化了焊接设备结构)。In order to compare the oxidation resistance of the solder after adding the anti-oxidation element Y, the inventors compared the Sn-4wt%Ag-4wt%Ti solder and the Sn-4wt%Ag-4wt%Ti-0.5wt%Y solder at a soldering temperature of 250°C Under the conditions, the thickness of the oxide film on the surface of the solder after heating (analyzed by Auger electron spectroscopy), under the same process specification conditions, the thickness of the oxide film on the surface of the Sn-4wt%Ag-4wt%Ti solder has reached 59nm, However, the thickness of the oxide layer on the surface of the Sn-4wt%Ag-4wt%Ti-0.5wt%Y solder is only 12nm. This proves that the Sn-4wt%Ag-4wt%Ti-0.5wt%Y solder disclosed in the present invention has good oxidation resistance. The addition of the anti-oxidation element Y solves the problems that the Sn-4wt%Ag-4wt%Ti solder must be protected by gas due to surface oxidation during the soldering process, which brings about the increase of equipment and the complexity of the process. The Sn-4wt%Ag-4wt%Ti-0.5wt%Y solder of the present invention simplifies the welding process (no protective atmosphere, no flux, direct welding) and reduces the welding cost (no protective gas equipment, simplifies the welding equipment structure).
本发明Sn-0.1~6wt%Ag-0.5~6wt%Ti-0.1~2.5wt%Y焊料能够实现同类、异类材料(包括金属和非金属)组合之间,在空气中不采用任何焊剂的直接焊接。焊接对象可以是铝及铝合金、铜及铜合金、钢、不锈钢、钛合金、铸铁、硬质合金、镍基合金等金属材料;也可以是金刚石、石墨、金属间化合物、金属基复合材料和非金属基复合材料;也可以是氧化铝、氧化锆、氮化硅、氮化铝、氮化钛、碳化硅、碳化铬、碳化钨、碳化钼等陶瓷材料。对于不同的焊接对象的焊接请参见下述公开的实施例说明,实施例仅用于说明本发明焊料的可行,不得用于限制本发明焊料的实际用途。The Sn-0.1~6wt%Ag-0.5~6wt%Ti-0.1~2.5wt%Y solder of the present invention can realize direct welding between combinations of similar and dissimilar materials (including metals and nonmetals) without using any flux in the air . The welding objects can be metal materials such as aluminum and aluminum alloys, copper and copper alloys, steel, stainless steel, titanium alloys, cast iron, hard alloys, nickel-based alloys; diamonds, graphite, intermetallic compounds, metal matrix composites and Non-metal matrix composite materials; it can also be ceramic materials such as alumina, zirconia, silicon nitride, aluminum nitride, titanium nitride, silicon carbide, chromium carbide, tungsten carbide, and molybdenum carbide. For the welding of different welding objects, please refer to the following disclosed embodiments. The embodiments are only used to illustrate the feasibility of the solder of the present invention, and shall not be used to limit the practical use of the solder of the present invention.
本发明Sn-0.1~6wt%Ag-0.5~6wt%Ti-0.1~2.5wt%Y焊料尤其适用于电子产品中的陶瓷材料与陶瓷材料之间的直接焊接,或者陶瓷材料与金属材料之间的直接焊接,焊接过程无需任何焊剂。The Sn-0.1~6wt%Ag-0.5~6wt%Ti-0.1~2.5wt%Y solder of the present invention is especially suitable for direct welding between ceramic materials and ceramic materials in electronic products, or between ceramic materials and metal materials Direct welding, welding process without any flux.
实施例1:制Sn-4wt%Ag-2wt%Ti-0.5wt%Y焊料Embodiment 1: making Sn-4wt%Ag-2wt%Ti-0.5wt%Y solder
按重量份称取Sn、Ag、Ti和Y材料,放入非自耗真空电弧炉内,抽真空度至1×10-2,充高纯氩气;调节熔炼温度1500℃,熔炼时间10min;炉内材料熔炼一片均匀后铸成锭材,随炉冷却后取出;然后,采用冷轧工艺将Sn-4wt%Ag-2wt%Ti-0.5wt%Y焊料铸锭轧制成25mm×5mm×0.5mm的薄片。Weigh Sn, Ag, Ti and Y materials by weight, put them into a non-consumable vacuum electric arc furnace, evacuate to 1×10 -2 , and fill with high-purity argon; adjust the melting temperature to 1500°C, and the melting time to 10 minutes; The material in the furnace is smelted evenly and cast into an ingot, which is taken out after cooling with the furnace; then, the Sn-4wt%Ag-2wt%Ti-0.5wt%Y solder ingot is rolled into a 25mm×5mm×0.5 mm flakes.
对不同焊接对象采用上述Sn-4wt%Ag-2wt%Ti-0.5wt%Y焊料进行焊接,并用控温电阻炉加热焊接对象,其焊接接头的剪切强度见下表:Use the above-mentioned Sn-4wt%Ag-2wt%Ti-0.5wt%Y solder for different welding objects, and heat the welding objects with a temperature-controlled resistance furnace. The shear strength of the welded joints is shown in the following table:
测试条件:对上表中不同焊接对象经焊料焊接后,采用MTS-880型万能材料实验机测试上述Sn-4wt%Ag-2wt%Ti-0.5wt%Y焊料的焊接接头的剪切强度。Test conditions: After welding the different welding objects in the above table with solder, use the MTS-880 universal material testing machine to test the shear strength of the welded joint of the above-mentioned Sn-4wt%Ag-2wt%Ti-0.5wt%Y solder.
实施例2:制Sn-6wt%Ag-6wt%Ti-2.5wt%Y焊料Embodiment 2: making Sn-6wt%Ag-6wt%Ti-2.5wt%Y solder
按重量份称取Sn、Ag、Ti和Y材料放入非自耗真空电弧炉内,抽真空度至5×10-2,充高纯氩气;调节熔炼温度1500℃,熔炼时间10min;炉内材料熔炼一片均匀后铸成锭材,随炉冷却后取出;然后,采用冷轧工艺将Sn-6wt%Ag-6wt%Ti-2.5wt%Y焊料铸锭轧制成25mm×5mm×0.5mm的薄片。Weigh Sn, Ag, Ti and Y materials by weight and put them into a non-consumable vacuum electric arc furnace, evacuate to 5×10 -2 , and fill with high-purity argon; adjust the melting temperature to 1500°C, and the melting time to 10 minutes; The inner material is smelted evenly and cast into an ingot, which is taken out after cooling with the furnace; then, the Sn-6wt%Ag-6wt%Ti-2.5wt%Y solder ingot is rolled into 25mm×5mm×0.5mm by cold rolling process of flakes.
对不同焊接对象采用Sn-6wt%Ag-6wt%Ti-2.5wt%Y焊料进行焊接,并用控温电阻炉加热焊接对象,其焊接接头的剪切强度见下表:
测试条件:对上表中不同焊接对象经焊料焊接后,采用MTS-880型万能材料实验机测试上述Sn-6wt%Ag-6wt%Ti-2.5wt%Y焊料的焊接接头的剪切强度。Test conditions: After welding the different welding objects in the above table with solder, use the MTS-880 universal material testing machine to test the shear strength of the welded joint of the above-mentioned Sn-6wt%Ag-6wt%Ti-2.5wt%Y solder.
实施例3:公开不同焊料组份的接头剪切强度Example 3: Disclosure of Joint Shear Strength of Different Solder Compositions
对于本发明公开的Sn-0.1~6wt%Ag-0.5~6wt%Ti-0.1~2.5wt%Y焊料在对同一焊接对象采用不同组分焊料的接头剪切强度见下表:
熔炼设备:非自耗真空电弧炉Melting equipment: non-consumable vacuum electric arc furnace
熔炼条件:真空度至1×10-2,充高纯氩气;Melting conditions: vacuum to 1×10 -2 , filled with high-purity argon;
熔炼温度1500℃,熔炼时间10min铸锭;The melting temperature is 1500°C, and the melting time is 10 minutes to cast ingots;
焊接条件:焊接温度250℃±5℃,并用常规的台式电阻炉加热焊接对象;Welding conditions: welding temperature 250°C±5°C, and use a conventional desktop resistance furnace to heat the welding object;
测试条件:采用MTS-880型万能材料实验机测试上述Sn-6wt%Ag-6wt%Ti-2.5wt%Y焊料的焊接接头的剪切强度。Test conditions: MTS-880 universal material testing machine was used to test the shear strength of the soldered joint of the above-mentioned Sn-6wt%Ag-6wt%Ti-2.5wt%Y solder.
从上表可以看出,抗氧化元素钇Y的含量与活性元素钛Ti的含量变化密切相关。在实际焊接过程中,焊料表面的氧化层主要由锡和钛的氧化物构成,抗氧化元素钇Y的添加主要抑制了氧化钛的生成。It can be seen from the above table that the content of the anti-oxidation element yttrium Y is closely related to the content change of the active element titanium Ti. In the actual soldering process, the oxide layer on the surface of the solder is mainly composed of tin and titanium oxides, and the addition of anti-oxidation element yttrium Y mainly inhibits the formation of titanium oxide.
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CNB2006101126375A CN100409996C (en) | 2006-08-28 | 2006-08-28 | An oxidation-resistant tin-based lead-free solder capable of flux-free soldering in air |
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