CN101062625A - Pattern forming method, droplet discharging device and circuit module - Google Patents

Abstract

The invention provides a pattern forming method, a liquid drop ejecting device and a circuit assembly. The mirror (27) mounted on the carriage (20) reflects the laser light emitted from the semiconductor laser (LD) as the first irradiation light (Le1) along the approximate scanning direction to irradiate the first irradiation position ( P1). And, the concave mirror (29) mounted on the carriage (20) reflects the reflected scattered light (Lr) from the first irradiation position (P1), and irradiates the liquid film again as the second irradiation light (Le2) along the approximate scanning direction ( FL) for the second irradiation position (P2). Therefore, the drying efficiency of the liquid droplets can be improved, and it is possible to reduce the formation failure of the pattern made of the liquid droplets.

Description

Pattern forming method, droplet ejection device, and circuit assembly

technical field

The invention relates to a pattern forming method, a liquid drop ejecting device and a circuit assembly.

Background technique

In recent years, low temperature co-fired ceramics (Low Temperature Co-fired Ceramics, or LTCC multilayer substrates) composed of glass ceramics have been known in circuit assemblies carrying electronic components such as semiconductor elements. Since the LTCC multilayer substrate can calcinate the laminated printed circuit board (green sheet) at a low temperature below 900°C, it is possible to use low-melting-point metals such as silver or gold for internal wiring, and can achieve low resistance of internal wiring.

In the manufacturing process of such an LTCC substrate, a wiring pattern is drawn on each printed circuit board before lamination with metal paste or metal ink. As this drawing method, Patent Document 1 proposes a so-called inkjet method in which metallic ink is discharged as fine droplets. Since the inkjet method draws a wiring pattern by bonding tiny liquid droplets, it is possible to quickly respond to design changes in internal wiring (for example, increasing the density of internal wiring or reducing the wiring width and wiring pitch).

However, the droplet that bounces onto the printed circuit board often changes in size or shape depending on the surface state of the printed circuit board or the surface tension of the droplet. Droplets that change in size or shape define the size of the wiring pattern according to the timing of drying. For example, when a droplet made of metallic ink with an outer diameter of 30 μm lands on a lyophilic printed circuit board, the outer diameter expands to 70 μm after 10 milliseconds, and further expands to 100 μm after 200 milliseconds. Therefore, if the drying timing of the liquid droplets is scattered in the range of 100 ms to 200 ms later, the line width of the corresponding wiring pattern is scattered in the range of about 70 μm to 100 μm.

Therefore, in such a liquid droplet drying method, laser drying in which a laser beam is irradiated to the liquid droplet bouncing on the printed circuit board has been proposed in order to suppress the variation in pattern size. In laser drying, the drying process of the liquid droplets is performed only in the irradiation area of the laser light. Therefore, the drying timing of the bouncing liquid droplets can be controlled with high precision, and the variation in pattern size can be suppressed.

However, in a droplet ejection device used in the inkjet method, the gap between the droplet ejection head and the object is generally narrowed to several hundreds of μm in order to ensure droplet landing accuracy. Therefore, when drying the liquid droplets located directly under the droplet discharge head, it is necessary to irradiate the laser light in a direction approximately tangential to the object in the narrow gap between the liquid droplet discharge head and the object. As a result, the optical cross section (beam spot) of the laser beam formed on the object expands, and the intensity of the laser beam required to dry the liquid droplets cannot be ensured. Therefore, the drying of the liquid droplets is insufficient, which may cause poor pattern formation.

Contents of the invention

The present invention is aimed at solving the above-mentioned problems, and an object of the present invention is to provide a pattern forming method, a droplet ejection device, and a circuit assembly that can improve the drying effect of liquid droplets and reduce formation defects of patterns made of liquid droplets.

In the pattern forming method of the present invention, the pattern forming material is formed into liquid droplets and sprayed on the substrate, and the liquid droplets bounced on the substrate are dried to form a pattern on the substrate. The pattern forming method is composed of: The laser light emitted from the source is irradiated to the area of the droplet, and the laser light reflected or scattered from the area of the droplet is reflected and irradiated to the area of the droplet again to dry the droplet.

According to the pattern forming method of the present invention, the laser light reflected or scattered from the area of the liquid droplet is reflected and irradiated to the area of the liquid droplet again. Accordingly, the drying efficiency of the liquid droplets can be improved, insufficient drying of the liquid droplets can be avoided, and pattern formation defects can be eliminated.

In addition, it may also be configured as follows: scan the liquid droplets bounced and landed on the substrate along the scanning direction with respect to the laser light, irradiate the area of the laser light emitted by the laser source, and reflect the radiation from the area of the liquid droplets or The areas of scattered laser light are located at different positions in the scanning direction.

According to this pattern forming method, the laser light reflected or scattered from the area of the liquid droplet, and the laser light from the laser light source irradiate different positions in the scanning direction. As a result, multiple laser shots can be applied to the region of the droplet during scanning of the droplet. Furthermore, even when the reflected laser light is reflected again by the region of the liquid droplet, the reflected laser light can be prevented from entering the laser light source side. Therefore, the irradiation operation of the laser beam can be stabilized, and the drying efficiency of the liquid droplets can be improved under the condition of exhibiting higher reproducibility.

In addition, in this pattern forming method, it may also be configured as follows: scanning the liquid droplets bounced and landed on the substrate along the scanning direction relative to the laser light, and converging the laser light emitted by the laser source in the scanning direction. , irradiate the area of the droplet, and converge the laser light reflected or scattered from the area of the droplet in the scanning direction, and irradiate the area of the droplet again.

According to this pattern forming method, a plurality of laser beams converging in the scanning direction irradiate the region of the liquid droplet. As a result, only by converging the laser light in the scanning direction, the drying efficiency of the liquid droplets can be further improved without reducing the accuracy of irradiation of the laser light on the liquid droplets. As a result, pattern formation defects can be eliminated more reliably.

The droplet ejection device of the present invention is provided with a droplet ejection head for forming a pattern forming material into droplets and spraying them on a substrate, the droplet ejection device includes: a first irradiation unit, irradiating the area of the droplet bouncing onto the substrate with laser light emitted from the laser source; and a second irradiation unit that reflects and irradiates the laser light reflected or scattered from the area of the droplet to the area of the droplet again.

According to the liquid droplet ejection device of the present invention, the first irradiation unit irradiates the laser light emitted from the laser source to the area of the liquid droplet, and the second irradiation unit reflects and irradiates the laser light reflected or scattered from the area of the liquid droplet to the liquid droplet again. Area. Accordingly, the drying efficiency of the liquid droplets can be improved, insufficient drying of the liquid droplets can be avoided, and pattern formation defects can be eliminated.

Furthermore, in this liquid droplet discharge device, the second irradiation unit includes a mirror disposed on the opposite side of the first irradiation unit with the droplet discharge head interposed therebetween, and The laser light reflected or scattered by the area of the droplet is reflected again to illuminate the area of the droplet.

According to this droplet ejection device, the reflection mirror is arranged on the opposite side of the first irradiation unit. Thereby, the laser light from the laser source scattered through the region of the droplet can be more effectively reflected. As a result, the drying efficiency of liquid droplets can be improved more reliably.

Furthermore, in this droplet ejection device, when viewed from the normal direction of the substrate, the reflection mirror has a concave surface, and the concave surface reflects the laser beam passing through the region of the droplet so that it converges on the droplet again. Area.

According to this droplet ejection device, the concave surface of the mirror reconverges the laser beam diffused from the droplet region to the droplet region when viewed from the normal direction of the substrate. Thereby, the laser light from the region of the droplet can be more effectively used.

Also, in the droplet ejection device, the first irradiation unit irradiates the laser light emitted from the laser source to the region of the droplet along the approximate tangent direction of the substrate, and the second irradiation unit There is a reflection mirror that reflects and irradiates the laser light reflected or scattered from the region of the droplet to the region of the droplet along the approximate tangent direction of the substrate, and when viewed from the normal direction of the substrate, the reflection mirror is equipped with a The distance between the first illuminating unit and the reflective mirror is approximately a concave surface with a radius of curvature.

According to this liquid droplet ejection device, the concave surface of the reflection mirror approximates the distance between the first irradiation unit and the reflection mirror to its approximate radius of curvature. This makes it possible to more reliably reflect the laser light from the first irradiation unit passing through the droplet region in the region of the droplet.

Furthermore, in this droplet ejection device, it may be configured such that, when viewed from a tangential direction of the substrate, the reflection mirror has a concave surface facing the droplet area side, and the reflection mirror from the droplet area side The laser light is again focused on the droplet area.

According to this droplet ejection device, the concave surface of the mirror reconverges the laser light diffused from the droplet region on the droplet region when viewed from the tangential direction of the substrate. In this way, the laser light from the area of the droplet can be effectively used.

Also, in this liquid droplet ejection device, the reflection mirror irradiates the laser light from the reflection position of the liquid droplet to the liquid droplet again so that The momentum of the laser beam irradiated to the reflection position by the mirror and the laser beam of the first irradiation unit cancels each other when viewed from the tangential direction of the substrate.

According to this liquid droplet ejection device, the momentums of the laser light from the first irradiation unit and the laser light from the reflection mirror cancel each other out, and the liquid droplets do not move. Therefore, the kinetic energy of the two lasers can be efficiently converted into heat energy, and the drying can be quickly performed at low cost and with high efficiency.

In addition, in this droplet ejection device, it further includes: a carriage on which the droplet ejection head, the first irradiation unit, and the second irradiation unit are mounted; and a scanning unit that moves along the scanning direction The substrate is scanned relative to the carriage.

According to this liquid droplet discharge device, the liquid droplet discharge head mounted on the carriage discharges liquid droplets to the substrate, and the first irradiation unit and the second irradiation unit mounted on the carriage eject the liquid droplets falling on the substrate. The area is irradiated with laser light. Thereby, the relative position of the irradiated laser light can be maintained with respect to the area of the droplet. As a result, the laser beams irradiated by the first irradiating unit and the second irradiating unit can be more reliably irradiated to the region of the droplet.

Furthermore, in this liquid droplet ejection device, the first irradiation unit irradiates the laser light emitted from the laser source to the first irradiation position, and the second irradiation unit includes a reflector, and the reflector irradiates the laser beam from the droplet to the first irradiation position. The reflected or scattered laser light reflected by the area of the region is irradiated to a second irradiating position different from the first irradiating position in the scanning direction.

According to this droplet ejection device, the laser light irradiated by the first irradiation unit and the laser light irradiated by reflection by the mirror irradiate different positions in the scanning direction. As a result, during the course of scanning the droplet, multiple laser shots can be applied to the region of the droplet. Furthermore, even when the reflected laser light is reflected again by the liquid droplet region, the reflected laser light can be suppressed from entering the laser light source side. Therefore, the irradiation operation of the laser beam can be stabilized, and the drying efficiency of the liquid droplets can be improved under the condition of exhibiting higher reproducibility.

Also, in this droplet discharge device, the pattern forming material is metal ink in which metal fine particles are dispersed, and the substrate is a low-temperature calcined ceramic substrate.

According to this droplet ejection device, the laser beams irradiated by the first irradiation unit and the second irradiation unit irradiate the region of the droplet of the metallic ink that lands on the low-temperature fired ceramic substrate. Thereby, the drying efficiency of the metallic ink can be improved, and formation defects of a pattern (for example, a wiring pattern or an element pattern on a low-temperature fired ceramic substrate) made of the metallic ink can be reduced.

The circuit module of the present invention includes a substrate, a circuit element formed on the substrate, and a metal wiring formed on the substrate and electrically connected to the circuit element, the metal wiring being formed by the above-mentioned droplet discharge device.

According to the circuit module of the present invention, formation defects of metal wiring can be reduced.

Description of drawings

FIG. 1 is a perspective view showing a circuit module of the present invention.

Fig. 2 is an explanatory diagram illustrating a method of manufacturing a circuit module of the present invention.

Fig. 3 is a perspective view showing a droplet ejection device of the present invention.

Fig. 4 is a perspective view showing a droplet ejection head of the present invention.

Fig. 5 is a side view showing the droplet discharge head of the present invention.

FIG. 6 is an explanatory diagram illustrating a droplet discharge head and a semiconductor laser according to the present invention.

FIG. 7 is a circuit block diagram illustrating the electrical configuration of the droplet ejection device of the present invention.

In the figure: 1-circuit assembly, 4S-printed circuit substrate as substrate, 5-circuit element, 5F-component pattern constituting pattern, 6-internal wiring as metal wiring, 6F-wiring pattern constituting pattern, 10-liquid Droplet ejection device, 13-tabletop as scanning unit, 20-sliding frame, 21-droplet ejection head, 25-cylindrical lens forming the first irradiation unit, 27-mirror forming the first irradiation unit, 28 -concave mirror as a reflector constituting the second irradiation unit, F-metallic ink as a pattern forming material, Fb-liquid droplet, Le1-first irradiation light constituting laser light, Le2-second irradiation light constituting laser light, LD - Semiconductor lasers as laser sources.

Detailed ways

An embodiment of the present invention will be described below with reference to FIGS. 1 to 7 . First, the circuit module 1 of the present invention will be described.

In FIG. 1 , a circuit module 1 includes a plate-shaped LTCC multilayer substrate 2 and a plurality of semiconductor chips 3 connected to the upper side of the LTCC multilayer substrate 2 by wire bonding or flip chip connection.

The LTCC multilayer substrate 2 is laminated with a plurality of low-temperature fired ceramic substrates (hereinafter simply referred to as insulating layers 4 ) formed in a sheet shape. Each lamination layer 4 is a sintered body made of a glass-ceramic material (for example, a mixture of a glass component such as borosilicate alkali metal oxide and a ceramic component such as alumina), and is formed to a thickness of several hundred μm.

Between the layers of each insulating layer 4 are formed: various circuit elements 5 such as resistive elements, capacitive elements, and coil elements; Each circuit element 5 and each internal wiring 6 are sintered compacts of metal fine particles such as silver or silver alloy, and are formed by the droplet ejection device 10 of the present invention. Via wiring 7 exhibiting a stack via structure or a thermal via structure is formed in each insulating layer 4 to electrically connect each circuit element 5 or each internal wiring 6 between layers. Like each circuit element 5 or each internal wiring 6, each via wiring 7 is a sintered body of metal fine particle powder such as silver or silver alloy.

Next, a method of manufacturing the above-mentioned LTCC multilayer substrate 2 will be described with reference to FIG. 2 .

In FIG. 2 , first, the printed circuit board 4S, which is the substrate from which the insulating layer 4 can be cut out, is subjected to punching or laser processing, and through holes 7H are punched out. Next, screen printing using a metal paste is performed multiple times on the printed circuit board 4S, and the metal paste is filled in the through holes 7H to form a through hole pattern 7F made of the metal paste. Next, using metal ink F (aqueous silver ink in this embodiment) as a pattern forming material in which metal nanoparticles are dispersed in an aqueous solvent, spraying is performed on the upper surface of the printed circuit board 4S (hereinafter simply referred to as the pattern forming surface 4Sa). ink printing.

To describe in detail, droplets Fb of the metal ink F are ejected to the pattern forming surface 4Sa, that is, a region for forming circuit elements 5 and internal wiring 6 (hereinafter simply referred to as the pattern forming region), and the droplets falling on the pattern forming region The droplet Fb dries. Then, the discharge operation and the drying operation are repeated to draw the element pattern 5F and the wiring pattern 6F corresponding to the pattern formation area. At this time, the liquid droplet Fb that landed on the pattern formation area is dried by irradiating the liquid droplet Fb that landed on the laser beam.

When the element pattern 5F, the wiring pattern 6F, and the via pattern 7F are formed on the printed circuit board 4S, a plurality of printed circuit boards 4S are stacked together, and the area corresponding to the LTCC multilayer board 2 is cut out as a laminated body 4B and then processed. calcined. That is, the printed circuit board 4S, the element pattern 5F, the wiring pattern 6F, and the via pattern 7F are collectively laminated and fired. Thus, the LTCC multilayer substrate 2 having the insulating layer 4, the circuit element 5, the internal wiring 6, and the via wiring 7 is formed.

Next, the droplet ejection device 10 for drawing the above-described element pattern 5F and wiring pattern 6F will be described with reference to FIG. 3 . FIG. 3 is an overall perspective view showing the droplet ejection device 10 .

In FIG. 3 , a droplet ejection device 10 includes a base 11 formed in a rectangular parallelepiped shape. A pair of guide grooves 12 extending along the longitudinal direction (Y arrow direction) are formed on the upper surface of the base 11 . Above the guide groove 12 is provided a table 13 as a scanning unit that moves in the Y arrow direction and the direction opposite to the Y arrow along the guide groove 12 . The mounting part 14 is formed in the upper surface of the table surface 13, and the printed circuit board 4S which made the said pattern formation surface 4Sa the upper side is mounted. The mounting unit 14 positions and fixes the printed circuit board 4S in the mounted state with respect to the table 13 , and conveys the printed circuit board 4S in the Y arrow direction and in the direction opposite to the Y arrow. In this embodiment, the Y arrow direction is defined as the scanning direction in FIG. 3 . In addition, the conveyance speed of the printed circuit board 4S in the scanning direction is defined as scanning speed Vy.

On the base 11 , a gate-shaped guide member 16 is bridged over the base 11 on both sides in the X arrow direction perpendicular to the scanning direction. An ink tank 17 extending in the direction of the arrow X is disposed on the upper side of the guide member 16 . The ink tank 17 stores the metallic ink F, and supplies the metallic ink F to each of droplet ejection heads (hereinafter simply referred to as ejection heads) 21 arranged below at a predetermined pressure.

A pair of upper and lower guide rails 18 extending in the direction of the arrow X are formed on the side in the direction opposite to the arrow Y of the guide member 16 over almost the entire width in the direction of the X arrow. A carriage 20 is mounted on a pair of guide rails 18, and moves along the guide rails 18 in the direction of the X arrow and in the direction opposite to the X arrow. The ejection head 21 is mounted on the bottom surface 20 a of the carriage 20 , that is, the approximate center portion in the scanning direction. FIG. 4 is a perspective view of the discharge head 21 viewed from the lower side (printed circuit board 4S side), and FIG. 5 is a cross-sectional view taken along line A-A of FIG. 4 . FIG. 6 is an explanatory diagram illustrating the carriage 20 .

In FIG. 4 , the ejection head 21 is formed in a rectangular parallelepiped shape extending in the direction of the X arrow. A nozzle plate 22 is provided on the lower side of the ejection head 21 (the side of the printed circuit board 4S, that is, the upper side in FIG. 4 ). The nozzle plate 22 is formed in a plate shape extending in the direction of the arrow X, and has a nozzle forming surface 22 a formed on the lower surface (the upper surface in FIG. 4 ). The nozzle forming surface 22a is formed approximately parallel to the pattern forming surface 4Sa of the printed circuit board 4S, and when the printed circuit board 4S is located directly below the ejection head 21, the distance between the nozzle forming surface 22a and the pattern forming surface 4Sa (platen gap) at a predetermined distance (300 μm in this embodiment). On the nozzle forming surface 22a, a plurality of nozzles N formed to pass through the normal direction of the nozzle forming surface 22a are arranged along the X arrow direction.

In FIG. 5 , cavities 23 communicating with the ink tanks 17 are formed on the upper sides of the nozzles N, respectively. The cavity 23 supplies the corresponding nozzle N with the metallic ink F from the ink tank 17 . On the upper side of each cavity 23 , a vibrating plate 24 is attached to vibrate in the vertical direction to expand or reduce the volume of the cavity 23 . A plurality of piezoelectric elements PZ corresponding to the nozzles N are arranged on the upper side of the vibrating plate 24 . Each piezoelectric element PZ contracts and expands in the vertical direction, respectively, so that the region of the corresponding vibrating plate 24 vibrates in the vertical direction, so that the metallic ink F is discharged from the corresponding nozzle as a droplet Fb of a predetermined volume (10 pl in this embodiment). N spews out. The liquid droplet Fb flies in the direction opposite to the Z arrow of the corresponding nozzle N, and bounces to a position on the opposing pattern forming surface 4Sa. In this embodiment, positions on the pattern forming surface 4Sa, that is, positions corresponding to the direction of the reverse Z arrow of each nozzle N, that is, positions where the droplets Fb bounce are defined as bounce positions P, respectively.

When scanning is performed in the scanning direction, the bounced liquid droplet Fb wets and spreads along the pattern forming surface 4Sa, and soon joins with the previous bounced droplet Fb. The joined liquid droplets Fb form a liquid film FL extending in the scanning direction, and a liquid surface FLa approximately parallel to the pattern forming surface 4Sa is formed on the entire top surface thereof.

In the present embodiment, the time required for the bounced liquid droplets Fb to form the liquid film FL is defined as the irradiation standby time T. In addition, the distance that the droplet Fb is scanned within the irradiation standby time T is defined as the irradiation standby distance WF (=scanning speed Vy×irradiation standby time T).

In addition, in this embodiment, the positions on the liquid surface FLa, that is, the positions separated from the respective bounce positions P by the irradiation standby distance WF in the scanning direction are respectively defined as the first irradiation positions P1. In addition, the scanning direction side (Y arrow direction side) of each 1st irradiation position P1, ie, the position which opposes the edge part of the scanning direction of the nozzle formation surface 22a, is defined as the 2nd irradiation position P2, respectively.

In FIG. 6 , on the bottom surface 20 a of the carriage 20 , that is, in the scanning direction (Y arrow direction) of the ejection head 21 , an ejection hole H penetrating into the interior of the carriage 20 is formed. The exit hole H is formed such that its width in the X-arrow direction is approximately the same as the width of the ejection head 21 in the X-arrow direction. On the upper side of the output hole H, a semiconductor laser LD is arranged as a laser light source.

The semiconductor laser LD emits the strip-shaped parallel-corrected laser light extending to almost the entire width of the exit hole H in the direction of the arrow X in the downward direction. The wavelength of the laser light emitted from the semiconductor laser LD is set to the absorption wavelength range of the metallic ink F (808 nm in this embodiment).

A cylindrical lens 25 constituting a first irradiation unit is disposed inside the output hole H. The cylindrical lens 25 is a lens having curvature only in the Y arrow direction, and is formed to have the same dimension as the width of the lens surface in the X arrow direction and the width of the ejection head 21 in the X arrow direction. When the semiconductor laser LD emits laser light, the cylindrical lens 25 converges only the component along the scanning direction of the laser light, and emits it downward as first irradiation light Le1.

Disposed below the output hole H are: a first mirror table 26 extending below the carriage 20 ; and a mirror 27 rotatably supported by the first mirror table 26 and constituting a first irradiation unit. The first mirror table 26 supports the mirror 27 so as to be rotatable around a rotation axis along the X-arrow direction.

The reflection mirror 27 is a flat mirror having a reflection surface 27 m on the side of the cylindrical lens 25 , and is formed to have the same dimension as the width of the reflection surface 27 m in the X-arrow direction and the width of the ejection head 21 in the X-arrow direction. The reflection mirror 27 reflects the first irradiation light Le1 from the cylindrical lens 25 in a substantially tangential direction (a substantially anti-scan direction) of the pattern forming surface 4Sa when the semiconductor laser LD emits laser light. The mirror 27 irradiates the first irradiation light Le1 to all the first irradiation positions P1 so that the beam waist of the reflected first irradiation light Le1 is common to all the first irradiation positions P1.

Part of the first irradiation light Le1 irradiated to the first irradiation position P1 passes through the liquid surface FLa, is absorbed by the liquid film FL, and the drying of the liquid film FL starts. At this time, the amount of the first irradiation light Le1 irradiating the first irradiation position P1 to transmit the beam waist through the liquid film FL is only increased by the amount corresponding to the first irradiation position P1. Thereby, only the beam waist of the first irradiation light Le1 corresponding to the first irradiation position P1 is absorbed by the liquid film FL in many cases, and the drying efficiency of the liquid film FL can be improved.

On the other hand, the first irradiation light Le1 that irradiates the first irradiation position P1, that is, the first irradiation light Le1 that is not absorbed by the liquid film FL starts from the first irradiation position P1 in a direction approximately opposite to the scanning direction as reflected scattered light Lr. and is reflected (or scattered).

In FIG. 6 , on the bottom surface 20 a of the carriage 20 , that is, in the anti-scanning direction of the ejection head 21 (direction opposite to the direction of the Y arrow), a second mirror table 28 extending below the carriage 20 is provided; A concave mirror 29 is rotatably supported by the second mirror stage 28 and serves as a mirror constituting the second irradiation unit. The second mirror table 28 rotatably supports a concave mirror 29 about a rotation axis in the X arrow direction.

Concave mirror 29 is to make only the concave surface (reflection surface 29m) that has curvature on the Y arrow direction toward the cylinder mirror of the discharge head 21 side, and the width in the direction of the X arrow of its X arrow and the width of the direction of the X arrow of discharge head 21 Approximately equal dimensions are formed. The reflective surface 29m is a concave surface whose curvature radius is the distance between the second irradiation position P2 and the reflective surface 29m.

When the semiconductor laser LD emits laser light and the droplets Fb form the liquid film FL, the concave mirror 29 receives the reflected scattered light Lr from the first irradiation position P1 on the reflection surface 29m. The reflective surface 29m of the concave mirror 29 reflects the reflected scattered light Lr in a direction approximately tangential to the pattern forming surface 4Sa (approximately in the scanning direction), and converges in the scanning direction as second irradiation light Le2. The concave mirror 29 irradiates the second irradiation light Le2 to all the second irradiation positions P2 so that the beam waist of the second irradiation light Le2 is common to all the second irradiation positions P2.

Part of the second irradiation light Le2 irradiated to the second irradiation position P2 passes through the liquid surface FLa in a state where drying has started, thereby promoting drying of the liquid film FL. At this time, the irradiation light Le2 irradiated to the second irradiation position P2 increases the transmission amount of the beam waist to the liquid film FL by an amount corresponding to the second irradiation position P2. Thereby, only the beam waist of the second irradiation light Le2 corresponding to the second irradiation position P2 is absorbed by the liquid film FL in many cases, and the drying efficiency of the liquid film FL can be further improved.

As a result, the liquid film FL (droplet Fb) irradiated with the first irradiating light Le1 is reliably dried only for the portion irradiated with the reflected scattered light Lr as the second irradiating light Le2 , forming a layer pattern FP without insufficient drying. Furthermore, by sequentially laminating the layer pattern FP, the element pattern 5 and the wiring pattern 6 can be formed, and formation defects thereof can be reduced.

Next, the electrical configuration of the droplet ejection device 10 configured as described above will be described with reference to FIG. 7 .

In FIG. 7, the control device 40 as a control unit has a CPU, ROM, RAM, etc., and drives and controls the semiconductor laser LD while moving the stage 13 and the carriage 20 based on various data and various control programs stored therein. And each piezoelectric element PZ.

An input device 41 having operation switches such as a start switch and a stop switch is connected to the control device 40 . The input device 41 inputs information on the position coordinates of the pattern forming region (layer pattern FP) corresponding to the drawing plane (pattern forming surface 4Sa) to the control device 40 as drawing information Ia of a predetermined format. The control device 40 receives the drawing information Ia from the input device 41, and generates bitmap data BMD.

The bitmap data BMD is data for specifying ON or OFF of each piezoelectric element PZ according to the value (0 or 1) of each bit. The bitmap data BMD is data for specifying whether or not to discharge the liquid droplet Fb to each position on the drawing plane (pattern formation surface 4Sa) through which the discharge head 21 passes. That is, the bitmap data BMD is data for ejecting the liquid droplets Fb to respective predetermined target positions in the pattern formation area.

The control device 40 is connected to the X-axis motor drive circuit 42 and outputs a corresponding drive control signal to the X-axis motor drive circuit 42 . The X-axis motor drive circuit 42 rotates the X-axis motor MX for moving the carriage 20 forwardly or backwardly in response to a drive control signal from the control device 40 . The X-axis motor drive circuit 42 is connected to the X-axis encoder XE, and receives a detection signal from the X-axis encoder XE. The X-axis motor driving circuit 42 generates a signal related to the moving direction and moving amount of the carriage 20 (each bounce position P) corresponding to the pattern forming surface 4Sa according to the detection signal from the X-axis encoder XE, and outputs the signal to the control unit. device 40.

The control device 40 is connected to a Y-axis motor drive circuit 43 and outputs a corresponding drive control signal to the Y-axis motor drive circuit 43 . The Y-axis motor drive circuit 43 rotates the Y-axis motor MY for moving the table 13 forward or backward in response to a drive control signal from the control device 40 . That is, the control device 40 scans the irradiation standby distance WF only on the stage 13 (pattern formation surface 4Sa) within the irradiation standby time T via the Y-axis motor drive circuit 43, so that the liquid droplets Fb at the first irradiation position P1 form a liquid film FL. .

The Y-axis motor drive circuit 43 is connected to the Y-axis encoder YE, and receives a detection signal from the Y-axis encoder YE. The Y-axis motor drive circuit 43 generates a signal related to the moving direction and moving amount of the stage 13 (pattern forming surface 4Sa) based on the detection signal from the Y-axis encoder YE, and outputs the signal to the control device 40 . The control device 40 calculates the relative position of the pop-up position P corresponding to the pattern forming surface 4Sa based on the signal from the Y-axis motor drive circuit 43, and outputs the ejection timing signal LP every time the target position is at the corresponding pop-up position P.

The control device 40 is connected to a semiconductor laser drive circuit 44 , outputs a drawing start signal S1 when the drawing operation starts, and outputs a drawing end signal S2 when the drawing operation ends. The semiconductor laser driving circuit 44 receives a drawing start signal S1 from the control device 40 to cause the semiconductor laser LD to emit laser light, and receives a drawing end signal S2 from the control device 40 to stop the semiconductor laser LD from emitting laser light. That is, the control device 40 drives and controls the semiconductor laser LD via the semiconductor laser drive circuit 44 during the drawing operation period, and performs the irradiation operation of laser light.

The control device 40 is connected to a discharge head drive circuit 45 , and outputs a piezoelectric element drive voltage COM for driving each piezoelectric element PZ in synchronization with the discharge timing LP described above. In addition, the control device 40 generates a discharge control signal SI synchronized with a predetermined clock signal based on the bitmap data BMD, and serially transmits the discharge control signal SI to the discharge head drive circuit 45 . The ejection head driving circuit 45 associates the ejection control signal SI from the control device 40 with each piezoelectric element PZ, and sequentially performs serial/parallel conversion. Each time the ejection head drive circuit 45 receives the ejection timing signal LP from the control device 40, it latches the serial/parallel converted ejection control signal SI, and sends the selected piezoelectric elements PZ respectively The piezoelectric element driving voltage COM is supplied.

Next, a method of drawing the element pattern 5F and the wiring pattern 6F using a droplet discharge device will be described.

First, as shown in FIG. 3 , the printed circuit board 4S is placed on the table 13 so that the pattern formation surface 4Sa is located on the upper side. At this time, the stage 13 arranges the printed circuit board 4S in the reverse scanning direction of the carriage 20 .

From this state, the drawing information Ia is input from the input device 41 to the control device 40, and the control device 40 generates and stores bitmap data BMD based on the drawing information Ia. Next, when scanning the printed circuit board 4S, the control device 40 arranges and moves the carriage 20 (ejection head 31 ) to a predetermined position through the X-axis motor drive circuit 42 so that the target position passes the corresponding ejection position P. When the carriage 20 is arranged and moved, the control device 40 starts scanning of the printed circuit board 4S via the Y-axis motor drive circuit 43 .

When scanning of the printed circuit board 4S starts, the control device 40 outputs the ejection control signal SI generated based on the bitmap data BMD to the ejection head drive circuit 45 .

In addition, when the scanning of the printed circuit board 4S is started, the control device 40 outputs the discharge timing signal LP to the discharge head driving circuit 45 every time the target position is located at the corresponding ejection position P. And, every time the ejection timing signal LP is output, the control device 40 selects the nozzle N for ejecting the liquid droplet Fb according to the ejection control signal SI through the ejection head drive circuit 45, and the nozzle N corresponds to the selected nozzle N. The droplet Fb is ejected at the bounce position P, that is, the target position. Each ejected liquid droplet Fb bounces and lands on the corresponding target position on the pattern forming surface 4Sa. When the liquid droplets Fb bounced to each target position are scanned and irradiated by the standby distance WF in the scanning direction, they will join with the previous liquid droplets Fb in the vicinity of the first irradiation position P1 to form a liquid film FL extending in the scanning direction. .

In addition, when scanning of the printed circuit board 4S is started, the control device 40 outputs a drawing start signal S1 to the semiconductor laser drive circuit 44, and laser light is emitted from the semiconductor laser LD.

When the semiconductor laser LD emits laser light, the mirror 27 reflects the laser light from the semiconductor laser LD, and irradiates the first irradiation position P1 as the first irradiation light Le1 along the substantially anti-scanning direction. The liquid film FL at the first irradiation position P1 transmits a part of the first irradiation light Le1 and starts to dry, while it reflects or scatters toward the concave mirror 29 side as reflected scattered light Lr along the approximate anti-scanning direction.

When the liquid film FL reflects or scatters the first irradiation light Le1, the concave mirror 29 reflects the reflected scattered light Lr from the liquid film FL, and irradiates the second irradiation position P2 as the second irradiation light Le2 along the approximate scanning direction. The drying of the liquid film FL at the second irradiation position P2 is accelerated by transmitting part of the second irradiation light Le2. As a result, the liquid film FL that has been dried by the irradiation of the first irradiation light Le1 can be dried more reliably by re-irradiating only the reflected scattered light Lr as the second irradiation light Le2, and the layer pattern FP without insufficient drying can be formed. Furthermore, by sequentially laminating the layer patterns FP, the element pattern 5F and the wiring pattern 6F can be formed, and formation defects thereof can be reduced.

Next, effects of the present embodiment constituted as described above will be described below.

(1) According to the above embodiment, the reflection mirror 27 mounted on the carriage 20 reflects the laser light emitted from the semiconductor laser LD, and irradiates the first irradiation position P1 of the liquid film FL as the first irradiation light Le1 along the approximate anti-scanning direction. Then, the concave mirror 29 mounted on the carriage 20 reflects the reflected scattered light Lr from the first irradiation position P1 to irradiate the second irradiation position P2 of the liquid film FL again as the second irradiation light Le2 along the approximate scanning direction.

Thus, the drying efficiency of the liquid film FL can be improved only by irradiating the liquid film FL again with the reflected scattered light Lr reflected by the liquid film FL. As a result, insufficient drying of the droplets Fb can be avoided, and formation defects of the element pattern 5F and the wiring pattern 6F can be eliminated.

(2) According to the above embodiment, the reflective mirror 27 and the concave mirror 29 irradiate the first irradiation light Le1 and the second irradiation light Le2 converged in the scanning direction (Y arrow direction), respectively. Thereby, only the first irradiation light Le1 and the second irradiation light Le2 converged in the scanning direction are irradiated, and the drying efficiency of the liquid droplets can be further improved. Thereby, it is possible to more reliably eliminate pattern formation defects.

(3) According to the above-mentioned embodiment, the ejection head 21 , the semiconductor laser LD, the cylindrical lens 25 , the reflection mirror 27 , and the concave mirror 29 are mounted on the carriage 20 . Accordingly, the relative position of the first irradiation light Le1 and even the relative position of the second irradiation light Le2 can be maintained with respect to the bouncing position P (liquid film FL) of the droplet Fb. As a result, the first irradiation position P1 and the second irradiation position P2 of the liquid film FL can be respectively irradiated with the first irradiation light Le1 and the second irradiation light Le2 under the condition of exhibiting higher reproducibility. Therefore, the dry state of the element pattern 5F and the wiring pattern 6F can be stabilized, and formation defects of the circuit element 5 and the internal wiring 6 can be further reduced.

(4) According to the above-mentioned embodiment, the first irradiation position P1 irradiated with the first irradiation light Le1 and the second irradiation position P2 irradiated with the second irradiation light Le2 are positioned at different positions in the scanning direction. As a result, laser irradiation across the liquid film FL can be performed twice during scanning of the liquid droplet Fb. Furthermore, even when the second irradiation light Le2 is reflected from the liquid surface FLa, the reflected second irradiation light Le2 can be suppressed from entering the semiconductor laser LD side. As a result, the irradiation operation of the laser beam can be stabilized, and the drying effect of the liquid droplet Fb can be enhanced under the condition of exhibiting higher reproducibility.

(5) According to the above-mentioned embodiment, the reflective mirror 27 and the concave mirror 29 irradiate the region of the liquid film FL facing the discharge head 21 with the first irradiation light Le1 and the second irradiation light in a direction approximately tangential to the pattern forming surface 4Sa, respectively. Le2. Thereby, the drying efficiency of the liquid droplet Fb immediately after falling can be improved, and the degree of freedom of the shape and size of the liquid film FL can be expanded.

In addition, the above-mentioned embodiment can also be changed as follows.

- In the said embodiment, the concave mirror 29 was embodied as the cylindrical mirror which has curvature when viewed from the X arrow direction. Not limited thereto, the concave mirror 29 may also be embodied as a concave mirror (such as a spherical mirror) having a curvature when viewed from the Z arrow direction, and is configured to reflect the reflected scattered light Lr along the approximate tangential direction (approximate scanning direction) of the pattern forming surface 4Sa. Then converge in the region of the droplet Fb.

In addition, at this time, it is preferable that the radius of curvature of the concave mirror 29 viewed from the Z arrow direction be the distance between the concave mirror 29 and the reflection mirror 27 .

As a result, the concave mirror 29 only has a curvature viewed from the direction of the Z arrow, and the efficiency of taking in the reflected and scattered light Lr reflected or scattered from the region of the droplet Fb can be improved. Furthermore, only by setting the radius of curvature of the concave mirror 29 as the distance between the concave mirror 29 and the reflective mirror 27, the first irradiation light Le1 from the reflective mirror 27 passing through the area of the droplet Fb can be more reliably reflected again. The region of the droplet Fb is irradiated.

- In the above-mentioned embodiment, the plurality of nozzles N is arranged in only one row along the X arrow direction. Not limited thereto, for example, a configuration may be adopted in which the plurality of nozzles N are arranged in only two rows along the X arrow direction.

In this case, the first irradiation position P1 may be set near the ejection position corresponding to one nozzle row, and the second irradiation position P2 may be set near the ejection position corresponding to the other nozzle row. Thereby, it is possible to irradiate the respective liquid droplets Fb that land at different landing positions with laser irradiation at substantially the same timing. Thereby, the uniformity of each liquid droplet Fb (pattern) after drying can be improved.

Alternatively, the focal length of the concave mirror 29 is extended (or shortened) to expand the optical cross section of the second irradiation light Le2 formed on the liquid surface FLa in the scanning direction. Furthermore, the second irradiation light Le2 may be configured to reflect and irradiate both the first irradiation position P1 and the second irradiation position P2. Even in this configuration, it is possible to avoid insufficient drying of the individual droplets Fb bounced to different landing positions.

· In the above-mentioned embodiments, the second irradiation unit is embodied as a concave mirror 29 . Not limited thereto, the second irradiation unit may also be embodied as a plurality of concave mirrors 29 . That is, the reflected scattered light Lr of the first irradiation light Le1 irradiated on the liquid film FL may be reflected by the plurality of concave mirrors 29 . Alternatively, the reflected light of the second irradiation light Le2 irradiated onto the liquid film FL may be reflected by a different concave mirror 29 . Thereby, the drying efficiency of liquid droplets can be further improved.

- In the above-mentioned embodiment, the second irradiation unit was embodied as the concave mirror 29 . Not limited thereto, for example, the second illuminating unit may also be embodied as a plane mirror or a prism. That is, the second irradiating means only needs to be able to reflect and irradiate the laser light reflected or scattered from the droplet area to the droplet area again.

- In the said embodiment, the 1st irradiation unit was embodied as the cylindrical lens 25 and the reflection mirror 27. Not limited to this, the first irradiation unit may be constituted by only the cylindrical lens 25, and the laser light emitted from the cylindrical lens 25 may be directly irradiated onto the liquid film FL. That is to say, the first irradiation unit only needs to irradiate the area of the droplet with the laser light emitted by the laser source.

- In the said embodiment, it is comprised so that the 1st irradiation light Le1 and the 2nd irradiation light Le2 may be irradiated to the liquid film FL. Not limited thereto, for example, a configuration may be adopted in which the first irradiation light Le1 is irradiated to the droplet Fb before the liquid film FL is formed, and the second irradiation light Le2 is irradiated to the droplet Fb after the liquid film FL is formed. Alternatively, a hemispherical pattern may be formed by irradiating the first irradiation light Le1 and the second irradiation light Le2 to the liquid droplets Fb before the liquid film FL is formed. That is, what is necessary is just to be comprised so that the 1st irradiation light Le1 and the 2nd irradiation light Le2 may be irradiated to the area|region of the liquid droplet which bounced and landed on the board|substrate.

- In the above embodiment, the region of the liquid film FL (droplet Fb) is irradiated with the first irradiation light Le1, and the reflected scattered light Lr from the liquid film FL is reflected and irradiated as the second irradiation light Le2. Not limited thereto, a configuration may be adopted in which a part of the first irradiation light Le1 is irradiated to the pattern formation surface 4Sa, and reflected light from the pattern formation surface 4Sa is reflected and irradiated as the second irradiation light Le2.

- In the said embodiment, it comprised so that the 2nd irradiation position P2 may be set in the scanning direction of the 1st irradiation position P1. Not limited thereto, the second irradiation position P2 may be set in the anti-scanning direction of the first irradiation position P1, or the first irradiation position P1 and the second irradiation position P2 may be set at the same position.

- In the said embodiment, it is comprised so that the common 1st irradiation light Le1 and the common 2nd irradiation light Le2 may be irradiated to the liquid film FL which consists of a some liquid droplet Fb. Not limited thereto, for example, the laser beam from the semiconductor laser LD may be divided corresponding to each nozzle N, and a plurality of first irradiation lights Le1 and a plurality of second irradiation lights Le2 may be irradiated to the liquid film FL (each liquid droplet Fb). Alternatively, semiconductor lasers LD equal to the number of nozzles N may be arranged to irradiate a plurality of first irradiation lights Le1 and a plurality of second irradiation lights Le2 to the liquid film FL (each liquid droplet Fb). That is, it may be configured such that the first irradiation light Le1 and the second irradiation light Le2 corresponding to each liquid droplet Fb are respectively irradiated to the corresponding liquid droplet Fb area.

- In the said embodiment, it is comprised so that the liquid film FL (droplet Fb) may be dried by the 1st irradiation light Le1 and the 2nd irradiation light Le2. Not limited thereto, the liquid film FL (droplet Fb) may be dried and fired using the first irradiation light Le1 and the second irradiation light Le2. Thereby, the formation defect of the element pattern 5F and the wiring pattern 6F can be reduced by the 1st irradiation light Le1 and the 2nd irradiation light Le2 which were irradiated locally.

In the above embodiment, the concave mirror 29 mounted on the carriage 20 is configured to irradiate the second irradiation position P2 of the liquid film FL again by using the reflected scattered light Lr from the first irradiation position P1 as the second irradiation light Le2 , to dry the liquid film FL (droplet Fb) in cooperation with the first irradiation light Le1. In other words, with the laser light emitted from one semiconductor laser LD, not only effective drying is performed, but also insufficient drying can be avoided.

Instead of this, for example, the second irradiation unit, which is installed at a symmetrical position to the first irradiation unit via the ejection head 21, adjusts the mirror 29 to irradiate the liquid film FL again with the reflected scattered light Lr as the second irradiation light Le2. The first irradiation position P1. Then, the first irradiation light Le1 and the second irradiation light Le2 cooperate to dry the liquid film FL (droplet Fb) at the first irradiation position P1.

With such a configuration, by irradiating the first irradiation light Le1 and the second irradiation light Le2 from different directions to the first irradiation position P1 of the liquid film FL, the first irradiation light Le1 and the second irradiation light Le2 in the tangential direction of the printed circuit board 4S are canceled out. The amount of movement of the second irradiation light Le2 does not cause the liquid film FL (droplet Fb) to move. Moreover, the kinetic energy of the first illumination light Le1 and the second illumination light Le2 can be effectively converted into thermal energy.

Thereby, low-cost, high-efficiency drying can be performed quickly.

- In the above-described embodiment, the bitmap data BMD is generated based on the drawing information Ia. The present invention is not limited thereto, and bitmap data BMD generated in advance by an external device may be input from the input device 41 to the control device 40 .

- In the above-described embodiment, the liquid droplet ejection head is embodied as the liquid droplet ejection head 21 of the piezoelectric element drive method. However, the present invention is not limited thereto, and the droplet ejection head may be embodied as a resistive heating method or an electrostatic driving method.

- In the said embodiment, the circuit element 5 and the internal wiring 6 were formed by the inkjet method. However, the present invention is not limited thereto, and only relatively thin circuit elements 5 or internal wiring 6 may be formed by the above-mentioned inkjet method.

- In the above-mentioned embodiment, the pattern forming material was embodied as metallic ink. But not limited thereto, for example, the pattern forming material may be embodied as a liquid in which an insulating film material or an organic material is dispersed. That is, the pattern forming material may be any material as long as it receives laser light, dries, and forms a solid pattern.

- In the above-mentioned embodiment, the pattern was embodied as the element pattern 5F and the wiring pattern 6F. However, the pattern is not limited thereto, and the pattern may be embodied as various metal wirings included in a liquid crystal display device, an organic electroluminescence display device, a field effect display device (FED, SED, etc.) equipped with a planar electron emission element, etc. . Alternatively, the pattern can also be embodied as an identification code composed of a plurality of line patterns or dot patterns. That is, the pattern may be any pattern as long as it is formed of dried liquid droplets.

Claims (13)

1. pattern formation method forms material with pattern and forms drop and be sprayed onto on the substrate, and the drop that bullet is dropped on the described substrate carries out drying, forms pattern on described substrate,

This pattern formation method is: the laser that lasing light emitter is emitted shines the zone of drop, and will from the laser of the regional reflex of drop or scattering once more reflected illumination make droplet drying to the zone of drop.

2. pattern formation method according to claim 1 is characterized in that,

The drop that bullet drops on the described substrate is scanned with respect to laser along the scanning direction,

Shine the zone of the emitted laser of described lasing light emitter and reflected illumination zone, on described scanning direction, be positioned at different positions from the laser of the regional reflex of drop or scattering.

3. pattern formation method according to claim 1 and 2 is characterized in that,

The drop that bullet drops on the described substrate is scanned with respect to laser along the scanning direction,

The laser convergence that described lasing light emitter is emitted shines the zone of drop to described scanning direction, and will shine the zone of drop once more from the laser convergence of the regional reflex of drop or scattering to described scanning direction.

4. droplet ejection apparatus, it possesses droplet jetting head, and this droplet jetting head forms material with pattern and forms drop and be sprayed onto on the substrate,

This droplet ejection apparatus comprises:

First illumination unit, it drops on the emitted laser of area illumination lasing light emitter of the drop on the described substrate to bullet; With

Second illumination unit, its will from the laser of the regional reflex of described drop or scattering once more reflected illumination to the zone of drop.

5. droplet ejection apparatus according to claim 4 is characterized in that,

Described second illumination unit possesses speculum, and this speculum is equipped on the opposition side of described first illumination unit across described droplet jetting head, will from the laser of the regional reflex of described drop or scattering once more reflected illumination to the zone of described drop.

6. droplet ejection apparatus according to claim 5 is characterized in that,

Observe from the normal direction of described substrate, described speculum has concave surface, and this concave reflection makes it converge to the zone of described drop once more through the laser in the zone of described drop.

7. droplet ejection apparatus according to claim 6 is characterized in that,

Described first illumination unit shines the zone of described drop along the approximate tangential direction of the described substrate laser that described lasing light emitter is emitted,

Described second illumination unit have along the approximate tangential direction of described substrate will from the laser of the regional reflex of described drop or scattering once more reflected illumination to the speculum in the zone of drop,

Observe from the normal direction of described substrate, it is the concave surface of approximate radius of curvature that described speculum possesses the distance that makes between described first illumination unit and the described speculum.

8. according to each described droplet ejection apparatus in the claim 5～7, it is characterized in that,

Observe from the tangential direction of described substrate, described speculum has the concave surface towards the area side of described drop, will converge to the zone of described drop from the laser in the zone of described drop once more.

9. droplet ejection apparatus according to claim 8 is characterized in that,

Described speculum will shine described drop once more from the laser of the reflection position of described drop, make towards shining the laser of reflection position, observe from the tangential direction of described substrate with the momentum of the laser of described first illumination unit and cancel out each other by the described drop of the laser of described first illumination unit irradiation and by this speculum.

10. according to each described droplet ejection apparatus in the claim 4～9, it is characterized in that,

Also comprise:

Balladeur train, it carries described droplet jetting head, described first illumination unit and described second illumination unit; With

Scanning element, it scans described substrate with respect to described balladeur train along the scanning direction.

11. droplet ejection apparatus according to claim 10 is characterized in that,

Described first illumination unit shines first irradiation position with the laser that described lasing light emitter penetrates,

Described second illumination unit possesses speculum, this speculum will from the laser reflected illumination of the regional reflex of drop or scattering to described first irradiation position different second irradiation position on described scanning direction.

12. according to each described droplet ejection apparatus in the claim 4～11, it is characterized in that,

It is the metallic ink that is dispersed with metal particle that described pattern forms material,

Described substrate is the low temperature calcination ceramic substrate.

13. a circuit unit, the metal line that it comprises substrate, is formed at the component of described substrate and is formed at described substrate and is electrically connected with described component,

Described metal line is formed by each described droplet ejection apparatus in the claim 4～12.

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